CN219232942U

CN219232942U - Wafer spin coater with spin centering device

Info

Publication number: CN219232942U
Application number: CN202223602258.8U
Authority: CN
Inventors: 许琪伟; 吕学良; 冯季村; 褚淼; 刘蕊; 李开宇; 杨金慧; 周东站
Original assignee: China Building Materials Photon Technology Co ltd
Current assignee: China Building Materials Photon Technology Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-06-23
Anticipated expiration: 2032-12-29

Abstract

The utility model relates to the technical field of spin coating, in particular to a wafer spin coating machine with a spin coating centering device, comprises a spin coater body provided with a spin bath and a wafer placing table which can be lifted and lowered; the wafer centering mechanism comprises a plurality of supporting rings which are arranged at intervals and are positioned right above the center of the wafer placing table, each straight section is rotationally matched with a wafer clamp, each wafer clamp is provided with an arc-shaped supporting plate matched with a wafer, each arc-shaped supporting plate extends to the inner side of the supporting ring, each wafer clamp is externally connected with a clamp adjusting ring, and the wafer clamp is enabled to rotate outwards by snapping the clamp adjusting ring; the utility model can realize the rapid centering of the wafer spin center, improve the operation efficiency and avoid the generation of larger deviation in manual centering and the new defect of the wafer surface.

Description

Wafer spin coater with spin centering device

Technical Field

The utility model relates to the technical field of spin coating, in particular to a wafer spin coating machine with a spin coating centering device.

Background

The spin coater is a device for uniformly coating glue on a substrate by rotating at a high speed, and directly affects the thickness and uniformity of the glue layer. When the spin coater is used, the center of the wafer is required to be aligned with the spin coater, otherwise, when the spin coater motor rotates at high speed, the wafer may be thrown out, or the glue layer on the surface of the wafer is unevenly distributed. The main defects of the current spin centering operation are as follows:

most rely on the operator for manual centering. The operation mode is too dependent on the operation experience and visual inspection capability of operators, and the accuracy and the operation efficiency of the alignment of the wafer and the spin center cannot be ensured. During manual centering, the wafer is moved multiple times to find the center position, possibly causing defects such as scratches on the wafer surface.

And (II) when manually mounting and centering, new defects can be introduced into the surface of the wafer, but inspection cannot be performed. For operators, defects such as scratches, particles and the like on the surface of a wafer are possibly caused by improper operation or dust particles on the body in the process of loading and centering. The wafer itself may be contaminated with surface contaminants such as dust particles due to poor environmental cleaning or personnel walking during the process of waiting for loading, thereby causing surface defects such as dirt points and through holes after spin coating, exposure and development. Most of the current spin methods cannot be used for re-checking the surface of the wafer before spin, and many wafers with contaminated or damaged surfaces cannot be screened out in time, so that waste of a lot of material cost and labor cost is generated.

Disclosure of Invention

The utility model aims to provide a wafer spin coater with a spin centering device, which is used for solving the problems in the prior art. In order to achieve the above object, the present utility model solves the following problems by the following technical scheme:

the utility model provides a wafer spin coater with a spin centering device, which comprises:

the spin coater body is provided with a spin bath and a wafer placing table which can be lifted and lowered;

wafer centering mechanism, including the interval setting a plurality of straight sections's supporting ring, the supporting ring is located the wafer is placed the platform center and is directly over, each straight section swivelling fit has the wafer fixture, the wafer fixture all is equipped with the arc layer board with the wafer adaptation, the arc layer board extends to the supporting ring inboard, the wafer fixture all external fixture adjusting ring makes through breaking the fixture adjusting ring the wafer fixture rotates to the outside.

As a further technical scheme, the support ring is provided with a plurality of brackets, and strong lights higher than and lower than the lifting surface of the arc-shaped supporting plate are arranged on the brackets.

As a further technical scheme, the bracket is provided with a nitrogen spray gun which is higher than and lower than the lifting surface of the arc-shaped supporting plate.

As a further technical scheme, the left end and the right end of the wafer clamp are provided with first limiting protrusions by the supporting ring.

As a further technical scheme, the wafer fixture is provided with a sleeve and the straight section is in rotary fit, a notch for assembly is formed in the bus of the sleeve, and the sleeve is clamped into the straight section by opening the notch.

As a further technical scheme, the notch faces the outer side of the supporting ring.

As a further technical scheme, the support ring is provided with a second limiting protrusion at the notch, and when the arc-shaped supporting plate is in a horizontal state, the second limiting protrusion just limits the upper side of the notch.

As a further technical scheme, an extension part is arranged between the sleeve and the arc-shaped supporting plate.

As a further technical solution, the fixture adjusting ring is connected to the sleeve of each wafer fixture.

As a further technical scheme, the fixture adjusting ring is provided with a handle.

The beneficial effects of the utility model are as follows:

the utility model can realize the rapid centering of the wafer spin center, improve the operation efficiency and avoid the generation of larger deviation in manual centering to cause new defects on the wafer surface; the subsequent material cost and labor cost waste are reduced, the re-inspection of the wafer surface before spin coating is realized, and the circulation of the wafer with the problem is cut off in time; the processing yield is improved, and the use efficiency and the processing qualification rate of the wafer are improved by timely processing pollutants on the surface of the wafer.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. It should also be understood that the drawings are for simplicity and clarity and have not necessarily been drawn to scale. The utility model will now be described and explained with additional specificity and detail through the use of the accompanying drawings in which:

FIG. 1 is a schematic view showing the overall structure of a centering device in an embodiment of the present utility model;

FIG. 2 shows a schematic diagram of a centering mechanism in an embodiment of the utility model;

FIG. 3 is a schematic view of a wafer chuck according to an embodiment of the utility model;

FIG. 4 is a schematic diagram showing a connection between a wafer chuck and a chuck adjusting ring according to an embodiment of the utility model;

fig. 5 is a schematic view showing an opening state of the clamp adjusting ring when the clamp adjusting ring is detached in the embodiment of the utility model.

In the figure: 1-1, a spin bath; 1-2, a wafer placement table; 1-3, a spin motor; 1-4, a telescopic rod; 2-1, fixing rods; 2-2, a wafer clamp; 2-3, a supporting ring; 2-4, a first limiting protrusion; 2-5, a second limiting protrusion; 3. a clamp adjusting ring; 3-1, a handle; 3-2, a ring buckle; 4. a bracket; 4-1, a shell; 4-2, an angle adjusting knob; 5. a strong light lamp; 6. a nitrogen lance; 6-1, an air gun nozzle; 6-2, a filter; 6-3, a gas passage.

Detailed Description

The technical solutions in the exemplary embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

As shown in fig. 1 to 5, the present embodiment provides a wafer spin coater with a spin coater centering device, which includes a spin coater body, a wafer centering mechanism, a fixture adjusting ring 3, a bracket 4, a strong light 5, and a nitrogen spray gun 6.

As shown in fig. 1, a spin coater body is provided with a spin coater groove 1-1 and a wafer placing table 1-2 which can be lifted and lowered; specifically, a spin groove 1-1 is formed in the spin machine body, a wafer placing table 1-2 is arranged in the center of the spin groove 1-1, and the lower part of the wafer placing table 1-2 is connected with the output end of a spin motor 1-3 and is fixedly arranged on the telescopic end of a telescopic rod 1-4. The wafer placement stage 1-2 is aligned with the center of the wafer centering mechanism.

As shown in fig. 1 and 2, the wafer centering mechanism is fixed above the spin coater body by a fixing rod 2-1, and comprises a wafer clamp 2-2, a support ring 2-3, a first limiting protrusion 2-4 and a second limiting protrusion 2-5. The support ring 2-3 is provided with a plurality of straight sections at intervals, in this embodiment three sections. The support ring 2-3 is located right above the center of the wafer placing table 1-2, each straight section is rotatably matched with the wafer clamp 2-2, the wafer clamps 2-2 are all provided with arc-shaped supporting plates matched with the wafers, the arc-shaped supporting plates extend towards the inner side of the support ring 2-3, the wafer clamps 2-2 are all externally connected with the clamp adjusting ring 3, and the wafer clamps 2-2 are outwards rotated by pulling the clamp adjusting ring 3.

The wafer clamp 2-2 is provided with a sleeve which is in rotary fit with the straight section, a notch for assembly is formed in a bus of the sleeve, the sleeve is clamped into the straight section by opening the notch, the three wafer clamps 2-2 are arranged in a triangular mode and are buckled on the supporting ring 2-3.

As shown in fig. 3, first limit protrusions 2-4 are provided at left and right end positions of the support ring 2-3 where the wafer chuck 2-2 is mounted. The first limiting protrusions 2-4 are used for determining distribution positions of the wafer clamping device 2-2 on the supporting ring 2-3.

As shown in fig. 4, the notch faces the outside of the support ring 2-3. The support ring 2-3 is provided with a second limiting protrusion 2-5 at the opening, and when the arc-shaped supporting plate is in a horizontal state, the second limiting protrusion 2-5 just limits the upper side of the opening. The second limiting protrusion 2-5 is used for determining the up-down turning range of the wafer clamp 2-2 relative to the support ring 2-3.

As shown in fig. 3, an extension is provided between the sleeve and the arc-shaped supporting plate, so that the arc-shaped supporting plate maintains a distance from the sleeve.

As shown in fig. 2, a chuck adjusting ring 3 is attached to the sleeve of each wafer chuck 2-2. The clamp adjusting ring is provided with a handle 3-1. By pulling the handle 3-1 inward, the wafer chuck 2-2 is turned outward following the chuck adjusting ring 3. It will be appreciated that the clamp adjustment ring must have a degree of elasticity and toughness. In the embodiment, the mortises of the clamp adjusting ring 3 are tightly buckled with the tenons of the wafer clamp 2-2, and after the mortises are connected with each other, the wafer clamp 2-2 can be turned up and down by rotating the clamp adjusting ring handle 3-1; as shown in fig. 5, the disassembly of the jig adjusting ring 3 can be completed by opening the ring buckle 3-2.

The support ring 2-3 is provided with a plurality of brackets 4, the brackets 4 are of a detachable structure and are composed of a shell 4-1 and an angle adjusting knob 4-2, and the brackets are arranged on the support ring 2-3 in a dispersing manner and are used for fixing the strong light lamp 5 and the nitrogen spray gun 6.

The bracket 4 is provided with a strong light 5 which is higher and lower than the lifting surface of the arc-shaped supporting plate. The strong light lamp 5 is an LED strong light lamp, and the two strong light lamps are higher than the lifting plane of the wafer clamp 2-2, and are used for detecting the surface defects of the wafer; and a lifting plane lower than the wafer clamping device 2-2 is used for complementarily inspecting the surface defects of the transparent wafer.

The bracket 4 is provided with a nitrogen spray gun 6 which is higher and lower than the lifting surface of the arc-shaped supporting plate. The three high-purity nitrogen spray guns 6 consist of an air gun spray head 6-1, a filter 6-2 and a gas passage 6-3, so that the wafer surface can be purged from different directions, and environmental pollutants introduced due to poor air purification degree, improper personnel operation and the like are prevented from remaining on the wafer surface.

The strong light lamp 5 and the nitrogen spray gun 6 in the market are ready-made products, and the specification and the model can be selected according to the needs.

When in actual use, the wafer is firstly placed on the wafer clamp 2-2, and then the wafer placing table 1-2 is lifted by adjusting the telescopic rod 1-4 until the wafer placed on the wafer centering mechanism at the fixed center position is slightly jacked up, so that wafer spin center alignment before spin can be realized. Then, the handle 3-1 of the clamp adjusting ring 3 is rotated upwards to drive the wafer clamp 2-2 on the supporting ring 2-3 to rotate outwards, so that the wafer can descend into the spin coating groove 1-1 along with the wafer placing table 1-2, and then the spin coating motor 1-3 drives the wafer placing table 1-2 and the wafer to rotate, thereby realizing the spin coating function.

When the wafer is placed on the wafer clamp 2-2, under the irradiation of the strong light 5 higher than the lifting plane of the wafer clamp 2-2, whether the surface of the wafer has surface defects such as dust particles, film bulges and the like can be checked; under the irradiation of a strong light below the lifting plane of the wafer clamp 2-2, whether the surface of the transparent wafer has defects such as scratches and the like can be checked. If the surface of the wafer has pollutants such as dust particles, the nitrogen spray gun 6 is used for purging the surface of the wafer at multiple angles, so that the pollutants on the surface of the wafer are removed, the surface defects such as multiple through holes and multiple dirty points are avoided, and the processing yield is improved.

Although the present utility model has been described in terms of the preferred embodiments, it is not intended to be limited to the embodiments, and any person skilled in the art can make any possible variations and modifications to the technical solution of the present utility model by using the methods and technical matters disclosed above without departing from the spirit and scope of the present utility model, so any simple modifications, equivalent variations and modifications to the embodiments described above according to the technical matters of the present utility model are within the scope of the technical matters of the present utility model.

Claims

1. A wafer spin coater with spin centering device, which is characterized in that:

2. A wafer spin coater having a spin centering apparatus as set forth in claim 1 wherein said support ring mounts a plurality of brackets having high light lamps disposed thereon above and below said arcuate pallet lifting surface.

3. A wafer spin coater having a spin centering apparatus as set forth in claim 2 wherein said support is provided with nitrogen lances above and below said arcuate pallet lifting surface.

4. The wafer spin coater with a spin centering device as claimed in claim 1, wherein first limit protrusions are provided at left and right end positions of the support ring where the wafer chuck is mounted.

5. The wafer spin coater with a spin coater according to claim 1, wherein the wafer chuck is provided with a sleeve rotatably fitted to the straight section, the sleeve bus is provided with a notch for assembly, and the sleeve is engaged with the straight section by opening the notch.

6. A wafer spin coater having a spin centering apparatus as set forth in claim 5 wherein said gap is oriented outwardly of said support ring.

7. The wafer spin coater with a spin centering device as claimed in claim 6, wherein said support ring is provided with a second limiting protrusion at said opening, said second limiting protrusion being adapted to limit the upper side of said opening when said arc-shaped support plate is in a horizontal state.

8. A wafer spin coater having a spin centering apparatus as set forth in claim 5 wherein an extension is provided between said sleeve and said arcuate support plate.

9. A wafer spin coater having a spin centering apparatus as set forth in claim 5 wherein said chuck adjusting ring is attached to said sleeve of each of said wafer chucks.

10. A wafer spin coater having a spin centering apparatus as set forth in claim 9, wherein said chuck adjusting ring is provided with a handle.