CN219120800U - Semiconductor temperature adjusting assembly and neck hanging temperature adjusting device - Google Patents
Semiconductor temperature adjusting assembly and neck hanging temperature adjusting device Download PDFInfo
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- CN219120800U CN219120800U CN202223262249.9U CN202223262249U CN219120800U CN 219120800 U CN219120800 U CN 219120800U CN 202223262249 U CN202223262249 U CN 202223262249U CN 219120800 U CN219120800 U CN 219120800U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The utility model provides a semiconductor temperature adjusting component and a neck hanging temperature adjusting device, wherein the semiconductor temperature adjusting component comprises a semiconductor refrigerating piece and a temperature guiding piece, the semiconductor refrigerating piece comprises a PN galvanic couple particle layer, a first substrate and a second substrate which are arranged on two opposite sides of the PN galvanic couple particle layer, a first curved surface is arranged on one side, away from the PN galvanic couple particle layer, of the first substrate, a second curved surface matched with the first curved surface in shape is arranged on the temperature guiding piece, and the first curved surface is in heat conduction connection with the second curved surface. According to the utility model, the first curved surface matched with the second curved surface of the temperature guide piece is processed on the first substrate in a material removing mode, so that the semiconductor refrigeration piece and the temperature guide piece can be closely attached, and compared with the process of processing the convex plane part on the temperature guide piece, the difficulty in production and manufacturing is reduced, and the overall thickness and weight of the semiconductor temperature adjusting component are reduced.
Description
Technical Field
The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor temperature adjusting assembly and a neck hanging temperature adjusting device.
Background
The semiconductor refrigerating sheet generally comprises a thermocouple pair formed by connecting an N-type semiconductor and a P-type semiconductor, and insulating heat conducting layers arranged on two opposite sides of the thermocouple pair, and when current passes through the thermocouple pair, the two sides of the thermocouple pair absorb heat and emit heat respectively, so that one-side refrigeration and one-side heating effects are realized.
In the existing semiconductor refrigeration sheet, one side of the insulating heat-conducting layer far away from the thermocouple pair is usually in a planar structure, for example, chinese patent CN211823257U discloses a semiconductor refrigeration sheet and a thermal insulation box, the semiconductor refrigeration sheet comprises a first substrate and a second substrate, the first substrate and the second substrate are the insulating heat-conducting layer, and one side of the first substrate far away from the thermocouple pair and one side of the second substrate far away from the thermocouple pair are both in a planar structure.
In some practical applications of the semiconductor refrigeration sheet, the cold guide sheet is of a curved structure, how the cold guide sheet of the curved structure performs effective heat conduction with the insulating heat conduction layer of the planar structure becomes a research direction, for example, chinese patent CN213687096U discloses a portable neck hanging fan with a refrigeration function, which comprises the semiconductor refrigeration sheet and the cold guide sheet, so as to improve the fitting degree of the cold guide sheet and the human neck to facilitate cold guide on the human neck, and therefore, the cold guide sheet is of a curved structure to adapt to the shape of the human neck. The cold junction of the semiconductor refrigeration piece of planar structure and the cold conducting piece area of contact of curved surface structure are too little, are unfavorable for the semiconductor refrigeration piece to conduct cold volume to on the cold conducting piece, so current cold conducting piece is close to the cold junction of semiconductor refrigeration piece one side processing out convex plane portion and comes to carry out the heat conduction with the cold junction contact of the semiconductor film-making of planar structure to lead to the whole thickness and the weight increase of semiconductor temperature adjusting assembly, and because the cold conducting piece is curved surface structure, further increased the processing degree of difficulty of plane portion.
Disclosure of Invention
The embodiment of the utility model provides a semiconductor temperature adjusting component, which aims to solve the problems.
The embodiment of the utility model realizes the aim through the following technical scheme.
The embodiment of the utility model provides a semiconductor temperature adjusting component, which comprises a semiconductor refrigerating sheet and a temperature guiding piece, wherein the semiconductor refrigerating sheet comprises a PN (PN) couple particle layer, a first substrate and a second substrate which are arranged on two opposite sides of the PN couple particle layer, a first curved surface is arranged on one side, away from the PN couple particle layer, of the first substrate, a second curved surface matched with the first curved surface in shape is arranged on the temperature guiding piece, and the first curved surface is in heat conduction connection with the second curved surface.
And a first plane is arranged on one side of the first substrate, which is close to the PN galvanic couple particle layer.
The distance between the first curved surface and the first plane gradually increases from the middle part of the first curved surface towards two ends, or the distance between the first curved surface and the first plane gradually increases from one end of the first curved surface towards the other end of the first curved surface.
And one side, close to the PN galvanic couple particle layer, of the second substrate is provided with a second plane, the opposite side is provided with a third plane, and/or the second substrate is a uniform thickness plate.
Wherein, the side of the temperature guide piece far away from the semiconductor refrigerating piece is provided with a third curved surface.
The semiconductor temperature adjusting assembly further comprises a heat radiating piece, the heat radiating piece comprises a heat conducting part and a plurality of heat radiating fins arranged on the heat conducting part, the heat conducting part is in heat conduction connection with the second substrate, and a heat radiating air channel is formed between every two adjacent heat radiating fins.
The heat dissipation part further comprises a first fan, wherein the first fan is arranged on the heat conduction part, and the air outlet faces the heat dissipation air duct.
The embodiment of the utility model also provides a neck hanging temperature regulating device, which comprises a shell and the semiconductor temperature regulating assembly, wherein the semiconductor refrigerating piece is arranged in the shell, and the temperature guide piece is arranged on the shell.
The shell is provided with a mounting opening, the temperature guide piece is arranged on the mounting opening, and the other side of the temperature guide piece opposite to the side provided with the second curved surface is exposed out of the mounting opening.
The shell is provided with a heat radiation opening, an air inlet and an air outlet, the heat radiation opening corresponds to the position of the semiconductor refrigerating sheet, a second fan is arranged in the shell and corresponds to the position of the air inlet, and the second fan is used for sucking air flow from the air inlet and blowing out from the air outlet or sucking air flow from the air inlet and blowing out from the air outlet and the heat radiation opening.
According to the utility model, the first curved surface matched with the second curved surface of the temperature-conducting piece is processed on the side, far away from the PN galvanic couple particle layer, of the first substrate in a material removing mode, and the first curved surface is matched with the second curved surface, so that the heat conduction connection between the semiconductor refrigerating piece and the temperature-conducting piece is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a semiconductor temperature adjusting assembly according to a first embodiment of the present utility model;
FIG. 2 is a cross-sectional view of the semiconductor tempering assembly shown in FIG. 1;
FIG. 3 is an exploded view of the semiconductor tempering assembly of FIG. 1;
FIG. 4 is an exploded view of FIG. 3 at another angle;
fig. 5 is a schematic structural view of a neck hanging temperature regulating device according to a second embodiment of the present utility model;
FIG. 6 is a cross-sectional view of the neck hanging temperature regulating device shown in FIG. 5;
fig. 7 is an exploded view of a semiconductor tempering assembly according to a third embodiment of the present utility model;
fig. 8 is a schematic structural view of a neck-hanging temperature regulating device according to a fourth embodiment of the present utility model;
fig. 9 is a partial cross-sectional view of fig. 8.
Detailed Description
In order to enable those skilled in the art to better understand the present utility model, the following description will make clear and complete descriptions of the technical solutions according to the embodiments of the present utility model with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, a first embodiment of the present utility model provides a semiconductor temperature adjusting assembly 10, which includes a semiconductor cooling sheet 100 and a heat conducting member 200, wherein the semiconductor cooling sheet 100 includes a PN galvanic particle layer 110, and a first substrate 120 and a second substrate 130 disposed on opposite sides of the PN galvanic particle layer 110, a first curved surface 121 is disposed on a side of the first substrate 120 away from the PN galvanic particle layer 110, a second curved surface 201 matching the first curved surface 121 in shape is disposed on the heat conducting member 200, and the first curved surface 121 is thermally connected to the second curved surface 201.
Specifically, the PN galvanic particle layer 110 is encapsulated with semiconductor crystal grains and a diversion metal sheet, and when current passes through, heat is transferred from one end of the PN galvanic particle layer 110 to the other end, so that temperature difference is generated at the two ends, and cold and hot ends are respectively formed. When the semiconductor refrigeration piece 100 is in the refrigeration mode, the first substrate 120 is a low-temperature side close to the cold end, and the first substrate 120 is connected with the temperature-conducting piece 200 directly or through mediums such as silicone grease, heat-conducting silica gel and the like; the second substrate 130 is the high temperature side near the hot side. Alternatively, the first substrate 120 and the second substrate 130 are made of ceramic or aluminum alloy.
Further, a first plane 122 is disposed on a side of the first substrate 120 near the PN galvanic particle layer 110. Because the opposite sides of the conventional PN galvanic particle layer 110 are both planar structures, the first plane 122 disposed on the first substrate 120 is beneficial to assembling the first substrate 120 and the PN galvanic particle layer 110, and reduces the difficulty in manufacturing the semiconductor refrigeration sheet 100.
Further, the distance between the first curved surface 121 and the first plane 122 becomes gradually larger from the middle portion of the first curved surface 121 toward both ends, or the distance between the first curved surface 121 and the first plane 122 becomes gradually larger from one end of the first curved surface 121 toward the other end.
In this embodiment, the temperature-guiding member 200 has an arc structure and a shape adapted to the shape of the back side of the neck of the human body. When the semiconductor refrigeration piece 100 is disposed in the middle of the temperature guide 200, since the opposite sides of the PN couple particle layer 110 are in a planar structure, the distance between the first curved surface 121 and the first plane 122 gradually increases from the middle of the first curved surface 121 toward two ends or the distance between the first curved surface 121 and the first plane 122 gradually increases from one end of the first curved surface 121 toward the other end, so as to be convenient for adapting to the second curved surfaces 201 with different shapes, thereby improving the connection tightness between the semiconductor refrigeration piece 100 and the temperature guide 200 and reducing the overall thickness of the semiconductor temperature adjustment assembly 10.
Further, a second plane 131 is disposed on one side of the second substrate 130 near the PN galvanic particle layer 110, a third plane 132 is disposed on the opposite side, and/or the second substrate 130 is a uniform thickness plate.
It can be appreciated that the second plane 131 facilitates assembling the second substrate 130 with the PN galvanic particle layer 110, and the third plane 132 facilitates mounting a heat dissipating component on the second substrate 130, so as to improve the refrigerating efficiency of the PN galvanic particle layer 110.
Further, a third curved surface 202 is disposed on a side of the temperature-conducting member 200 away from the semiconductor refrigeration sheet 100.
The heat conducting member 200 is used for directly contacting the skin of the human body to transfer heat. When the semiconductor temperature adjusting assembly 10 is used for a neck hanging air conditioner or a wrist wearing air conditioner, the third curved surface 202 can enable the temperature guiding member 200 to be better attached to the wrist or the neck of a user, so that the refrigerating or heating efficiency of the temperature guiding member 200 is improved.
Further, the semiconductor temperature adjustment assembly 10 further includes a heat dissipation member 300, wherein the heat dissipation member 300 includes a heat conduction portion 310 and a plurality of heat dissipation fins 320 disposed on the heat conduction portion 310, the heat conduction portion 310 is connected with the second substrate 130 in a heat conduction manner, and a heat dissipation air channel 301 is formed between every two adjacent heat dissipation fins 320.
Specifically, the heat conducting portion 310 is in a plate structure and is disposed on the third plane 132, and the plurality of heat dissipating fins 320 are uniformly disposed on the heat conducting portion 310 at intervals, and a heat dissipating air channel 301 is disposed between every two adjacent heat dissipating fins 320, so as to increase the contact area between the air flow passing through the heat dissipating air channel 301 and the heat dissipating member 300, and improve the heat dissipating efficiency.
Further, the heat dissipation device 300 further includes a first fan 330, the first fan 330 is disposed on the heat conducting portion 310, and an air flow outlet of the first fan 330 faces the heat dissipation air duct 301.
It can be appreciated that the first fan 330 can drive the air to pass through the heat dissipation air channel 301 and form an air flow, so as to improve the heat dissipation efficiency.
Referring to fig. 5 to 6, the second embodiment of the present utility model further provides a neck hanging temperature adjusting device, which includes a housing 20 and a semiconductor temperature adjusting assembly 10 according to the first embodiment, wherein a semiconductor cooling fin 100 is disposed in the housing 20, and a temperature guiding member 200 is disposed on the housing 20. In this embodiment, the housing 20 is U-shaped for wearing around the neck of a person.
Further, the housing 20 is provided with a mounting opening 21, the temperature guide 200 is provided on the mounting opening 21, and the other side of the temperature guide 200 opposite to the side provided with the second curved surface 201 is exposed to the mounting opening 21. In the present embodiment, the housing 20 is provided with a housing chamber 22 communicating with the mounting opening 21, and the semiconductor refrigeration sheet 100 is disposed in the housing chamber 22. The temperature guide 200 has a substantially oblong shape and has one side protruding with respect to the mounting opening 21 so as to be in contact with the neck of the user.
Further, a heat dissipation port 23, an air inlet 24 and an air outlet 25 are arranged on the housing 20, the heat dissipation port 23 corresponds to the position of the semiconductor refrigeration piece 100, a second fan 26 is arranged in the housing 20, the second fan 26 corresponds to the position of the air inlet 24, and the second fan 26 is used for sucking air flow from the air inlet 24 and blowing out from the air outlet 25.
In this embodiment, since the heat dissipation component 300 includes the first fan 330, the first fan 330 can directly dissipate heat in the heat dissipation air duct 301, and the second fan 26 directly blows out from the air outlet 25 after sucking air flow from the air inlet 24, so that the air outlet 25 has a higher air outlet speed and an air outlet distance.
Referring to fig. 7, a semiconductor temperature adjusting assembly 10 according to a third embodiment of the present utility model is further provided, which is different from the first embodiment in that the shape of the temperature guiding member 200 is adapted to the shape of the left or right side of the neck of the human body.
Referring to fig. 8 to 9, the fourth embodiment of the present utility model further provides a neck hanging temperature adjusting device, which is different from the second embodiment in that the device comprises two semiconductor temperature adjusting assemblies 10 according to the third embodiment, the temperature guiding members 200 on the two semiconductor temperature adjusting assemblies 10 are respectively disposed corresponding to the left side and the right side of the neck of the human body, and the heat dissipating member 300 does not include the first fan 330.
In this embodiment, the second fan 26 is used for sucking air flow from the air inlet 24 and blowing out from the air outlet 25 and the heat dissipation port 23, which saves the space for setting the first fan 330, reduces the volume of the neck hanging temperature adjusting device, and improves portability.
According to the utility model, the first curved surface 121 matched with the shape of the second curved surface 201 of the temperature-conducting member 200 is processed on the side, away from the PN galvanic particle layer 110, of the first substrate 120, and the first curved surface 121 is matched with the second curved surface 201, so that the heat conduction connection between the semiconductor refrigeration piece 100 and the temperature-conducting member 200 is realized, and as the side, away from the PN galvanic particle layer 110, of the first substrate 120 is of a planar structure, the side, close to the first substrate 120, of the temperature-conducting member 200 is of a curved surface structure, and compared with the processing of a convex planar part on the curved surface structure, the processing of the first curved surface 121 on the planar structure reduces the difficulty of production and manufacture, and simultaneously reduces the overall thickness and weight of the semiconductor temperature-regulating assembly 10.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model, and are intended to be included in the scope of the present utility model.
Claims (10)
1. The semiconductor temperature adjusting component is characterized by comprising a semiconductor refrigerating sheet and a temperature guide piece, wherein the semiconductor refrigerating sheet comprises a PN (PN) couple particle layer, a first substrate and a second substrate, the first substrate and the second substrate are arranged on two opposite sides of the PN couple particle layer, a first curved surface is arranged on one side, away from the PN couple particle layer, of the first substrate, a second curved surface matched with the first curved surface in shape is arranged on the temperature guide piece, and the first curved surface is in heat conduction connection with the second curved surface.
2. The semiconductor temperature regulating assembly of claim 1, wherein a side of the first substrate adjacent to the PN galvanic particulate layer is provided with a first plane.
3. The semiconductor tempering assembly according to claim 2, wherein a distance between the first curved surface and the first plane becomes gradually larger from a middle portion of the first curved surface toward both ends, or a distance between the first curved surface and the first plane becomes gradually larger from one end of the first curved surface toward the other end.
4. The semiconductor temperature regulating assembly of claim 1, wherein one side of the second substrate adjacent to the PN galvanic particulate layer is provided with a second plane, the opposite side is provided with a third plane, and/or the second substrate is a flat plate.
5. The semiconductor temperature regulating assembly as claimed in claim 1, wherein a side of the temperature guide member remote from the semiconductor cooling fin is provided with a third curved surface.
6. The semiconductor temperature regulating assembly of claim 1, further comprising a heat sink comprising a thermally conductive portion and a plurality of heat sinks disposed on the thermally conductive portion, the thermally conductive portion being thermally conductively coupled to the second substrate, a heat dissipation air channel being formed between each two adjacent heat sinks.
7. The semiconductor tempering assembly of claim 6, wherein the heat sink further comprises a first fan disposed on the heat conducting portion and having an air outlet facing the heat dissipation air channel.
8. A neck-hung temperature regulating device comprising a housing and the semiconductor temperature regulating assembly according to any one of claims 1 to 7, wherein the semiconductor cooling sheet is disposed in the housing, and the temperature guide member is disposed on the housing.
9. The neck-hung temperature regulating device according to claim 8, wherein the housing is provided with a mounting opening, the temperature-guiding member is provided on the mounting opening, and the other side of the temperature-guiding member opposite to the side provided with the second curved surface is exposed from the mounting opening.
10. The neck-hung temperature regulating device according to claim 8, wherein the shell is provided with a heat radiation opening, an air inlet and an air outlet, the heat radiation opening corresponds to the position of the semiconductor refrigerating piece, the shell is internally provided with a second fan, the second fan corresponds to the position of the air inlet, and the second fan is used for sucking air flow from the air inlet and blowing out from the air outlet, or sucking air flow from the air inlet and blowing out from the air outlet and the heat radiation opening.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2022201820065 | 2022-01-20 | ||
| CN202220182006 | 2022-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219120800U true CN219120800U (en) | 2023-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223262249.9U Active CN219120800U (en) | 2022-01-20 | 2022-12-05 | Semiconductor temperature adjusting assembly and neck hanging temperature adjusting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219120800U (en) |
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2022
- 2022-12-05 CN CN202223262249.9U patent/CN219120800U/en active Active
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