CN117206712A - Wafer MEMS chip cantilever beam laser cutting machine - Google Patents
Wafer MEMS chip cantilever beam laser cutting machine Download PDFInfo
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- CN117206712A CN117206712A CN202311464551.9A CN202311464551A CN117206712A CN 117206712 A CN117206712 A CN 117206712A CN 202311464551 A CN202311464551 A CN 202311464551A CN 117206712 A CN117206712 A CN 117206712A
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 70
- 238000005520 cutting process Methods 0.000 claims abstract description 38
- 230000003287 optical effect Effects 0.000 claims description 20
- 239000000428 dust Substances 0.000 claims description 15
- 229940095676 wafer product Drugs 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Abstract
The invention discloses a wafer MEMS chip cantilever beam laser cutting machine, and aims to provide a laser cutting machine which is simple in structure, meets the cutting precision of micron level and has good laser processing effect. The laser cutting device comprises a platform base, a light path platform support, a light path component and a jig component, wherein the jig component is matched with a working end of the light path component, the light path component comprises a laser, a fixed outer light path module and a lifting outer light path module, the fixed outer light path module comprises a fixed outer light path box, a plurality of first horizontal reflectors, a laser beam expander and a first vertical reflector, the lifting outer light path module is connected with one side of the fixed outer light path box through a Z-axis focusing servo screw rod module, the lifting outer light path module comprises a lifting outer light path box, a second horizontal reflector and a second vertical reflector, a laser cutting head is arranged on the lower end face of the lifting outer light path platform, and the jig component comprises an X-axis linear module, a Y-axis linear module and a cutting carrier. The invention is applied to the technical field of laser cutting processing.
Description
Technical Field
The invention is applied to the technical field of laser cutting processing, and particularly relates to a wafer MEMS chip cantilever beam laser cutting machine.
Background
The laser cutting technology is to utilize high power density light spot formed by focusing laser beam to heat material to vaporization temperature fast, so as to evaporate small holes and make the light beam and material move relatively to realize continuous cutting. Wafer MEMS chip cutting belongs to high-precision high-process-requirement cutting application, on one hand, micron-level cutting position precision is ensured, and on the other hand, good laser processing process effect is ensured; therefore, the precision of a motion platform of the whole machine, the precision of visual positioning and a laser processing system are all very high; no satisfactory device is currently available. For example, chinese patent with publication number CN212398530U discloses a semiconductor wafer laser cutting machine, which comprises a machine base, a workpiece moving platform and a laser cutting unit, wherein the laser cutting unit comprises a laser, an optical path component, a Z-axis component, a focus tracking system, a laser cutting head and a laser focusing system, the focus tracking system, the laser cutting head and the laser focusing system are respectively arranged on the Z-axis component, the laser emitted by the laser enters the focus tracking system through the conduction of the optical path component, and then is sequentially transmitted by the laser cutting head and the laser focusing system, and then, the laser is focused on a workpiece on the workpiece moving platform, and the workpiece moving platform drives the workpiece to move, so as to complete the laser cutting of the workpiece. Aiming at the application of wafer MEMS chip cantilever beam laser cutting, the invention provides wafer chip cutting processing equipment integrating a linear motor high-precision motion platform, a large-view coarse positioning and small-view fine positioning vision system, a purple skin laser, a precise focusing cutting head optical path system and a coaxial dust removal system. The precision of the machining position is ensured through the high-precision linear motor motion platform and the double-camera visual positioning; the laser processing technology effect is ensured by the ultraviolet skin second laser, the precise focusing cutting head and the coaxial laser dust removing system of the cutting head.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing the laser cutting machine which has a simple structure and can meet the cutting precision of micron level and good laser processing effect.
The technical scheme adopted by the invention is as follows: the laser cutting device comprises a platform base, a light path platform support, a light path component and a jig component, wherein the jig component is matched with the working end of the light path component, the light path component comprises a laser, a fixed outer light path module and a lifting outer light path module, the fixed outer light path module comprises a fixed outer light path box, a plurality of first horizontal reflectors, a laser beam expander and a first vertical reflector, the lifting outer light path module is connected with one side of the fixed outer light path box through a Z-axis focusing servo screw rod module, the lifting outer light path module comprises a lifting outer light path box, a second horizontal reflector and a second vertical reflector, a laser cutting head is arranged on the lower end face of the lifting outer light path box, and the jig component comprises an X-axis linear module, a Y-axis linear module and a cutting carrier.
Further, fixed outer light path box one side is provided with the connecting rod, the laser instrument is provided with the sleeve, the sleeve passes through the connecting rod with fixed outer light path box is connected, fixed outer light path box one side is provided with first laser through-hole, first laser through-hole with the sleeve cooperatees, fixed outer light path box still is provided with the second laser through-hole, the second laser through-hole with first perpendicular speculum cooperatees.
Further, one side of the light path platform support is provided with the Z-axis focusing servo screw rod module, and one side of the lifting outer light path box is connected with the movable end of the Z-axis focusing servo screw rod module.
Further, the second horizontal reflecting mirror and the second vertical reflecting mirror are respectively arranged at two ends of the lifting outer light path box, the second horizontal reflecting mirror is matched with the first vertical reflecting mirror through the second laser through hole, the lifting outer light path box is further provided with a third laser through hole, and the second vertical reflecting mirror is matched with the laser cutting head through the third laser through hole.
Further, the Y-axis linear module is connected with the movable end of the X-axis linear module, the cutting carrier is connected with the movable end of the Y-axis linear module, the cutting carrier is provided with a plurality of crystal expanding ring clamping blocks, the middle part of the cutting carrier is provided with a wafer product with crystal expanding rings, a plurality of crystal expanding ring clamping blocks are in limit fit with the crystal expanding rings, and the cutting carrier is further provided with a plurality of leveling screws.
Further, a large-view camera and a small-view camera are further arranged on one side of the lifting outer light path box, and the large-view camera and the small-view camera are matched with the wafer products on the cutting carrier.
Further, the bottom of the laser cutting head is also provided with a coaxial dust removal module, and the coaxial dust removal module is matched with the laser cutting head.
Further, the fixed outer light path box is further provided with a cylinder light gate, a laser baffle is arranged at the movable end of the cylinder light gate, and the laser baffle is matched with the first laser through hole.
Further, the wafer MEMS chip cantilever beam laser cutting machine further comprises a machine cover, wherein the machine cover is provided with a feeding port double-door, an operation panel and an observation door.
The beneficial effects of the invention are as follows: the equipment housing is lower frame for welding square, and the upper frame is the section bar frame, and the dustcoat is plate dustcoat and joins in marriage ya keli observation window, and equipment main operating panel all is equipped with maintenance two and opens door and observation window in the feed inlet right side, all around, makes things convenient for the operator to operate and maintain, contains three in the fixed outer light path box first horizontal mirror, one cylinder optical gate, one laser beam expander and one first vertical mirror, through the combined application of speculum and beam expander, go on the collimation beam expander with the laser outgoing facula by the horizontal direction to by the vertical direction, the sleeve with the connecting rod combination is realized the laser instrument light outlet with the light path seal between the fixed outer light path box, the lift outer light path box includes one second horizontal focusing, one second vertical mirror, one set of laser cutting head, coaxial dust removal module and one set Z axle lead screw servo module group constitutes, laser beam after the beam expander, through two sets of reflection mirror, and vertical and the coaxial focusing module, the laser beam expander carries out the laser spot, and the laser beam has the laser cutting head is high-level laser cutting machine, and the laser beam has the laser beam cutting machine has the laser cutting machine to carry the high-shot position the laser, and has the laser cutting machine to guarantee the high accuracy and the high-precision laser cutting machine, and the high-precision laser beam cutting machine has the laser cutting machine to the laser. The laser cutting head completes three-axis compound motion through the X-axis linear module, the Y-axis linear module and the Z-axis focusing servo screw rod module, and realizes laser cutting of the wafer.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the light path assembly;
FIG. 3 is a top view of the light path assembly;
FIG. 4 is a perspective view of the jig assembly;
fig. 5 is a perspective view of the hood.
Description of the embodiments
As shown in fig. 1 to 4, in this embodiment, the present invention includes a platform base 1, a light path platform support 2, a light path component 3, and a fixture component 4, where the fixture component 4 is matched with a working end of the light path component 3, the light path component 3 includes a laser 31, a fixed external light path module 32, and a lifting external light path module 33, the fixed external light path module 32 includes a fixed external light path box 321, a plurality of first horizontal reflectors 322, a laser beam expander 323, and a first vertical reflector 324, the lifting external light path module 33 is connected with one side of the fixed external light path box 321 through a Z-axis focusing servo screw module 5, the lifting external light path module 33 includes a lifting external light path box 331, a second horizontal reflector 332, and a second vertical reflector 333, a laser cutting head 6 is disposed on a lower end surface of the lifting external light path box 331, and the fixture component 4 includes an X-axis linear module 41, a Y-axis linear module 42, and a cutting carrier 43. Therefore, the light path platform support 2 is arranged on one side of the platform base 1, the light path component 3 is arranged on the upper end face of the light path platform support 2, the jig component 4 is arranged in the middle of the upper end face of the platform base 1, the laser cutting head 6 is matched with the cutting carrier 43, and the X-axis linear module 41, the Y-axis linear module 42 and the Z-axis focusing servo screw rod module 5 can realize XYZ-axis compound motion.
As shown in fig. 1 to 3, in this embodiment, a connecting rod 7 is disposed on one side of the fixed outer light path box 321, the laser 31 is provided with a sleeve 8, the sleeve 8 is connected with the fixed outer light path box 321 through the connecting rod 7, a first laser through hole 325 is disposed on one side of the fixed outer light path box 321, the first laser through hole 325 is matched with the sleeve 8, a second laser through hole 326 is further disposed on the fixed outer light path box 321, and the second laser through hole 326 is matched with the first vertical mirror 324. Therefore, the laser 31 emits light spots through the sleeve 8, the connecting rod 7 is matched with the sleeve 8, so that the light path between the light outlet of the laser 31 and the fixed outer light path box 321 is sealed, the laser 31 is matched with a plurality of first horizontal reflectors 322 through the first laser through holes 325, the light spots emitted by the laser 31 are collimated and expanded through the combined application of the first horizontal reflectors 322 and the laser beam expander 323, and the expanded laser beams reflect the light spots through the second through holes 326 through the first vertical reflectors 324 and are matched with the lifting outer light path box 331.
As shown in fig. 1 to 3, in this embodiment, the Z-axis focusing servo screw module 5 is disposed on one side of the optical path platform support 2, and one side of the lifting outer optical path box 331 is connected to a movable end of the Z-axis focusing servo screw module 5. Therefore, the Z-axis focusing servo screw rod module 5 is arranged on one side of the optical path platform support 2, the movable end of the Z-axis focusing servo screw rod module is connected with the lifting outer optical path box 331, and movement of the lifting outer optical path box 331 on the Z axis can be controlled.
As shown in fig. 2, in this embodiment, the second horizontal mirror 332 and the second vertical mirror 333 are respectively disposed at two ends of the lifting external light path box 331, the second horizontal mirror 332 is matched with the first vertical mirror 324 through the second laser through hole 326, the lifting external light path box 331 is further provided with a third laser through hole 334, and the second vertical mirror 333 is matched with the laser cutting head 6 through the third laser through hole 334. It can be seen that the laser beam passes through the second laser through hole 326 and is matched with the second horizontal mirror 332, and reflects the light spot to the second vertical mirror 333, and the laser beam is vertically and coaxially injected into the laser cutting head 6 through the third laser through hole 334, so that the laser cutting head 6 focuses the laser beam into a light spot with high energy density, and laser cutting processing is realized.
As shown in fig. 1 and fig. 4, in this embodiment, the Y-axis linear module 42 is connected to the movable end of the X-axis linear module 41, the cutting carrier 43 is connected to the movable end of the Y-axis linear module 42, the cutting carrier 43 is provided with a plurality of wafer expanding ring clamping blocks 44, a wafer product 46 with a wafer expanding ring 45 is provided in the middle of the cutting carrier 43, a plurality of wafer expanding ring clamping blocks 44 are in limit fit with the wafer expanding ring 45, and the cutting carrier 43 is further provided with a plurality of leveling screws 47. Therefore, the X-axis linear module 41 and the Y-axis linear module 42 can enable the dicing stage 43 to move in the X-axis and Y-axis directions, and the dicing stage 43 can also vacuum the wafer product 43, so that the dicing process is more stable and precise.
As shown in fig. 1, in this embodiment, a large-field camera 9 and a small-field camera 10 are further disposed on one side of the lifting external light path box 331, and the large-field camera 9 and the small-field camera 10 are matched with the wafer products 46 on the dicing stage 43. Therefore, the large-view camera 9 captures the feature points on the wafer product 43 for coarse positioning, the small-view camera captures the cantilever beam feature to be processed of the first chip for fine positioning, and each chip has 6 processing positions, so that the wafer product 46 and the laser cutting head 6 can be precisely positioned.
As shown in fig. 2, in this embodiment, a coaxial dust removal module 11 is further disposed at the bottom of the laser cutting head 6, and the coaxial dust removal module 11 is matched with the laser cutting head 6. Therefore, the coaxial dust removal module 11 performs negative pressure adsorption dust removal while performing laser cutting processing, so as to timely remove smoke dust and microparticles generated in the laser cutting process and ensure the cleanliness of the processed wafer chip surface.
As shown in fig. 2 and 3, in this embodiment, the fixed external light path box 321 is further provided with a cylinder shutter 12, a movable end of the cylinder shutter 12 is provided with a laser baffle 13, and the laser baffle 13 is matched with the first laser through hole 325. It can be seen that the cylinder shutter 12 can drive the laser shutter 13 to cooperate with the first laser through hole 325 after the laser cutting is completed, so as to intercept the laser beam.
As shown in fig. 5, in this embodiment, the MEMS wafer chip cantilever beam laser cutter further includes a housing 14, and the housing 14 is provided with a feed port double-opening door 15, an operation panel 16, and an observation door 17. Therefore, the lower frame of the hood 14 is a welding square tube, the upper frame is a section bar frame, the operation panel 16 is arranged on the right side of the feeding double door 15, the operation by operators is facilitated, and the observers 17 can observe when they are provided with an acrylic plate for laser cutting.
The working principle of the invention is as follows: before the equipment is started, an operator opens the feeding double door 15, the perpendicularity of the plane of the cutting carrier 43 and the laser cutting head 6 is adjusted through a plurality of leveling screws 47, so that each machining point laser is ensured to be vertically incident, a wafer product 46 with a wafer expanding ring 45 is placed on the upper end face of the cutting carrier 43, a plurality of wafer expanding ring clamping blocks 44 clamp the wafer expanding ring 45, the cutting carrier 43 vacuum adsorbs the wafer product 46, the X-axis linear module 41, the Y-axis linear module 42 and the Z-axis focusing servo screw module 5 perform triaxial compound motion, the large-view camera 9 grabs a characteristic point on the wafer to perform coarse positioning, the XYZ triaxial compound motion positioning, the small-view camera 10 grabs a first chip to be machined cantilever beam characteristic to perform fine positioning (6 machining positions of each chip), after the fine positioning in a visual sense, guiding the XYZ axis to perform composite motion compensation, moving the laser cutting head 6 to a first position to be processed, enabling the laser 31 to emit laser beams to pass through the first laser through hole 325 and apply the laser beams to the three first horizontal reflectors 322 and the laser beam expander 323 in a combined way, enabling the laser beams to pass through the first vertical reflector 324 and convert the laser beams into a vertical direction from a horizontal direction, enabling the laser beams to pass through the second laser through hole 326 and reach the second horizontal reflector 332, enabling the laser beams to convert the laser beams into a horizontal direction from a vertical direction, enabling the laser beams to be vertically and coaxially injected into the laser cutting head 6, enabling the laser cutting head 6 to focus the laser beams into high-energy-density light spots, enabling the coaxial dust removal module 11 to perform negative pressure adsorption dust removal while performing laser cutting processing, smoke dust and microparticles generated in the laser cutting process are timely removed, cleanliness of the surface of a processed wafer chip is guaranteed, the visual fine positioning and laser cutting steps are repeated, cutting processing of all chips on a whole wafer product 46 is completed, after processing is completed, an air cylinder optical shutter 12 drives a laser baffle 13 to intercept laser beams, a Z-axis focusing servo screw module 5 drives a laser cutting head 6 to return to a safe position, an X-axis linear module 41 and a Y-axis linear module 42 drive a cutting carrier 43 to a blanking position, the cutting carrier 43 is in a vacuum adsorption state, a wafer expanding ring clamping block 44 is loosened, an operator takes down the cut wafer product 46, places the wafer product 46 which is not cut on the cutting carrier 43, and repeats the steps, so that wafer MEMS chip cantilever beam laser cutting can be completed.
While the embodiments of this invention have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this invention, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.
Claims (9)
1. The utility model provides a wafer MEMS chip cantilever beam laser cutting machine, includes platform base (1), light path platform support (2), light path subassembly (3) and tool subassembly (4), tool subassembly (4) with light path subassembly (3) work end cooperatees, its characterized in that: the optical path assembly (3) comprises a laser (31), a fixed outer optical path module (32) and a lifting outer optical path module (33), the fixed outer optical path module (32) comprises a fixed outer optical path box (321), a plurality of first horizontal reflectors (322), a laser beam expander (323) and a first vertical reflector (324), the lifting outer optical path module (33) is connected with one side of the fixed outer optical path box (321) through a Z-axis focusing servo screw rod module (5), the lifting outer optical path module (33) comprises a lifting outer optical path box (331), a second horizontal reflector (332) and a second vertical reflector (333), a laser cutting head (6) is arranged on the lower end face of the lifting outer optical path box (331), and the jig assembly (4) comprises an X-axis linear module (41), a Y-axis linear module (42) and a cutting carrier (43).
2. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: the laser comprises a fixed outer light path box (321), wherein a connecting rod (7) is arranged on one side of the fixed outer light path box (321), a sleeve (8) is arranged on the laser (31), the sleeve (8) is connected with the fixed outer light path box (321) through the connecting rod (7), a first laser through hole (325) is formed in one side of the fixed outer light path box (321), the first laser through hole (325) is matched with the sleeve (8), a second laser through hole (326) is further formed in the fixed outer light path box (321), and the second laser through hole (326) is matched with a first vertical reflecting mirror (324).
3. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: one side of the light path platform support (2) is provided with the Z-axis focusing servo screw rod module (5), and one side of the lifting outer light path box (331) is connected with the movable end of the Z-axis focusing servo screw rod module (5).
4. The wafer MEMS chip cantilever beam laser cutting machine according to claim 2, wherein: the second horizontal reflecting mirror (332) and the second vertical reflecting mirror (333) are respectively arranged at two ends of the lifting outer light path box (331), the second horizontal reflecting mirror (332) is matched with the first vertical reflecting mirror (324) through the second laser through hole (326), the lifting outer light path box (331) is further provided with a third laser through hole (334), and the second vertical reflecting mirror (333) is matched with the laser cutting head (6) through the third laser through hole (334).
5. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: the Y-axis linear module (42) is connected with the movable end of the X-axis linear module (41), the cutting carrier (43) is connected with the movable end of the Y-axis linear module (42), the cutting carrier (43) is provided with a plurality of crystal expanding ring clamping blocks (44), the middle part of the cutting carrier (43) is provided with a wafer product (46) with crystal expanding rings (45), a plurality of crystal expanding ring clamping blocks (44) are in limit fit with the crystal expanding rings (45), and the cutting carrier (43) is also provided with a plurality of leveling screws (47).
6. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: and a large-view camera (9) and a small-view camera (10) are further arranged on one side of the lifting outer light path box (331), and the large-view camera (9) and the small-view camera (10) are matched with the wafer products (46) on the cutting carrier (43).
7. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: the bottom of the laser cutting head (6) is also provided with a coaxial dust removal module (11), and the coaxial dust removal module (11) is matched with the laser cutting head (6).
8. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: the fixed outer light path box (321) is further provided with a cylinder light gate (12), a laser baffle (13) is arranged at the movable end of the cylinder light gate (12), and the laser baffle (13) is matched with the first laser through hole (325).
9. The wafer MEMS chip cantilever beam laser cutting machine according to claim 1, wherein: the wafer MEMS chip cantilever beam laser cutting machine further comprises a machine cover (14), wherein the machine cover (14) is provided with a feeding port double-door (15), an operation panel (16) and an observation door (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311464551.9A CN117206712A (en) | 2023-11-07 | 2023-11-07 | Wafer MEMS chip cantilever beam laser cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311464551.9A CN117206712A (en) | 2023-11-07 | 2023-11-07 | Wafer MEMS chip cantilever beam laser cutting machine |
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| Publication Number | Publication Date |
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| CN117206712A true CN117206712A (en) | 2023-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311464551.9A Pending CN117206712A (en) | 2023-11-07 | 2023-11-07 | Wafer MEMS chip cantilever beam laser cutting machine |
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| CN205789914U (en) * | 2016-05-17 | 2016-12-07 | 刘盈坤 | Expand brilliant ring clamping device |
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