CN219226251U - Chip blanking and placing device - Google Patents

Abstract

A chip blanking placement device, comprising: the device comprises a blanking mechanism, an ejection template, a bottom plate, a chip plate and a frame; the ejection template is arranged at the upper part of the blanking mechanism, the bottom plate is arranged at the lower part of the blanking mechanism, and the ejection template and the bottom plate are longitudinally corresponding and adaptive; the frame is arranged on the upper end face of the bottom plate, and the chip board is arranged on the upper end face of the frame; the ejection template is provided with a plurality of protruding parts, the chip board is provided with a plurality of chips, and the frame is provided with a plurality of accommodating grooves; after being matched in place, the convex parts, the chips and the accommodating grooves are in one-to-one correspondence and are matched.

Description

Chip blanking and placing device

Technical Field

The utility model relates to the technical field of chip processing, in particular to a chip blanking and placing device.

Background

After the chip is cut on the chip board by laser, the chip is not completely cut, only the shape is cut, and then ejection is performed. However, the current operation mode is to eject the chips one by one manually, put the chips into the frame, and take out the chips to carry out the next process.

Disclosure of Invention

The utility model provides a chip blanking placement device, which is provided with a corresponding ejection template, a chip board and a frame, so that when chips on the chip board are ejected, the chips on the whole chip board can be ejected into the frame together through a blanking mechanism, and the manual complicated operation is avoided, so that the technical problems can be solved.

The technical aim of the utility model is realized by the following technical scheme:

a chip blanking placement device, comprising:

the device comprises a blanking mechanism, an ejection template, a bottom plate, a chip plate and a frame;

the ejection template is arranged on the upper part of the blanking mechanism, the bottom plate is arranged on the lower part of the blanking mechanism, and the ejection template and the bottom plate are longitudinally corresponding and adaptive;

the frame is arranged on the upper end face of the bottom plate, and the chip board is arranged on the upper end face of the frame;

the ejection template is provided with a plurality of protruding parts, the chip board is provided with a plurality of chips, and the frame is provided with a plurality of accommodating grooves; after being matched in place, the protruding parts, the chips and the accommodating grooves are in one-to-one correspondence and are matched.

Compared with the prior art, the utility model has the following beneficial effects:

after the corresponding positions of the chip plate and the frame on the bottom plate are installed in place, the blanking mechanism drives the ejection template to push down, chips can be ejected out into the accommodating groove under the action of the protruding part, and the chips of the whole chip plate can be placed in the accommodating groove of the frame in order, so that manual complicated operation is avoided.

Further, the chip board is provided with a first positioning hole;

the frame is provided with a second positioning hole;

the bottom plate is provided with a positioning column, and the first positioning hole, the second positioning hole and the positioning column are mutually corresponding and matched.

Further, the blanking mechanism comprises a frame, a moving plate, a guide pillar and a lifting assembly;

the moving plate is in sliding fit with the guide post;

the lifting component is arranged on the frame and is connected with the moving plate in an adaptive manner so as to control the moving plate to move along the guide post.

Further, the lifting assembly comprises a sliding cylinder, a bracket, a connecting frame and a handle;

the support with the frame coupling, the slide with support sliding fit, slide one end with ejection template is connected, the other end with the link, the other end of link with the handle middle part is connected, the tip of handle with the support connection.

Further, the moving plate is provided with a plurality of spring pins;

when the spring needle is pressed down, the end part of the spring needle is matched with the chip board.

Drawings

FIG. 1 is a block diagram of a chip blanking placement apparatus of the present utility model;

fig. 2 is a partial structure diagram of an ejector die plate, a chip board and a frame.

In the figure: a blanking mechanism 1; ejecting the template 2; a bottom plate 3; a chip board 4; a frame 5; a spring needle 6; a frame 11; a moving plate 12; a guide post 13; a lifting assembly 14; a boss 21; a positioning column 31; a chip 41; a first positioning hole 42; the accommodating groove 51; a second positioning hole 52; a slide cylinder 141; a bracket 142; a connection 143; a handle 144.

Detailed Description

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.

As shown in fig. 1-2, a chip blanking placement apparatus includes:

the blanking mechanism 1, the ejection template 2, the bottom plate 3, the chip board 4 and the frame 5;

the ejection template 2 is arranged at the upper part of the blanking mechanism 1, the bottom plate 3 is arranged at the lower part of the blanking mechanism 1, and the ejection template 2 and the bottom plate 3 are longitudinally corresponding and adaptive;

the frame 5 is arranged on the upper end face of the bottom plate 3, and the chip board 4 is arranged on the upper end face of the frame 5;

the ejection template 2 is provided with a plurality of protruding parts 21, the chip board 4 is provided with a plurality of chips 41, and the frame 5 is provided with a plurality of accommodating grooves 51; after being matched in place, the convex parts 21, the chips 41 and the accommodating grooves 51 are in one-to-one correspondence and are matched.

Specifically, after the chip board 4 and the frame 5 are installed in place at the corresponding positions on the bottom plate 3, the blanking mechanism 1 drives the ejection template 2 to push down, under the action of the protruding portion 21, the chips 41 can be ejected into the accommodating groove 51, and the chips 41 on the whole chip board 4 can be placed in the accommodating groove 51 of the frame 5 in order.

In some embodiments, the chip board 4 is provided with a first positioning hole 42;

the frame 5 is provided with a second positioning hole 52;

the bottom plate 3 is provided with a positioning column 31, and the first positioning hole 42, the second positioning hole 52 and the positioning column 31 are mutually corresponding and matched.

By adopting the technical scheme, the chip board 4, the frame 5, the first positioning holes 42 and the second positioning holes 52 are aligned and then are placed on the alignment positioning column 31, so that the positions of the chip board 4 and the frame 5 can be aligned with the ejection template 2, and the ejection and blanking process is more accurate.

In some embodiments, the blanking mechanism 1 comprises a frame 11, a moving plate 12, a guide post 13 and a lifting assembly 14;

the moving plate 12 is in sliding fit with the guide post 13;

the lifting assembly 14 is disposed on the frame 11 and is connected to the moving plate 12 in an adaptive manner, so as to control the moving plate 12 to move along the guide post 13.

The lifting assembly 14 comprises a slide tube 141, a bracket 142, a connecting frame 143 and a handle 144;

the support 142 is connected with the frame 11, the slide tube 141 is in sliding fit with the support 142, one end of the slide tube 141 is connected with the ejection template 2, the other end of the slide tube 141 is connected with the connecting frame 143, the other end of the connecting frame 143 is connected with the middle part of the handle 144, and the end part of the handle 144 is connected with the support 142.

By adopting the technical scheme, the lifting assembly 14 can drive the movable plate 12 to slide up and down along the guide post 13 so as to perform ejection and blanking operations. Further, by pulling the handle 144, the connecting frame 143 can drive the sliding cylinder 141 to push and pull, and the sliding cylinder 141 is sleeved at the end of the bracket 142, so as to play a role in guiding movement.

In some embodiments, the moving plate 12 is provided with a plurality of pogo pins 6;

when pressed down, the end of the pogo pin 6 engages the chip board 4.

By adopting the technical scheme, after the movable plate 12 is pressed down, the end part of the spring needle 6 can prop against the area of the chip plate 4 without the chip 41, and after the end, when the movable plate 12 moves up, the spring needle 6 can separate the top of the chip plate 4 by virtue of elasticity, so that the chip plate 4 is prevented from being taken away by the ejection template 2.

It is to be understood that the above-described embodiments of the present utility model are merely illustrative of or explanation of the principles of the present utility model and are in no way limiting of the utility model. Accordingly, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present utility model should be included in the scope of the present utility model. Furthermore, the appended claims are intended to cover all such changes and modifications that fall within the scope and boundary of the appended claims, or equivalents of such scope and boundary.

Claims (5)

1. Chip unloading puts device, its characterized in that includes:

the device comprises a blanking mechanism (1), an ejection template (2), a bottom plate (3), a chip board (4) and a frame (5);

the ejection template (2) is arranged on the upper part of the blanking mechanism (1), the bottom plate (3) is arranged on the lower part of the blanking mechanism (1), and the ejection template (2) and the bottom plate (3) are longitudinally corresponding and adaptive;

the frame (5) is arranged on the upper end face of the bottom plate (3), and the chip board (4) is arranged on the upper end face of the frame (5);

the ejection template (2) is provided with a plurality of protruding parts (21), the chip board (4) is provided with a plurality of chips (41), and the frame (5) is provided with a plurality of accommodating grooves (51); after being matched in place, the protruding parts (21), the chips (41) and the accommodating grooves (51) are in one-to-one correspondence and are matched.

2. The chip blanking placement apparatus of claim 1, wherein:

the chip board (4) is provided with a first positioning hole (42);

the frame (5) is provided with a second positioning hole (52);

the bottom plate (3) is provided with a positioning column (31), and the first positioning hole (42), the second positioning hole (52) and the positioning column (31) are mutually corresponding and adaptive.

3. The chip blanking placement apparatus of claim 1, wherein:

the blanking mechanism (1) comprises a frame (11), a moving plate (12), a guide pillar (13) and a lifting assembly (14);

the moving plate (12) is in sliding fit with the guide post (13);

the lifting component (14) is arranged on the frame (11) and is connected with the moving plate (12) in an adapting mode so as to control the moving plate (12) to move along the guide post (13).

4. A chip blanking placement apparatus according to claim 3, wherein:

the lifting assembly (14) comprises a sliding cylinder (141), a bracket (142), a connecting frame (143) and a handle (144);

the support (142) with frame (11) is connected, slide (141) with support (142) sliding fit, slide (141) one end with ejecting template (2) are connected, the other end with link (143), the other end of link (143) with handle (144) middle part is connected, the tip of handle (144) with support (142) are connected.

5. A chip blanking placement apparatus according to claim 3, wherein:

the movable plate (12) is provided with a plurality of spring pins (6);

when the spring needle (6) is pressed down, the end part of the spring needle is matched with the chip board (4).

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