CN219218201U

CN219218201U - High aspect ratio via hole PCB board pulse VCP electroplating device

Info

Publication number: CN219218201U
Application number: CN202223478682.6U
Authority: CN
Inventors: 沈海平; 沈哲; 严星冈; 陈华星
Original assignee: Guangde Dongfeng Electronics Co ltd
Current assignee: Guangde Dongfeng Electronics Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-06-20
Anticipated expiration: 2032-12-26

Abstract

The utility model relates to a high aspect ratio via PCB pulse VCP electroplating device, which comprises a VCP pulse electroplating pool with an inclined bottom surface of the electroplating pool, wherein an electroplating pool electric heater and a VCP pulse electroplating cathode controller are arranged on the long side of the VCP pulse electroplating pool, an electroplating liquid circulating conveyor and a VCP pulse electroplating anode controller are arranged on the short side of the VCP pulse electroplating pool, and the VCP pulse electroplating cathode controller is electrically connected with an electroplating cathode mounting seat and is electrically connected with an electroplating cathode mounting seat on the opposite side through a cathode electroplating connector. The utility model is provided with the electric heating pipe in the electroplating pool, and the electric heating pipe is isolated from being in direct contact with the electroplating liquid by heat transfer of the heat transfer medium, high working efficiency of the electroplating pool is realized by simultaneous electroplating of multiple rows of cathode materials, the solution is kept homogeneous and stable by circulating the electroplating liquid, and the PCB pulse VCP electroplating is realized by controlling the high aspect ratio, so that the high-quality PCB is obtained.

Description

High aspect ratio via hole PCB board pulse VCP electroplating device

Technical Field

The utility model relates to the technical field of VCP electroplating, in particular to a pulse VCP electroplating device for a high-aspect ratio via PCB.

Background

The PCB has the main function of enabling various electronic parts to form connection of a preset circuit, plays a role of relay transmission, is a key interconnection piece of electronic products, and is a support body and a carrier of electric connection of the electronic components. Electroplating is an important link in the PCB manufacturing process, and in order to realize connection of conductive metals of different levels, the hole wall of the through hole needs to be plated with metallic copper with good conductivity. Along with the vigorous competition of the terminal products, higher requirements on the reliability of the PCB products are required, and the thickness of the electroplated hole copper is one of the items for measuring the reliability guarantee of the PCB.

The copper in the PCB electroplating hole is noble metal copper, so that the price of the noble metal copper is gradually increased at present, the cost pressure of PCB manufacturing enterprises faces a great challenge, the reliability of PCB products can be guaranteed, the cost of the noble metal copper balls can be saved to the greatest extent, and the method is the focus of consideration of each PCB enterprise.

VCP plating (Vertical ConveyorPlating vertical continuous plating) is a process of plating a thin layer of other metal or alloy on the surface of some metals by using the principle of electrolysis, and a process of adhering a metal film to the surface of the metal or other material member by using electrolysis, thereby playing roles of preventing oxidation (such as rust) of the metal, improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate) and improving beauty. However, the VCP dc plating is substantially one to about 90% deep, and the thickness of the plating is about 10% thick for both the hole copper and the surface copper, for example, 22um for 20um copper plating.

The pulse plating refers to a plating mode of replacing a direct current power supply with a pulse power supply, and the existing pulse plating equipment comprises a placing frame, a plating pool and a pulse plating power supply. Existing processes are typically electroless plating and electroplating, which are performed using pulse plating for high precision, high density and high reliability circuit boards.

Therefore, it is highly desirable to design a high aspect ratio pulse VCP plating apparatus to achieve a VCP plating depth capability of up to 100% in combination with the advantages of pulse plating, so as to solve the technical problems encountered at present.

Disclosure of Invention

The utility model aims to design a pulse VCP electroplating device for a high-aspect-ratio via hole PCB, wherein an electric heating pipe is arranged in an electroplating tank and is isolated from being in direct contact with electroplating liquid through heat transfer of a heat transfer medium, high working efficiency of the electroplating tank is realized through simultaneous electroplating of multiple rows of cathode materials, solution is kept homogeneous and stable through circulating the electroplating liquid, and high-quality PCB is obtained through controlling the high-aspect-ratio to realize the pulse VCP electroplating of the PCB.

In order to achieve the aim of the utility model, the technical scheme adopted is as follows:

a high aspect ratio via PCB pulse VCP electroplating device comprises a VCP pulse electroplating tank provided with an inclined bottom surface of the electroplating tank, wherein an electroplating tank electric heater and a VCP pulse electroplating cathode controller are arranged on the long side of the VCP pulse electroplating tank, and an electroplating liquid circulating conveyor and a VCP pulse electroplating anode controller are arranged on the short side of the VCP pulse electroplating tank; the VCP pulse plating cathode controller is electrically connected with the plating cathode mounting seat, and is electrically connected with the plating cathode mounting seat on the opposite side through the cathode plating connector, and the plating cathode mounting seat comprises a plurality of cathode plating connecting slots and cathode plating connecting electromagnetic blocks symmetrically arranged on two sides of the cathode plating connecting slots, and the VCP pulse plating anode controller is electrically connected with a plating anode carrying basket filled with plating anode materials.

Preferably, the plating solution circulating conveyor is connected with the inclined bottom surface of the plating tank of the VCP pulse plating tank through a plating solution circulating conveying pipe at the input end side and a plating solution conveying filter head, the plating solution circulating conveying pipe at the output end side of the plating solution circulating conveyor enters the VCP pulse plating tank from the top of the VCP pulse plating tank, and a plurality of plating solution spray heads are taken by a passport on the plating solution circulating conveying pipe in the VCP pulse plating tank.

Preferably, the VCP pulse plating tank comprises a plating solution bearing tank and a plating tank heat-insulating layer wrapped on the outer surface of the plating solution bearing tank, wherein a plating tank electric heating pipe electrically connected with a plating tank electric heater is arranged in the plating solution bearing tank, and the plating tank electric heating pipe is soaked in an electric heat transfer medium filled in the plating solution bearing tank.

Preferably, the cathode plating connector comprises a cathode plating connecting rod which is hung and electrically connected with a cathode material, two sides of the cathode plating connecting rod are provided with cathode plating connectors which are matched with a cathode plating connecting slot and a cathode plating connecting electromagnetic block, permanent connecting magnetic blocks are semi-embedded in the cathode plating connectors and magnetically connected with the electrified cathode plating connecting electromagnetic block, a plurality of cathode plating connecting wires with freely telescopic lengths are arranged on the lower side of the cathode plating connecting rod, and an electroplating cathode mounting head which is electrically connected with the cathode plating connecting wires is arranged at the lower end of the cathode plating connecting wires.

The beneficial effects of the utility model are as follows: the high-aspect ratio through hole PCB pulse VCP electroplating device is characterized in that an electric heating pipe is arranged in an electroplating pool and is isolated from being in direct contact with electroplating liquid through heat transfer of a heat transfer medium, high working efficiency of the electroplating pool is realized through simultaneous electroplating of multiple rows of cathode materials, solution is kept homogeneous and stable through circulating electroplating liquid, and high-quality PCB is obtained through controlling the high aspect ratio to realize PCB pulse VCP electroplating.

Drawings

Fig. 1 is a schematic top view of a pulse VCP electroplating apparatus for a high aspect ratio via PCB of the present utility model.

Fig. 2 is a schematic diagram of a side perspective structure of a pulse VCP electroplating apparatus for a high aspect ratio via PCB board according to the present utility model.

FIG. 3 is a schematic cross-sectional view of a VCP pulse plating cell of the high aspect ratio via PCB pulse VCP plating apparatus of the present utility model.

Fig. 4 is a schematic top view of a cathode plating connector of the pulse VCP plating apparatus for high aspect ratio via PCB of the present utility model.

Fig. 5 is a schematic side view of a cathode plating connector of the pulse VCP plating apparatus for high aspect ratio via PCB of the present utility model.

Fig. 6 is a schematic view 1 of a cathode plating connector part of a pulse VCP plating apparatus for a high aspect ratio via PCB board according to the present utility model.

Fig. 7 is a schematic view of a cathode plating connector part of the pulse VCP plating apparatus for high aspect ratio via PCB board of the present utility model in fig. 2.

In the figure: 1. VCP pulse electroplating pool; 2. an electric heater of the electroplating pool; 3. a plating solution circulating conveyor; 4. VCP pulse plating cathode controller; 5. VCP pulse plating anode controller; 6. electroplating an anode carrier basket; 7. electroplating a cathode mounting seat; 8. a cathode plating connector; 9. a plating solution circulating and conveying pipe; 10. delivering the electroplating solution to a filter head; 11. electroplating solution spray header; 12. cathode electroplating connecting slot; 13. the cathode is connected with the electromagnetic block by electroplating; 14. an insulating layer of the electroplating pool; 15. an electroplating solution bearing tank; 16. an electric heating pipe of the electroplating pool; 17. an electrothermal transmission medium; 18. a cathode electroplating connecting rod; 19. a cathode electroplating connector; 20. connecting permanent magnetic blocks; 21. cathode electroplating connecting wires; 22. electroplating a cathode mounting head; 23. the bottom surface of the electroplating pool is inclined.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1 and 2, a high aspect ratio via hole PCB pulse VCP plating apparatus includes a VCP pulse plating tank 1 provided with a plating tank inclined bottom surface 23, a plating tank electric heater 2 and a VCP pulse plating cathode controller 4 provided on a long side of the VCP pulse plating tank 1, and a plating solution circulation conveyor 3 and a VCP pulse plating anode controller 5 provided on a short side; the VCP pulse plating cathode controller 4 is electrically connected with the plating cathode mounting seat 7 and is electrically connected with the plating cathode mounting seat 7 on the opposite side through the cathode plating connector 8, the plating cathode mounting seat 7 comprises a plurality of cathode plating connecting slots 12 and cathode plating connecting electromagnetic blocks 13 symmetrically arranged on two sides of the cathode plating connecting slots 12, the VCP pulse plating anode controller 5 is electrically connected with a plating anode carrier basket 6 filled with plating anode materials, the plating solution circulating conveyor 3 is connected with a plating tank inclined bottom surface 23 of the VCP pulse plating tank 1 through a plating solution circulating conveying pipe 9 and a plating solution conveying filter head 10 on the input end side, the plating solution circulating conveying pipe 9 on the output end side of the plating solution circulating conveyor 3 enters the inside of the VCP pulse plating tank 1 from the top of the VCP pulse plating tank 1, and a plurality of plating solution spray heads 11 are taken by a passport on the plating solution circulating conveying pipe 9 inside the VCP pulse plating tank 1.

Referring to fig. 3, a VCP pulse electroplating device for a high aspect ratio via PCB board, wherein the VCP pulse electroplating cell 1 comprises a plating solution carrying cell 15 and a plating cell insulation layer 14 wrapped on the outer surface of the plating solution carrying cell 15, an electroplating cell electric heating tube 16 electrically connected with an electroplating cell electric heater 2 is disposed in the plating solution carrying cell 15, and the electroplating cell electric heating tube 16 is immersed in an electric heating transmission medium 17 filled in the electroplating solution carrying cell 15.

Referring to fig. 4-7, a pulse VCP electroplating device for a high aspect ratio via hole PCB board, the cathode electroplating connector 8 includes a cathode electroplating connecting rod 18 for suspending and electrically conducting a cathode material, cathode electroplating connectors 19 cooperating with a cathode electroplating connecting slot 12 and a cathode electroplating connecting electromagnetic block 13 are disposed on two sides of the cathode electroplating connecting rod 18, connecting permanent magnet blocks 20 are semi-embedded in the cathode electroplating connectors 19, the connecting permanent magnet blocks 20 are magnetically connected with the electrified cathode electroplating connecting electromagnetic block 13, a plurality of cathode electroplating connecting wires 21 with freely telescopic lengths are disposed on the lower side of the cathode electroplating connecting rod 18, and electroplating cathode mounting heads 22 electrically conducting with the cathode electroplating connecting wires 21 are mounted on the lower ends of the cathode electroplating connecting wires 21.

Working principle: adding the electroplating solution into the electroplating solution bearing pool 15 in the VCP pulse electroplating pool 1, starting the electroplating pool electric heater 2, starting the electroplating pool electric heating pipe 16 to perform electric heating operation, transferring heat to the electroplating solution in the electroplating solution bearing pool 15 through the electric heating transfer medium 17, and preventing the heat of the electroplating solution bearing pool 15 from being dissipated by the electroplating pool heat-insulating layer 14;

placing anode materials required by electroplating in an electroplating anode carrier basket 6, enabling the anode materials to be in contact with the electroplating anode carrier basket 6, installing a pole electroplating connector 8 on an electroplating cathode installation seat 7, electrically connecting a cathode electroplating connector 19 with a cathode electroplating connection slot 12, connecting a permanent magnet block 20 with a electrified cathode electroplating connection electromagnetic block 13 to be magnetically connected so as to fix the cathode electroplating connector 8 on the VCP pulse electroplating pool 1, installing the cathode materials on the cathode electroplating connector 8 through an electroplating cathode installation head 22, and adjusting the depth of the cathode materials immersed in electroplating liquid through a cathode electroplating connection wire 21;

starting the plating solution circulating conveyor 3, wherein the plating solution enters the plating solution circulating conveyor pipe 9 at the input end side of the plating solution circulating conveyor 3 from the plating solution conveying filter head 10 at the bottom surface of the plating solution bearing tank 15, enters the plating solution circulating conveyor 3, is pumped into the plating solution bearing tank 15 through the plating solution circulating conveyor pipe 9 at the output end side of the plating solution circulating conveyor 3, and finally is sprayed into the plating solution bearing tank 15 through the plating solution spray head 11;

starting the VCP pulse plating cathode controller 4 and the VCP pulse plating anode controller 5 to realize synchronous VCP pulse plating of anode materials and cathode materials, wherein the anode materials in the plating anode basket 6 are dissolved in plating liquid due to the fact that the anode materials are in direct contact with the conductive plating anode basket 6, insoluble impurities enter the plating tank inclined bottom surface 23 of the plating liquid bearing tank 15 through the plating anode basket 6 and are collected, and the cathodes obtain electrons to realize plating.

Example 2

This embodiment differs from embodiment 1 in that:

a pulse VCP electroplating device for a high aspect ratio via PCB board is characterized in that anode materials and cathode materials are immersed into electroplating liquid in an electroplating liquid bearing tank 15 in a hanging mode, and the anode materials or the cathode materials can be hung on the same cathode electroplating connector 8 at the same time or hung on the same cathode electroplating connector 8 at the same time.

According to the high-aspect ratio through hole PCB pulse VCP electroplating device, the electric heating pipe is arranged in the electroplating pool and is isolated from being in direct contact with the electroplating liquid through heat transfer of a heat transfer medium, the high working efficiency of the electroplating pool is realized through simultaneous electroplating of multiple rows of cathode materials, the solution is kept homogeneous and stable through circulating the electroplating liquid, the high-quality PCB is obtained through controlling the high-aspect ratio to realize PCB pulse VCP electroplating, the whole electroplating process is simple and easy to operate, the working efficiency and the electroplating effect are good, the electroplating layer quality is uniform, the thickness is flat, and the high practical and application values are realized.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high aspect ratio via PCB pulse VCP electroplating device is characterized in that: the electroplating device comprises a VCP pulse electroplating pool (1) provided with an electroplating pool inclined bottom surface (23), wherein an electroplating pool electric heater (2) and a VCP pulse electroplating cathode controller (4) are arranged on the long side of the VCP pulse electroplating pool (1), and an electroplating liquid circulating conveyor (3) and a VCP pulse electroplating anode controller (5) are arranged on the short side of the VCP pulse electroplating pool;

the VCP pulse plating cathode controller (4) is electrically connected with the plating cathode mounting seat (7) and is electrically connected with the plating cathode mounting seat (7) on the opposite side through the cathode plating connector (8), the plating cathode mounting seat (7) comprises a plurality of cathode plating connecting slots (12) and cathode plating connecting electromagnetic blocks (13) symmetrically arranged on two sides of the cathode plating connecting slots (12), and the VCP pulse plating anode controller (5) is electrically connected with a plating anode carrier basket (6) filled with plating anode materials.

2. The high aspect ratio via PCB pulse VCP plating apparatus of claim 1, wherein: the plating solution circulating conveyor (3) is connected with the plating tank inclined bottom surface (23) of the VCP pulse plating tank (1) through a plating solution circulating conveying pipe (9) and a plating solution conveying filter head (10) at the input end side.

3. The high aspect ratio via PCB pulse VCP plating apparatus of claim 2, wherein: the electroplating solution circulating and conveying pipe (9) at the output end side of the electroplating solution circulating and conveying device (3) enters the inside of the VCP pulse electroplating tank (1) from the top of the VCP pulse electroplating tank, and a plurality of electroplating solution spray heads (11) are taken by taking a passport on the electroplating solution circulating and conveying pipe (9) in the VCP pulse electroplating tank (1).

4. The high aspect ratio via PCB pulse VCP plating apparatus of claim 1, wherein: the VCP pulse electroplating tank (1) comprises an electroplating liquid bearing tank (15) and an electroplating tank heat insulation layer (14) wrapped on the outer surface of the electroplating liquid bearing tank (15).

5. The high aspect ratio via PCB pulse VCP plating apparatus of claim 4, wherein: an electroplating tank electric heating pipe (16) electrically connected with the electroplating tank electric heater (2) is arranged in the electroplating liquid bearing tank (15), and the electroplating tank electric heating pipe (16) is soaked in an electric heating transmission medium (17) filled in the electroplating liquid bearing tank (15).

6. The high aspect ratio via PCB pulse VCP plating apparatus of claim 1, wherein: the cathode electroplating connector (8) comprises a cathode electroplating connecting rod (18) which is hung and electrically connected with a cathode material, and cathode electroplating connectors (19) which are matched with the cathode electroplating connecting slots (12) and the cathode electroplating connecting electromagnetic blocks (13) are arranged on two sides of the cathode electroplating connecting rod (18).

7. The high aspect ratio via PCB pulse VCP plating apparatus of claim 6, wherein: the inside of the cathode electroplating connector (19) is semi-embedded with a connecting permanent magnet (20), and the connecting permanent magnet (20) is magnetically connected with the electrified cathode electroplating connecting electromagnetic block (13).

8. The high aspect ratio via PCB pulse VCP plating apparatus of claim 6, wherein: the lower side of the cathode electroplating connecting rod (18) is provided with a plurality of cathode electroplating connecting wires (21) with freely telescopic lengths, and the lower end of each cathode electroplating connecting wire (21) is provided with an electroplating cathode mounting head (22) electrically connected with each cathode electroplating connecting wire (21).