CN219203107U

CN219203107U - Wafer stage apparatus

Info

Publication number: CN219203107U
Application number: CN202320007765.2U
Authority: CN
Inventors: 刘活; 韦敏荣; 王英广; 王健; 李安平
Original assignee: Shenzhen Mifitech Technology Co ltd
Current assignee: Shenzhen Mifitech Technology Co ltd
Priority date: 2023-01-03
Filing date: 2023-01-03
Publication date: 2023-06-16
Anticipated expiration: 2033-01-03

Abstract

The application belongs to the technical field of semiconductor packaging, and provides a wafer platform device which comprises a substrate; the film expanding mechanism comprises a first driving assembly and a first rotary table, the first driving assembly is arranged on the substrate, the first rotary table is in transmission connection with the first driving assembly, and the first driving assembly can drive the first rotary table to linearly move back and forth; the rotating mechanism comprises a second driving assembly and a second rotating disc, the second driving assembly is arranged on the base plate, the second rotating disc is respectively in transmission connection with the second driving assembly and the first rotating disc, and the second driving assembly can drive the first rotating disc to rotate through the second rotating disc; the bearing table is in transmission connection with the first rotating disc, and a mounting position for mounting the crystal disc is arranged on the bearing table. The wafer platform device provided by the application can simultaneously perform a film expansion process and a rotation process on the wafer disc through being provided with the film expansion mechanism and the rotation mechanism, and improves the production efficiency of the whole wafer platform device.

Description

Wafer stage apparatus

Technical Field

The present application relates to the field of semiconductor packaging technology, and more particularly, to a wafer stage apparatus.

Background

The wafer platform device is a common mechanism on equipment such as a chip mounter, and in the production process, the wafer platform device can realize the functions of wafer bearing, wafer fixing, wafer position changing, wafer film expanding and the like. The wafer stage device mainly comprises a wafer rotating system and a film expanding system.

Most of the existing wafer platform devices realize two functions of wafer film expansion and angle rotation only through a single driver, a conversion mechanism is arranged between two sets of equipment components in different procedures, and one set of equipment components of the driver is changed to realize transmission connection by controlling the conversion mechanism, so that the whole wafer platform device can only perform one of the two functions of wafer film expansion and angle rotation each time, cannot be performed simultaneously, and the production efficiency of the wafer platform device is seriously reduced.

Disclosure of Invention

An objective of the embodiments of the present application is to provide a wafer stage device, so as to solve the technical problem that the wafer stage device in the prior art cannot perform the film expansion and rotation processes at the same time, resulting in low production efficiency of the wafer stage device.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows: provided is a wafer stage apparatus including: a substrate; the film expanding mechanism comprises a first driving assembly and a first rotary table, wherein the first driving assembly is arranged on the substrate, the first rotary table is in transmission connection with the first driving assembly, and the first driving assembly can drive the first rotary table to linearly move back and forth; the rotating mechanism comprises a second driving assembly and a second rotary table, the second driving assembly is arranged on the base plate, the second rotary table is respectively in transmission connection with the second driving assembly and the first rotary table, and the second driving assembly can drive the first rotary table to rotate through the second rotary table; the bearing table is in transmission connection with the first rotating disc, and an installation position for installing the crystal disc is arranged on the bearing table.

The wafer platform device provided by the application has the beneficial effects that: compared with the prior art, the wafer platform device has the advantages that the first driving component and the second driving component are arranged on the substrate, the bearing table is in transmission connection with the first rotating disc, the first rotating disc is in transmission connection with the first driving component, and therefore the first driving component can drive the wafer disc on the bearing table through the first rotating disc to complete a film expanding process; the second carousel is connected with second drive assembly and first carousel transmission simultaneously to second drive assembly can drive first carousel through the second carousel and rotate, with the rotatory process is accomplished to the brilliant disc that drives on the plummer, makes the wafer platform device of this application can be under first drive assembly and second drive assembly drive, carries out the membrane process and the rotatory process to the brilliant disc simultaneously, improves the production efficiency of whole wafer platform device.

In one embodiment, the film expanding mechanism comprises a limiting block, the limiting block is arranged on one side, close to the bearing table, of the first rotating disc, a limiting groove is formed in one side, close to the first rotating disc, of the bearing table, and the limiting block is clamped in the limiting groove.

In one embodiment, a foolproof groove for being connected with the crystal disc in a clamping manner is formed in one side, away from the first rotary disc, of the bearing table.

In one embodiment, the first driving assembly includes a first driver, a first transmission portion and a transmission turntable, the first driver and the first transmission portion are both disposed on the substrate, the first driver is in transmission connection with the first transmission portion, the transmission turntable is in transmission connection with the first transmission portion, and the first turntable is connected with the transmission turntable.

In one embodiment, the first transmission part comprises a transmission wheel set, a lifting screw and a lifting block, wherein the transmission wheel set is in transmission connection with the first driver, the lifting screw is in transmission connection with the transmission wheel set, the lifting block is arranged on the periphery side of the transmission turntable, and the lifting block is in threaded connection with the lifting screw.

In one embodiment, the film expanding mechanism further comprises a first sensor and a first sensing piece, wherein the first sensor is arranged on one of the base plate and the transmission turntable, the first sensing piece is arranged on the other one of the base plate and the transmission turntable, and the first sensor is used for sensing the first sensing piece.

In one embodiment, the film expanding mechanism comprises a supporting ring, the supporting ring is connected with the second turntable, and the supporting ring is used for assisting the crystal disc in the installation position to complete the film expanding process.

In one embodiment, the rotating mechanism comprises a second sensor and a second sensing piece, wherein the second sensor is arranged on one of the base plate and the second rotating disc, the second sensing piece is arranged on the other of the base plate and the second rotating disc, and the second sensor can be used for sensing the second sensing piece.

In one embodiment, a limiting piece is arranged on one side, close to the first rotary disc, of the second rotary disc, a limiting hole is formed on one side, close to the second rotary disc, of the first rotary disc, and the limiting piece is clamped in the limiting hole.

In one embodiment, the film expanding mechanism comprises a plurality of groups of follower wheels, the follower wheels are circumferentially distributed on the first driving assembly, a clamping space is formed between each group of follower wheels, and the first turntable can be rotatably clamped in the clamping space along the axis of the first turntable.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a wafer stage apparatus according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of another perspective view of the wafer stage apparatus shown in FIG. 1;

FIG. 3 is a schematic perspective view of the first turntable, the second turntable, the bearing table, the transmission turntable and the support ring shown in FIG. 1;

FIG. 4 is a cross-sectional block diagram of the first turntable, the second turntable, the carrier table, the drive turntable, and the support ring shown in FIG. 3;

fig. 5 is an enlarged view at a shown in fig. 4;

FIG. 6 is an exploded view of the first turntable, second turntable, carrier table, drive turntable, and support ring shown in FIG. 3;

FIG. 7 is a schematic perspective view of the transmission turntable shown in FIG. 3;

fig. 8 is a schematic perspective view of the second turntable shown in fig. 3.

Wherein, each reference sign in the figure:

10. a substrate;

20. a film expanding mechanism; 21. a first drive assembly; 211. a first driver; 212. a first transmission part; 2121. a transmission wheel set; 2122. lifting screw rods; 2123. a lifting block; 213. a transmission turntable; 2131. a follower wheel; 22. a first turntable; 221. a limiting block; 23. a first sensor; 24. a first sensing member; 25. a support ring;

30. a rotation mechanism; 31. a second drive assembly; 32. a second turntable; 321. a limiting piece; 33. a second sensor; 34. a second sensing member;

40. a carrying platform; 41. a mounting position; 42. a limit groove; 43. a fool-proof groove.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

Referring to fig. 1 to 5, a description will now be given of a wafer stage apparatus according to an embodiment of the present application. The wafer stage device comprises a substrate 10, a film expanding mechanism 20, a rotating mechanism 30 and a bearing table 40.

The film expanding mechanism 20 comprises a first driving component 21 and a first rotating disc 22, wherein the first driving component 21 is arranged on the base plate 10, the first rotating disc 22 is in transmission connection with the first driving component 21, and the first driving component 21 can drive the first rotating disc 22 to linearly move back and forth so as to complete the film expanding process; the rotating mechanism 30 comprises a second driving component 31 and a second rotary table 32, the second driving component 31 is arranged on the base plate 10, the second rotary table 32 is respectively in transmission connection with the second driving component 31 and the first rotary table 22, and the second driving component 31 can drive the first rotary table 22 to rotate through the second rotary table 32; the bearing table 40 is in transmission connection with the first rotating disc 22, and a mounting position 41 for mounting the crystal disc is arranged on the bearing table 40.

For example, as shown in fig. 1 to 5, the substrate 10 is mainly used for providing a mounting position 41 for other mechanisms, the film expanding mechanism 20 is provided with a first driving component 21 capable of independently providing power output, the first driving component 21 is mounted on the substrate 10, and the first driving component 21 can drive the first rotating disc 22 to move up and down so as to drive the wafer disc to move up and down to complete the film expanding process; the rotating mechanism 30 is also provided with a second driving component 31 which can independently provide power output, the second driving component 31 is also arranged on the base plate 10, and the second driving component 31 can drive the second turntable 32 to rotate around the central axis of the second turntable 32 so as to drive the crystal disc to rotate to complete the rotating process; the carrying table 40 is arranged on the first rotating disc 22, the wafer disc to be processed can be mounted on the mounting position 41 of the carrying table 40, and the carrying table 40 is mainly used for providing a mounting position 41 for the wafer disc to be processed.

Compared with the prior art, the wafer platform device provided by the application has the advantages that the first driving component 21 and the second driving component 31 are arranged on the substrate 10, the bearing table 40 is in transmission connection with the first rotating disc 22, the first rotating disc 22 is in transmission connection with the first driving component 21, and therefore the first driving component 21 can drive the wafer disc on the bearing table 40 through the first rotating disc 22 to complete a film expanding process; the second carousel 32 is connected with second drive assembly 31 and first carousel 22 transmission simultaneously to second drive assembly 31 can drive first carousel 22 through second carousel 32 and rotate, with the rotatory process is accomplished to the wafer disc that drives on the plummer 40, makes the wafer platform device of this application can be under first drive assembly 21 and second drive assembly 31 drive, carries out the membrane process and the rotatory process to the wafer disc simultaneously, improves the production efficiency of whole wafer platform device.

In an embodiment of the present application, referring to fig. 1 and fig. 3, the film expanding mechanism 20 includes a limiting block 221, the limiting block 221 is disposed on a side of the first rotating disc 22 near the bearing table 40, a limiting groove 42 is disposed on a side of the bearing table 40 near the first rotating disc 22, and the limiting block 221 is engaged in the limiting groove 42.

Specifically, the limiting block 221 is connected with the first rotating disc 22 through a fastener, the bearing table 40 is provided with a limiting groove 42 matched with the limiting block 221 in shape, and when the bearing table 40 is connected with the first rotating disc 22, the limiting block 221 is clamped in the limiting groove 42, so that when the first rotating disc 22 rotates, the bearing table 40 and a crystal disc to be processed on the bearing table 40 can be driven to rotate together, and transmission connection between the first rotating disc 22 and the bearing table 40 is realized.

In one embodiment of the present application, referring to fig. 1 and 3, a foolproof slot 43 for snap-fit connection with the wafer disc is provided on a side of the carrying table 40 facing away from the first rotating disc 22.

Specifically, the fool-proof slot 43 is located in the mounting position 41 of the carrying platform 40, when the wafer disc to be processed is mounted in the mounting position 41, the wafer disc to be processed needs to be mounted in the mounting position 41 at a set angle to be mutually clamped and mounted with the fool-proof slot 43, otherwise, the wafer disc to be processed cannot be mounted in the mounting position 41. By providing the fool-proof groove 43 on the carrying table 40, the crystal disc to be processed can be effectively ensured to be mounted in the carrying table 40 at a correct angle, thereby ensuring the subsequent processing quality and efficiency.

In one embodiment of the present application, referring to fig. 1, 4 and 5, the first driving assembly 21 includes a first driver 211, a first transmission portion 212 and a transmission turntable 213, wherein the first driver 211 and the first transmission portion 212 are disposed on the substrate 10, the first driver 211 is in transmission connection with the first transmission portion 212, the transmission turntable 213 is in transmission connection with the first transmission portion 212, and the first turntable 22 is connected with the transmission turntable 213.

Specifically, the first driver 211 is mainly responsible for outputting power, the first transmission portion 212 mainly assists in transferring the power output from the first driver 211 to the transmission turntable 213, in this embodiment, the transmission turntable 213 is in a ring structure, and the first driver 211 needs to drive the first turntable 22 to move up and down, so 4 transmission fulcrums need to be disposed between the first transmission portion 212 and the transmission turntable 213, the 4 transmission fulcrums are circumferentially distributed on the outer peripheral side of the transmission turntable 213, the first driver 211 transfers the power to the 4 transmission fulcrums, and the 4 transmission fulcrums simultaneously drive the transmission turntable 213 to complete the up and down movement.

In one embodiment of the present application, referring to fig. 1, the first driver 211 is a motor, the first transmission portion 212 includes a transmission wheel set 2121, a lifting screw 2122 and a lifting block 2123, the transmission wheel set 2121 is in transmission connection with the first driver 211, the lifting screw 2122 is in transmission connection with the transmission wheel set 2121, the lifting block 2123 is disposed on the outer peripheral side of the transmission turntable 213, and the lifting block 2123 is in threaded connection with the lifting screw 2122.

Specifically, a belt transmission mode is provided between the driving wheel sets 2121, the belt transmission mode can improve the stability of the power transmission process, in the running process, the first driver 211 drives the driving wheel sets 2121 to rotate, then the driving wheel sets 2121 drive the lifting screw 2122 to rotate, and meanwhile, due to the threaded connection between the lifting screw 2122 and the lifting block 2123, when the lifting screw 2122 rotates, the lifting block 2123 drives the driving turntable 213 to complete lifting movement under the driving of the threaded structure. Through setting up first driver 211 as the motor to set up threaded connection structure between lifting screw 2122 and the lifting block 2123, can improve and wait to process brilliant disc lift process accuracy, thereby control more accurately and wait to process brilliant disc lift distance, improve the tectorial membrane effect of waiting to process brilliant disc in the tectorial membrane process, improve the quality of product.

In one embodiment of the present application, referring to fig. 1, the film expanding mechanism 20 further includes a first sensor 23 and a first sensing element 24, the first sensor 23 is disposed on one of the substrate 10 and the transmission turntable 213, the first sensing element 24 is disposed on the other of the substrate 10 and the transmission turntable 213, and the first sensor 23 is used for sensing the first sensing element 24.

Specifically, the first sensor 23 is formed with a detection groove, and when the first sensing piece 24 moves into the detection groove, the first sensor 23 can detect the first sensing piece 24. The first sensor 23 is disposed on the substrate 10, the first sensing element 24 is disposed on the transmission turntable 213, and when the first sensing element 24 moves up and down along with the transmission turntable 213, the first sensing element 24 passes through the detection groove, and at this time, the first sensor 23 can sense the position of the first sensing element 24, thereby obtaining the position information of the transmission turntable 213, and knowing the film expansion condition of the wafer disc to be processed.

In one embodiment of the present application, referring to fig. 3 to 6, the film expanding mechanism 20 includes a supporting ring 25, the supporting ring 25 is connected to the second turntable 32, and the supporting ring 25 is used for assisting the wafer in the mounting position 41 to complete the film expanding process.

Specifically, the second driving assembly 31 includes a second driver and a second transmission portion, where the second driver and the second transmission portion are both disposed on the substrate 10, the second driver is in transmission connection with the second transmission portion, the second transmission portion is in transmission connection with the second turntable 32, and the second driver drives the second turntable 32 to rotate through the second transmission portion. The support ring 25 is connected to the second turntable 32 near one side of the second turntable 32, one side of the support ring 25 away from the second turntable 32 is a support part, and the support part is located at the position of the mounting position 41 of the bearing table 40, when the bearing table 40 descends along with the transmission turntable 213 and the first turntable 22, the support ring 25 is kept motionless, so that the support ring 25 and the bearing table 40 relatively move, and at this time, the support part in the support ring 25 acts on the wafer disc to be processed, thereby driving the wafer disc to complete the film expansion process.

In one embodiment of the present application, referring to fig. 2, the rotating mechanism 30 includes a second sensor 33 and a second sensing element 34, the second sensor 33 is disposed on one of the base plate 10 and the second turntable 32, the second sensing element 34 is disposed on the other of the base plate 10 and the second turntable 32, and the second sensor 33 is used for sensing the second sensing element 34.

Specifically, the second sensor 33 is also formed with a detection groove, and when the second sensing member 34 moves into the detection groove, the second sensor 33 can detect the second sensing member 34. The second sensor 33 is disposed on the substrate 10, the second sensing element 34 is disposed on the second turntable 32, and when the second sensing element 34 rotates along with the second turntable 32, the second sensing element 34 passes through the detection slot, and at this time, the second sensor 33 can sense the position of the second sensing element 34, thereby obtaining the motion information of the second turntable 32, and knowing the rotation condition of the wafer disc to be processed.

In an embodiment of the present application, referring to fig. 6 and 8, a limiting member 321 is disposed on a side of the second turntable 32 adjacent to the first turntable 22, a limiting hole is disposed on a side of the first turntable 22 adjacent to the second turntable 32, and the limiting member 321 is engaged in the limiting hole.

Specifically, the limiting piece 321 is provided with a convex column in a protruding manner, the shape of the limiting hole is matched with the shape of the convex column, when the first rotating disc 22 and the second rotating disc 32 are installed together, the convex column on the limiting piece 321 is clamped in the limiting hole, so that transmission connection between the first rotating disc 22 and the second rotating disc 32 is completed, when the second driver drives the second rotating disc 32 to rotate, the second rotating disc 32 can simultaneously drive the first rotating disc 22 to rotate together, meanwhile, the first rotating disc 22 and the bearing table 40 are also in transmission connection, and therefore the rotation procedure is completed by the second driver indirectly driving the crystal disc on the bearing table 40.

In an embodiment of the present application, referring to fig. 4 to 7, the film expanding mechanism 20 includes a plurality of groups of follower wheels 2131, the plurality of groups of follower wheels 2131 are circumferentially distributed on the first driving assembly 21, a clamping space is provided between each group of follower wheels 2131, and the first rotating disc 22 is rotatably clamped in the clamping space along its own axis.

Specifically, in the present embodiment, the follower wheels 2131 are provided with 4 groups, the 4 groups of follower wheels 2131 are all disposed on the inner side surface of the transmission turntable 213, meanwhile, the diameter of the first turntable 22 is smaller than that of the transmission turntable 213, the transmission turntable 213 is disposed around the outer periphery side of the first turntable 22, and the outer side surface of the first turntable 22 is convexly provided with an annular convex portion assumed in the clamping space, so that the transmission turntable 213 can drive the first turntable 22 to realize lifting movement together, but does not affect the relative rotation between the first turntable 22 and the transmission turntable 213, so that the first turntable 22 can complete the rotation action while lifting movement.

The foregoing description of the preferred embodiments of the present utility model has been provided for the purpose of illustrating the general principles of the present utility model and is not to be construed as limiting the scope of the utility model in any way. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model, and other embodiments of the present utility model as will occur to those skilled in the art without the exercise of inventive faculty, are intended to be included within the scope of the present utility model.

Claims

1. A wafer stage apparatus, comprising:

a substrate;

the film expanding mechanism comprises a first driving assembly and a first rotary table, wherein the first driving assembly is arranged on the substrate, the first rotary table is in transmission connection with the first driving assembly, and the first driving assembly can drive the first rotary table to linearly move back and forth;

the rotating mechanism comprises a second driving assembly and a second rotary table, the second driving assembly is arranged on the base plate, the second rotary table is respectively in transmission connection with the second driving assembly and the first rotary table, and the second driving assembly can drive the first rotary table to rotate through the second rotary table;

the bearing table is in transmission connection with the first rotating disc, and an installation position for installing the crystal disc is arranged on the bearing table.

2. The wafer stage apparatus according to claim 1, wherein: the film expanding mechanism comprises a limiting block, the limiting block is arranged on one side, close to the bearing table, of the first rotary table, a limiting groove is formed in one side, close to the first rotary table, of the bearing table, and the limiting block is clamped in the limiting groove.

3. The wafer stage apparatus according to claim 2, wherein: one side of the bearing table, which is away from the first rotary table, is provided with a fool-proof groove for being connected with the crystal disc in a clamping way.

4. The wafer stage apparatus according to claim 1, wherein: the first driving assembly comprises a first driver, a first transmission part and a transmission turntable, wherein the first driver and the first transmission part are arranged on the substrate, the first driver is in transmission connection with the first transmission part, the transmission turntable is in transmission connection with the first transmission part, and the first turntable is connected with the transmission turntable.

5. The wafer stage apparatus according to claim 4, wherein: the first transmission part comprises a transmission wheel set, a lifting screw and a lifting block, wherein the transmission wheel set is in transmission connection with the first driver, the lifting screw is in transmission connection with the transmission wheel set, the lifting block is arranged on the periphery side of the transmission turntable, and the lifting block is in threaded connection with the lifting screw.

6. The wafer stage apparatus according to claim 4, wherein: the film expanding mechanism further comprises a first sensor and a first sensing piece, wherein the first sensor is arranged on one of the base plate and the transmission turntable, the first sensing piece is arranged on the other one of the base plate and the transmission turntable, and the first sensor is used for sensing the first sensing piece.

7. The wafer stage apparatus according to claim 1, wherein: the film expanding mechanism comprises a supporting ring, wherein the supporting ring is connected with the second turntable and is used for assisting the crystal disc in the installation position to complete the film expanding process.

8. The wafer stage apparatus according to claim 1, wherein: the rotating mechanism comprises a second sensor and a second sensing piece, wherein the second sensor is arranged on one of the base plate and the second rotating disc, the second sensing piece is arranged on the other one of the base plate and the second rotating disc, and the second sensor is used for sensing the second sensing piece.

9. The wafer stage apparatus according to claim 1, wherein: one side of the second turntable, which is close to the first turntable, is provided with a limiting part, one side of the first turntable, which is close to the second turntable, is provided with a limiting hole, and the limiting part is clamped in the limiting hole.

10. The wafer stage apparatus according to claim 9, wherein: the film expanding mechanism comprises a plurality of groups of follower wheels, the follower wheels are circumferentially distributed on the first driving assembly, clamping spaces are formed between the follower wheels, and the first rotary table can be rotationally clamped in the clamping spaces along the axis of the first rotary table.