CN209779021U - Electroplating conductive contact structure - Google Patents
Electroplating conductive contact structure Download PDFInfo
- Publication number
- CN209779021U CN209779021U CN201920270028.5U CN201920270028U CN209779021U CN 209779021 U CN209779021 U CN 209779021U CN 201920270028 U CN201920270028 U CN 201920270028U CN 209779021 U CN209779021 U CN 209779021U
- Authority
- CN
- China
- Prior art keywords
- cathode
- cathode box
- box
- conductive copper
- common
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims abstract description 17
- 230000007306 turnover Effects 0.000 claims abstract description 6
- 238000005086 pumping Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplate conductive contact structure, including the pumping, pumping one side is equipped with the aqua storage tank, and the aqua storage tank is equipped with the cathode box business turn over pipe of being connected with the cathode box, and one side that the cathode box is close to the cathode box business turn over pipe is equipped with the rectifier cathode contact, is equipped with in the cathode box cavity and leads electrical copper spring and leads electrical copper with common negative, and the cathode box upper end is equipped with the conducting block, and the conducting block passes through the bolt to be connected with the anchor clamps connecting rod, and the lower extreme is equipped with anchor clamps in the middle of the anchor clamps connecting rod. The utility model has the advantages that: the cathode power supply transmits the common-cathode conductive copper through the cathode contact, the equipment runs for a long time, the common-cathode conductive copper is moved up and down through the common-cathode conductive copper spring, in order to cool the conductive copper in contact, water in the water storage tank is utilized in the cavity of the cathode box, the water in the water storage tank can be recycled, the water can be used for making the common-cathode conductive copper contact with the conductive blocks better than the conductor, and the conductive blocks arranged on each connecting rod are driven by the chain.
Description
Technical Field
The utility model relates to an electroplate the field, concretely relates to electroplate electrically conductive contact structure.
Background
The electroplating process is a process that metal ions in the plating solution are reduced into metal atoms through electrode reaction under the action of an external electric field, and metal deposition is carried out on a cathode. Therefore, the method is a metal electrodeposition process comprising the steps of liquid phase mass transfer, electrochemical reaction, electric crystallization and the like.
During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In mass production, the power supply of the cathode of the rectifier is generally transmitted to the common cathode conductive copper through the cathode contact of the rectifier, and the common cathode conductive copper is connected with the electrode through friction contact, so that the electroplating is sequentially completed in the transmission process. However, the temperature of the flashlight is too high in the production of the prior device. The device is easy to be damaged, so that the problem of untight contact can be caused, electric arcs are generated due to poor conductivity, and the quality of products is influenced due to the damage of the device.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides an electroplating conductive contact structure.
For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes: the utility model provides an electroplate conductive contact structure, includes the pumping, pumping one side is equipped with the aqua storage tank, the aqua storage tank is equipped with the cathode box business turn over pipe of being connected with the cathode box, the cathode box is close to one side of cathode box business turn over pipe is equipped with rectifier cathode contact, be equipped with totally negative conductive copper spring in the cathode box cavity, totally negative conductive copper spring upper end is equipped with totally negative conductive copper, the cathode box upper end is equipped with the conducting block, the conducting block passes through the bolt and is connected with the anchor clamps connecting rod, the lower extreme is equipped with anchor clamps in the middle of the anchor clamps connecting rod, anchor clamps connecting rod upper end both sides are equipped with the chain.
Preferably, one side of the water storage tank can be provided with a plurality of cathode box inlet and outlet pipes connected with the cathode box.
Preferably, the cathode box is of a cuboid structure, and the length of the box body can be increased according to requirements.
Preferably, the clamp connecting rods may be provided with a plurality of groups of connecting rods according to the length of the cathode box.
Preferably, the clamp connecting rod is connected with the clamp through at least two sets of fixing screws.
Preferably, three groups of common-cathode conductive copper springs are arranged in the cavity of the cathode box, where each group of the fixture connecting rods is connected with the cathode box, and two groups of common-cathode conductive copper are arranged on the common-cathode conductive copper springs.
Preferably, two sets of the rectifier cathode contacts are arranged on one side of the cathode box close to the cathode box inlet and outlet pipe.
The beneficial effects of the utility model are that
The cathode power supply of the rectifier is transmitted to the common cathode conductive copper through the cathode contact of the rectifier, the common cathode conductive copper is installed in the cathode box and needs to run for a long time due to equipment, in addition, in consideration of the good conductivity, the common cathode conductive copper enables the common cathode conductive copper to move up and down through the common cathode conductive copper spring and can be better contacted with the conductive block through moving up and down, in order to enable the conductive copper to be cooled in the contact process, water in a water storage tank is pumped into a cathode box inlet and outlet pipeline through a pump in a cavity of the cathode box to be cooled, the water in the water storage tank can be recycled, the common cathode conductive copper can be better contacted with the conductive block through the water as a conductor, the clamp is a single clamp, each clamp is respectively connected with the clamp connecting rods, and the conductive block arranged on each connecting rod is driven by a chain.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic side view of the present invention.
Fig. 3 is a schematic top view of the present invention.
Fig. 4 is a front view schematically illustrating the present invention.
Fig. 5 is an enlarged view in the cavity of the cathode box of the present invention.
Reference numerals
1. The device comprises a clamp, 2, a cathode box, 3, a chain, 4, a clamp connecting rod, 5, a conductive block, 6, common cathode conductive copper, 7, a common cathode conductive copper spring, 8, a rectifier cathode contact, 9, a cathode box inlet and outlet pipeline, 10, a water storage tank, 11 and a pump.
Detailed Description
The power supply of a cathode of the rectifier is transmitted to the common-cathode conductive copper through a cathode contact of the rectifier, the common-cathode conductive copper is installed in the cathode box, the common-cathode conductive copper enables the common-cathode conductive copper to move up and down through a common-cathode conductive copper spring, water in a water storage tank is pumped into a cathode box inlet and outlet pipeline through a pump in a cavity of the cathode box to cool, the water is a conductor to enable the common-cathode conductive copper to be in contact with conductive blocks better, the clamp is a single clamp, each clamp is connected with a clamp connecting rod respectively, and the conductive blocks arranged on each connecting rod are driven by chains.
Examples
As shown in fig. 1-5, an electroplating conductive contact structure comprises a pump 11, a water storage tank 10 is arranged on one side of the pump 11, the water storage tank 10 is provided with a cathode box inlet and outlet pipe 9 connected with a cathode box 2, one side of the cathode box 2 close to the cathode box inlet and outlet pipe 9 is provided with a rectifier cathode contact 8, a common cathode conductive copper spring 7 is arranged in a cavity of the cathode box 2, common cathode conductive copper 6 is arranged at the upper end of the common cathode conductive copper spring 7, a conductive block 5 is arranged at the upper end of the cathode box 2, the conductive block 5 is connected with a clamp connecting rod 4 through a bolt, a clamp 1 is arranged at the middle lower end of the clamp connecting rod 4, and chains 3 are respectively arranged.
Preferably, a plurality of cathode can inlet and outlet pipes 9 connected to the cathode can 2 may be provided at one side of the water storage tank 10.
Preferably, the cathode box 2 is a rectangular parallelepiped structure, and the length of the box body can be increased as required.
Preferably, the clamp connection rods 4 may be provided with a plurality of sets of connection rods according to the length of the cathode can 2.
Preferably, the clamp connection rod 4 is connected with the clamp 1 by at least two sets of fixing screws.
Preferably, three groups of common-cathode conductive copper springs 7 are arranged in the cavity of the cathode box 2, which is connected with the cathode box 2, of each group of clamp connecting rods 4, and two groups of common-cathode conductive copper 6 are arranged on the common-cathode conductive copper springs 7.
Preferably, two sets of commutator cathode contacts 8 are provided on the cathode box 2 on the side close to the cathode box inlet/outlet tube 9.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An electroplated conductive contact structure comprising a pump (11), characterized in that: pump (11) one side is equipped with aqua storage tank (10), aqua storage tank (10) are equipped with cathode box business turn over pipe (9) be connected with cathode box (2), cathode box (2) are close to one side of cathode box business turn over pipe (9) is equipped with rectifier cathode contact (8), be equipped with totally negative conductive copper spring (7) in the cathode box (2) cavity, totally negative conductive copper spring (7) upper end is equipped with totally negative conductive copper (6), cathode box (2) upper end is equipped with conducting block (5), conducting block (5) are connected with anchor clamps connecting rod (4) through the bolt, the lower extreme is equipped with anchor clamps (1) in the middle of anchor clamps connecting rod (4), anchor clamps connecting rod (4) upper end both sides are equipped with chain (3) respectively.
2. The electroplated conductive contact structure of claim 1, wherein: one side of the water storage tank (10) can be provided with a plurality of cathode box inlet and outlet pipes (9) connected with the cathode box (2).
3. The electroplated conductive contact structure of claim 1, wherein: the cathode box (2) is of a cuboid structure, and the length of the box body can be increased according to requirements.
4. The electroplated conductive contact structure of claim 1, wherein: the clamp connecting rods (4) can be provided with a plurality of groups of connecting rods according to the length of the cathode box (2).
5. The plated conductive contact structure of claim 4, wherein: the clamp connecting rod (4) is connected with the clamp (1) through at least two groups of fixing screws.
6. The plated conductive contact structure of claim 4, wherein: every group anchor clamps connecting rod (4) with cathode box (2) are connected all be equipped with three groups in cathode box (2) cavity totally negative conductive copper spring (7), totally negative conductive copper spring (7) are gone up all to be equipped with two sets of totally negative conductive copper (6).
7. The plated conductive contact structure of claim 4, wherein: and two groups of rectifier cathode contacts (8) are arranged on one side of the cathode box (2) close to the cathode box inlet and outlet pipe (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920270028.5U CN209779021U (en) | 2019-03-04 | 2019-03-04 | Electroplating conductive contact structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920270028.5U CN209779021U (en) | 2019-03-04 | 2019-03-04 | Electroplating conductive contact structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209779021U true CN209779021U (en) | 2019-12-13 |
Family
ID=68796318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920270028.5U Expired - Fee Related CN209779021U (en) | 2019-03-04 | 2019-03-04 | Electroplating conductive contact structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209779021U (en) |
-
2019
- 2019-03-04 CN CN201920270028.5U patent/CN209779021U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191213 |