CN219123245U

CN219123245U - Chip packaging structure

Info

Publication number: CN219123245U
Application number: CN202320056237.6U
Authority: CN
Inventors: 王帅
Original assignee: Hunan Yuemo Advanced Semiconductor Co ltd
Current assignee: Hunan Yuemo Advanced Semiconductor Co ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-06-02
Anticipated expiration: 2033-01-09

Abstract

The utility model belongs to the technical field of chip packaging and discloses a chip packaging structure. The chip packaging structure comprises a substrate, a chip, a welding convex ball, a dam body and light-transmitting glass, wherein the chip is arranged on the substrate and is electrically connected with the substrate through a lead, and the outer side of the lead is coated with protective glue; the welding convex balls are arranged on the substrate and uniformly distributed on the peripheral side of the chip, an adhesive surface is arranged on one side of the welding convex balls, which is far away from the substrate, and the height of the welding convex balls is larger than the thickness of the chip; the dam body is arranged on the peripheral side of the chip in a surrounding way, and the height of the dam body is larger than that of the welding convex ball; the light-transmitting glass is adhered to the adhering surface and the dam body, and is positioned above the photosensitive area of the chip. According to the chip packaging structure provided by the utility model, when the transparent glass is adhered, the transparent glass is firstly contacted with the dam body, and then the transparent glass is pressed to be adhered with the adhesive surface, so that the installation stability and flatness of the transparent glass are ensured, and the deviation of the path of light entering the photosensitive area is avoided.

Description

Chip packaging structure

Technical Field

The present disclosure relates to chip packaging technology, and particularly to a chip packaging structure.

Background

In recent years, with the demand for electronic products having higher functions, higher signal transmission speeds, and higher densities of circuit elements, the semiconductor-related industry has been developing. In the semiconductor package fabrication process of the semiconductor industry, chip package structures that have not been singulated may be formed on a temporary substrate and then separated from the substrate.

As shown in fig. 1, the packaging process of the vehicle-mounted camera chip on the circuit board in the prior art includes: the wafer is thinned and diced according to the design requirement, the cut chip 200 'is stuck on the substrate 100' through the DA glue 400 ', then the electric signal of the chip 200' is transmitted to the substrate 100 'through the bonding mode of the lead 300', then the dam glue 600 'is arranged above the chip 200', the light-transmitting glass 700 'is stuck above the photosensitive area 210' of the chip 200 'through the dam glue 600', the plastic package body 800 'is used for protection, and finally the welding convex ball 500' is planted.

In this packaging form, on the one hand, the elastic modulus of the dam adhesive 600 ' is relatively low, and the process requirements for dispensing the dam adhesive 600 ' and plastic packaging are high, on the other hand, when dispensing the dam adhesive 600 ', the dam adhesive 600 ' may be uneven, so that the light-transmitting glass 700 ' is inclined, the path of light entering the photosensitive region 210 ' is offset, and in addition, if the process control of the dam adhesive 600 ' is poor, the plastic packaging material may enter the photosensitive region 210 ' to pollute the photosensitive region 210 '.

Disclosure of Invention

The utility model aims to provide a chip packaging structure which aims to improve the mounting reliability of light-transmitting glass.

To achieve the purpose, the utility model adopts the following technical scheme:

a chip package structure, comprising:

a substrate;

the chip is arranged on the substrate and is electrically connected with the substrate through a lead, and the outer side of the lead is coated with protective glue;

the welding convex balls are arranged on the substrate and uniformly distributed on the outer peripheral side of the chip, an adhesive surface is arranged on one side, away from the substrate, of each welding convex ball, and the height of each welding convex ball is larger than the thickness of the chip;

the dam surrounding body is arranged on the outer peripheral side of the chip in a surrounding mode, and the height of the dam surrounding body is larger than that of the welding convex ball;

and the light-transmitting glass is adhered to the adhesion surface and the dam body and is positioned above the photosensitive area of the chip.

Optionally, the substrate is a PCB substrate.

Optionally, the solder bump and the substrate are connected by soldering.

Optionally, the welding stud balls are provided with four, and the four welding stud balls are uniformly distributed on the outer peripheral side of the chip.

Optionally, the chip packaging structure further comprises an adhesive layer, and the adhesive layer is arranged on the adhesive surface.

Optionally, the sum of the heights of the welding stud ball and the bonding layer is smaller than the height of the dam body.

Optionally, the dam body is encircled on the outer peripheral side of the chip, and a plurality of welding convex balls are embedded in the dam body.

Optionally, the chip is adhered to the substrate by an adhesive.

Optionally, the box dam body is box dam silica gel.

Optionally, the dam body is square and encloses to locate the periphery side of chip, a plurality of welding convex ball gomphosis in the dam body.

The utility model has the beneficial effects that: according to the chip packaging structure provided by the utility model, the chip is electrically connected with the substrate through the lead, and the outer side of the lead is coated with the protective adhesive, so that the lead can be protected by the protective adhesive; the welding convex balls are arranged on the substrate and uniformly distributed on the peripheral side of the chip, an adhesive surface is arranged on one side, far away from the substrate, of the welding convex balls, an enclosing dam body is further arranged on the peripheral side of the chip, the height of the enclosing dam body is larger than that of the welding convex balls, when the transparent glass is adhered, the transparent glass is firstly contacted with the enclosing dam body, and then the transparent glass is pressed to be adhered with the adhesive surface, so that the welding convex balls can play a supporting role on the transparent glass, and the installation stability and flatness of the transparent glass are ensured, so that the deviation of a path of light entering a photosensitive area is avoided; the chip packaging structure is simple, easy to process and low in manufacturing cost.

Drawings

FIG. 1 is a schematic diagram of a prior art chip package structure;

fig. 2 is a schematic structural diagram of a chip provided in an embodiment of the present utility model after the chip is disposed on a substrate;

fig. 3 is a schematic structural diagram of a solder bump provided in an embodiment of the present utility model after being disposed on a substrate;

fig. 4 is a schematic structural diagram of a lead wire and a protective adhesive according to an embodiment of the present utility model;

FIG. 5 is a schematic illustration of a dam and tie layer structure provided by an embodiment of the present utility model;

FIG. 6 is a top view of an illustrative dam according to the present utility model;

fig. 7 is an overall schematic diagram of a chip package structure according to an embodiment of the present utility model.

In the figure:

100', a substrate; 200', chip; 210' and a photosensitive region; 300', lead wire; 400' and DA glue; 500', welding convex balls; 600', a dam glue; 700', light-transmitting glass; 800', plastic package;

100. a substrate; 200. a chip; 210. a photosensitive region; 300. a lead wire; 400. a protective adhesive; 500. welding a convex ball; 510. an adhesive surface; 600. a dam body; 700. light-transmitting glass; 800. a bonding layer; 900. and an adhesive member.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The embodiment provides a chip packaging structure, as shown in fig. 2-7, the chip packaging structure comprises a substrate 100, a chip 200, a solder bump 500, a dam 600 and a transparent glass 700, wherein the chip 200 is arranged on the substrate 100, the chip 200 is electrically connected with the substrate 100 through a lead 300, and a protective adhesive 400 is coated on the outer side of the lead 300; the plurality of welding convex balls 500 are arranged on the substrate 100 and are uniformly distributed on the outer peripheral side of the chip 200, an adhesive surface 510 is arranged on one side, away from the substrate 100, of the welding convex balls 500, and the height of the welding convex balls 500 is larger than the thickness of the chip 200; the dam body 600 is arranged on the outer peripheral side of the chip 200 in a surrounding manner, and the height of the dam body 600 is larger than that of the welding convex ball 500; the transparent glass 700 is adhered to the adhesion surface 510 and the dam 600, and the transparent glass 700 is located above the photosensitive area 210 of the chip 200.

According to the chip packaging structure provided by the utility model, the chip 200 is electrically connected with the substrate 100 through the lead 300, the outer side of the lead 300 is coated with the protective adhesive 400, and the protective adhesive 400 can protect the lead 300; the plurality of welding convex balls 500 are arranged on the substrate 100 and uniformly distributed on the peripheral side of the chip 200, the bonding surface 510 is arranged on the side, away from the substrate 100, of the welding convex balls 500, the dam body 600 is further arranged on the peripheral side of the chip 200, the height of the dam body 600 is larger than that of the welding convex balls 500, when the transparent glass 700 is adhered, the transparent glass 700 firstly contacts the dam body 600, then the transparent glass 700 is pressed to bond with the bonding surface 510, the welding convex balls 500 can play a supporting role on the transparent glass 700, and the installation stability and flatness of the transparent glass 700 are ensured so as to avoid deviation of the way that light enters the photosensitive area 210; the chip packaging structure is simple, easy to process and low in manufacturing cost.

Optionally, the substrate 100 is a PCB substrate, and the PCB substrate is a support for electronic components, for example, it is a support for the vehicle-mounted camera chip 200, and the chip 200 is electrically connected to the PCB substrate to realize signal transmission. In other embodiments, the substrate 100 may be provided as other semiconductor substrates as desired.

In this embodiment, the solder bump 500 and the substrate 100 are connected by soldering, and the soldering is stable and reliable. The solder bumps 500 and the substrate 100 are illustratively connected by solder reflow. Specifically, the bottom of the solder bump 500 is provided with a solder surface, and the solder surface is attached to the upper surface of the substrate 100, so as to ensure the connection stability between the solder bump 500 and the substrate 100.

Preferably, the number of the solder bumps 500 is four, and the four solder bumps 500 are uniformly distributed on the outer circumferential side of the chip 200 to ensure the uniformity of the support of the light-transmitting glass 700 by the four solder bumps 500. In other embodiments, the number of the devices may be other, such as six, and the like, as required. Alternatively, the welding stud ball 500 may be made of a welding metal such as copper, nickel, zinc, molybdenum, and alloys thereof.

Alternatively, the chip 200 is adhered to the substrate 100 by the adhesive 900, which is simple and easy to operate. Specifically, the adhesive 900 is glue.

The chip package structure further includes an adhesive layer 800, where the adhesive layer 800 is disposed on the adhesive surface 510. Alternatively, the adhesive layer 800 is a DAF (Die Attach Film) film layer, and the DAF film layer has excellent adhesion.

Preferably, the sum of the heights of the solder stud ball 500 and the bonding layer 800 is less than the height of the back dam 600. When the light-transmitting glass 700 is bonded, the light-transmitting glass 700 can be contacted with the dam body 600 first, and after the light-transmitting glass 700 is bonded on the dam body 600, the light-transmitting glass 700 is pressed, so that the lower surface of the light-transmitting glass 700 is connected with the bonding layer 800, and the stability and reliability of connection are improved.

Specifically, the dam body 600 is dam silica gel, and the dam silica gel has good adhesion, high strength and excellent sealing property.

Optionally, the dam body 600 is circularly arranged on the outer peripheral side of the chip 200, the plurality of welding beads 500 are embedded in the dam body 600, the dam body 600 and the welding beads 500 are arranged on the outer peripheral side of the chip 200, and after the light-transmitting glass 700 is adhered to the dam body 600 and the welding beads 500, a sealing area is formed, so that foreign matters are prevented from entering the sealing area to pollute the photosensitive area 210 of the chip 200.

Alternatively, the dam 600 is square and surrounds the outer periphery of the chip 200, and the plurality of solder bumps 500 are fitted into the dam 600. The shape of the dam 600 may be set by those skilled in the art as desired.

The packaging process of the chip packaging structure provided in this embodiment: referring to fig. 2 to 7, the chip 200 is first bonded to the substrate 100, the solder bump 500 is planted in the pad area of the substrate 100, and the solder bump 500 is connected to the substrate 100 by soldering, and the solder bump 500 is subjected to a leveling process to prepare the bonding surface 510; bonding the chip 200 and the substrate 100 through the lead 300, and coating a layer of protective adhesive 400 on the lead 300; preparing a dam-surrounding body 600 on the peripheral side of the chip 200, and attaching a layer of bonding layer 800 on the bonding surface 510 of the welding stud ball 500; the light-transmitting glass 700 is adhered to the dam body 600, and as the height of the dam body 600 is higher than that of the welding convex ball 500, the light-transmitting glass 700 is pressed, so that the lower surface of the light-transmitting glass 700 is connected with the bonding layer 800, good tightness in the dam body 600 is ensured, foreign matters are prevented from entering the sealing area to pollute the photosensitive area 210, and the dam body 600 is solidified after the light-transmitting glass 700 is adhered.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

1. Chip packaging structure, its characterized in that includes:

a substrate (100);

the chip (200) is arranged on the substrate (100), the chip (200) is electrically connected with the substrate (100) through a lead (300), and the outer side of the lead (300) is coated with a protective adhesive (400);

the welding convex balls (500) are arranged on the substrate (100) and uniformly distributed on the outer periphery side of the chip (200), an adhesive surface (510) is arranged on one side, away from the substrate (100), of each welding convex ball (500), and the height of each welding convex ball (500) is larger than the thickness of the chip (200);

the dam surrounding body (600) is arranged on the outer peripheral side of the chip (200) in a surrounding mode, and the height of the dam surrounding body (600) is larger than that of the welding convex ball (500);

and the light-transmitting glass (700) is adhered to the adhesion surface (510) and the dam body (600), and the light-transmitting glass (700) is positioned above the photosensitive area (210) of the chip (200).

2. The chip package structure according to claim 1, wherein the substrate (100) is a PCB substrate.

3. The chip packaging structure according to claim 1, wherein the solder bump (500) and the substrate (100) are connected by soldering.

4. The chip packaging structure according to claim 1, wherein four solder bumps (500) are provided, and four solder bumps (500) are uniformly distributed on an outer peripheral side of the chip (200).

5. The chip packaging structure according to claim 1, further comprising an adhesive layer (800), the adhesive layer (800) being provided on the adhesive surface (510).

6. The chip package structure according to claim 5, wherein a sum of heights of the solder bump (500) and the adhesive layer (800) is smaller than a height of the dam body (600).

7. The chip packaging structure according to claim 1, wherein the dam body (600) is formed in a circle shape and surrounds the outer peripheral side of the chip (200), and a plurality of the solder bumps (500) are embedded in the dam body (600).

8. The chip package structure according to claim 1, wherein the chip (200) is bonded to the substrate (100) by an adhesive member (900).

9. The chip package structure of claim 1, wherein the dam body (600) is a dam silicone.

10. The chip packaging structure according to claim 1, wherein the dam body (600) is square and surrounds the outer peripheral side of the chip (200), and a plurality of the solder bumps (500) are embedded in the dam body (600).