CN206020606U - A kind of Vertrical probe clasp for chip testing - Google Patents
A kind of Vertrical probe clasp for chip testing Download PDFInfo
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- CN206020606U CN206020606U CN201620868453.0U CN201620868453U CN206020606U CN 206020606 U CN206020606 U CN 206020606U CN 201620868453 U CN201620868453 U CN 201620868453U CN 206020606 U CN206020606 U CN 206020606U
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- probe
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Abstract
The utility model discloses a kind of Vertrical probe clasp for chip testing, which includes probe and the PCB connecting plates being arranged at the top of probe, it is characterised in that：Probe includes probe substrate, probe substrate includes upper substrate and infrabasal plate, infrabasal plate through is provided with groove, the upper and lower ends of groove are respectively arranged with the first groove and the second groove, upper guide plate and film membrane are respectively arranged with from top to down in first groove, bottom guide is provided with second groove, bottom guide, some through holes are correspondingly arranged on upper guide plate and film membrane, bottom guide, upper guide plate and film membrane are connected with the probe for chip testing by through hole, upper substrate top down is provided with a circular groove, base plate for packaging is provided with circular groove, probe connects base plate for packaging, base plate for packaging connection PCB connecting plate.
Description
Technical field
The utility model is related to IC wafers test, especially a kind of Vertrical probe clasp for chip testing.
Background technology
Chip refers to the silicon chip for including integrated circuit, one of volume very little, often computer or other electronic equipments
Point.With the development of science and technology, chip becomes an indispensable important component part in current electronic equipment, its impact
It is very huge, so after chip production is finished, being also very necessary to the detection of chip, needing to use during chip detection
Detected to probe card, the structure of traditional probe card is beam type, the IC that past uses in a large number essentially 2 sides or 4
The packing forms of side pin, the probe card of beam type can conveniently in 4 side cloth pins, but at present, more and more
The packing forms of BGA, CSP (chipscalepackage) occur, and the pin of IC has been changed to matrix form distribution, beam type probe
Cacaine structure is limited and cannot carry out matrix form cloth pin, and the assembling of beam type probe card is made by hand with pure substantially, it is impossible to machine
Production, to us, growing life is made troubles.
Utility model content
In order to overcome the problems referred to above, the utility model provide a kind of simple structure, production efficiency for chip testing
Vertrical probe clasp.
The technical solution of the utility model is to provide a kind of Vertrical probe clasp for chip testing, it include probe and
The PCB connecting plates being arranged at the top of the probe, it is characterised in that：The probe includes probe substrate, the probe
Substrate includes that upper substrate and infrabasal plate, the infrabasal plate through are provided with groove, and the upper and lower ends of the groove are set respectively
It is equipped with the first groove and the second groove, first groove and is respectively arranged with upper guide plate and film membrane from top to down, described
Bottom guide is provided with second groove, is correspondingly arranged on the bottom guide, the upper guide plate and the film membrane some
Through hole, the bottom guide, the upper guide plate and the film membrane are connected with the probe for chip testing by the through hole,
The upper substrate top down is provided with a circular groove, is provided with base plate for packaging in the circular groove, and the probe connects the encapsulation
Substrate, the base plate for packaging connect the PCB connecting plates.
In one preferred embodiment of the utility model, some block tins, the encapsulation at the top of the base plate for packaging, is provided with
Substrate is connected plate weld by the block tin with the PCB.
In one preferred embodiment of the utility model, the probe extends the bottom of the probe by the bottom guide
Portion.
In one preferred embodiment of the utility model, the upper substrate is disc-shape.
In one preferred embodiment of the utility model, the infrabasal plate is cone cylinder shape wide at the top and narrow at the bottom.
A kind of Vertrical probe clasp for chip testing of the present utility model is used for connecting IC chip (IC) and surveys
Test-run a machine, plays a part of signal transmission during chip testing, and the utility model belongs to rectilinear probe card, and which is relative
Can be made with machine in kinds of processes link for beam type probe card, reduce to manual dependence, improve production
The efficiency of making, accelerates process, and in detection process, detection efficiency is higher, and Detection results are more fully.
Description of the drawings
Fig. 1 is the structural representation of the utility model most preferred embodiment.
Specific embodiment
Below specific embodiment of the present utility model is described in further detail.
As shown in figure 1, a kind of Vertrical probe 7 for chip testing of the present utility model blocks, it include probe 71 and
The PCB connecting plates 2 being arranged at the top of probe 71, it is characterised in that：Probe includes 7 substrate of probe, 7 substrate bag of probe for 71
Upper substrate 3 and infrabasal plate 4 is included, 4 through of infrabasal plate is provided with groove 41, and the upper and lower ends of groove 41 are respectively arranged with first
Groove 5 and the second groove 6, are respectively arranged with upper guide plate 51 and film membrane 52, the second groove 6 in the first groove 5 from top to down
Bottom guide 61 is inside provided with, on bottom guide 61, upper guide plate 51 and film membrane 52, some through holes 12, bottom guide is correspondingly arranged on
61st, upper guide plate 51 and film membrane 52 are connected with the probe 7 for chip testing by through hole 12, and 3 top down of upper substrate sets
A circular groove 31 is equipped with, base plate for packaging 32 in circular groove 31, is provided with, probe 7 connects base plate for packaging 32, and 32 connection PCB of base plate for packaging connects
Fishplate bar 2.
Preferably, the top of base plate for packaging 32 is provided with some block tins 33, and base plate for packaging 32 is connected with PCB by block tin 33
Plate 2 is welded.
Preferably, probe 7 extends the bottom of probe 71 by bottom guide 61.
Preferably, upper substrate 3 is disc-shape.
Preferably, infrabasal plate 4 is cone cylinder shape wide at the top and narrow at the bottom.
A kind of Vertrical probe 7 for chip testing of the present utility model block for connect IC chip (IC) and survey
Test-run a machine, plays a part of signal transmission during chip testing, and the probe 7 that the utility model belongs to rectilinear blocks, its phase
Can be made with machine in kinds of processes link for beam type probe 7 blocks, reduce to manual dependence, improve life
The efficiency for making is produced, process is accelerated, detection efficiency is higher in detection process, and Detection results are more fully.
The utility model is used as its agent structure using the connection of probe 71 and PCB connecting plates 2, and probe includes for 71
7 substrate of probe as bearing structure, 7 substrate of probe includes the upper substrate 3 on top and is arranged at the lower base of 3 bottom of upper substrate
Plate 4, upper substrate 3 are set to disc-shape and are easily installed, and infrabasal plate 4 is set to cone cylinder shape wide at the top and narrow at the bottom and is easy to processing also just
In the installation and the detection of chip of probe 7,4 through of infrabasal plate is provided with groove 41, and the upper and lower ends of groove 41 are set respectively
The first groove 5 and the second groove 6 is equipped with, the first groove 5 is used for placing upper guide plate 51 and film membrane 52, and the second groove 6 is used for
Place bottom guide 61, be correspondingly arranged on bottom guide 61, upper guide plate 51 and film membrane 52 some through holes 12 for connection spy
Pin 7, probe 7 can be used for the detection to chip with contact chip by the bottom that bottom guide 61 extends probe 71；Upper substrate 3
Top down is provided with a circular groove 31 to be used for placing base plate for packaging 32, the pressing upper guide plate 51 of base plate for packaging 32 and linking probe 7,
So that transmission signal, the top of base plate for packaging 32 are provided with some block tins 33, base plate for packaging 32 is by block tin 33 and PCB connecting plates
2 welding are more fastened, and are prevented from loosening, are extended its service life.
Above example is only a kind of the utility model embodiment therein, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the utility model the scope of the claims can not be interpreted as.It should be pointed out that the ordinary skill for this area
For personnel, without departing from the concept of the premise utility, some deformations and improvement can also be made, these belong to this
The protection domain of utility model.Therefore, the protection domain of the utility model patent should be defined by claims.
Claims (5)
1. a kind of Vertrical probe clasp for chip testing, it include that probe and the PCB being arranged at the top of the probe connect
Fishplate bar, it is characterised in that：The probe includes probe substrate, and the probe substrate includes upper substrate and infrabasal plate, described
Infrabasal plate through is provided with groove, and the upper and lower ends of the groove are respectively arranged with the first groove and the second groove, described
Upper guide plate and film membrane are respectively arranged with from top to down in first groove, in second groove, bottom guide is provided with, described
Be correspondingly arranged on some through holes on bottom guide, the upper guide plate and the film membrane, the bottom guide, the upper guide plate and
The film membrane is connected with the probe for chip testing by the through hole, and the upper substrate top down is provided with a circle
Groove, is provided with base plate for packaging in the circular groove, and the probe connects the base plate for packaging, and the base plate for packaging connects the PCB
Connecting plate.
2. a kind of Vertrical probe clasp for chip testing according to claim 1, it is characterised in that the base plate for packaging
Top be provided with some block tins, the base plate for packaging is connected plate weld by the block tin with the PCB.
3. a kind of Vertrical probe clasp for chip testing according to claim 1, it is characterised in that the probe passes through
The bottom guide extends the bottom of the probe.
4. a kind of Vertrical probe clasp for chip testing according to claim 1, it is characterised in that the upper substrate is
Disc-shape.
5. a kind of Vertrical probe clasp for chip testing according to claim 1, it is characterised in that the infrabasal plate is
Cone cylinder shape wide at the top and narrow at the bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620868453.0U CN206020606U (en) | 2016-08-11 | 2016-08-11 | A kind of Vertrical probe clasp for chip testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620868453.0U CN206020606U (en) | 2016-08-11 | 2016-08-11 | A kind of Vertrical probe clasp for chip testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206020606U true CN206020606U (en) | 2017-03-15 |
Family
ID=58247976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620868453.0U Active CN206020606U (en) | 2016-08-11 | 2016-08-11 | A kind of Vertrical probe clasp for chip testing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206020606U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018209901A1 (en) * | 2017-05-18 | 2018-11-22 | 苏州韬盛电子科技有限公司 | Vertical probe card |
-
2016
- 2016-08-11 CN CN201620868453.0U patent/CN206020606U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018209901A1 (en) * | 2017-05-18 | 2018-11-22 | 苏州韬盛电子科技有限公司 | Vertical probe card |
| US10884026B2 (en) | 2017-05-18 | 2021-01-05 | Twinsolution Technology (Suzhou) Ltd | Vertical probe card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000, floor 2, building 39, No. 18, Dongchang Road, Suzhou Industrial Park, Jiangsu Province Patentee after: Strong Half Conductor (Suzhou) Co.,Ltd. Address before: 2nd Floor, Building 39, China Energy Conservation and Environmental Protection Technology Industrial Park, No. 18 Dongchang Road, Industrial Park, Suzhou City, Jiangsu Province, 210095 Patentee before: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. |