CN219145722U - High-thickness copper PCB multilayer board - Google Patents
High-thickness copper PCB multilayer board Download PDFInfo
- Publication number
- CN219145722U CN219145722U CN202223552644.0U CN202223552644U CN219145722U CN 219145722 U CN219145722 U CN 219145722U CN 202223552644 U CN202223552644 U CN 202223552644U CN 219145722 U CN219145722 U CN 219145722U
- Authority
- CN
- China
- Prior art keywords
- wall
- multilayer board
- shell
- copper pcb
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 39
- 239000010949 copper Substances 0.000 title claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 239000002023 wood Substances 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a high-thickness copper PCB (printed circuit board) multilayer board which comprises a multilayer board body, wherein a first radiating plate and a second radiating plate are arranged on two sides of the multilayer board body, the first radiating plate and the second radiating plate both comprise a shell, a vacuum cavity is arranged in the shell, capillary layers are arranged on the inner wall of the shell, support columns which are uniformly distributed are arranged between the inner walls of the two sides of the shell, radiating protrusions which are uniformly distributed are arranged on the outer wall of the shell, a liquid inlet nozzle is integrally formed on the outer wall of the top of the shell, and a sealing cover is connected to the top of the liquid inlet nozzle through threads. According to the utility model, through the arranged shell and capillary tube, alcohol is injected into the vacuum cavity of the shell, and the vacuum cavity is in a vacuum state, so that when the multi-layer board body heats, the alcohol can evaporate and absorb heat and liquefy the inner wall of the shell, which is close to the heat dissipation bulge, so that heat generated by the multi-layer board body can be efficiently dissipated, and therefore, the effect of high-efficiency heat dissipation of the high-thickness copper PCB multi-layer board is realized.
Description
Technical Field
The utility model relates to the technical field of PCB boards, in particular to a high-thickness copper PCB multilayer board.
Background
The PCB multilayer board is more than two layers of printed boards, and consists of connecting wires on a plurality of layers of insulating substrates and bonding pads for assembling and welding electronic elements, and has the functions of conducting each layer of circuits and insulating each other.
Chinese patent number 201921482648.1 discloses a super thick copper PCB multiply wood belongs to PCB multiply wood technical field, including thick copper PCB board in top layer, thick copper PCB board in middle level and thick copper PCB board in bottom, the thick copper PCB board in bottom of thick copper PCB board in top layer is connected with thick copper PCB board in bottom through thick copper PCB board in middle layer, thick copper PCB board in top layer bottom and thick copper PCB board in bottom all are fixed with the lug, the top and the bottom of the thick copper PCB board in middle level have all seted up flutedly.
At present, a plurality of printed boards are stacked to form a PCB multi-layer board, so that heat is accumulated in the printed boards during working, the outside of the printed boards naturally contacts with air, the heat dissipation effect of the printed boards is poor, and the PCB multi-layer board can be damaged due to high temperature. Therefore, there is a need to design a high-thickness copper PCB multilayer board to solve the above problems.
Disclosure of Invention
The utility model aims to provide a high-thickness copper PCB multilayer board so as to solve the defects in the prior art.
In order to achieve the above object, the present utility model provides the following technical solutions:
the utility model provides a high thick copper PCB multiply wood, includes the multiply wood body, the both sides of multiply wood body are provided with heating panel one and heating panel two, heating panel one and heating panel two all include the casing, the inside of casing is provided with the vacuum chamber, the inner wall of casing is provided with the capillary layer, be provided with evenly distributed's support column between the both sides inner wall of casing, the outer wall of casing is provided with evenly distributed's heat dissipation arch, the top outer wall integrated into one piece of casing has the feed liquor mouth, there is sealed lid at the top of feed liquor mouth through threaded connection.
Further, the inner wall of the liquid inlet nozzle is provided with a conical hole, and the inner wall of the top of the sealing cover is integrally formed with a conical body matched with the conical hole.
Further, the outer wall of the top of the sealing cover is provided with a hexagonal hole, and a sealing gasket is arranged in the sealing cover.
Further, the multi-layer board body comprises a plurality of laminated single boards, and connecting cylinders are arranged in the single boards.
Further, an upper baffle ring is integrally formed at the top end of the connecting cylinder, a lower baffle ring is integrally formed at the bottom end of the connecting cylinder, and a plurality of single plates are positioned between the upper baffle ring and the lower baffle ring.
Further, heat conduction silica gel is arranged between the first heat radiation plate, the second heat radiation plate and the multi-layer plate body, and a supporting plate is fixed at the bottoms of the first heat radiation plate and the second heat radiation plate.
Further, the bottom integrated into one piece of connecting cylinder has the spliced pole, the outer wall integrated into one piece of spliced pole has the anti-slip ring.
In the technical scheme, the high-thickness copper PCB multilayer board provided by the utility model has the beneficial effects that:
(1) Through casing and capillary that set up, with the inside alcohol that pours into of vacuum chamber of casing into to make vacuum intracavity portion form vacuum state, alcohol can evaporate the heat absorption and liquefy near the bellied inner wall of heat dissipation at the casing when the multiply wood body generates heat, make the heat that the multiply wood body produced can effectually dispel, consequently realized the efficient effect of high thick copper PCB multiply wood heat dissipation.
(2) Through welding post and the antiskid ring that sets up, welding post and connecting cylinder integrated into one piece are as the pin of multiply wood body for the multilayer board body is after the welding, and the antiskid ring can realize carrying out the effect of embedding each other with the solder, and then more firm when making high thick copper PCB multiply wood welded, and can not produce the phenomenon of rosin joint.
(3) Through sealed lid and the feed liquor mouth that sets up, utilize the conical body that seals to cover to cooperate with the inside bell mouth of feed liquor mouth for sealed lid is better to the sealed effect of feed liquor mouth, has consequently realized preventing the inside vacuum chamber of shell and has got into the effect of air.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic diagram of a front view structure of a high-thickness copper PCB multilayer board according to an embodiment of the present utility model.
Fig. 2 is a schematic diagram of an internal structure of a high-thickness copper PCB multilayer board according to an embodiment of the present utility model.
Fig. 3 is a schematic diagram of a heat dissipating plate according to an embodiment of the present utility model.
Fig. 4 is a schematic view of a liquid inlet nozzle structure provided by an embodiment of a high-thickness copper PCB multilayer board according to the present utility model.
Reference numerals illustrate:
the heat-conducting plate comprises a 1 multi-layer plate body, a 2 heat-radiating plate I, a 3 heat-radiating plate II, 4 heat-conducting silica gel, 5 heat-radiating bulges, 6 support plates, 7 welding columns, 8 anti-slip rings, 9 single plates, 10 connecting cylinders, 11 upper baffle rings, 12 lower baffle rings, 13 shells, 14 capillary layers, 15 vacuum cavities, 16 support columns, 17 liquid inlets, 18 sealing covers, 19 conical holes, 20 conical bodies, 21 six-edge holes and 22 sealing gaskets.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-4, the high-thickness copper PCB multilayer board provided by the embodiment of the utility model comprises a multilayer board body 1, wherein a first heat dissipation plate 2 and a second heat dissipation plate 3 are arranged on two sides of the multilayer board body 1, the first heat dissipation plate 2 and the second heat dissipation plate 3 both comprise a shell 13, a vacuum cavity 15 is arranged inside the shell 13, a capillary layer 14 is arranged on the inner wall of the shell 13, evenly distributed support columns 16 are arranged between the inner walls of the two sides of the shell 13, evenly distributed heat dissipation bulges 5 are arranged on the outer wall of the shell 13, a liquid inlet nozzle 17 is integrally formed on the outer wall of the top of the shell 13, and a sealing cover 18 is connected to the top of the liquid inlet nozzle 17 through threads.
Specifically, in this embodiment, including multiply wood body 1, multiply wood body 1 is prior art's high thick copper PCB multilayer circuit board, multiply wood body 1 is provided with heating panel one 2 and heating panel two 3 in the both sides of multiply wood body 1, heating panel one 2 and heating panel two 3 all include casing 13, casing 13 inside cavity, casing 13's inside is provided with vacuum cavity 15, vacuum cavity 15 is the vacuum state, casing 13's inner wall is provided with capillary layer 14, capillary layer 14 inside is loose porous, be provided with evenly distributed's support column 16 between casing 13's the both sides inner wall, utilize support column 16 to prevent casing 13 negative pressure deformation, casing 13's outer wall is provided with evenly distributed's heat dissipation arch 5, heat dissipation arch 5 plays the effect of increase radiating area, casing 13's top outer wall integrated into one piece has feed liquor mouth 17, feed liquor mouth 17 is for adding alcohol use, feed liquor mouth 17's top is through threaded connection with sealed lid 18, sealed lid 18 plays sealed effect to feed liquor mouth 17, firstly add alcohol with casing 13 inside, then sealed lid 18 under the vacuum state with casing 13.
According to the high-thickness copper PCB multilayer board provided by the utility model, the alcohol is injected into the vacuum cavity 15 of the shell 13 through the shell 13 and the capillary tube, and the vacuum cavity 15 is in a vacuum state, so that when the multilayer board body 1 heats, the alcohol can evaporate and absorb heat and liquefy the inner wall of the shell 13, which is close to the heat dissipation bulge 5, so that the heat generated by the multilayer board body 1 can be efficiently dissipated, and therefore, the high-efficiency heat dissipation effect of the high-thickness copper PCB multilayer board is realized.
In one embodiment provided by the utility model, the inner wall of the liquid inlet nozzle 17 is provided with the conical hole 19, the conical body 20 matched with the conical hole 19 is integrally formed on the inner wall of the top of the sealing cover 18, the conical body 20 on the sealing cover 18 is matched with the conical hole 19 in the liquid inlet nozzle 17, so that the sealing effect of the sealing cover 18 on the liquid inlet nozzle 17 is better, the effect of preventing the vacuum cavity 15 in the shell from entering air is realized, the six-edge hole 21 is arranged on the outer wall of the top of the sealing cover 18, the six-edge hole 21 is convenient for the six-edge wrench to rotate the sealing cover 18, the sealing gasket 22 is arranged in the sealing cover 18, and the sealing effect of the sealing cover 18 is enhanced by the sealing gasket 22.
In still another embodiment provided by the utility model, the multi-layer board body 1 comprises a plurality of laminated single boards 9, a connecting cylinder 10 is arranged in the single boards 9, the connecting cylinder 10 is a pin, the conductive effect is realized, an upper baffle ring 11 is integrally formed at the top end of the connecting cylinder 10, a lower baffle ring 12 is integrally formed at the bottom end of the connecting cylinder 10, the single boards 9 are fixed between the upper baffle ring 11 and the lower baffle ring 12 by utilizing the space between the upper baffle ring 11 and the lower baffle ring 12, a welding column 7 is integrally formed at the bottom end of the connecting cylinder 10, the welding column 7 is welded with a power supply, an anti-slip ring 8 is integrally formed at the outer wall of the welding column 7, the welding column 7 and the connecting cylinder 10 are integrally formed as pins of the multi-layer board body 1, the anti-slip ring 8 can realize the effect of mutual embedding with solder after the multi-layer board body 1 is welded, so that the multi-layer board with high-thickness copper PCB is more firmly welded, and no false welding phenomenon occurs.
In still another embodiment of the present utility model, a heat-conducting silica gel 4 is disposed between the first heat dissipation plate 2 and the second heat dissipation plate 3 and the multi-layer board body 1, the heat-conducting silica gel 4 has an efficient heat-conducting effect, the bottoms of the first heat dissipation plate 2 and the second heat dissipation plate 3 are fixed with a support plate 6, and the support plate 6 realizes the fixing function of the first heat dissipation plate 2 and the second heat dissipation plate 3 to the multi-layer board body 1.
Working principle: alcohol is injected into the vacuum cavity 15 of the shell 13, and a vacuum state is formed in the vacuum cavity 15, so that when the multi-layer board body 1 heats, the alcohol can evaporate and absorb heat and liquefy the inner wall of the shell 13, which is close to the heat dissipation bulge 5, so that heat generated by the multi-layer board body 1 can be efficiently dissipated, and the effect of high-efficiency heat dissipation of the high-thickness copper PCB multi-layer board is realized; through the integrated formation of the welding post 7 and the connecting cylinder 10 which are arranged as the pins of the multi-layer board body 1, the anti-slip ring 8 can realize the effect of mutual embedding with solder after the multi-layer board body 1 is welded, so that the high-thickness copper PCB multi-layer board is firmer during welding, and the phenomenon of cold joint can not be generated; the conical body 20 on the sealing cover 18 is matched with the conical hole 19 in the liquid inlet nozzle 17, so that the sealing effect of the sealing cover 18 on the liquid inlet nozzle 17 is better, and the effect of preventing the vacuum cavity 15 in the shell from entering air is realized.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (7)
1. The utility model provides a high thick copper PCB multiply wood, its characterized in that, including multiply wood body (1), the both sides of multiply wood body (1) are provided with heating panel one (2) and heating panel two (3), heating panel one (2) and heating panel two (3) all include casing (13), the inside of casing (13) is provided with vacuum chamber (15), the inner wall of casing (13) is provided with capillary layer (14), be provided with evenly distributed's support column (16) between the both sides inner wall of casing (13), the outer wall of casing (13) is provided with evenly distributed's heat dissipation arch (5), the top outer wall integrated into one piece of casing (13) has feed liquor mouth (17), the top of feed liquor mouth (17) has sealed lid (18) through threaded connection.
2. The high-thickness copper PCB multilayer board according to claim 1, wherein the inner wall of the liquid inlet nozzle (17) is provided with a conical hole (19), and the top inner wall of the sealing cover (18) is integrally formed with a conical body (20) matched with the conical hole (19).
3. The high-thickness copper PCB multilayer board according to claim 1, wherein the top outer wall of the sealing cover (18) is provided with a hexagonal hole (21), and the inside of the sealing cover (18) is provided with a sealing gasket (22).
4. The high-thickness copper PCB multilayer board according to claim 1, wherein the multilayer board body (1) comprises a plurality of laminated single boards (9), and a connecting cylinder (10) is arranged inside the plurality of single boards (9).
5. The high-thickness copper PCB multilayer board according to claim 4, wherein an upper baffle ring (11) is integrally formed at the top end of the connecting cylinder (10), a lower baffle ring (12) is integrally formed at the bottom end of the connecting cylinder (10), and a plurality of single plates (9) are positioned between the upper baffle ring (11) and the lower baffle ring (12).
6. The high-thickness copper PCB multilayer board according to claim 1, wherein heat conducting silica gel (4) is arranged between the first heat dissipation plate (2) and the second heat dissipation plate (3) and the multilayer board body (1), and support plates (6) are fixed at the bottoms of the first heat dissipation plate (2) and the second heat dissipation plate (3).
7. The high-thickness copper PCB multilayer board according to claim 4, wherein the bottom end of the connecting cylinder (10) is integrally formed with a welding post (7), and the outer wall of the welding post (7) is integrally formed with an anti-slip ring (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223552644.0U CN219145722U (en) | 2022-12-29 | 2022-12-29 | High-thickness copper PCB multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223552644.0U CN219145722U (en) | 2022-12-29 | 2022-12-29 | High-thickness copper PCB multilayer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219145722U true CN219145722U (en) | 2023-06-06 |
Family
ID=86592333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223552644.0U Active CN219145722U (en) | 2022-12-29 | 2022-12-29 | High-thickness copper PCB multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219145722U (en) |
-
2022
- 2022-12-29 CN CN202223552644.0U patent/CN219145722U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211429852U (en) | Heat dissipation plate and electronic device with same | |
| CN104748597A (en) | Flat plate heating tube and manufacturing method thereof | |
| CN219145722U (en) | High-thickness copper PCB multilayer board | |
| CN213847398U (en) | Circuit board heat radiation structure and electrical equipment | |
| CN213093194U (en) | Ceramic steam cavity radiator | |
| CN209882204U (en) | PCB board | |
| CN209897342U (en) | Circuit board assembly and electronic equipment | |
| CN210381441U (en) | High-temperature-resistant circuit board | |
| CN113242641A (en) | Single-layer printed circuit board and chip packaging electronic equipment | |
| CN113727515A (en) | Metal copper-clad plate | |
| CN111900141A (en) | Ceramic steam cavity radiator | |
| JP3245255U (en) | circuit board | |
| CN213818360U (en) | High-efficient radiating bluetooth circuit board | |
| CN111442671A (en) | Electrochemical corrosion resistant radiator heat pipe embedded structure | |
| CN217333840U (en) | High-temperature-resistant tubular motor capacitor | |
| CN208954804U (en) | A kind of internal direct water-cooling formula capacitor | |
| CN210007992U (en) | kinds of multi-layer printed composite integrated circuit board | |
| CN219834772U (en) | Nanometer twin crystal copper fin | |
| CN216507805U (en) | Heating device for heat medium | |
| CN213213930U (en) | Multilayer printed circuit board | |
| CN219642671U (en) | Metallized polyethylene film capacitor | |
| CN209882213U (en) | Labyrinth type high-efficiency heat dissipation printed circuit board | |
| CN217904905U (en) | Network connection mechanism | |
| CN108428533A (en) | A kind of installation method of water cooling inductor module on printed wiring board and its application | |
| CN218499340U (en) | Multilayer circuit board with high-efficient heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A High Thickness Copper PCB Multilayer Board Effective date of registration: 20231007 Granted publication date: 20230606 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Baiqiang Technology Co.,Ltd. Registration number: Y2023980060087 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20230606 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Baiqiang Technology Co.,Ltd. Registration number: Y2023980060087 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high thickness copper PCB multilayer board Granted publication date: 20230606 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Baiqiang Technology Co.,Ltd. Registration number: Y2024980041036 |