CN219142676U

CN219142676U - Epoxy molding compound overlap testing arrangement

Info

Publication number: CN219142676U
Application number: CN202223426168.8U
Authority: CN
Inventors: 王成; 林宇东; 杨东辉; 牛明建
Original assignee: Beijing Zhongxin Taihe Electronic Material Technology Co ltd
Current assignee: Beijing Zhongxin Taihe Electronic Material Technology Co ltd
Priority date: 2022-12-21
Filing date: 2022-12-21
Publication date: 2023-06-06
Anticipated expiration: 2032-12-21

Abstract

The application discloses epoxy molding compound overlap testing arrangement relates to overlap testing field, the on-line screen storage device comprises a workbench, the top of workstation is provided with the CCD detector, the top of workstation is displayed there is the CCD camera, the top of workstation is provided with the supporting seat, be provided with suction device on the workstation, suction device includes: the air inlet of the air pump is provided with a guide pipe, the top extension end of the guide pipe penetrates through the supporting seat, and the top extension end of the guide pipe is provided with a sucker; the top of sucking disc is provided with the placing seat, and the top of placing seat has been seted up the standing groove, the top of placing seat has been seted up the through-hole, the through-hole communicates with each other with the sucking disc air inlet, and the utility model has adopted the placing seat, is favorable to accelerating the material loading speed to be favorable to improving test efficiency, simultaneously, guaranteed that epoxy molding compound model steadily places, the CCD camera is more accurate from every angle is photographed.

Description

Epoxy molding compound overlap testing arrangement

Technical Field

The utility model belongs to the field of flash test, and particularly relates to an epoxy molding compound flash test device.

Background

At present, in the injection molding process of the epoxy molding compound, gaps exist between the mold cavities of the movable mold and the fixed mold, so that flash can be formed around the movable mold and the fixed mold after the epoxy molding compound is injected, and the encapsulation of an integrated circuit is not facilitated.

However, the existing flash test equipment still has the defects when in use, the clamp is manually controlled one by one and locked in the process of clamping and positioning the epoxy molding compound model by the test equipment workbench, and the feeding efficiency is low, so that the use is not facilitated.

Disclosure of Invention

The technical problems to be solved are as follows:

aiming at the defects of the prior art, the utility model provides an epoxy molding compound flash testing device, which solves the problems in the background art.

The technical scheme is as follows:

in order to achieve the above purpose, the utility model is realized by the following technical scheme:

the utility model provides an epoxy molding compound overlap testing arrangement, includes the workstation, the top of workstation is provided with the CCD detector, the top of workstation shows there is the CCD camera, the top of workstation is provided with the supporting seat, be provided with suction device on the workstation, suction device includes:

the air inlet of the air pump is provided with a guide pipe, the top extension end of the guide pipe penetrates through the supporting seat, and the top extension end of the guide pipe is provided with a sucker;

the top of the sucker is provided with a placing seat, the top of the placing seat is provided with a placing groove, the top of the placing seat is provided with a through hole, and the through hole is communicated with an air inlet of the sucker;

the epoxy molding compound model after injection molding is in a plate shape, a worker places the epoxy molding compound model in a placing groove of a placing seat, an air pump is started to pump air, the air enters the placing seat from a through hole, then passes through the internal space of the placing seat, then enters a sucker, then enters a conduit, and finally is discharged from an air outlet of the air pump through the conduit, and at the moment, the epoxy molding compound model is sucked tightly;

in a possible implementation manner of the epoxy molding compound flash testing device, the placing seat is of a hollow cuboid structure, the through hole is communicated with the internal space of the placing seat, and the internal space of the placing seat is communicated with the air inlet of the sucker.

In a possible implementation mode of the epoxy molding compound flash testing device, a support is arranged at the top of the workbench, an arc-shaped track is arranged on the front surface of the support, a movable electric slide block is arranged on the arc-shaped track, and the CCD camera is connected with the electric slide block;

starting the CCD detector, driving the CCD camera by the electric sliding block, shooting the epoxy molding compound model by the CCD camera in the moving process, detecting flash on the epoxy molding compound model by the CCD detector, thereby obtaining a result, and powering on the LED lamp ring to work when the CCD camera is in the moving shooting process, wherein the LED lamp ring emits bright light to irradiate the epoxy molding compound model, thereby facilitating timely light supplementing, and being clearer when shooting by the CCD camera.

In a possible implementation manner of the epoxy molding compound flash testing device, a mounting groove is formed in the workbench, the air pump is placed in the mounting groove, and a door plate is arranged on the front surface of the mounting groove.

In a possible implementation manner of the epoxy molding compound flash testing device, a lens outer ring is arranged on one side of a lens of the CCD camera, and an LED lamp ring is arranged on the outer wall of the lens outer ring.

In one possible implementation of the epoxy molding compound flash test apparatus, the conduit is a rigid tube.

In a possible implementation manner of the epoxy molding compound flash testing device, a hole is formed in the bottom of the placement seat, the hole corresponds to the top air inlet of the sucker, and the top of the sucker and the bottom of the placement seat are fixed through glue adhesion.

The utility model has the beneficial effects that the placing seat is adopted, the suction device is arranged at the bottom of the placing seat, the epoxy molding compound model placed on the placing seat is sucked and tightly sucked through the suction device, the feeding speed is accelerated, the testing efficiency is improved, the stable placing of the epoxy molding compound model is ensured, and the CCD camera photographs from all angles more accurately.

Drawings

FIG. 1 is an external view of the present utility model;

FIG. 2 is a schematic view of the internal structure of the present utility model;

FIG. 3 is a top view of the placement base of the present utility model;

fig. 4 is a side view of the CCD camera of the present utility model.

Reference numerals: 1. a CCD detector; 2. an arc-shaped track; 3. a placement seat; 31. a placement groove; 32. a through hole; 4. a bracket; 5. a CCD camera; 51. a lens outer ring; 52. an LED lamp ring; 6. an electric slide block; 7. a support base; 8. a door panel; 9. a work table; 10. a conduit; 11. a suction cup; 12. an air pump; 13. and a mounting groove.

Detailed Description

The embodiment of the application solves the problem in the prior art by providing the epoxy molding compound flash testing device.

The technical scheme in the embodiment of the application aims to solve the problems, and the overall thought is as follows:

the specific structure of this embodiment, as shown in fig. 1 and 4, an epoxy molding compound flash testing arrangement, including workstation 9, the top of workstation 9 is provided with CCD detector 1, and the top of workstation 9 shows there is CCD camera 5, and the top of workstation 9 is provided with supporting seat 7, is provided with suction device on the workstation 9, and suction device includes:

the air pump 12, the air inlet of the air pump 12 is provided with a conduit 10, the top extension end of the conduit 10 penetrates through the supporting seat 7, and the top extension end of the conduit 10 is provided with a sucker 11;

the top of sucking disc 11 is provided with places seat 3, and places the top of seat 3 and has seted up standing groove 31, and through-hole 32 has been seted up at the top of placing seat 3, and through-hole 32 communicates with each other with sucking disc 11 air inlet.

In some examples, the placement base 3 has a hollow cuboid structure, and the through hole 32 is communicated with the inner space of the placement base 3, and the inner space of the placement base 3 is communicated with the air inlet of the sucker 11.

In some examples, the top of the workbench 9 is provided with a bracket 4, the front surface of the bracket 4 is provided with an arc-shaped track 2, the arc-shaped track 2 is provided with a movable electric slide block 6, the CCD camera 5 is connected with the electric slide block 6, the electric slide block 6 is disclosed in a special device for glasses shooting in China patent No. CN202022329799.2, and the working principle of a second electric slide seat is the same as that of the electric slide block 6 of the utility model in the specification.

In some examples, the workbench 9 is internally provided with a mounting groove 13, the air pump 12 is placed in the mounting groove 13, the front surface of the mounting groove 13 is provided with a door plate 8, and the door plate 8 is provided with air holes and a filter screen, so that air in the mounting groove 13 can circulate conveniently.

In some examples, a lens outer ring 51 is provided on the lens side of the CCD camera 5, and an LED bezel 52 is provided on the outer wall of the lens outer ring 51.

In some examples, catheter 10 is a rigid tube.

In some examples, the bottom of the placement base 3 is provided with a hole, the hole corresponds to the top air inlet of the suction cup 11, and the top of the suction cup 11 and the bottom of the placement base 3 are adhered and fixed by glue.

By adopting the technical scheme:

when the device is used, the epoxy molding compound model after injection molding is in a plate shape, a worker places the epoxy molding compound model in the placing groove 31 of the placing seat 3, the air pump 12 is started, the air pump 12 pumps air, the air enters the placing seat 3 from the through hole 32, then passes through the inner space of the placing seat 3, then enters the sucker 11 and then enters the guide pipe 10, the air is finally discharged from the air outlet of the air pump 12 through the guide pipe 10, at the moment, the epoxy molding compound model is sucked tightly, then the CCD detector 1 is started, the electric sliding block 6 drives the CCD camera 5, the CCD camera 5 shoots the epoxy molding compound model in the moving process, the CCD detector 1 detects flash on the epoxy molding compound model, so that a result is obtained, the CCD camera 5 is electrified in the moving shooting process, and the LED lamp ring 52 emits bright light to irradiate the epoxy molding compound model, so that the time of light supplementing is convenient, and the CCD camera 5 shoots more clearly.

Finally, it should be noted that: it is apparent that the above examples are only illustrative of the present utility model and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present utility model.

Claims

1. The utility model provides an epoxy molding compound overlap testing arrangement, its characterized in that, includes workstation (9), the top of workstation (9) is provided with CCD detector (1), the top of workstation (9) shows CCD camera (5), the top of workstation (9) is provided with supporting seat (7), be provided with suction device on workstation (9), suction device includes:

the air pump (12), the air inlet of the air pump (12) is provided with a conduit (10), the top extension end of the conduit (10) penetrates through the supporting seat (7), and the top extension end of the conduit (10) is provided with a sucker (11);

the top of sucking disc (11) is provided with places seat (3), and place the top of seat (3) and seted up standing groove (31), place the top of seat (3) and seted up through-hole (32), through-hole (32) communicate with each other with sucking disc (11) air inlet.

2. An epoxy molding compound flash test apparatus as defined in claim 1, wherein: the placing seat (3) is of a hollow cuboid structure, the through hole (32) is communicated with the inner space of the placing seat (3), and the inner space of the placing seat (3) is communicated with the air inlet of the sucker (11).

3. An epoxy molding compound flash test apparatus as defined in claim 1, wherein: the top of workstation (9) is provided with support (4), and the front surface of support (4) is provided with arc track (2), be provided with mobilizable electronic slider (6) on arc track (2), CCD camera (5) are connected with electronic slider (6).

4. An epoxy molding compound flash test apparatus as defined in claim 1, wherein: the workbench is characterized in that a mounting groove (13) is formed in the workbench (9), the air pump (12) is placed in the mounting groove (13), and a door plate (8) is arranged on the front surface of the mounting groove (13).

5. An epoxy molding compound flash test apparatus as defined in claim 1, wherein: a lens outer ring (51) is arranged on one side of a lens of the CCD camera (5), and an LED lamp ring (52) is arranged on the outer wall of the lens outer ring (51).

6. An epoxy molding compound flash test apparatus as defined in claim 1, wherein: the catheter (10) is a rigid tube.

7. An epoxy molding compound flash test apparatus as defined in claim 1, wherein: the bottom of the placing seat (3) is provided with a hole, the hole corresponds to a top air inlet of the sucker (11), and the top of the sucker (11) is fixedly bonded with the bottom of the placing seat (3) through glue.