CN219132438U - Cutting device and processing equipment - Google Patents
Cutting device and processing equipment Download PDFInfo
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- CN219132438U CN219132438U CN202223406291.3U CN202223406291U CN219132438U CN 219132438 U CN219132438 U CN 219132438U CN 202223406291 U CN202223406291 U CN 202223406291U CN 219132438 U CN219132438 U CN 219132438U
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Abstract
The utility model discloses a cutting device and processing equipment, wherein the cutting device is used for cutting an adhesive layer of a display module, the display module comprises a cover plate, a liquid crystal screen and the adhesive layer arranged between the cover plate and the liquid crystal screen, the cutting device comprises a base station and a cutting assembly, the base station is provided with a working surface, the working surface is provided with a placement area, the placement area is used for placing the display module, the cutting assembly comprises a driving piece and a cutting disc, the driving piece is arranged on the base station, the output end of the driving piece penetrates through the working surface and is connected with the cutting disc so that the cutting disc is arranged adjacent to the placement area, and the cutting disc is used for cutting the adhesive layer; the thickness of the cutting disc is smaller than the distance from the cover plate to the liquid crystal screen. The utility model aims to cut and break the silicone adhesive between the cover plate and the liquid crystal screen through the cutting device, so that the separation of the cover plate and the liquid crystal screen is realized, the breakage of the liquid crystal screen caused by using larger external force is avoided, and the labor is effectively saved.
Description
Technical Field
The utility model relates to the technical field of display screens, in particular to a cutting device and processing equipment using the same.
Background
In the mobile phone display module, silicone adhesive is generally coated between the cover plate and the liquid crystal screen and at two ends of the IC chip, so as to achieve the purposes of connecting the cover plate and the liquid crystal screen and sealing the IC chip.
In actual production, foreign matters or dirt can remain between the cover plate and the liquid crystal screen of some products after the silicone adhesive is coated and cured, the coated silicone adhesive needs to be disassembled, and the cover plate and the liquid crystal screen are separated so as to take out the foreign matters or clear the dirt inside; the traditional method adopts PET hard film with certain size and thickness, and the silicone adhesive is manually inserted from two sides of a product, namely, the silicone adhesive is broken and detached by the hard film inserting method, so that the separation of the cover plate and the liquid crystal screen is realized, but the method has larger external force, so that the stress in the silicone adhesive is easily transferred to the liquid crystal screen, the breakage of the liquid crystal screen is easily caused, and more manpower is consumed.
Disclosure of Invention
The utility model mainly aims to provide a cutting device and processing equipment, which aim to cut and break silicone adhesive between a cover plate and a liquid crystal screen through the cutting device, separate the cover plate from the liquid crystal screen, avoid the breakage of the liquid crystal screen caused by using larger external force and effectively save manpower.
In order to achieve the above object, the present utility model provides a cutting device for cutting a glue layer of a display module, the display module includes a cover plate, a liquid crystal screen, and the glue layer disposed between the cover plate and the liquid crystal screen, the cutting device includes:
the base station is provided with a working surface, and the working surface is provided with a placement area which is used for placing the display module;
the cutting assembly comprises a driving piece and a cutting disc, the driving piece is arranged on the base station, the output end of the driving piece penetrates through the working surface and is connected with the cutting disc, so that the cutting disc is arranged adjacent to the placement area, and the cutting disc is used for cutting the adhesive layer;
the thickness of the cutting disc is smaller than the distance from the cover plate to the liquid crystal screen.
In one embodiment, the cutting disc has a lower surface facing the working surface and an upper surface facing away from the working surface;
the distance between the lower surface and the working surface is larger than the thickness of the cover plate, and the distance between the upper surface and the working surface is smaller than the distance between the liquid crystal screen and the working surface.
In an embodiment, the working surface is concavely arranged adjacent to the cutting disc to form a placing groove, the placing groove forms the placing area, the placing groove is used for accommodating and limiting the display module, and the distance between the bottom wall of the placing groove and the cutting disc is larger than the thickness of the cover plate;
and/or, the side of the cutting disc facing the working surface is close to the working surface.
In one embodiment, the cutting assembly comprises two cutting discs, the two cutting discs are in transmission connection with the driving piece, and the two cutting discs are arranged at intervals along the extending direction of the placement area;
the display module further comprises a chip, the chip is arranged between the cover plate and the liquid crystal screen, the glue layers comprise a first glue layer and a second glue layer which are arranged on two sides of the chip, and the first glue layer and the second glue layer are cut by the two cutting discs respectively.
In an embodiment, the two cutting discs are located on the same plane, and an avoidance area is formed between the two cutting discs and used for avoiding the chip; the width of the chip along the extending direction of the placement area is L1, the distances from the edge of the first adhesive layer or the edge of the second adhesive layer to the edge of the chip are equal and are L2, the distance between the two edges of the cutting disc along the extending direction of the placement area is L3, and L1< L3< L1+2L2.
In one embodiment, the driving piece comprises two driving motors, and the output ends of the two driving motors are respectively connected with the two cutting discs in a transmission way;
or, the driving piece comprises a transmission component, the transmission component is connected with the output end of the driving piece in a transmission way, and the transmission component is connected with the two cutting discs and used for synchronously driving the two cutting discs to rotate.
In an embodiment, the cutting device further comprises an adjusting assembly, the adjusting assembly comprises a first transmission piece and a second transmission piece, the first transmission piece is rotatably installed on the base, and the second transmission piece is arranged on the driving piece and is in transmission connection with the first transmission piece;
when the first transmission piece rotates, the second transmission piece can be driven to move along the direction perpendicular to the working face, and the distance between the cutting disc and the working face is adjusted.
In an embodiment, the cutting assembly further comprises a controller, the controller is mounted on the base station, the controller comprises a switch controller and a speed controller, and the switch controller and the speed controller are respectively and electrically connected with the driving piece and used for controlling the working state of the driving piece;
and/or the thickness of the cutting disc is 0.15mm to 0.25mm;
and/or the cutting disc is made of polyester resin or polyethylene.
In an embodiment, the base station further includes a plurality of adjusting members, and the plurality of adjusting members are mounted at the bottom of the base station on a side facing away from the working surface, for adjusting the parallelism of the base station.
The utility model also proposes a processing device comprising:
a dust collection device; and
the cutting device according to the above, wherein the dust suction device is mounted on the cutting device and is used for sucking scraps generated by the cutting device.
The cutting device is used for cutting the adhesive layer between the display module cover plate and the liquid crystal screen, a base table is arranged, a working surface is formed on the base table, and a placing area is formed on the working surface and used for placing the display module; the cutting assembly comprises a driving piece and a cutting disc, the driving piece is arranged on the base station, the output end of the driving piece penetrates through the working face, the cutting disc is rotatably arranged at the output end of the driving piece and is arranged adjacent to the placement area, and the thickness of the cutting disc is also smaller than the distance from the cover plate to the liquid crystal screen so as to cut the adhesive layer between the cover plate and the liquid crystal screen. Through this cutting device, can realize the separation of display module assembly apron and display module assembly LCD screen to avoid traditional hard-insert membrane method to lead to the breakage of LCD screen because of using great external force, also effectually saved the manpower simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a cutting device according to an embodiment of the present utility model;
fig. 2 is an enlarged schematic view at a in fig. 1.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Meanwhile, the meaning of "and/or" and/or "appearing throughout the text is to include three schemes, taking" a and/or B "as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
In the mobile phone display module, silicone adhesive is generally coated between the cover plate and the liquid crystal screen and at two ends of the IC chip, so as to achieve the purposes of connecting the cover plate and the liquid crystal screen and sealing the IC chip.
In actual production, foreign matters or dirt can remain between the cover plate and the liquid crystal screen of some products after the silicone adhesive is coated and cured, the coated silicone adhesive needs to be disassembled, and the cover plate and the liquid crystal screen are separated so as to take out the foreign matters or clear the dirt inside; the traditional method adopts PET hard film with certain size and thickness, and the silicone adhesive is manually inserted from two sides of a product, namely, the silicone adhesive is broken and detached by the hard film inserting method, so that the separation of the cover plate and the liquid crystal screen is realized, but the method has larger external force, so that the stress in the silicone adhesive is easily transferred to the liquid crystal screen, the breakage of the liquid crystal screen is easily caused, and more manpower is consumed.
Based on the above-mentioned conception and problems, the present utility model provides a cutting device 100, where the cutting device 100 is used for cutting a glue layer between a cover plate and a liquid crystal screen in a display module to separate the cover plate from the liquid crystal screen; compared with the traditional method for breaking and dismantling the adhesive layer by manually inserting the hard film, the cutting device 100 effectively reduces the probability of breaking the cover plate and the liquid crystal screen due to hard insertion in the adhesive layer cutting process, saves labor, synchronously reduces scraps generated by the hard film due to reduction of the use of the hard film, and improves the cleanliness inside a workshop.
Referring to fig. 1 to 2 in combination, in an embodiment of the present utility model, the cutting device 100 is used for cutting a glue layer of a display module, the display module includes a cover plate, a liquid crystal screen, and a glue layer disposed between the cover plate and the liquid crystal screen, the cutting device 100 includes a base 1 and a cutting assembly 2, the base 1 is formed with a working surface 11, the working surface 11 is provided with a placement area 112, the placement area 112 is used for placing the display module, the cutting assembly 2 includes a driving member 21 and a cutting disc 22, the driving member 21 is mounted on the base 1, an output end of the driving member 21 penetrates through the working surface 11 and is connected to the cutting disc 22, so that the cutting disc 22 is disposed adjacent to the placement area 112, and the cutting disc 22 is used for cutting the glue layer; wherein the thickness of the cutting disc 22 is smaller than the distance from the cover plate to the liquid crystal screen.
In this embodiment, the display module includes a cover plate, a liquid crystal screen, and a glue layer disposed between the cover plate and the liquid crystal screen, and the cutting device 100 is used for cutting the glue layer disposed between the cover plate and the liquid crystal screen, so as to separate the cover plate and the liquid crystal screen. The cutting device 100 includes a base 1, where the base 1 is a structural supporting component of the cutting device 100, and the base 1 may be a frame, a mounting table, a placement frame, or the like, which is not limited herein; a working surface 11 is formed on the base 1, and a placement area 112 is provided on the working surface 11, and the placement area 112 is used for placing a display module to cut the display module.
It can be understood that the working surface 11 is formed on one side surface of the base 1, the working surface 11 has a placement area 112 for placing the display module, and the placement area 112 has a certain limiting effect on the display module, so that the cutting device 100 can avoid cutting the circuit or the body thereof inside the display module when cutting the display module.
In this embodiment, the cutting assembly 2 includes a driving member 21 and a cutting disc 22, the driving member 21 is mounted on the base 1 along a direction perpendicular to the working surface 11, and an output end of the driving member 21 passes through the working surface 11, so that the cutting disc 22 is connected to the output end of the driving member 21 and is disposed adjacent to the working surface 11, and at the same time, the cutting disc 22 is also disposed adjacent to the placement area 112 to cut the adhesive layer in the display module.
It will be appreciated that the surface of the cutting disc 22 is parallel to the working surface 11, and the lower surface 221 of the cutting disc 22 is disposed adjacent to the working surface 11, when the display module is cut, the cover plate of the display module is placed on the placement area 112, and the driving member 21 drives the cutting disc 22 to cut the adhesive layer disposed between the cover plate and the liquid crystal screen; and, the thickness of cutting dish 22 is less than the distance between apron to the LCD screen, and the distance between cutting dish 22 to working face 11 is also greater than the thickness of apron to guarantee that cutting dish 22 can not touch apron or LCD screen when the during operation, avoid causing the damage to the display module assembly.
The cutting device 100 of the present technical solution is used for cutting an adhesive layer between a cover plate of a display module and a liquid crystal display, and by setting a base 1 and forming a working surface 11 on the base 1, a placement area 112 is arranged on the working surface 11 for placing the display module; the cutting assembly 2 comprises a driving member 21 and a cutting disc 22, the driving member 21 is mounted on the base 1, the output end of the driving member 21 passes through the working surface 11, so that the cutting disc 22 is rotatably arranged at the output end of the driving member 21, and the cutting disc 22 is arranged adjacent to the placement area 112, and the thickness of the cutting disc 22 is also smaller than the distance between the cover plate and the liquid crystal screen, so that the glue layer between the cover plate and the liquid crystal screen is cut. Through this cutting device 100, can realize the separation of display module assembly apron and display module assembly LCD screen to avoid traditional hard-insert membrane method to lead to the breakage of LCD screen because of using great external force, also effectually saved the manpower simultaneously.
In one embodiment, cutting disc 22 has a lower surface 221 facing work surface 11 and an upper surface 222 facing away from work surface 11; the distance between the lower surface 221 and the working surface 11 is greater than the thickness of the cover plate, and the distance between the upper surface 222 and the working surface 11 is smaller than the distance between the liquid crystal screen and the working surface 11.
In the present embodiment, as shown in fig. 1 and 2, the cutting disc 22 has a thickness such that the cutting disc 22 is formed to have a lower surface 221 facing the working surface 11 side and an upper surface 222 facing away from the working surface 11 side, and the upper surface 222 and the lower surface 221 are kept parallel or at an angle; wherein the distance between the lower surface 221 and the working surface 11 is greater than the thickness of the cover plate, and the distance between the upper surface 222 and the working surface 11 is smaller than the distance between the liquid crystal screen and the working surface 11.
It will be appreciated that the distance between the upper surface 222 of the cutting disc 22 and the working surface 11 is smaller than the distance between the liquid crystal screen and the working surface 11, and the distance between the lower surface 221 and the working surface 11 is larger than the thickness of the cover plate, so that the rotating area of the cutting disc 22 is always between the cover plate and the liquid crystal screen when the cutting disc 22 rotates at high speed, that is, only the adhesive layer between the cover plate and the liquid crystal screen is cut, and no damage is caused to the cover plate or the liquid crystal screen.
In one embodiment, the working surface 11 is concavely arranged adjacent to the cutting disc 22 to form a placing groove 111, the placing groove 111 forms a placing area 112, the placing groove 111 is used for accommodating and limiting the display module, and the distance between the bottom wall of the placing groove 111 and the cutting disc 22 is larger than the thickness of the cover plate; alternatively, the side of the cutting disc 22 facing the working surface 11 is brought into abutment with the working surface 11.
In this embodiment, as shown in fig. 1 and 2, a placement groove 111 is formed at the edge of the working surface 11 and adjacent to one side of the cutting disc 22, and a placement area 112 is formed at the bottom wall of the placement groove 111, so that the placement groove 111 can accommodate and limit the display module, and the placement groove 111 may be a through groove or an annular groove with an edge, which is not limited herein.
It will be appreciated that in the process of cutting the adhesive layer in the display module by the cutting device 100, the placement groove 111 can define the horizontal position of the display module, where the horizontal position includes two directions perpendicular to each other, and the placement groove 111 generally exceeds the maximum edge of the cutting disc 22 by 5mm to 10mm, so as to ensure that the cutting device 100 can be applied to display modules of different sizes, and improve the versatility and practicality of the cutting device 100. In another embodiment, the placement groove 111 may be a through groove with two through sides, which is not limited herein. The lower surface 221 of the cutting disc 22 is as close to the working surface 11 as possible, so that the distance between the lower surface 221 of the cutting disc 22 and the bottom wall of the placement groove 111 is as close to the groove thickness of the placement groove 111 as possible, thereby being capable of better matching the thickness of the cover plate in the display module and improving the cutting precision.
In one embodiment, the cutting assembly 2 comprises two cutting discs 22, the two cutting discs 22 being in driving connection with the driving member 21, the two cutting discs 22 being spaced apart along the extension of the placement area 112; wherein, the display module assembly still includes the chip, and the chip is located between apron and the LCD screen, and the glue film is including locating the first glue film and the second glue film of chip both sides, and two cutting discs 22 cut first glue film and second glue film respectively.
In the present embodiment, as shown in fig. 1, the cutting assembly 2 includes two cutting discs 22 disposed at intervals, and the two cutting discs 22 are disposed along the extending direction of the placement area 112, and both the two cutting discs 22 are disposed adjacent to the placement area 112, such that one portion of the two cutting discs 22 is disposed above the placement area 112 and the other portion is disposed above the working surface 11.
It can be understood that the display module is also provided with a chip, the chip is located between the cover plate and the liquid crystal display, and the first glue layer and the second glue layer which are used for sealing are arranged at two ends of the chip, the two cutting discs 22 are respectively used for cutting the first glue layer and the second glue layer, and the two cutting discs 22 are arranged, so that the first glue layer and the second glue layer can be cut simultaneously on the basis of avoiding the chip between the first glue layer and the second glue layer, the cutting efficiency is effectively improved, and the labor is saved.
In one embodiment, the two cutting discs 22 are on the same plane, and an avoidance area 23 is formed between the two cutting discs 22 for avoiding the chip; the width of the chip along the extending direction of the placement area 112 is L1, the distances from the edge of the first adhesive layer or the second adhesive layer to the edge of the chip are equal and are L2, the distance between the edges of the two cutting discs 22 along the extending direction of the placement area 112 is L3, and L1< L3< l1+2l2.
In this embodiment, the upper surfaces 222 of the two cutting disks 22 are in the same plane, and a relief is formed between the two cutting disks 22 for relieving the chip. It can be understood that the width of the chip in the extending direction of the placement area 112 is defined as L1, the distance from the edge of the first adhesive layer or the second adhesive layer adjacent to the chip to the edge of the chip in the extending direction of the placement area 112 is defined as L2, the distance between the two cutting discs 22 in the extending direction of the placement area 112 is defined as L3, that is, the distance between the avoidance area 23 in the extending direction is L3, where L1< l3< l1+2l2 needs to be satisfied, so that on the basis that the avoidance area 23 can effectively avoid the chip, the two cutting discs 22 can completely cut the first adhesive layer and the second adhesive layer, that is, on the basis that the chip is just opposite to the avoidance area 23, the two cutting discs 22 can completely penetrate the first adhesive layer and the second adhesive layer, and the adhesive layer can be broken and detached by one-time cutting, thereby the separation of the cover plate and the liquid crystal screen can be realized rapidly, and the chip can be protected.
In one embodiment, the driving member 21 comprises two driving motors, and the output ends of the two driving motors are respectively connected with the two cutting discs 22 in a transmission way; alternatively, the driving member 21 includes a transmission assembly drivingly connected to the output end of the driving member 21, and the transmission assembly is connected to the two cutting discs 22 for synchronously driving the two cutting discs 22 to rotate.
It will be appreciated that, as shown in fig. 1, the driving member 21 includes two driving motors, the output ends of the two driving motors are respectively in transmission connection with the two cutting discs 22, so that the two driving motors can drive the two cutting discs 22, and the two driving motors can drive the two cutting discs 22 synchronously or drive the two cutting discs 22 asynchronously, and the adhesive layers with different cutting thicknesses can be processed by adjusting different rotation speeds or different rotation sequences, so that the practicability and the universality of the cutting device 100 are improved. In another embodiment, the driving member 21 has only one driving motor, and has a transmission assembly at an output end of the driving motor, to which two cutting discs 22 are connected, so that the two cutting discs 22 are driven to rotate by one driving motor. The transmission assembly may be belt transmission, gear transmission or chain transmission, and is not limited herein, and the transmission assembly includes a driving wheel and a driven wheel, where the driving wheel is disposed at an output end of the driving motor, and the driving wheel is also connected with a cutting disc 22, the driven wheel is connected with the driving wheel, and the driven wheel is also connected with a cutting disc 22, so that synchronous rotation or asynchronous rotation of the two cutting discs 22 can be achieved by changing the sizes of the driving wheel and the driven wheel.
In one embodiment, the cutting device 100 further includes an adjusting assembly, where the adjusting assembly includes a first transmission member and a second transmission member, the first transmission member is rotatably mounted on the base 1, and the second transmission member is disposed on the driving member 21 and is in transmission connection with the first transmission member; when the first driving member rotates, the second driving member is driven to move along the direction perpendicular to the working surface 11, so as to adjust the distance between the cutting disc 22 and the working surface 11.
In this embodiment, the cutting device 100 further includes an adjusting component for adjusting the distance between the cutting component 2 and the working surface 11 in the vertical direction. The adjusting assembly comprises a first transmission part rotatably arranged on the base 1 and a second transmission part arranged on the driving part 21, and the first transmission part is in transmission connection with the second transmission part.
It may be appreciated that the adjusting component may be a rack and pinion transmission or a screw transmission, where the gear is a first transmission member, so that an operator may rotate the first transmission member, the second transmission member is a rack, and the second transmission member is disposed on the driving member 21, so that the operator may drive the second transmission member disposed on the driving member 21 to move along a direction perpendicular to the working surface 11 when performing rotation operation on the first transmission member, thereby realizing movement of the cutting disc 22 along a direction perpendicular to the working surface 11, so that the cutting device 100 may be suitable for display modules with different thicknesses.
In an embodiment, the cutting assembly 2 further includes a controller 24, the controller 24 is mounted on the base 1, the controller 24 includes a switch controller 241 and a speed controller 242, and the switch controller 241 and the speed controller 242 are respectively electrically connected to the driving member 21 and are used for controlling the working state of the driving member 21. It will be appreciated that, as shown in fig. 1, the cutting assembly 2 further includes a controller 24, where the controller 24 includes a switch controller 241 and a speed controller 242, and the switch controller 241 and the speed controller 242 are electrically connected to the driving member 21 to control the start and stop of the driving member 21 and the rotation speed, and further indirectly control the start and stop of the cutting disc 22, and for glue layers with different cutting thicknesses, different rotation speeds are generally required to achieve quick, stable and safe cutting of the glue layers.
Optionally, the thickness of the cutting disc 22 is 0.15mm to 0.25mm, and the cutting disc 22 is made of polyester resin or polyethylene.
In an embodiment, the base 1 further includes a plurality of adjusting members 12, where the plurality of adjusting members 12 are installed at the bottom of the base 1 facing away from the working surface 11, for adjusting the parallelism of the base 1. It can be understood that, as shown in fig. 1, the plurality of adjusting members 12 are disposed at the bottom of the base 1 facing away from the working surface 11, and are used for adjusting the parallelism of the base 1, so that the working surface 11 of the base 1 is always kept horizontal, thereby improving the accuracy of cutting the display module and avoiding touching the cover plate or the liquid crystal screen during cutting due to inclination.
The utility model also provides processing equipment, which comprises the dust collection device and the cutting device 100, wherein the dust collection device is arranged on the cutting device 100, and is used for absorbing scraps generated by the cutting device 100. The specific structure of the cutting device 100 refers to the foregoing embodiments, and since the present processing apparatus adopts all the technical solutions of all the foregoing embodiments, at least the present processing apparatus has all the beneficial effects brought by the technical solutions of the foregoing embodiments, which are not described in detail herein.
The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all equivalent structural modifications made by the present description and accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present utility model.
Claims (10)
1. A cutting device for cutting the glue film of display module assembly, the display module assembly includes apron, LCD screen and locates the apron with between the LCD screen the glue film, its characterized in that, cutting device includes:
the base station is provided with a working surface, and the working surface is provided with a placement area which is used for placing the display module;
the cutting assembly comprises a driving piece and a cutting disc, the driving piece is arranged on the base station, the output end of the driving piece penetrates through the working surface and is connected with the cutting disc, so that the cutting disc is arranged adjacent to the placement area, and the cutting disc is used for cutting the adhesive layer;
the thickness of the cutting disc is smaller than the distance from the cover plate to the liquid crystal screen.
2. The cutting device of claim 1, wherein the cutting disc has a lower surface facing the working surface and an upper surface facing away from the working surface;
the distance between the lower surface and the working surface is larger than the thickness of the cover plate, and the distance between the upper surface and the working surface is smaller than the distance between the liquid crystal screen and the working surface.
3. The cutting device of claim 1, wherein the working surface is concavely arranged adjacent to the cutting disc to form a placement groove, the placement groove forms the placement area, the placement groove is used for accommodating and limiting the display module, and the distance between the bottom wall of the placement groove and the cutting disc is larger than the thickness of the cover plate;
and/or, the side of the cutting disc facing the working surface is close to the working surface.
4. The cutting device according to claim 1, wherein the cutting assembly comprises two cutting discs, the two cutting discs being in driving connection with the driving member, the two cutting discs being arranged at intervals along the extension of the placement area;
the display module further comprises a chip, the chip is arranged between the cover plate and the liquid crystal screen, the glue layers comprise a first glue layer and a second glue layer which are arranged on two sides of the chip, and the first glue layer and the second glue layer are cut by the two cutting discs respectively.
5. The cutting device according to claim 4, wherein two of the cutting discs are in the same plane, and an avoidance area is formed between the two cutting discs for avoiding the chip; the width of the chip along the extending direction of the placement area is L1, the distances from the edge of the first adhesive layer or the edge of the second adhesive layer to the edge of the chip are equal and are L2, the distance between the two edges of the cutting disc along the extending direction of the placement area is L3, and L1< L3< L1+2L2.
6. The cutting device according to claim 4, wherein the driving member comprises two driving motors, and the output ends of the two driving motors are respectively connected with the two cutting discs in a transmission way;
or, the driving piece comprises a transmission component, the transmission component is connected with the output end of the driving piece in a transmission way, and the transmission component is connected with the two cutting discs and used for synchronously driving the two cutting discs to rotate.
7. The cutting device of claim 1, further comprising an adjustment assembly comprising a first transmission member rotatably mounted to the base and a second transmission member disposed on the drive member and in driving communication with the first transmission member;
when the first transmission piece rotates, the second transmission piece can be driven to move along the direction perpendicular to the working face, and the distance between the cutting disc and the working face is adjusted.
8. The cutting apparatus according to any one of claims 1 to 7, wherein the cutting assembly further comprises a controller mounted to the base station, the controller comprising a switch controller and a speed controller, the switch controller and the speed controller being electrically connected to the driving member, respectively, for controlling an operation state of the driving member;
and/or the thickness of the cutting disc is 0.15mm to 0.25mm;
and/or the cutting disc is made of polyester resin or polyethylene.
9. The cutting device of claim 8, wherein the base further comprises a plurality of adjusting members mounted to a bottom of the base on a side facing away from the working surface for adjusting parallelism of the base.
10. A processing apparatus, characterized in that the processing apparatus comprises:
a dust collection device; and
a cutting device as claimed in any one of claims 1 to 9, the dust extraction device being mounted to the cutting device for extracting waste dust generated by the cutting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223406291.3U CN219132438U (en) | 2022-12-15 | 2022-12-15 | Cutting device and processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223406291.3U CN219132438U (en) | 2022-12-15 | 2022-12-15 | Cutting device and processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219132438U true CN219132438U (en) | 2023-06-06 |
Family
ID=86561803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223406291.3U Active CN219132438U (en) | 2022-12-15 | 2022-12-15 | Cutting device and processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219132438U (en) |
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2022
- 2022-12-15 CN CN202223406291.3U patent/CN219132438U/en active Active
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