CN219226580U

CN219226580U - Miniaturized filter

Info

Publication number: CN219226580U
Application number: CN202223549489.7U
Authority: CN
Inventors: 张欣悦; 王鹏程
Original assignee: Shenzhen Wonder Electronic Technology Co ltd
Current assignee: Shenzhen Wonder Electronic Technology Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-06-20
Anticipated expiration: 2032-12-29

Abstract

The utility model discloses a miniaturized filter, which belongs to the technical field of electronics, and comprises a first ground wire layer, a first coupling layer, a second coupling layer and a second ground wire layer, so that the technical problem of an LTCC (Low temperature Co-fired ceramic) process radio frequency filter which is high in reliability and capable of customizing a frequency range is solved through a laminated structure.

Description

Miniaturized filter

Technical Field

The utility model belongs to the technical field of electronics, and particularly relates to a miniaturized filter.

Background

With the rapid development of mobile communication, satellite communication and miniaturization of national defense electronic systems, high performance, low cost and miniaturization have become the development directions of the current microwave/radio frequency field, and higher requirements are put on the performance, size, reliability and cost of the microwave filter.

The low-temperature co-fired ceramic is an electronic packaging technology, adopts a multilayer ceramic technology LTCC, can internally place passive elements in a dielectric substrate, and can also paste active elements on the surface of the substrate to prepare a passive/active integrated functional module.

The structure of the current radio frequency filter is complex, the whole structure of the capacitive coupling structure of the filter is fixed, and the volume is thicker, which is not beneficial to the customization of the frequency range and the actual processing of the LTCC.

Disclosure of Invention

The utility model aims to provide a miniaturized filter, which solves the technical problems of high reliability and capability of customizing a frequency range of an LTCC process radio frequency filter through a laminated structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the miniaturized filter comprises a first ground wire layer, a first coupling layer, a second coupling layer and a second ground wire layer, wherein the first ground wire layer is provided with a ground wire GND1, the first coupling layer is arranged below the ground wire GND1, a capacitor C7 is arranged in the first coupling layer, an inductor L1 and an inductor L4 are sequentially arranged below the capacitor C7 at intervals from left to right, the inductor L1 is connected with a signal INPUT port INPUT, the inductor L4 is connected with an OUTPUT port OUTPUT, a capacitor C1 is arranged at the rear side of the inductor L1, the capacitor C1 is electrically connected with the inductor L1 through a connecting part Y1, a capacitor C4 is arranged at the rear side of the inductor L4, and the inductor L4 are electrically connected through a connecting part Y2;

the lower side of the first coupling layer is provided with a second coupling layer at intervals, an inductor L2 is arranged in the second coupling layer, the inductor L2 is arranged below the inductor L1, a capacitor C2 is arranged at the rear side of the inductor L2, the capacitor C2 is electrically connected with the inductor L2 through a connecting part Y3, an inductor L3 is arranged at the right side of the inductor L2, a capacitor C3 is arranged at the rear side of the inductor L3, the capacitor C3 is electrically connected through a connecting part Y4, and a capacitor C6 is arranged below the capacitor C2 and the capacitor C3;

a second ground plane is arranged below the second coupling layer, and a ground GND2 is arranged in the second ground plane.

Preferably, the capacitor C7 is covered above the inductor L1, the inductor L4, the capacitor C1 and the capacitor C4.

Preferably, the first ground layer, the first coupling layer, the second coupling layer and the second ground layer are all integrated package structures realized by LTCC technology.

Preferably, the capacitor C1 includes an upper conductive layer and a lower conductive layer, and the upper conductive layer of the capacitor C1 is connected to the inductor L1 through the connection portion Y1;

the capacitor C4 comprises an upper conductive layer and a lower conductive layer, and the upper conductive layer of the capacitor C4 is connected with the inductor L4 through the connecting part Y2;

the capacitor C2 comprises an upper conductive layer and a lower conductive layer, and the lower conductive layer of the capacitor C2 is connected with the inductor L2 through the connecting part Y3;

the capacitor C3 comprises an upper conductive layer and a lower conductive layer, and the lower conductive layer of the capacitor C3 is connected with the inductor L3 through the connecting part Y4.

Preferably, the connection portion Y1, the connection portion Y2, the connection portion Y3, and the connection portion Y4 are microstrip lines.

The miniaturized filter solves the technical problems of the LTCC process radio frequency filter which has high reliability and can be customized in frequency range through a laminated structure, is small in size, suitable for high-density mounting, wide in frequency range, particularly customizable in use, abrupt in attenuation characteristic, capable of effectively losing noise, high in reliability, good in welding characteristic and heat resistance.

Drawings

FIG. 1 is a front view of the present utility model;

FIG. 2 is a side view of the present utility model;

FIG. 3 is a top view of the present utility model;

FIG. 4 is a schematic diagram of a first coupling layer of the present utility model;

FIG. 5 is a schematic diagram of a second coupling layer of the present utility model;

fig. 6 is a graph of the filtering of a radio frequency signal of the present utility model.

Detailed Description

A miniaturized filter as shown in fig. 1-6, comprising a first ground plane, a first coupling layer, a second coupling layer and a second ground plane, said first coupling layer, said second coupling layer and said second ground plane being all integrally encapsulated by LTCC technology.

The utility model adopts two coupling layers to realize filtering, wherein the first coupling layer is composed of two parallel coupling units, namely a first coupling unit composed of an inductor L1 and a capacitor C1 and a second coupling unit composed of an inductor L4 and a capacitor C4, and the two coupling units are coupled through a capacitor C7, and in the utility model, the capacitor C7 is a coupling capacitor composed of a conductive layer.

The second coupling layer also comprises two parallel coupling units, namely a third coupling unit consisting of an inductance L2 and a capacitance C2 and a fourth coupling unit consisting of an inductance L3 and a capacitance C3, which are coupled by a capacitance C6, in the present utility model, the capacitance C6 is a coupling capacitance formed by a conductive layer.

The circuit structure principles of the first coupling unit, the second coupling unit, the third coupling unit and the fourth coupling unit are the same.

The frequency range of the filter can be customized by changing the structures and the sizes of the inductor L1, the capacitor C1, the inductor L2, the capacitor C2, the inductor L3, the capacitor C3, the inductor L4 and the capacitor C4.

The first ground wire layer is provided with a ground wire GND1, a first coupling layer is arranged below the ground wire GND1, a capacitor C7 is arranged in the first coupling layer, an inductor L1 and an inductor L4 are sequentially arranged below the capacitor C7 at intervals from left to right, the inductor L1 is connected with a signal INPUT port INPUT, the inductor L4 is connected with an OUTPUT port OUTPUT, a capacitor C1 is arranged at the rear side of the inductor L1, the capacitor C1 is electrically connected with the inductor L1 through a connecting part Y1, a capacitor C4 is arranged at the rear side of the inductor L4, and the capacitor C4 is electrically connected with the inductor L4 through a connecting part Y2;

the capacitor C7 is covered above the inductor L1, the inductor L4, the capacitor C1 and the capacitor C4.

The capacitor C1 comprises an upper conductive layer and a lower conductive layer, and the upper conductive layer of the capacitor C1 is connected with the inductor L1 through the connecting part Y1;

The connecting part Y1, the connecting part Y2, the connecting part Y3 and the connecting part Y4 are microstrip lines.

In this embodiment, the first coupling unit, the second coupling unit, the third coupling unit and the fourth coupling unit are respectively coupled in pairs up and down, two pairs left and right, the signal is input by the inductor L1 and output by the inductor L4, the center frequency is 125MHz, the passband width is 20MHz, and the size is 4.5×3.2×1.5mm.

Claims

1. A miniaturized filter, characterized by: the high-voltage power supply comprises a first ground wire layer, a first coupling layer, a second coupling layer and a second ground wire layer, wherein the first ground wire layer is provided with a ground wire GND1, the first coupling layer is arranged below the ground wire GND1, a capacitor C7 is arranged in the first coupling layer, an inductor L1 and an inductor L4 are sequentially arranged below the capacitor C7 at intervals from left to right, the inductor L1 is connected with a signal INPUT port INPUT, the inductor L4 is connected with an OUTPUT port OUTPUT, a capacitor C1 is arranged at the rear side of the inductor L1, the capacitor C1 is electrically connected with the inductor L1 through a connecting part Y1, a capacitor C4 is arranged at the rear side of the inductor L4, and the capacitor C4 is electrically connected with the inductor L4 through a connecting part Y2;

2. A miniaturised filter according to claim 1 wherein: the capacitor C7 is covered above the inductor L1, the inductor L4, the capacitor C1 and the capacitor C4.

3. A miniaturised filter according to claim 1 wherein: the first ground wire layer, the first coupling layer, the second coupling layer and the second ground wire layer are all integrated packaging structures realized through LTCC technology.

4. A miniaturised filter according to claim 1 wherein: the capacitor C1 comprises an upper conductive layer and a lower conductive layer, and the upper conductive layer of the capacitor C1 is connected with the inductor L1 through the connecting part Y1;

5. A miniaturised filter according to claim 1 wherein: the connecting part Y1, the connecting part Y2, the connecting part Y3 and the connecting part Y4 are microstrip lines.