CN219203126U - Loading tool for small-size chips - Google Patents
Loading tool for small-size chips Download PDFInfo
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- CN219203126U CN219203126U CN202223105115.6U CN202223105115U CN219203126U CN 219203126 U CN219203126 U CN 219203126U CN 202223105115 U CN202223105115 U CN 202223105115U CN 219203126 U CN219203126 U CN 219203126U
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- 239000013078 crystal Substances 0.000 claims abstract description 22
- 238000004626 scanning electron microscopy Methods 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 2
- 239000000523 sample Substances 0.000 description 25
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to the technical field of LED chip detection, in particular to a loading tool for small-size chips, which comprises a crystal expansion ring mounting block, a transfer assembly and an observation assembly, wherein the crystal expansion ring mounting block is arranged on the crystal expansion ring mounting block; the top of the die-expanding ring mounting block is provided with a mounting groove for mounting a die-expanding ring loaded with chips; the transfer assembly comprises an FIB carrier and a suction pen for transplanting the chip on the crystal expansion ring to the FIB carrier; the observation assembly comprises a first CCD detector and a CCD display screen; the first CCD detector is positioned above the crystal expanding ring mounting block, the lens of the first CCD detector is opposite to the crystal expanding ring mounting block, and the CCD display screen is in communication connection with the first CCD detector. The utility model can reduce the grabbing difficulty of the small-sized LED chips so as to improve the working efficiency of the small-sized LED chips for carrying out FIB and SEM analysis.
Description
Technical Field
The utility model relates to the technical field of LED chip detection, in particular to a loading tool for small-size chips.
Background
LEDs, which are generally referred to as light emitting diodes, are solid state semiconductor devices that convert electrical energy into light energy. As a novel light emitting device, LEDs have advantages of high light efficiency, energy saving, long service life, short response time, environmental protection, and the like, and thus are called as the most potential new generation light sources. Because the manufacturing process of the LED chip is complex, abnormal chips are inevitably generated, the LED chip is required to be clamped and placed into equipment for FIB and SEM analysis. However, the small-sized LED chips below 200um are difficult to grasp, so that the working efficiency of FIB and SEM analysis of the small-sized LED chips is low.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: the loading tool for the small-size chips can reduce the grabbing difficulty of the small-size LED chips so as to improve the working efficiency of performing FIB and SEM analysis on the small-size LED chips.
In order to solve the technical problems, the utility model adopts the following technical scheme: a loading tool for small-size chips comprises a crystal expansion ring mounting block, a transfer assembly and an observation assembly; the top of the die-expanding ring mounting block is provided with a mounting groove for mounting a die-expanding ring loaded with chips;
the transfer assembly comprises an FIB carrier and a suction pen for transplanting the chip on the crystal expansion ring to the FIB carrier;
the observation assembly comprises a first CCD detector and a CCD display screen; the first CCD detector is positioned above the crystal expanding ring mounting block, the lens of the first CCD detector is opposite to the crystal expanding ring mounting block, and the CCD display screen is in communication connection with the first CCD detector.
Further, the observation assembly further comprises a second CCD detector, the second CCD detector is located above the FIB carrier, a lens of the second CCD detector is opposite to the FIB carrier, and the second CCD detector is in communication connection with the CCD display screen.
Further, the FIB carrier comprises a carrier base, an adjusting screw and a sample carrier; one end of the adjusting screw is connected with the carrier base, and the sample carrier is in threaded connection with one end of the adjusting screw, which is far away from the carrier base.
Further, the FIB carrier further comprises a carrier fixing block, and a groove for placing the carrier base is formed in the carrier fixing block.
Further, a threaded hole is formed in the side end of the carrier base, and holes corresponding to the threaded hole are formed in the carrier fixing block.
Further, a positioning mark is arranged on the top of the sample carrying platform.
Further, the loading tool for the small-size chip further comprises a detector bracket, wherein the detector bracket comprises an upright post and a mounting plate; the mounting plate is arranged on the upright post, the mounting height of the mounting plate is higher than that of the crystal expanding ring mounting block and the FIB carrier, and the first CCD detector and the second CCD detector are arranged on the mounting plate.
The utility model has the beneficial effects that: compared with the prior art, the die-expanding ring loaded with the LED chips is arranged in the mounting groove of the die-expanding ring mounting block, so that the LED chips are positioned below the first CCD detector, and then an operator can accurately and stably suck the LED chips by observing the CCD display screen and place the LED chips on the FIB carrier by using the suction pen.
Drawings
Fig. 1 is a schematic structural diagram of a loading tool for small-sized chips in a specific embodiment of the present utility model;
fig. 2 is a schematic diagram of a die-expanding ring mounting block of a loading tool for small-sized chips in an embodiment of the utility model;
FIG. 3 is a schematic view of a FIB stage of a loading tool for small-sized chips in an embodiment of the present utility model;
description of the reference numerals:
1. a die-expanding ring mounting block; 11. a mounting groove;
2. a transfer assembly; 21. a FIB stage; 211. a carrier base; 2111. a threaded hole; 212. adjusting a screw; 213. a sample stage; 2131. positioning marks; 214. a stage fixing block; 2141. a groove; 2142. an eyelet; 22. a suction pen;
3. an observation component; 31. a first CCD detector; 32. a CCD display screen; 33. a second CCD detector;
4. a die-expanding ring;
5. a detector support; 51. a column; 52. and (3) mounting a plate.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 and 2, the loading tool for small-sized chips of the present utility model includes a die-expanding ring mounting block 1, a transfer assembly 2 and an observation assembly 3; the top of the die-expanding ring mounting block 1 is provided with a mounting groove 11 for mounting the die-expanding ring 4 loaded with the chip;
the transfer assembly 2 comprises a FIB carrier 21 and a suction pen 22 for transplanting the chip on the crystal expansion ring 4 onto the FIB carrier 21;
the observation assembly 3 comprises a first CCD detector 31 and a CCD display screen 32; the first CCD detector 31 is located above the crystal expanding ring mounting block 1, the lens of the first CCD detector 31 is opposite to the crystal expanding ring mounting block 1, and the CCD display screen 32 is in communication connection with the first CCD detector 31.
From the above description, the beneficial effects of the utility model are as follows: the die-expanding ring 4 loaded with the LED chips is arranged in the mounting groove 11 of the die-expanding ring mounting block 1, so that the LED chips are positioned below the first CCD detector 31, and then an operator can accurately and stably suck the LED chips by using the suction pen 22 and place the LED chips on the FIB carrier 21 by observing the CCD display screen 32.
Referring to fig. 1, further, the observation assembly 3 further includes a second CCD detector 33, the second CCD detector 33 is located above the FIB carrier 21, and a lens of the second CCD detector 33 faces the FIB carrier 21, and the second CCD detector 33 is connected with the CCD display screen 32 in a communication manner.
As can be seen from the above description, after the operator places the LED chip on the FIB stage 21 through the suction pen 22, the second CCD detector 33 captures the image and displays the captured image on the CCD display screen 32, so that the operator can know whether the placement direction of the LED chip placed on the FIB stage 21 is correct.
Referring to fig. 3, further, the FIB stage 21 includes a stage base 211, an adjusting screw 212, and a sample stage 213; one end of the adjusting screw 212 is connected with the carrier base 211, and the sample carrier 213 is in threaded connection with one end of the adjusting screw 212 away from the carrier base 211.
As can be seen from the above description, the sample stage 213 is screwed on the adjusting screw 212, so that the distance between the sample stage 213 and the second CCD detector 33 can be adjusted by rotating the sample stage 213, so that the second CCD detector 33 can observe the LED chip on the stage base 211 more flexibly.
Referring to fig. 3, further, the FIB stage 21 further includes a stage fixing block 214, and the stage fixing block 214 is provided with a groove 2141 for the stage base 211 to be placed in.
As can be seen from the above description, the stage base 211 is inserted into the groove 2141 of the stage fixing block 214 to limit the movement of the sample stage 213, so that the operator can place the LED chip on the sample stage 213.
Referring to fig. 3, further, a threaded hole 2111 is provided at a side end of the stage base 211, and an aperture 2142 corresponding to the threaded hole 2111 is provided on the stage fixing block 214.
As can be seen from the above description, the screw is screwed into the threaded hole 2111 of the stage base 211 through the hole 2142, so that the stage base 211 can be further mounted on the stage fixing block 214, thereby improving the stability of the sample stage 213.
Referring to fig. 3, further, a positioning mark 2131 is provided on the top of the sample stage 213.
As can be seen from the above description, the positioning mark 2131 is used to facilitate the positioning of the LED chip by the unit according to the positioning mark 2131 after the sample stage 213 is placed in the FIB machine.
Referring to fig. 3, further, the loading tool for small-sized chips further includes a probe bracket 5, where the probe bracket 5 includes a stand column 51 and a mounting plate 52; the mounting plate 52 is arranged on the upright post 51, the mounting height of the mounting plate 52 is higher than that of the die-expanding ring mounting block 1 and the FIB carrier 21, and the first CCD detector 31 and the second CCD detector 33 are arranged on the mounting plate 52.
As is apparent from the above description, the first and second CCD detectors 31 and 33 are suspended above the corresponding flip-chip mounting blocks 1 and FIB stages 21 by the mounting plates 52.
The utility model relates to an application scene of a loading tool for a small-size chip, which comprises the following steps: when the LED chip is required to be placed on the FIB stage 21, the die-expanding ring 4 loaded with the LED chip is mounted in the mounting groove 11 of the die-expanding ring mounting block 1, so that the LED chip is located below the first CCD detector 31, and then an operator can accurately and stably suck the LED chip by using the suction pen 22 through observing the CCD display screen 32 and place the LED chip on the FIB stage 21.
Example 1
Referring to fig. 1 and 2, a loading tool for small-size chips comprises a die-expanding ring mounting block 1, a transfer assembly 2 and an observation assembly 3; the top of the die-expanding ring mounting block 1 is provided with a mounting groove 11 for mounting the die-expanding ring 4 loaded with the chip; the transfer assembly 2 comprises a FIB carrier 21 and a suction pen 22 for transplanting the chip on the crystal expansion ring 4 onto the FIB carrier 21; the observation assembly 3 comprises a first CCD detector 31 and a CCD display screen 32; the first CCD detector 31 is located above the crystal expanding ring mounting block 1, the lens of the first CCD detector 31 is opposite to the crystal expanding ring mounting block 1, and the CCD display screen 32 is in communication connection with the first CCD detector 31. The observation assembly 3 further comprises a second CCD detector 33, the second CCD detector 33 is located above the FIB carrier 21, a lens of the second CCD detector 33 faces the FIB carrier 21, and the second CCD detector 33 is in communication connection with the CCD display screen 32.
Referring to fig. 3, the FIB stage 21 includes a stage base 211, an adjusting screw 212, and a sample stage 213; one end of the adjusting screw 212 is connected with the carrier base 211, and the sample carrier 213 is in threaded connection with one end of the adjusting screw 212 away from the carrier base 211. The FIB stage 21 further includes a stage fixing block 214, where the stage fixing block 214 is provided with a groove 2141 in which the stage base 211 is placed on the stage fixing block 214. Screw holes 2111 are provided at the side end of the carrier base 211, and holes 2142 corresponding to the screw holes 2111 are provided in the carrier fixing block 214. The top of the sample stage 213 is provided with a positioning mark 2131.
Working principle: in the mounting process, the die-expanding ring mounting block 1 and the carrier fixing block 214 are respectively arranged below the first CCD detector 31 and the second CCD detector 33, and then the die-expanding ring 4 loaded with the LED chips is mounted in the mounting groove 11 of the die-expanding ring mounting block 1, so that the die-expanding ring 4 is positioned below the first CCD detector 31; the carrier base 211 is placed in the groove 2141 of the carrier fixing block 214, and is connected with the threaded hole 2111 of the carrier base 211 by a screw penetrating through the hole 2142, so that the sample carrier 213 is positioned below the second CCD detector 33, and the sample carrier 213 is rotated appropriately according to actual requirements, so that the distance between the sample carrier 213 and the second CCD detector 33 is adjusted.
In the process of grabbing the LED chip, an operator can accurately and stably suck the LED chip by observing the CCD display screen 32 and using the suction pen 22 and place the LED chip on the sample carrying platform 213, and meanwhile, according to the picture displayed on the CCD display screen 32, the placement direction of the LED chip is the required direction after the LED chip is placed on the sample carrying platform 213.
Example two
The loading tool for small-size chips based on the first embodiment of the present embodiment further includes a probe bracket, which is specifically as follows:
referring to fig. 1, the detector support 5 includes a column 51 and a mounting plate 52; the mounting plate 52 is arranged on the upright post 51, the mounting height of the mounting plate 52 is higher than that of the die-expanding ring mounting block 1 and the FIB carrier 21, and the first CCD detector 31 and the second CCD detector 33 are arranged on the mounting plate 52.
Working principle: the mounting plate 52 is made to have a mounting height higher than the die-ring mounting block 1 and the FIB stage 21 by the upright posts 51, so that the first CCD detector 31 and the second CCD detector 33 provided on the mounting plate 52 can be suspended above the corresponding die-ring mounting block 1 and FIB stage 21.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (7)
1. The utility model provides a loading frock of small-size chip which characterized in that: the device comprises a crystal expansion ring mounting block, a transfer assembly and an observation assembly; the top of the die-expanding ring mounting block is provided with a mounting groove for mounting a die-expanding ring loaded with chips;
the transfer assembly comprises an FIB carrier and a suction pen for transplanting the chip on the crystal expansion ring to the FIB carrier;
the observation assembly comprises a first CCD detector and a CCD display screen; the first CCD detector is positioned above the crystal expanding ring mounting block, the lens of the first CCD detector is opposite to the crystal expanding ring mounting block, and the CCD display screen is in communication connection with the first CCD detector.
2. The loading tool for small-sized chips according to claim 1, wherein: the observation assembly further comprises a second CCD detector, the second CCD detector is located above the FIB carrier, a lens of the second CCD detector is opposite to the FIB carrier, and the second CCD detector is in communication connection with the CCD display screen.
3. The loading fixture for small-sized chips according to claim 2, wherein: the FIB carrier comprises a carrier base, an adjusting screw and a sample carrier; one end of the adjusting screw is connected with the carrier base, and the sample carrier is in threaded connection with one end of the adjusting screw, which is far away from the carrier base.
4. A loading fixture for small-sized chips according to claim 3, wherein: the FIB carrier also comprises a carrier fixing block, wherein the carrier fixing block is provided with a groove for placing a carrier base.
5. The small-size chip loading tool according to claim 4, wherein: the side end of the carrier base is provided with a threaded hole, and the carrier fixing block is provided with holes corresponding to the threaded hole.
6. A loading fixture for small-sized chips according to claim 3, wherein: and a positioning mark is arranged at the top of the sample carrier.
7. The loading fixture for small-sized chips according to claim 2, wherein: the detector comprises a detector support, a detector support and a detector, wherein the detector support comprises a stand column and a mounting plate; the mounting plate is arranged on the upright post, the mounting height of the mounting plate is higher than that of the crystal expanding ring mounting block and the FIB carrier, and the first CCD detector and the second CCD detector are arranged on the mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223105115.6U CN219203126U (en) | 2022-11-22 | 2022-11-22 | Loading tool for small-size chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223105115.6U CN219203126U (en) | 2022-11-22 | 2022-11-22 | Loading tool for small-size chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219203126U true CN219203126U (en) | 2023-06-16 |
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ID=86715928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223105115.6U Active CN219203126U (en) | 2022-11-22 | 2022-11-22 | Loading tool for small-size chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219203126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117206712A (en) * | 2023-11-07 | 2023-12-12 | 珠海市申科谱工业科技有限公司 | Wafer MEMS chip cantilever beam laser cutting machine |
-
2022
- 2022-11-22 CN CN202223105115.6U patent/CN219203126U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117206712A (en) * | 2023-11-07 | 2023-12-12 | 珠海市申科谱工业科技有限公司 | Wafer MEMS chip cantilever beam laser cutting machine |
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