CN219123183U

CN219123183U - Wafer detection device

Info

Publication number: CN219123183U
Application number: CN202222565748.9U
Authority: CN
Inventors: 袁康
Original assignee: Suzhou Tuosi Semiconductor Technology Co ltd
Current assignee: Suzhou Tuosi Semiconductor Technology Co ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-06-02
Anticipated expiration: 2032-09-27

Abstract

The utility model discloses a wafer detection device, wherein a wafer to be detected is positioned on a ceramic disc and comprises a detection platform, a positioning disc is arranged on the detection platform, and a limit strip is arranged at the edge of the positioning disc; the jacking module comprises a driving motor, a screw rod positioned at the rotating shaft end of the driving motor and a jacking block moving along the length direction of the screw rod, wherein a jacking rod is arranged on the jacking block and penetrates through the positioning disc to jack the ceramic disc; the detection sensor is positioned above the positioning disc and is used for detecting the wafer; the driving module comprises an X-axis module and a Y-axis module moving along the length direction of the X-axis module, and the detection sensor moves along the length direction of the Y-axis module. The utility model adopts the infrared interference sensor as the detection sensor to automatically scan and detect the data of the wafer surface, thereby realizing the full-parameter test of the wafer surface.

Description

Wafer detection device

Technical Field

The utility model belongs to the technical field of wafer detection, and particularly relates to a wafer detection device.

Background

In semiconductor production, a wafer is a basis for manufacturing chips, and parameters such as thickness uniformity, bending degree and warpage of the wafer have great influence on stress and performance of the wafer, and full parameters of the wafer need to be detected, so that wafer detection equipment is important precision measurement equipment in the semiconductor industry.

In the existing production, for the full-parameter test of the wafer, the measurement mode is mainly interferometry, the efficiency of the interferometry is higher, but the interferometry mode can lead to the huge volume and the complex design of an interference imaging optical path system, the interference measurement mode has high requirements on the installation and debugging precision, and the key technology of the large-caliber interference imaging is blocked by foreign enterprises and cannot be popularized and applied in a large range, so that a wafer detection device is needed to test the full parameters of the wafer.

Disclosure of Invention

The utility model overcomes the defects of the prior art and provides a wafer detection device to solve the problems in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a wafer inspection apparatus for inspecting a wafer on a ceramic disk includes

The ceramic disc positioning device comprises a detection platform, wherein a positioning disc is arranged on the detection platform, a limiting strip is arranged at the edge of the positioning disc, and the limiting strip is used for positioning the ceramic disc;

the jacking module comprises a driving motor, a screw rod positioned at the rotating shaft end of the driving motor and a jacking block moving along the length direction of the screw rod, wherein a jacking rod is arranged on the jacking block and penetrates through the positioning disc to jack the ceramic disc;

the detection sensor is positioned above the positioning disc and is used for detecting the wafer;

the driving module comprises an X-axis module and a Y-axis module moving along the length direction of the X-axis module, and the detection sensor moves along the length direction of the Y-axis module.

In a preferred embodiment of the utility model, the method further comprises

The fixed rack, detection platform pass through the snubber block with the fixed rack is connected.

In a preferred embodiment of the present utility model, the fixing rack is provided with a mounting rack, the mounting rack is provided with a camera and light sources, the camera is located above the positioning disk, and the number of the light sources is two and located at two sides of the positioning disk.

In a preferred embodiment of the present utility model, the detection platform is a marble platform, and the detection sensor is an infrared interference sensor.

In a preferred embodiment of the present utility model, the jacking block is triangular, and the number of the jacking rods is three and the jacking rods are located at the corners of the jacking block.

In a preferred embodiment of the present utility model, a limiting block is disposed on the jacking block, and the limiting block limits the jacking block.

In a preferred embodiment of the present utility model, the X-axis module and the Y-axis module are linear motor modules.

The utility model solves the defects existing in the background technology, and has the following beneficial effects:

(1) Under the cooperation of the detection platform, the jacking module, the detection sensor and the driving module, the full-parameter test of the wafer is realized, after the camera photographs the ceramic disc and the wafer, the wafer bar code scanning operation and the automatic detection path planning operation are performed, and then the infrared interference sensor is used as the detection sensor to automatically scan and detect the data on the surface of the wafer, so that the full-parameter test of the surface of the wafer is realized;

(2) The jacking block adopts a triangle shape, can form a triangle support to jack up the ceramic disc, and the jacking effect is stable.

Drawings

The utility model is further described below with reference to the drawings and examples;

FIG. 1 is a schematic view of the overall structure of a preferred embodiment of the present utility model;

FIG. 2 is a front view of a preferred embodiment of the present utility model;

FIG. 3 is a top view of a preferred embodiment of the present utility model;

FIG. 4 is a schematic diagram of a jack-up module according to a preferred embodiment of the present utility model;

in the figure: 10. a detection platform; 11. a positioning plate; 111. a limit bar; 20. a jacking module; 21. a driving motor; 22. a screw rod; 23. a jacking block; 231. a lifting rod; 30. a detection sensor; 40. a driving module; 41. an X-axis module; 42. a Y-axis module; 50. a stationary gantry; 51. a mounting frame; 511. a camera; 512. a light source; 60. a damper block; 70. and a limiting block.

Detailed Description

Various embodiments of the utility model are disclosed in the following drawings, in which details of the practice are set forth in the following description for the purpose of clarity. However, it should be understood that these practical details are not to be taken as limiting the utility model. That is, in some embodiments of the utility model, these practical details are unnecessary. Moreover, for the purpose of simplifying the drawings, some conventional structures and components are shown in the drawings in a simplified schematic manner.

In addition, the descriptions of the "first," "second," and the like, herein are for descriptive purposes only and are not intended to be specifically construed as order or sequence, nor are they intended to limit the utility model solely for distinguishing between components or operations described in the same technical term, but are not to be construed as indicating or implying any relative importance or order of such features. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1 to 3, a wafer inspection apparatus for inspecting a wafer on a ceramic disk, the inspection apparatus comprising:

the detection platform 10, be provided with positioning disk 11 on the detection platform 10, positioning disk 11 edge is provided with spacing 111, and spacing 111 is fixed a position the ceramic dish, and detection platform 10 is marble platform, places the ceramic dish behind the positioning disk 11, and spacing 111 realizes spacing to the ceramic dish from the edge of ceramic dish, guarantees the degree of accuracy of follow-up detection of wafer on the ceramic dish.

As shown in fig. 1 and 4, the detection device further comprises a jacking module 20, the jacking module 20 comprises a driving motor 21, a screw rod 22 positioned at the rotating shaft end of the driving motor 21 and a jacking block 23 moving along the length direction of the screw rod 22, a jacking rod 231 is arranged on the jacking block 23, the jacking rod 231 penetrates through the positioning disc 11 to jack the ceramic disc, so that full-parameter detection of the wafer is better realized, and the jacking module 20 can jack the ceramic disc to realize comprehensive detection of the wafer.

Specifically, the jacking block 23 is triangular, the number of the jacking rods 231 is three and the jacking rods are located at the corners of the jacking block 23, the jacking block 23 is triangular, a triangular support can be formed to jack up the ceramic disc, the jacking effect is stable, and the detection accuracy of the wafer is further guaranteed.

In this embodiment, the lifting block 23 is provided with a limiting block 70, the limiting block 70 limits the lifting block 23, and the limiting block 70 can limit the lifting height of the lifting block 23, so as to avoid the influence on the detection of the wafer caused by the overhigh lifting height of the lifting block 23.

The detection device further comprises a detection sensor 30, wherein the detection sensor 30 is positioned above the positioning disk 11 and is used for detecting the wafer, and the detection sensor 30 adopted in the embodiment is an infrared interference sensor and can be used for automatically scanning and detecting the surface data of the wafer.

The detection device further comprises a driving module 40, the driving module 40 comprises an X-axis module 41 and a Y-axis module 42 which moves along the length direction of the X-axis module 41, the detection sensor 30 moves along the length direction of the Y-axis module 42, and the driving module 40 realizes the movement of the detection sensor 30 in the X-axis direction and the Y-axis direction, so that the full-scale detection of the wafer is realized.

Specifically, the X-axis module 41 and the Y-axis module 42 are linear motor modules.

The detection device further comprises a fixed rack 50, the detection platform 10 is connected with the fixed rack 50 through a damping block 60, and the damping block 60 can greatly reduce the influence of vibration factors on the detection platform 10 and ensure the detection precision.

In this embodiment, the fixing rack 50 is provided with the mounting rack 51, the mounting rack 51 is provided with the cameras 511 and the light sources 512, the cameras 511 are located above the positioning disk 11, the number of the light sources 512 is two and located at two sides of the positioning disk 11, the adopted cameras 511 are industrial cameras 511, pictures of ceramic disks and wafers can be shot, wafer bar code scanning and automatic path planning can be performed, and the light sources 512 play a role in illumination, so that the use of the cameras 511 is guaranteed.

As shown in fig. 1 to 4, in actual use, an operator places a ceramic disc with a wafer to be tested on a positioning disc 11, after positioning is completed, a camera 511 photographs the ceramic disc and the wafer, so as to realize barcode scanning and automatic planning of a detection path of the wafer, after the completion, a driving module 40 drives a detection sensor 30 to move, the detection sensor 30 detects the wafer on the ceramic disc, and in the detection process, a jacking module 20 jacks up the ceramic disc, so that more comprehensive detection of the wafer is ensured.

In summary, the utility model realizes the full parameter test of the wafer under the cooperation of the detection platform 10, the jacking module 20, the detection sensor 30 and the driving module 40, and after the camera 511 photographs the ceramic disc and the wafer, the wafer bar code scanning operation and the automatic detection path planning operation are performed, and then the infrared interference sensor is used as the detection sensor 30 to automatically scan and detect the data on the surface of the wafer, so as to realize the full parameter test of the surface of the wafer.

The above-described preferred embodiments according to the present utility model are intended to suggest that, from the above description, various changes and modifications can be made by the person skilled in the art without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims

1. A wafer inspection apparatus, in which a wafer to be inspected is placed on a ceramic disk, is characterized by comprising

2. The wafer inspection apparatus of claim 1, further comprising

3. The wafer inspection apparatus according to claim 2, wherein the fixed rack is provided with a mounting frame, the mounting frame is provided with a camera and light sources, the camera is located above the positioning plate, and the number of the light sources is two and located at two sides of the positioning plate.

4. The wafer inspection apparatus of claim 1, wherein the inspection stage is a marble stage and the inspection sensor is an infrared interference sensor.

5. The wafer inspection apparatus of claim 1, wherein the lift-up block is triangular in shape, and the number of lift-up bars is three and is located at a corner position of the lift-up block.

6. The wafer inspection apparatus according to claim 5, wherein a stopper is provided on the lifting block, and the stopper limits the lifting block.

7. The wafer inspection apparatus of claim 1, wherein the X-axis module and the Y-axis module are linear motor modules.