CN219107401U - Radio frequency power amplifying circuit and radio frequency front end module - Google Patents

Abstract

The application discloses a radio frequency power amplifier circuit and a radio frequency front-end module. The radio frequency power amplifying circuit includes a power amplifying module, a balun module and a first capacitor. Wherein, the balun module is connected with the power amplifying module, the balun module includes a first coil and a second coil coupled to each other, and the first coil is connected with the power amplifying module. The second coil includes a first sub-coil and a second sub-coil, one end of the first sub-coil is connected to one end of the second sub-coil to form a common terminal, and the other end of the second sub-coil is grounded. One end of the first capacitor is connected to the common end, and the other end is grounded. Therefore, the output end of the balun module in the present application is provided with the first resonance formed by the parallel connection of the first capacitor and the second sub-coil, and the first resonance can affect some harmonic signals in the first radio frequency signal (especially High order resonance signal) is suppressed to ensure the signal transmission quality of the radio frequency power amplifier circuit.

Description

RF power amplifier circuit and RF front-end module

technical field

The present application relates to the field of radio frequency technology, and more specifically, to a radio frequency power amplifier circuit and a radio frequency front-end module.

Background technique

In a wireless communication system, an RF front-end circuit often includes a low-noise amplifier, a power amplifier, and a balanced-unbalanced converter (ie, a balun) and the like. Wherein, the balun is connected with the signal output end of the power amplifier, and is used for synthesizing the signals amplified by the power amplifier, and then outputting the radio frequency signal.

However, in the actual working process of the power amplifier (for example, a differential amplifier), there is a problem that the high-order harmonics in the signal cannot be well suppressed, which leads to the existence of certain high-order harmonics in the RF signal output by the balun, which affects The signal transmission quality of radio frequency signals.

Utility model content

Embodiments of the present application provide a radio frequency power amplifier circuit and a radio frequency front-end module.

According to the first aspect of the present application, an embodiment of the present application provides a radio frequency power amplifying circuit, where the radio frequency power amplifying circuit includes a power amplifying module, a balun module, and a first capacitor. Wherein, the balun module is connected with the power amplifying module, and is used for receiving the first radio frequency signal sent by the power amplifying module; the balun module includes a first coil and a second coil coupled to each other, and the first coil is connected with the power amplifying module. The second coil includes a first sub-coil and a second sub-coil, one end of the first sub-coil is connected to one end of the second sub-coil to form a common terminal, and the other end of the first sub-coil is used to output a second radio frequency signal; The other end of the second sub-coil is grounded. One end of the first capacitor is connected to the common end, and the other end is grounded.

Wherein, in some optional embodiments, the first capacitance and the equivalent inductance of the first sub-coil form a first resonance, and the first resonance frequency of the first resonance is between the signal frequency of the fundamental signal in the first radio frequency signal. The first ratio is greater than or equal to two.

Wherein, in some optional embodiments, the first ratio is equal to 3.

Wherein, in some optional embodiments, the ratio between the equivalent inductance value of the second sub-coil and the equivalent inductance value of the first sub-coil is less than or equal to 0.25.

Wherein, in some optional embodiments, the equivalent inductance of the second sub-coil is less than or equal to 100pH.

Wherein, in some optional embodiments, the first coil includes a first input terminal and a second input terminal; the power amplification module includes a first transistor and a second transistor, and the first transistor and the second transistor form a differential amplifier circuit, and the first The transistor is connected to the first input terminal, and the second transistor is connected to the second input terminal.

Wherein, in some optional embodiments, the first transistor is a first bipolar triode, and the second transistor is a second bipolar triode; the base of the first transistor is used to input the first differential signal, and the base of the first transistor The collector is connected to the first input terminal, the emitter of the first transistor is grounded; the base of the second transistor is used to input the second differential signal, the collector of the second transistor is connected to the second input terminal, and the second transistor’s The emitter is grounded; the phase of the second differential signal is opposite to that of the first differential signal.

Wherein, in some optional embodiments, the radio frequency power amplification circuit further includes a first resonance module and a second resonance module, the first resonance module is connected to the first input terminal, and the second resonance module is connected to the second input terminal; The first resonance module forms a second resonance, and the second ratio between the second resonance frequency of the second resonance and the signal frequency of the fundamental signal in the first radio frequency signal is different from the first ratio; the second resonance module forms a third resonance , the third resonance frequency of the third resonance is the same as the second resonance frequency.

Wherein, in some optional embodiments, the first resonant module includes a first inductor and a second capacitor, one end formed by connecting the first inductor and the second capacitor in series is connected to the first input end, and the other end is grounded; the second The resonant module includes a second inductor and a third capacitor, one end formed by connecting the second inductor and the third capacitor in series is connected to the second input end, and the other end is grounded.

According to the first aspect of the present application, an embodiment of the present application provides a radio frequency front-end module, the radio frequency front-end module includes the above-mentioned radio frequency power amplifying circuit.

Embodiments of the present application provide a radio frequency power amplifier circuit and a radio frequency front-end module configured with a radio frequency power amplifier circuit. The radio frequency power amplifier circuit includes a power amplifier module, a balun module and a first capacitor. Wherein, the first coil of the balun module is connected to the power amplifying module for receiving the first radio frequency signal sent by the power amplifying module. The second coil of the balun module includes a first sub-coil and a second sub-coil, one end of the second sub-coil is connected to one end of the first sub-coil to form a common terminal, and the other end of the second sub-coil is grounded. One end of the first capacitor is connected to the common end, and the other end is grounded.

Therefore, the output end of the balun module in the present application is provided with the first resonance formed by the parallel connection of the first capacitor and the second sub-coil, and the first resonance can affect some harmonic signals in the first radio frequency signal (especially High order resonance signal) is suppressed to ensure the signal transmission quality of the radio frequency power amplifier circuit. For example, by configuring the resonant frequency of the first resonance to be the harmonic frequency 3f ₀ of the third harmonic (wherein f ₀ is the signal frequency of the fundamental signal in the first radio frequency signal), the third harmonic can be suppressed . In addition, since the first resonance borrows part of the second coil (that is, the second sub-coil), only the first capacitor needs to be connected to realize the first resonance, which saves the hardware cost of the radio frequency power amplifier circuit .

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of a radio frequency power amplifier circuit provided by an embodiment of the present application.

FIG. 2 is another structural schematic diagram of the radio frequency power amplifying circuit shown in FIG. 1 .

FIG. 3 is another structural schematic diagram of the radio frequency power amplifying circuit shown in FIG. 1 .

FIG. 4 is another structural schematic diagram of the radio frequency power amplifying circuit shown in FIG. 1 .

FIG. 5 is another structural schematic diagram of the radio frequency power amplifying circuit shown in FIG. 1 .

FIG. 6 is a schematic structural diagram of a radio frequency front-end module provided by an embodiment of the present application.

Detailed ways

In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

Referring to FIG. 1 , in this embodiment, a radio frequency power amplifying circuit 100 may include a power amplifying module 120 , a balun module 140 and a first capacitor 160 . The balun module 140 is connected to the power amplifying module 120 for receiving the first radio frequency signal sent by the power amplifying module 120 . The balun module 140 may include a first coil 141 and a second coil 143 coupled to each other, wherein the first coil 141 is connected to the power amplification module 120 . The second coil 143 includes a first sub-coil 1432 and a second sub-coil 1434, one end of the first sub-coil 1432 and one end of the second sub-coil 1434 are connected to form a common terminal 1436, and the other end of the first sub-coil 1432 is used for The second radio frequency signal is output, and the other end of the second sub-coil 1434 is grounded. One end of the first capacitor 160 is connected to the common end 1436 and the other end is grounded.

Therefore, the output terminal of the balun module 140 in this application is provided with the first resonance formed by the parallel connection of the first capacitor 160 and the second sub-coil 1434, and the first resonance can affect the partial harmonic signal in the first radio frequency signal. (especially high-order resonance signals) are suppressed to ensure the signal transmission quality of the radio frequency power amplifier circuit. For example, by configuring the resonant frequency of the first resonance to be the harmonic frequency 3f ₀ of the third harmonic (wherein f ₀ is the signal frequency of the fundamental signal in the first radio frequency signal), the third harmonic can be suppressed . In addition, since the first resonance borrows part of the second coil 143 (i.e., the second sub-coil 1434), only the first capacitor 160 needs to be connected to realize the first resonance, saving the radio frequency power amplifier circuit 100 hardware cost.

Each module in the radio frequency power amplifying circuit 100 will be introduced in detail below.

The balun module 140 may include a balance-unbalance converter (Balance-unbalance, BALUN), and the balance-unbalance converter is used to convert and synthesize signals to output radio frequency signals. In this embodiment, the balun module 140 is connected to the signal output terminal of the power amplifying module 120 for receiving the first radio frequency signal sent by the power amplifying module 120 . Specifically, the first radio frequency signal is determined by the communication device to which the radio frequency power amplifying circuit 100 is specifically applied. Exemplarily, if the communication device works in the N77 frequency band, the signal frequency of the first radio frequency signal can be 3.3GHz-4.2GHz; if the communication device works in the N78 frequency band, the signal frequency of the first radio frequency signal can be 3.3GHz-3.8GHz GHz; if the communication device works in the N79 frequency band, the signal frequency of the first radio frequency signal may be 4.5GHz-5GHz. In this embodiment, the signal frequency of the first radio frequency signal is not specifically limited.

It should be noted here that the above "signal frequency of the first radio frequency signal" should be understood as "the signal frequency of the fundamental signal in the first radio frequency signal", but since the power amplification module 120 cannot analyze the higher harmonic frequency of the first radio frequency signal waves (for example, the third harmonic, the fifth harmonic, etc.) are better suppressed, so the first radio frequency signal will be doped with high-order harmonic signals, if the above-mentioned high-order harmonic signals are not suppressed, it will be The signal transmission quality of the radio frequency power amplifying circuit 100 is reduced.

In this embodiment, the balun module 140 may include a first coil 141 and a second coil 143 coupled to each other. In some possible embodiments, the first coil 141 and the second coil 143 may be wound on the same magnetic conductor (for example, a ferrite core) to achieve "electromagnetic coupling". In some other possible embodiments, the first coil 141 and the second coil 143 may also adopt direct coupling, inductive coupling, capacitive coupling, etc. to achieve mutual coupling. The coupling mode between them is not specifically limited.

In this embodiment, the first coil 141 is connected to the power amplifying module 120 for receiving the first radio frequency signal sent by the power amplifying module 120 . One end of the second coil 143 is used to output the second radio frequency signal, and the other end is grounded. Specifically, the second coil 143 includes a first sub-coil 1432 and a second sub-coil 1434, wherein one end of the first sub-coil 1432 and one end of the second sub-coil 1434 are connected to form a common terminal 1436, and the first sub-coil 1432 The other end of the second sub-coil 1434 is used to output the second radio frequency signal, and the other end of the second sub-coil 1434 is grounded.

The first capacitor 160 may be a chip capacitor, a plug-in capacitor, or the like. Wherein, one end of the first capacitor 160 is connected to the common end 1436, and the other end is grounded. That is, the first capacitor 160 and the second sub-coil 1434 are connected in parallel, therefore, when the RF power amplifying circuit 100 is working, the equivalent inductance of the first capacitor 160 and the second sub-coil 1434 can form a first resonance (that is, LC parallel resonance). When the first resonant frequency of the first resonance is approximately the same as the signal frequency of the high-order harmonic in the first radio frequency signal, the high-order harmonic can be suppressed. Specifically, the first ratio between the first resonance frequency of the first resonance and the signal frequency of the fundamental signal in the first radio frequency signal may be greater than or equal to 2. For example, the first ratio may be 2, 3, 4, 5, and so on.

In some possible embodiments, the first ratio between the first resonance frequency of the first resonance and the signal frequency of the fundamental signal in the first radio frequency signal may be equal to three. At this time, the first resonance frequency of the first resonance is 3f ₀ , where f ₀ is the signal frequency of the fundamental signal in the first radio frequency signal. In this case, when the third harmonic signal (that is, the harmonic signal with a frequency of _3f0 ) in the first radio frequency signal passes through the parallel resonant cavity formed by the parallel connection of the first capacitor 160 and the second sub-coil 1434 (LCtank), the parallel resonant cavity can be regarded as a band-stop filter, so when the third harmonic signal passes through the band-stop filter, the third harmonic signal can be suppressed. In addition, when the fundamental wave signal in the first radio frequency signal passes through the parallel resonant cavity, the parallel resonant cavity can be equivalent to a low resistance or only exhibit the characteristics of the equivalent inductance of the second sub-coil 1434, therefore, the parallel resonant cavity The parallel resonant cavity will not affect the impedance and insertion loss of the fundamental wave signal, which ensures the normal output of the fundamental wave signal.

In this embodiment, the ratio between the equivalent inductance of the second sub-coil 1434 and the equivalent inductance of the first sub-coil 1432 may be less than or equal to 0.25. Since the first sub-coil 1432 and the second sub-coil 1434 can be regarded as two parts of the second coil 143, taking the equivalent inductance value of the second coil 143 as 500pH as an example, the equivalent inductance value of the first sub-coil 1432 greater than or equal to 400pH, and the equivalent inductance of the second sub-coil 1434 is less than or equal to 100pH. If the second coil 143 is more evenly wound on the magnetic conductor, the length of the second sub-coil 1434 is no more than 1/5 of the total length of the second coil 143, that is, the second sub-coil 1434 only occupies the second coil 1434. A shorter section of the coil 143. Therefore, the equivalent inductance of the second sub-coil 1434 is small. In this embodiment, the equivalent inductance of the second sub-coil 1434 is less than or equal to 100pH.

Specifically, when the equivalent inductance value of the second sub-coil 1434 is determined, the capacitance value of the first capacitor 160 can be calculated based on the following formula.

Wherein, f is the resonant frequency, and when the first ratio is equal to 3, f=3f ₀ . L is the equivalent inductance of the second sub-coil 1434 . C is the capacitance of the first capacitor 160 . Therefore, the research and development personnel can determine the capacitance value of the corresponding first capacitor 160 according to the harmonic frequency of the higher harmonic (for example, the third harmonic) that needs to be suppressed actually, and the capacitance value of the first capacitor 160 is not specified in this embodiment. limited.

Referring to FIG. 2 and FIG. 3 , in this embodiment, the first coil 141 may include a first input terminal 1412 and a second input terminal 1414 . The first coil 141 is connected to the power amplification module 120 through the first input terminal 1412 and the second input terminal 1414 . Specifically, the power amplification module 120 may include a first transistor 121 and a second transistor 123 . Wherein, the first transistor 121 and the second transistor 123 form a differential amplifier circuit, the first transistor 121 is connected to the first input terminal 1412 , and the second transistor 123 is connected to the second input terminal 1414 . Since the power amplifying module 120 in this embodiment is a differential amplifying circuit composed of the first transistor 121 and the second transistor 123 , that is, the input signal of the power amplifying module 120 is a differential signal pair. Wherein, the differential signal pair may include a first differential signal and a second differential signal with the same amplitude and opposite phases. The power amplifying module 120 can amplify the amplitudes of the first differential signal and the second differential signal, and input the amplified first differential signal and the second differential signal into the balun module 140 as the first radio frequency signal. In addition, the power amplifying module 120 can play a role in overcoming zero drift and stabilizing the static operating point, thereby ensuring the stability of the radio frequency power amplifying circuit 100 .

Specifically, the type and model of the first transistor 121 and the second transistor 123 are the same. Exemplarily, the first transistor 121 and the second transistor 123 may be a bipolar transistor (Bipolar Junction Transistor, BJT), a field effect transistor (Field Effect Transistor, FET), an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) )etc. Here, the first transistor 121 and the second transistor 123 are both bipolar transistors as an example for illustration. In the embodiment shown in FIG. 3, the first transistor 121 is a first bipolar transistor, the second transistor 123 is a second bipolar transistor, and the models of the first transistor 121 and the second transistor 123 are the same, both are NPN type bipolar transistor. Specifically, the base of the first transistor 121 is used to input the first differential signal, and the collector of the first transistor 121 is connected to the first input terminal 1412 for sending the first differential signal after the amplitude amplification to the first The input terminal 1412, the emitter of the first transistor 121 is grounded. The base of the second transistor 123 is used to input the second differential signal, the collector of the second transistor 123 is connected to the second input terminal 1414, and is used to send the second differential signal after amplitude amplification to the second input terminal 1414 , the emitter of the second transistor 123 is grounded.

In the embodiment shown in FIG. 3 , the collector of the first transistor 121 and the collector of the second transistor 123 are also respectively connected to the power supply VCC. Wherein, the power supply VCC is a circuit voltage (Voltage To Current Converter, VCC), that is, the power supply voltage of the first transistor 121 and the second transistor 123 . In this embodiment, the power supply VCC is used to provide operating voltages for the first transistor 121 and the second transistor 123 respectively. Specifically, the voltage value of the power supply VCC may be less than or equal to 12V, for example, the voltage value is 12V, 5V, 1.5V and so on.

Referring to FIG. 3 and FIG. 4 , the power amplifying module 120 may further include a first collector inductor L1 and a second collector inductor L2 . Wherein, one end of the first collector inductor L1 is connected to the collector of the first transistor 121 , and the other end is connected to the power supply VCC. One end of the second collector inductor L2 is connected to the collector of the second transistor 123 , and the other end is connected to the power supply VCC. Specifically, the first collector inductor L1 and the second collector inductor L2 have the same inductance value, which is used to improve the circuit stability of the differential amplifier circuit formed by the first transistor 121 and the second transistor 123 .

Please refer to FIG. 4 , the power amplifying module 120 may further include a first resistor R1 and a second resistor R2 . Wherein, one end of the first resistor R1 is connected to the emitter of the first transistor 121 , and the other end is grounded. One end of the second resistor R2 is connected to the emitter of the second transistor 123 , and the other end is grounded. Specifically, the resistance values of the first resistor R1 and the second resistor R2 are the same, and both are emitter resistors. The first resistor R1 is used to limit the emitter current of the first transistor 121, and the second resistor R2 is used to limit the current of the second transistor 121. 123 emitter current to improve the circuit stability of the differential amplifier circuit formed by the first transistor 121 and the second transistor 123 .

In some possible embodiments, the first transistor 121 and the second transistor 123 may also be metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). Wherein, the first transistor 121 may be a first metal-oxide-semiconductor field-effect transistor, hereinafter referred to as “first field-effect transistor”; the second transistor 123 may be a second metal-oxide-semiconductor field-effect transistor, hereinafter referred to as "Second FET". The first field effect transistor and the second field effect transistor are of the same type, and may both be N-channel metal oxide semiconductor field effect transistors. Specifically, the gate of the first field effect transistor is used to input the first differential signal, and the source of the first field effect transistor is connected to the first input terminal 1412 for sending the amplified first differential signal to The first input terminal 1412, the drain of the first field effect transistor is grounded. The gate of the second field effect transistor is used to input the second differential signal, the source of the second field effect transistor is connected to the second input terminal 1414, and is used to send the second differential signal after amplitude amplification to the second input Terminal 1414, the drain of the second field effect transistor is grounded.

Referring to FIG. 5 , in this embodiment, the radio frequency power amplifying circuit 100 may further include a first resonant module 170 , and the first resonant module 170 is connected to the first input terminal 1412 . The first resonance module 170 may form a second resonance, and the second ratio between the second resonance frequency of the second resonance and the signal frequency of the fundamental signal in the first radio frequency signal is different from the first ratio. Exemplarily, the second ratio may be 2, and the first ratio may be 3. In this case, the second resonance frequency of the second resonance is 2f ₀ , that is, when there is a second harmonic in the first differential signal, the first resonance module 170 can input the first differential signal to the balun module Before 140, the second harmonic is suppressed. Specifically, the first resonant module 170 may include a first inductor 174 and a second capacitor 172 , one end formed by connecting the first inductor 174 and the second capacitor 172 in series is connected to the first input end 1412 , and the other end is grounded. Therefore, the second resonance in this embodiment is the series resonance formed by the first inductor 174 and the second capacitor 172 , specifically, the inductance of the first inductor 174 and the capacitance of the second capacitor 172 satisfy the following formula.

Wherein, f is the resonant frequency, and when the second ratio is equal to 2, f=2f ₀ . L is an inductance value of the first inductor 174 . C is the capacitance of the second capacitor 172 . Therefore, the researcher can determine the corresponding inductance value of the first inductor 174 and the capacitance value of the second capacitor 172 according to the harmonic frequency of the higher harmonic (for example, the second harmonic) that needs to be suppressed actually. This is not specifically limited.

In this embodiment, the radio frequency power amplifying circuit 100 may further include a second resonance module 180 , and the second resonance module 180 is connected to the second input terminal 1414 . The second resonance module 180 forms a third resonance, and the third resonance frequency of the third resonance is the same as the second resonance frequency. Exemplarily, the third resonance frequency of the third resonance and the second resonance frequency of the second resonance are both 2f ₀ , that is, when there is a second harmonic in the second differential signal, the second resonance module 180 can Before the second differential signal is input to the balun module 140, the second harmonic is suppressed. Specifically, the second resonant module 180 includes a second inductor 184 and a third capacitor 182 , one end formed by connecting the second inductor 184 and the third capacitor 182 in series is connected to the second input end 1414 , and the other end is grounded. The method of determining the inductance value of the second inductor 184 and the capacitance value of the third capacitor 182 can refer to the above formula, and will not be repeated here.

In this embodiment, the radio frequency power amplifying circuit 100 can suppress other high-order harmonics by setting the first resonance module 170 and the second resonance module 180, for example, there is a second harmonic in the first radio frequency signal and the third harmonic, the RF power amplifying circuit 100 can suppress the second harmonic through the first resonant module 170 and the second resonant module 180, and the parallel resonant cavity formed by the first capacitor 160 and the second sub-coil 1434 can The third harmonic is suppressed, thereby reducing the interference of the higher harmonic to the fundamental wave signal, and ensuring the signal transmission quality of the radio frequency power amplifying circuit 100 .

Referring to FIG. 6 , the embodiment of the present application also provides a radio frequency front-end module 200 configured with a radio frequency power amplifier circuit 100 . The RF front-end module 200 is a component that integrates two or more discrete devices such as RF switches, low-noise amplifiers, filters, duplexers, and power amplifiers into an independent module, thereby improving integration and hardware performance and miniaturization. Specifically, the radio frequency front-end module 200 can be applied to 4G and 5G communication devices such as smart phones, tablet computers, and smart watches.

This embodiment provides a radio frequency power amplifier circuit 100 and a radio frequency front-end module 200 configured with the radio frequency power amplifier circuit 100, wherein the radio frequency power amplifier circuit 100 may include a power amplifier module 120, a balun module 140 and a first capacitor 160. The balun module 140 is connected to the power amplifying module 120 for receiving the first radio frequency signal sent by the power amplifying module 120 . The balun module 140 may include a first coil 141 and a second coil 143 coupled to each other, wherein the first coil 141 is connected to the power amplification module 120 . The second coil 143 includes a first sub-coil 1432 and a second sub-coil 1434, one end of the first sub-coil 1432 and one end of the second sub-coil 1434 are connected to form a common terminal 1436, and the other end of the first sub-coil 1432 is used for The second radio frequency signal is output, and the other end of the second sub-coil 1434 is grounded. One end of the first capacitor 160 is connected to the common end 1436 and the other end is grounded.

Therefore, the output terminal of the balun module 140 in this application is provided with the first resonance formed by the parallel connection of the first capacitor 160 and the second sub-coil 1434, and the first resonance can affect the partial harmonic signal in the first radio frequency signal. (especially high-order resonance signals) are suppressed to ensure the signal transmission quality of the radio frequency power amplifier circuit. For example, by configuring the resonant frequency of the first resonance to be the harmonic frequency 3f ₀ of the third harmonic (wherein f ₀ is the signal frequency of the fundamental signal in the first radio frequency signal), the third harmonic can be suppressed . In addition, since the first resonance borrows part of the second coil 143 (i.e., the second sub-coil 1434), only the first capacitor 160 needs to be connected to realize the first resonance, saving the radio frequency power amplifier circuit 100 hardware cost.

In the specification of this application, certain terms are used as in the specification and claims to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The description and claims do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. As mentioned throughout the specification and claims, "comprising" is an open term, so it should be interpreted as "including but not limited to"; "approximately" means that those skilled in the art can solve the problem within a certain error range Technical problems, basically achieve technical results.

In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "in", etc. indicate orientation or positional relationship based on the drawings The orientation or positional relationship shown is only to simplify the description for the convenience of describing the present application, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a reference to the present application. limits.

In this application, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense unless otherwise clearly specified or limited. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, or it can be an internal connection between two components. Communication, or only surface contact. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not drive the essence of the corresponding technical solutions away from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims (10)

1. A radio frequency power amplifier circuit, characterized in that, comprising: Power amplifier module; A balun module, connected to the power amplifying module, for receiving the first radio frequency signal sent by the power amplifying module; the balun module includes a first coil and a second coil coupled to each other, and the first coil connected with the power amplification module; The second coil includes a first sub-coil and a second sub-coil, one end of the first sub-coil is connected to one end of the second sub-coil to form a common end, and the other end of the first sub-coil is connected to to output a second radio frequency signal; the other end of the second sub-coil is grounded; and A first capacitor, one end of the first capacitor is connected to the common end, and the other end is grounded. 2. The radio frequency power amplifying circuit according to claim 1, wherein the equivalent inductance of the first capacitor and the second sub-coil forms a first resonance, and the first resonance frequency and the first resonance frequency of the first resonance A first ratio between signal frequencies of the fundamental signal in the first radio frequency signal is greater than or equal to 2. 3. The radio frequency power amplifying circuit according to claim 2, wherein the first ratio is equal to 3. 4. The radio frequency power amplifying circuit according to claim 1, wherein the ratio between the equivalent inductance value of the second sub-coil and the equivalent inductance value of the first sub-coil is less than or equal to 0.25. 5. The radio frequency power amplifying circuit according to claim 1, wherein the equivalent inductance of the second sub-coil is less than or equal to 100pH. 6. The radio frequency power amplifying circuit according to any one of claims 1 to 5, wherein the first coil comprises a first input terminal and a second input terminal; The power amplification module includes a first transistor and a second transistor, the first transistor and the second transistor form a differential amplifier circuit, the first transistor is connected to the first input terminal, and the second transistor connected to the second input terminal. 7. The radio frequency power amplifying circuit according to claim 6, wherein the first transistor is a first bipolar transistor, and the second transistor is a second bipolar transistor; The base of the first transistor is used to input a first differential signal, the collector of the first transistor is connected to the first input terminal, and the emitter of the first transistor is grounded; The base of the second transistor is used to input a second differential signal, the collector of the second transistor is connected to the second input terminal, and the emitter of the second transistor is grounded; the second differential signal It is opposite to the phase of the first differential signal. 8. The radio frequency power amplifying circuit according to claim 6, wherein the radio frequency power amplifying circuit further comprises a first resonant module and a second resonant module, and the first resonant module is in phase with the first input terminal connected, the second resonant module is connected to the second input terminal; The first resonance module forms a second resonance, and the second ratio between the second resonance frequency of the second resonance and the signal frequency of the fundamental signal in the first radio frequency signal is different from the first ratio; The second resonance module forms a third resonance, and the third resonance frequency of the third resonance is the same as the second resonance frequency. 9. The radio frequency power amplifying circuit according to claim 8, wherein the first resonant module includes a first inductor and a second capacitor, and one end formed by connecting the first inductor and the second capacitor in series connected to the first input end, and the other end is grounded; The second resonant module includes a second inductor and a third capacitor, one end formed by connecting the second inductor and the third capacitor in series is connected to the second input end, and the other end is grounded. 10. A radio frequency front-end module, characterized by comprising: the radio frequency power amplifier circuit according to any one of claims 1 to 9.

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