CN219204353U - Power module and electronic equipment - Google Patents

Abstract

The application provides a power module and electronic equipment, the power module includes: an insulating and heat conducting substrate, which is provided with a first surface and a second surface which are opposite; the first metal layer is located the first surface, and the first metal layer includes at least: a first port block, a second port block, a third port block, and a buffer circuit block; the buffer circuit block is positioned between the first port block and the third port block; the first port block, the second port block and the third port block are used for fixedly connecting the power component and being used as ports for connecting an external circuit, and the buffer circuit block is used for fixedly connecting the buffer circuit component; the buffer circuit block includes: a first side and a second side opposite in a first direction; third and fourth sides opposite in the second direction; the first port block is disposed opposite the first side, the third port block is disposed opposite the second side, and the second port block is disposed opposite the third side.

Description

Power module and electronic equipment

Technical Field

The present disclosure relates to the field of semiconductor technologies, and in particular, to a power module and an electronic device.

Background

In the working process of a power electronic system, a switching process of a power semiconductor device is generally existed, and along with the changing process of a current path in the system, rapid changing voltage and current exist on the current path in the system in the process, and the rapid changing voltage and current are coupled with parasitic inductance of the current path, so that the problems of voltage/current overshoot, waveform oscillation and the like can be caused, the power stress borne by the power semiconductor device is increased, and the failure risk is increased. Meanwhile, the switching loss is increased, and the working efficiency of the system is reduced.

To cope with this problem, a buffer circuit is generally added to the system, and the buffer circuit is generally disposed on an external PCB circuit board, which occupies a large space and is further away from the internal semiconductor element, thereby degrading the performance of the buffer circuit.

The existing installation scheme of the buffer circuit aiming at the power module has the problems that the parasitic inductance is introduced for a long wire distance to reduce the performance of the device, the device cannot be close to a switching element, and the occupied space is large.

Disclosure of Invention

In view of this, the present application provides a power module and an electronic device, and the scheme is as follows:

a power module, comprising:

an insulating and heat conducting substrate, which is provided with a first surface and a second surface which are opposite;

a first metal layer, the first metal layer being located on the first surface, the first metal layer at least comprising: a first port block, a second port block, a third port block, and a buffer circuit block;

the buffer circuit block is located between the first port block and the third port block;

the first port block, the second port block and the third port block are used for fixedly connecting a power component and being ports for connecting an external circuit, and the buffer circuit block is used for fixedly connecting a buffer circuit component;

the buffer circuit block includes: a first side and a second side opposite in a first direction; third and fourth sides opposite in the second direction; the first port block is disposed opposite to the first side, the third port block is disposed opposite to the second side, and the second port block is disposed opposite to the third side.

Preferably, in the above power module, the diode in the buffer circuit assembly is an unpackaged die, a bottom of the die is fixed and electrically connected with the buffer circuit block, and a top of the die is electrically connected with the corresponding port block through a lead.

Preferably, in the above power module, the power assembly includes: a first leg power assembly fixedly connected to the first port block and a second leg power assembly fixedly connected to the third port block;

the first port block is used as a first direct current input end and is connected with a positive terminal of a power supply; the second port block is used as a second direct current input end and is connected with a negative terminal of the power supply; the third port block is used as an alternating current output end and is used for being connected with an output terminal.

Preferably, in the above power module, the first bridge arm power assembly and the second bridge arm power assembly each include at least one power chip; the bottom surface of the power chip is provided with a first pole, and the top surface of the power chip is provided with a second pole and a grid electrode;

for the first bridge arm power assembly, the bottom surface of the power chip is fixed on the first port block, so that a first pole of the power chip is connected with the first port block, and a second pole of the power chip is connected with the third port block;

for the second bridge arm power assembly, the bottom surface of the power chip is fixed on the third port block, so that the first pole of the power chip is connected with the third port block, and the second pole of the power chip is connected with the second port block.

Preferably, in the above power module, the first port block, the third port block, and the second port block are sequentially arranged in the first direction.

Preferably, in the above power module, the third port block has opposite first and second ends in the second direction;

in the second direction, the output terminal is opposite to the first end, the power supply positive terminal is opposite to the end of the first port block, which is away from the first end, and the power supply negative terminal is opposite to the end of the second port block, which is away from the first end.

Preferably, in the above power module, the third port block has opposite first and second ends in a second direction;

in the second direction, the output terminal is disposed opposite the first end;

the buffer circuit component is respectively connected with the first port block, the second port block and the third port block based on the buffer circuit block.

Preferably, in the above power module, the buffer circuit block includes: a first buffer circuit block and a second buffer circuit block disposed opposite to each other in the second direction;

the snubber circuit assembly includes: a first buffer circuit, the first buffer circuit being connected to the first port block, the second port block, and the third port block, respectively, based on the first buffer circuit block; the second buffer circuit is connected with the first port block, the second port block and the third port block based on the second buffer circuit block.

Preferably, in the above power module, the first buffer circuit includes a first resistor, a first capacitor, and a first diode; the two ends of the first resistor are respectively attached to the first buffer circuit block and the second port block, the two ends of the first capacitor are respectively attached to the first port block and the first buffer circuit block, and the first diode is connected between the first buffer circuit block and the third port block;

the second buffer circuit comprises a second resistor, a second capacitor and a second diode; the two ends of the second resistor are respectively in surface-mounted connection with the first port block and the second buffer circuit block, the two ends of the second capacitor are respectively in surface-mounted connection with the second buffer circuit block and the second port block, and the second diode is connected between the second buffer circuit block and the third port block.

An electronic device comprising a power module as claimed in any one of the preceding claims.

Based on the above description, the present application provides a power module and an electronic device, where the power module is provided with the first port block and the first side opposite to each other, the third port block and the second side opposite to each other, and the second port block and the third side opposite to each other, that is, the buffer circuit block is disposed at a junction position of three port blocks, so that the buffer circuit block and each port block have a shorter distance, and the length of a connection lead between the buffer circuit block and each port block is reduced; and the power module integrates the power component and the buffer circuit component on the same insulating heat conducting substrate, so that the integration level can be improved, the size of the power module is reduced, the buffer circuit component can also multiplex the heat dissipation design of the power module to dissipate heat, and meanwhile, the distance between the power component and the buffer circuit component is short, and the effect of the buffer circuit component is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the provided drawings without inventive effort to those skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and should not be construed as limiting the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, which would otherwise be used by those skilled in the art, would not have the essential significance of the present disclosure, would not affect the efficacy or otherwise be achieved, and would still fall within the scope of the present disclosure.

Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of another power module according to an embodiment of the present disclosure;

fig. 3 is a schematic circuit diagram of a power module according to an embodiment of the present application;

FIG. 4 is a cut-away view of the power module shown in FIG. 2 at A-A';

fig. 5 is a schematic structural diagram of another power module according to an embodiment of the present application.

Detailed Description

Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which it is shown, and in which it is evident that the embodiments described are exemplary only some, and not all embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the utility model briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a power module according to an embodiment of the present application, and according to fig. 1, there is provided a power module including:

an insulating and thermally conductive substrate 10 having opposite first and second surfaces;

a first metal layer 11, the first metal layer 11 is located on the first surface, and the first metal layer 11 at least includes: a first port block 111, a second port block 112, a third port block 113, and a buffer circuit block 13;

the buffer circuit block 13 is located between the first port block 111 and the third port block 113;

the first port block 111, the second port block 112 and the third port block 113 are used for fixedly connecting the power component 21 and being ports for connecting external circuits, and the buffer circuit block 13 is used for fixedly connecting the buffer circuit component 14;

the buffer circuit block 13 includes: a first side and a second side opposite in a first direction X; third and fourth sides opposite in the second direction Y; the first port block 111 is disposed opposite to the first side, the third port block 113 is disposed opposite to the second side, and the second port block 112 is disposed opposite to the third side.

The first direction X is perpendicular to the second direction Y, and is parallel to the plane of the insulating and heat-conducting substrate 10.

By providing the patterned first metal layer 11 on the first surface, so that the first port block 111 is disposed opposite to the first side, the third port block 113 is disposed opposite to the second side, and the second port block 112 is disposed opposite to the third side, that is, the buffer circuit block 13 is disposed at an intersection position of three port blocks, so that the buffer circuit block 13 and each port block have a shorter distance, the length of a connection lead between the buffer circuit block 13 and each port block is reduced, the connection distance between each block is reduced, the length of the connection lead is reduced, the influence of parasitic inductance in the lead on the power module is reduced, and the energy loss of the power module is also reduced.

In addition, the power components 21 are respectively and fixedly connected to the port blocks, and the buffer circuit components 14 are fixedly connected to the buffer circuit blocks 13, so that the number of connecting wires is reduced, parasitic inductance is reduced, and the size of the device is reduced.

Moreover, the power module integrates the power assembly 21 and the buffer circuit assembly 14 on the same insulating heat conducting substrate 10, so that the integration level can be improved, the size of the power module is reduced, the buffer circuit assembly 14 can also multiplex the heat dissipation design of the power module to dissipate heat, and meanwhile, the distance between the power assembly 21 and the buffer circuit assembly 14 is short, so that the effect of the buffer circuit assembly is improved.

In the power module provided in the embodiment of the present application, the diode in the buffer circuit assembly 14 is an unpackaged die, the bottom of the die is fixed to and electrically connected with the buffer circuit block, and the top of the die is electrically connected with the corresponding port block through a lead.

Through the diode that adopts bare chip for the bottom electrode of diode directly with first metal layer 11 contact, can be timely with a large amount of heat export that the diode produced in the course of the work has improved radiating efficiency, makes buffer circuit subassembly 14 can provide higher buffering effect, for power module 21 provides better protection effect. And the bottom electrode of the diode is directly and fixedly connected with one block in the first metal layer 11, the top electrode can be connected with other blocks in the first metal layer 11 through a lead wire, circuit interconnection in the power module can be realized based on a bare chip diode structure with the top electrode opposite to the bottom electrode, and the relative positions of two electrodes in the diode can be changed without adopting a packaged diode.

Referring to fig. 2, fig. 2 is a schematic structural diagram of another power module according to an embodiment of the present application. As shown in fig. 2, in the above-described power module, the power assembly 21 includes: a first leg power assembly 211 fixedly connected to the first port block 111 and a second leg power assembly 212 fixedly connected to the third port block 113; wherein the first port block 111 is used as a first dc input terminal for connecting with the positive terminal 24 of the power supply; the second port block 112 is used as a second direct current input end and is used for being connected with the power supply negative terminal 25; the third port block 113 serves as an ac output terminal for connection to the output terminal 26.

The first port block 111 is connected to the positive power supply terminal 24, the second port block 112 is connected to the negative power supply terminal 25, the third port block 113 is connected to the output terminal 26, and the first port block 111, the second port block 112 and the third port block 113 are spaced apart from each other so that the three are not connected to each other, and the three port areas are respectively connected to the power supply terminal and the output terminal 26, so that it is ensured that each port block has one terminal connected thereto. In this embodiment, the connection mode between the port block and each terminal may be selected based on the requirement, and the connection between the first port block 111 and the power supply positive terminal 24 is taken as an example, and the connection between the first port block 111 and the power supply positive terminal 24 may be an aluminum wire or a copper wire bonding, or may be any one of ultrasonic welding, reflow welding, laser welding, or the like, so that the power supply positive terminal 24 and the first port block 111 may be directly welded together.

As shown in fig. 2, in the above-described power module, the first arm power assembly 211 and the second arm power assembly 212 each include at least one power chip 20; the bottom surface of the power chip 20 is provided with a first pole, and the top surface is provided with a second pole and a grid electrode; for the first bridge arm power component 211, the bottom surface of the power chip 20 is fixed on the first port block 111, so that the first pole of the power chip 20 is connected with the first port block 111, and the second pole of the power chip 20 is connected with the third port block 113; for the second bridge arm power component 212, the bottom surface of the power chip 20 is fixed on the third port block 113, so that the first pole of the power chip 20 is connected with the third port block 113, and the second pole of the power chip 20 is connected with the second port block 112.

The first bridge arm power assembly 211 and the second bridge arm power assembly 212 each comprise at least one power chip 20, wherein the power chip 20 may use a MOSFET chip or an IGBT chip. When the power chip 20 is a MOSFET chip, the first pole is a source electrode, the second pole is a drain electrode, and when the power chip is an IGBT chip, the first pole is a collector electrode, and the second pole is an emitter electrode. In this embodiment, the connection mode of the power chip 20 and the corresponding port block may be selected based on the requirement, taking the mounting mode of the power chip 20 in the first bridge arm power assembly 211 as an example, the first pole of the power chip 20 may be mounted on the first port block 111 through any one of the mounting processes such as silver paste welding, solder paste reflow welding, silver sintering, etc., and the second pole of the power chip 20 may be connected with the third port block 113 through any one of the processes such as wire bonding, copper sheet welding, etc. The bonding wire in the wire bonding can be any one of gold wires, copper wires or aluminum wires and other metal leads.

In the above-described power module, the first port block 111, the third port block 113, and the second port block 112 are sequentially arranged in the first direction X.

Since the first bridge arm power component 211 is located on the first port block 111, the second bridge arm power component 212 is located on the third port block 113, and the second pole of the power chip 20 in the first bridge arm power component 211 is connected with the third port block 113, and the second pole of the power chip 20 in the second bridge arm power component 212 is connected with the second port block 112, when the first port block 111, the third port block 113 and the second port block 112 are sequentially arranged in the first direction X, the distance between the second pole of the power chip 20 and the corresponding connection port is shortest, and transmission loss is reduced. At the same time, the space on the insulating and heat conducting substrate 10 can be utilized to the maximum extent, and the heat generated by the power components 21 located in the first port area and the third port area in the working process can be conducted out rapidly.

In the power module described above, the third port block 113 has opposite first and second ends in the second direction Y; in the second direction Y, the output terminal 26 is disposed opposite to the first end, the power positive terminal 24 is disposed opposite to an end of the first port block 111 facing away from the first end, and the power negative terminal 25 is disposed opposite to an end of the second port block 112 facing away from the first end.

Placing the power supply positive terminal 24 and the power supply negative terminal 25 on the same side reduces the distance between the positive and negative electrodes and thus reduces the magnitude of parasitic inductance inside the circuit, thereby improving the performance of the power module.

In the power module described above, the third port block has opposite first and second ends in the second direction Y; in the second direction Y, the output terminal 26 is disposed opposite to the first end; the buffer circuit assembly 14 is connected to the first port block 111, the second port block 112, and the third port block 113 based on the buffer circuit block 13, respectively.

Since the buffer circuit assembly 14 is placed based on the buffer circuit block 13, when the buffer circuit block 13 is disposed between the first port block 111 and the second port block 112 and is close to the power supply positive terminal 24 and the power supply negative terminal 25, the distance between the buffer circuit assembly 14 and the power supply is shortest, and the distance between the power assembly 21 and the buffer circuit assembly 14 is also shorter, at this time, parasitic inductance inside the power module is minimized, and the influence on the device is minimized.

In the above-described power module, the buffer circuit block 13 includes: a first buffer circuit block 131 and a second buffer circuit block 132 disposed opposite to each other in the second direction Y; the snubber circuit assembly 14 includes: a first buffer circuit 22, the first buffer circuit 22 being connected to the first port block 111, the second port block 112, and the third port block 113 based on the first buffer circuit block 131, respectively; the second buffer circuit 23 is connected to the first port block 111, the second port block 112 and the third port block 113 based on the second buffer circuit block 132.

The first buffer circuit block 131 and the second buffer circuit block 132 are located near the power supply positive terminal 24 and the power supply negative terminal 25, and the first buffer circuit 22 connects the first port block 111, the second port block 112 and the third port block 113 based on the first buffer circuit block 131, so that the buffer circuit block 13 is disposed at the junction of the first port block 111, the second port block 112 and the third port block 113. At this time, the distances between the first buffer circuit block 131 and the second buffer circuit block 132 and the first port block 111, the second port block 112, and the third port block 113 are the shortest, the required connection harness is the shortest, and the parasitic inductance is the smallest, and the influence thereof is the lowest. And the distance between the buffer circuit assembly 14 and the power assembly is shortest, so that the absorption effect of the first buffer circuit 22 and the second buffer circuit 23 on parasitic inductance in the main circuit is enhanced, and the devices of the main circuit are protected.

In the embodiment of the application, the buffer circuit component adopts a discharge suppression RCD buffer circuit component, and the discharge suppression RCD buffer circuit component can absorb current oscillation generated by the power component in a discharge process, so that a circuit is protected. The buffer circuit assembly is not limited to the discharge suppression RCD buffer circuit assembly, and may be selected based on requirements, such as an RC buffer circuit assembly, and the like, and the buffer circuit assemblies are described as discharge suppression RCD buffer circuit assemblies in the following description.

Referring to fig. 2-3, fig. 3 is a schematic circuit diagram of a power module according to an embodiment of the present application. Fig. 3 illustrates a circuit configuration of the power module by taking a parallel configuration using a MOSFET chip and a power diode as the power component 21 as an example. As shown in fig. 2-3, in the above-described power module, the first buffer circuit 22 includes a first resistor 222, a first capacitor 221, and a first diode 223; the two ends of the first resistor 222 are respectively attached to the first buffer circuit block 131 and the second port block 112, the two ends of the first capacitor 221 are respectively attached to the first port block 111 and the first buffer circuit block 131, and the first diode 223 is connected between the first buffer circuit block 131 and the third port block 113; the second buffer circuit 23 includes a second resistor 232, a second capacitor 231, and a second diode 233; the two ends of the second resistor 232 are respectively connected with the first port block 111 and the second buffer circuit block 132 in a mounting manner, the two ends of the second capacitor 231 are respectively connected with the second buffer circuit block 132 and the second port block 112 in a mounting manner, and the second diode 233 is connected between the second buffer circuit block 132 and the third port block 113.

The first buffer circuit 22 includes a first resistor 222, a first capacitor 221, and a first diode 223. The first resistor 222 is used for connecting the first port block 111 with the first buffer circuit block 131, the first capacitor 221 is used for connecting the first buffer circuit block 131 with the second port block 112, and the first diode 223 is used for connecting the first buffer circuit block 131 with the third port block 113. By providing the first snubber circuit 22 and the second snubber circuit 23, peak oscillation of current and voltage generated by the first bridge arm power component 211 and the second bridge arm power component 212 during the switching process due to parasitic inductance is absorbed. Taking the first buffer circuit 22 as an example, when the first bridge arm power component 211 is turned off, the energy stored in the parasitic inductance inside the first bridge arm power component will be quickly released to generate peak oscillation of current and voltage, and due to the existence of the first diode 223, the generated oscillation current will quickly flow to the first capacitor 221 through the first diode 223 and be absorbed by the first capacitor 221. When the first bridge arm power component 211 is turned on, the energy stored in the first capacitor 221 is released in the form of current, and the current released by the first capacitor 221 is limited to a lower level due to the first resistor 222, and the first resistor 222 is also used for absorbing the energy released by the first capacitor 221, so as to reduce the influence on the power module. The two groups of buffer circuits 14 are arranged, so that peak oscillation of current and voltage generated in the switching process of the power component 21 can be well absorbed, and the third capacitor N1 is connected in parallel to two sides of the power supply and is used for absorbing peak oscillation of current and voltage generated by parasitic inductance between the power supply and the power component 21.

Referring to fig. 4, fig. 4 is a cut-away view of the power module at A-A' shown in fig. 2, and according to fig. 4, in order to improve the heat dissipation efficiency of the power module, in the above-described power module, the second surface has a second metal layer 30 for making the power module thermally contact with a heat sink.

The power component 21 and the buffer circuit component 14 in the power module generate a large amount of heat during the operation, and due to the effect of the insulating and heat conducting substrate 10, the heat can be quickly transferred to the second metal layer 30, and the heat is dissipated through the radiator located on the second metal layer 30, so that the power component 21 and the buffer circuit component 14 can operate at a lower temperature.

In the above-described power module, the insulating and heat conducting substrate 10 is a ceramic substrate. The ceramic substrate may be made of any one of silicon carbide, alumina, etc., and has good insulation and heat conduction properties, so that heat generated by the power component 21 and the buffer circuit component 14 during operation can be quickly conducted to the second metal layer 30, and the heat dissipation efficiency is improved by the second metal layer 30 and the heat sink thermally connected to the second metal layer 30.

The ceramic substrate has excellent heat conducting performance, and can better conduct heat away when the ceramic substrate is adopted, so that more power components 21 with larger heating value can be integrated on the ceramic substrate. Meanwhile, the ceramic substrate has better insulating property and lower thermal resistance, and can realize a new packaging and assembling method, so that the power module has better integration effect and smaller volume.

Referring to fig. 2 and fig. 5, a schematic structural diagram of another power module according to an embodiment of the present application is provided. As shown in fig. 2 and 5, in the above-described power module, one end of the first diode 223 is mounted on the surface of the first buffer circuit block 131, and the other end is connected to the third port block, or one end of the first diode 223 is mounted on the surface of the third port block 113, and the other end is connected to the first buffer circuit block 131; one end of the second diode 233 is mounted on the surface of the second buffer circuit block 132, and the other end is connected to the third port block, or one end of the second diode 233 is mounted on the surface of the third port block 113, and the other end is connected to the second buffer circuit block 132.

In fig. 2, one end of the first diode 223 is mounted on the surface of the third port block 113, and the other end is connected to the first buffer circuit block 131. The second diode 233 is mounted on the surface of the second buffer circuit block 132, and the other end is connected to the third port block 113. In fig. 5, the first diode 223 is mounted on the surface of the first buffer circuit block 131, the other end is connected to the third port block 113, and the second diode 233 is mounted on the surface of the third port block 113, the other end is connected to the second buffer circuit block 132. In the power module provided in the present application, the positions of the first buffer circuit block 131 and the second buffer circuit block 132 may be interchanged, and the positions of the first diode 223 and the second diode 233 may also be interchanged at will. The layout structure of the buffer circuit is not limited to the layout structure shown in fig. 2 and 5, and the layout structure of the buffer circuit described above can be used only by providing the first port block 111, the second port block 112 and the third port block 113 with a junction.

Since the third port block 113 is connected to both the first arm power component 211 and the second arm power component 212, in order to ensure the normal operation of the circuit, the power component 21 is not shorted, the anode of the first diode 223 is connected to the first buffer circuit block 131, the cathode is connected to the third port block 113, the anode of the second diode 233 is connected to the third port block 113, and the cathode is connected to the second buffer circuit block 132. In this embodiment, the connection mode of the diode and the first metal layer 11 may be selected based on the requirement, taking the connection mode of the first diode 223 as an example, when one end of the first diode 223 is attached to the surface of the first buffer circuit block 131 and the other end is connected to the third port block 113, the connection between the first diode 223 and the third port block 113 may be performed by any one of connection modes such as wire bonding, copper sheet welding, and conductive film welding.

In this embodiment, the resistor, the capacitor, the diode and the power chip 20 are all directly attached to the first metal layer 111, and then packaged, so that the heat dissipation capability of each element is enhanced, and the power component 21 and the buffer circuit component 14 can be maintained to operate at a lower temperature, so that the same function can be realized by adopting smaller package and fewer parallel numbers. The process adopted for packaging the capacitor, the resistor and the diode is consistent with the processes of chip mounting, wire bonding, encapsulation and the like used by the power chip 20, so that the addition of the buffer circuit does not add extra working procedures in production, and has good production adaptability.

In the power module described above, the first metal layer 11 further includes a first gate block 121 and a second gate block 122; the gate of the power chip 20 in the first bridge arm power component 211 is connected to the first gate block 121; the gate of the power chip 20 in the second bridge arm power assembly 212 is connected to the second gate block 122.

In this embodiment, the connection manner between the power chip 20 and the gate block 12 may be selected according to the requirement, and the first gate region and the gate connection of the power chip 20 in the first bridge arm power component 211 are taken as an example, and any one of wire bonding, copper sheet welding, and the like may be used to connect the gate of the power chip 20 and the first gate block 121, where when the wire bonding connection is adopted, the bonding wire may be any one of an aluminum wire, a copper wire, or a gold wire. In the following embodiments, the power chip 20 and the gate block 12 are all described by wire bonding.

In the above-described power module, the first port block 111, the third port block 113, and the second port block 112 are sequentially arranged in the first direction X; the first direction X is parallel to the insulating and heat conducting substrate 10; in the first direction X, the first gate block 121 is located on a side of the first port block 111 facing away from the third port block 113, and the second gate block 122 is located on a side of the second port block 112 facing away from the third port block 113.

Since the first power component 21 and the second power component 21 are respectively located on the first port block 111 and the third port block 113, when the first port block 111, the second port block 112 and the third port block 113 are connected side by side in the first direction X, the distance between the power component 21 and the gate block 12 can be reduced, so that the bonding wire distance connecting the power component 21 and the corresponding gate block 12 is shortened, and the influence of parasitic inductance is reduced. The gate block 12, the first port block 111, the second port block 112, the third port block 113, the first buffer circuit block 131 and the second buffer circuit block 132 form a rectangular area, and are thermally connected to the insulating and heat conducting substrate 10, so that the upper surface of the insulating and heat conducting substrate is utilized to the greatest extent. So that the insulating and heat conducting substrate 10 can lead out the heat generated by the power module in operation at the highest speed. The power module is ensured to operate at a lower temperature.

The present application provides an electronic device comprising any of the power modules described above. The electronic equipment can be various electronic equipment with power modules, such as mobile phones, computers, intelligent wearable equipment and the like.

The power module introduced in the embodiment is adopted in the electronic equipment, voltage, current peak and oscillation generated by parasitic inductance in the moment of switching of the electronic equipment can be well restrained, and the electronic equipment has smaller volume, longer service life and lower working temperature.

In the present specification, each embodiment is described in a progressive manner, or a parallel manner, or a combination of progressive and parallel manners, and each embodiment is mainly described as a difference from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the method disclosed in the embodiment, since it corresponds to the device disclosed in the embodiment, the description is relatively simple, and the relevant points are referred to the device part description.

It is noted that in the description of the present application, it is to be understood that the drawings and descriptions of the embodiments are illustrative and not restrictive. Like reference numerals refer to like structures throughout the embodiments of the specification. In addition, the drawings may exaggerate the thicknesses of some layers, films, panels, regions, etc. for understanding and ease of description. It will also be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present. In addition, "on …" refers to positioning an element on or under another element, but not essentially on the upper side of the other element according to the direction of gravity.

The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used for convenience in describing and simplifying the present application based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or apparatus that comprises such element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A power module, comprising:

an insulating and heat conducting substrate, which is provided with a first surface and a second surface which are opposite;

a first metal layer, the first metal layer being located on the first surface, the first metal layer at least comprising: a first port block, a second port block, a third port block, and a buffer circuit block;

the buffer circuit block is located between the first port block and the third port block;

the first port block, the second port block and the third port block are used for fixedly connecting a power component and being ports for connecting an external circuit, and the buffer circuit block is used for fixedly connecting a buffer circuit component;

the buffer circuit block includes: a first side and a second side opposite in a first direction; third and fourth sides opposite in the second direction; the first port block is disposed opposite to the first side, the third port block is disposed opposite to the second side, and the second port block is disposed opposite to the third side.

2. The power module of claim 1 wherein the diodes in the buffer circuit assembly are unpackaged die, a bottom of the die is fixed and electrically connected to the buffer circuit block, and a top of the die is electrically connected to the corresponding port block by leads.

3. The power module of claim 1, wherein the power assembly comprises: a first leg power assembly fixedly connected to the first port block and a second leg power assembly fixedly connected to the third port block;

the first port block is used as a first direct current input end and is connected with a positive terminal of a power supply; the second port block is used as a second direct current input end and is connected with a negative terminal of the power supply; the third port block is used as an alternating current output end and is used for being connected with an output terminal.

4. The power module of claim 3, wherein the first leg power assembly and the second leg power assembly each comprise at least one power chip; the bottom surface of the power chip is provided with a first pole, and the top surface of the power chip is provided with a second pole and a grid electrode;

for the first bridge arm power assembly, the bottom surface of the power chip is fixed on the first port block, so that a first pole of the power chip is connected with the first port block, and a second pole of the power chip is connected with the third port block;

for the second bridge arm power assembly, the bottom surface of the power chip is fixed on the third port block, so that the first pole of the power chip is connected with the third port block, and the second pole of the power chip is connected with the second port block.

5. The power module of claim 4, wherein the first port block, the third port block, and the second port block are arranged in sequence in the first direction.

6. The power module of claim 5, wherein the third port block has opposite first and second ends in the second direction;

in the second direction, the output terminal is opposite to the first end, the power supply positive terminal is opposite to the end of the first port block, which is away from the first end, and the power supply negative terminal is opposite to the end of the second port block, which is away from the first end.

7. The power module of claim 4, wherein the third port block has opposite first and second ends in the second direction;

in the second direction, the output terminal is disposed opposite the first end;

the buffer circuit component is respectively connected with the first port block, the second port block and the third port block based on the buffer circuit block.

8. The power module of claim 7, wherein the buffer circuit block comprises: a first buffer circuit block and a second buffer circuit block disposed opposite to each other in the second direction;

the snubber circuit assembly includes: a first buffer circuit connected to the first port block, the second port block, and the third port block, respectively, based on the first buffer circuit block; and the second buffer circuit is respectively connected with the first port block, the second port block and the third port block based on the second buffer circuit block.

9. The power module of claim 8, wherein the first buffer circuit comprises a first resistor, a first capacitor, and a first diode; the two ends of the first resistor are respectively attached to the first buffer circuit block and the second port block, the two ends of the first capacitor are respectively attached to the first port block and the first buffer circuit block, and the first diode is connected between the first buffer circuit block and the third port block;

the second buffer circuit comprises a second resistor, a second capacitor and a second diode; the two ends of the second resistor are respectively in surface-mounted connection with the first port block and the second buffer circuit block, the two ends of the second capacitor are respectively in surface-mounted connection with the second buffer circuit block and the second port block, and the second diode is connected between the second buffer circuit block and the third port block.

10. An electronic device comprising a power module as claimed in any one of claims 1-9.

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