CN219163427U

CN219163427U - Novel COB packaging structure and light source module thereof

Info

Publication number: CN219163427U
Application number: CN202320177224.4U
Authority: CN
Inventors: 李建胜
Original assignee: Shanghai Toplite Technology Co ltd
Current assignee: Shanghai Toplite Technology Co ltd
Priority date: 2023-02-10
Filing date: 2023-02-10
Publication date: 2023-06-09
Anticipated expiration: 2033-02-10

Abstract

The utility model belongs to the technical field of LED semiconductor illumination, and discloses a novel COB packaging structure and a light source module thereof. The novel COB packaging structure comprises a first substrate, a second substrate and a third substrate, wherein the second substrate is provided with a front surface and a back surface which are parallel to each other, the first substrate and the back surface are mutually attached, a through hole which penetrates through the front surface and the back surface is arranged on the second substrate, a first bonding pad is arranged on the front surface, a second bonding pad is arranged on the back surface, and the first bonding pad and the second bonding pad are connected through the through hole; the third substrate is arranged on one side of the first substrate far away from the second substrate, and the second bonding pad is connected with the third substrate through reflow soldering. According to the novel COB packaging structure provided by the utility model, the second bonding pad is connected with the third substrate through reflow soldering, so that the degree of automation is improved. The light source module provided by the utility model comprises the novel COB packaging structure, and the second substrate and the third substrate are connected through reflow soldering, so that the production efficiency is effectively improved.

Description

Novel COB packaging structure and light source module thereof

Technical Field

The utility model relates to the technical field of LED semiconductor illumination, in particular to a novel COB packaging structure and a light source module thereof.

Background

COB packaging is known as Chip On Board (COB), which is a technology for solving the problem of LED heat dissipation, and compared with direct-insert type and Surface Mounted Device (SMD), the COB packaging is characterized by space saving, simplified packaging operation and high-efficiency thermal management mode.

The COB package is to adhere a bare chip to an interconnection substrate with conductive or non-conductive adhesive, and then wire-bond the bare chip to achieve electrical connection. In the prior art, the front surface of the BT plate in the COB packaging structure is directly welded on the substrate, and manual welding operation is needed, so that the production efficiency is reduced.

Disclosure of Invention

The utility model aims to provide a novel COB packaging structure and a light source module thereof, and aims to improve the automation degree of COB packaging structure processing and further improve the production efficiency.

To achieve the purpose, the utility model adopts the following technical scheme:

novel COB packaging structure includes:

a first substrate;

the first substrate and the reverse side are mutually attached, a through hole penetrating through the front side and the reverse side is formed in the second substrate, a first bonding pad is arranged on the front side, a second bonding pad is arranged on the reverse side, and the first bonding pad and the second bonding pad are connected through the through hole;

and the third substrate is arranged on one side of the first substrate far away from the second substrate, and the second bonding pad is connected with the third substrate through reflow soldering.

Optionally, the first bonding pads are provided in plurality, the second bonding pads are provided in plurality, and the first bonding pads and the second bonding pads are provided in plurality in one-to-one correspondence.

Optionally, the first bonding pads are provided with four, the second bonding pads are provided with four, four first bonding pads are uniformly spaced and arranged on the front surface, and four second bonding pads are uniformly spaced and arranged on the back surface.

Optionally, the first substrate is in a cross structure, the second substrate is in a square structure, and the first substrate and the second substrate are coaxially arranged.

Optionally, the number of the through holes is four, the four through holes are respectively and correspondingly arranged at four corners of the second substrate, and the through holes are positioned in non-overlapping areas of the second substrate and the first substrate.

Optionally, the first substrate is a mirror aluminum substrate.

Optionally, the second substrate is a BT plate.

Optionally, the front side is provided with a chip.

Optionally, a fluorescent powder is arranged on one side of the chip away from the front surface.

The light source module comprises the novel COB packaging structure according to any one of the schemes.

The utility model has the beneficial effects that: according to the novel COB packaging structure provided by the utility model, the first bonding pad is arranged on the front surface, the second bonding pad is arranged on the back surface, the through holes of the second substrate penetrate through the front surface and the back surface, so that the first bonding pad and the second bonding pad are connected through the through holes, and the second bonding pad is connected with the corresponding structure on the third substrate through reflow soldering, so that the automation degree is improved, the assembly is convenient, and the production efficiency is further improved.

The light source module provided by the utility model comprises the novel COB packaging structure, and the second substrate and the third substrate are connected through reflow soldering, so that the degree of automation is high, and the production efficiency is effectively improved.

Drawings

Fig. 1 is a schematic structural diagram of a first substrate and a second substrate assembled at a viewing angle according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of a first substrate and a second substrate assembled at another view angle according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a third substrate according to an embodiment of the present utility model.

In the figure:

100. a first substrate;

200. a second substrate; 210. a front face; 220. a reverse side; 230. a through hole; 240. a first bonding pad; 250. a second bonding pad;

300. and a third substrate.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The embodiment provides a light source module, and this light source module includes novel COB packaging structure, and this novel COB packaging structure need not manual welding operation, has improved the degree of automation of equipment, and then has effectively improved production efficiency.

Specifically, as shown in fig. 1 to 3, the novel COB package structure includes a first substrate 100, a second substrate 200, and a third substrate 300, wherein the second substrate 200 has a front side 210 and a back side 220 that are parallel to each other, the first substrate 100 and the back side 220 are attached to each other, a through hole 230 penetrating the front side 210 and the back side 220 is formed in the second substrate 200, a first bonding pad 240 is formed in the front side 210, a second bonding pad 250 is formed in the back side 220, and the first bonding pad 240 and the second bonding pad 250 are connected through the through hole 230; the third substrate 300 is disposed on a side of the first substrate 100 away from the second substrate 200, and the second pads 250 are connected to the third substrate 300 by reflow soldering.

According to the novel COB packaging structure provided by the utility model, the front surface 210 is provided with the first bonding pad 240, the back surface 220 is provided with the second bonding pad 250, the through hole 230 of the second substrate 200 penetrates through the front surface 210 and the back surface 220, the first bonding pad 240 and the second bonding pad 250 are connected through the through hole 230, the second bonding pad 250 is connected with a corresponding structure (such as a bump bonding pad structure) on the third substrate 300 through reflow soldering, the automation degree is improved, the assembly is convenient, and the production efficiency is further improved.

The light source module provided by the utility model comprises the novel COB packaging structure, the second substrate 200 and the third substrate 300 are connected through reflow soldering, the automation degree is high, and the production efficiency is effectively improved.

Alternatively, the first pads 240 are provided in plurality, the second pads 250 are provided in plurality, and the plurality of first pads 240 and the plurality of second pads 250 are provided in one-to-one correspondence. The second pad 250 may serve as a positive and negative electrode pad, and is connected to the third substrate 300. Specifically, the first pads 240 are provided in four, the second pads 250 are provided in four, the four first pads 240 are uniformly spaced apart from the front surface 210, and the four second pads 250 are uniformly spaced apart from the back surface 220. Illustratively, the four second pads 250 are two positive electrode pads and two negative electrode pads, respectively. In other embodiments, the second pads 250 may be configured as other, such as six, etc., as desired.

In the present embodiment, the first substrate 100 has a cross structure, the second substrate 200 has a square structure, and the first substrate 100 and the second substrate 200 are coaxially disposed, so as to facilitate assembly of the first substrate 100 and the second substrate 200. When assembled, the first substrate 100 and the second substrate 200 are pressed together, so that the reliability of connection is ensured.

Specifically, the number of the through holes 230 is four, the four through holes 230 are respectively and correspondingly arranged at four corners of the second substrate 200, and the through holes 230 are located in non-overlapping areas of the second substrate 200 and the first substrate 100, and the through holes 230 are uniformly distributed and are convenient for processing.

The front side 210 of the second substrate 200 is further provided with a chip. The chip may be an LED chip for emitting light.

The side of the chip away from the front surface 210 is provided with fluorescent powder, which can make the light color softer or more vivid, and the fluorescent powder is made of an organic silicon elastomer material, has high light transmittance and refractive index, and has better thermal stability.

Alternatively, the first substrate 100 is a mirror aluminum substrate. It should be noted that, those skilled in the art can also set the first substrate 100 as a ceramic substrate or other substrates with the same functions according to the needs.

Alternatively, the second substrate 200 is a BT plate, which is a resin substrate, having excellent dielectric properties and good mechanical properties.

It will be apparent that the above examples of the present utility model are given for clarity of illustration of the utility model and are not limiting of the embodiments of the utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

1. Novel COB packaging structure, its characterized in that includes:

a first substrate (100);

a second substrate (200) having a front surface (210) and a back surface (220) parallel to each other, the first substrate (100) and the back surface (220) are attached to each other, a through hole (230) penetrating the front surface (210) and the back surface (220) is formed in the second substrate (200), a first bonding pad (240) is formed in the front surface (210), a second bonding pad (250) is formed in the back surface (220), and the first bonding pad (240) and the second bonding pad (250) are connected through the through hole (230);

and a third substrate (300) which is arranged on one side of the first substrate (100) away from the second substrate (200), and the second bonding pad (250) is connected with the third substrate (300) through reflow soldering.

2. The COB package structure of claim 1, wherein the first pads (240) are provided in plurality, the second pads (250) are provided in plurality, and the first pads (240) and the second pads (250) are provided in a one-to-one correspondence.

3. The novel COB package structure of claim 2, wherein the first pads (240) are four, the second pads (250) are four, four of the first pads (240) are uniformly spaced apart from the front surface (210), and four of the second pads (250) are uniformly spaced apart from the back surface (220).

4. The novel COB package structure of claim 1, wherein the first substrate (100) is a cross-shaped structure, the second substrate (200) is a square-shaped structure, and the first substrate (100) and the second substrate (200) are coaxially disposed.

5. The COB package structure of claim 4, wherein four through-holes (230) are provided, the four through-holes (230) are respectively and correspondingly provided at four corners of the second substrate (200), and the through-holes (230) are located in non-overlapping regions of the second substrate (200) and the first substrate (100).

6. The novel COB package as claimed in any one of claims 1-5, wherein the first substrate (100) is a mirrored aluminum substrate.

7. The novel COB package structure of any one of claims 1-5, wherein the second substrate (200) is a BT plate.

8. The novel COB package as claimed in any one of claims 1-5, wherein said front surface (210) is provided with chips.

9. The novel COB package structure of claim 8, wherein the chip is provided with phosphor on a side away from the front surface (210).

10. A light source module comprising the novel COB package as claimed in any one of claims 1 to 9.