CN219105093U - High-current conduction testing device for multilayer printed circuit board - Google Patents
High-current conduction testing device for multilayer printed circuit board Download PDFInfo
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- CN219105093U CN219105093U CN202223103053.5U CN202223103053U CN219105093U CN 219105093 U CN219105093 U CN 219105093U CN 202223103053 U CN202223103053 U CN 202223103053U CN 219105093 U CN219105093 U CN 219105093U
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Abstract
The utility model discloses a high-current conductive testing device for a multilayer printed circuit board, which relates to the technical field of circuit board detection.A pull rod moves in a movable cavity and drives a pressing plate to rotate the end part of the pressing plate and a vacant cavity, the pressing plate presses an arc-shaped spring when entering the vacant cavity, the multilayer printed circuit board is filled in a cavity formed by a testing jig and a bending plate, and the pressing plate resets to enable a pressing pad to be tightly attached to the top surface of the multilayer printed circuit board, so that the multilayer printed circuit board is quickly fixed in an auxiliary way, the stability of the multilayer printed circuit board in current testing is improved, and the accuracy of test data is improved; when the pressing plate connected with the pull rod is out of contact with the multilayer printed circuit board, the linear air cylinder pushes the push plate, and the rubber pad on the surface of the push plate is contacted with the multilayer printed circuit board, so that the damage of the end part of the multilayer printed circuit board during pushing is avoided, and the multilayer printed circuit board is convenient to leave the inside of the test fixture.
Description
Technical Field
The utility model relates to the technical field of circuit board detection, in particular to a high-current conduction testing device for a multilayer printed circuit board.
Background
The printed circuit board is called as a printed board for short, is one of important parts of the electronic industry, almost has the dual functions of a conductive circuit and an insulating bottom plate, a connecting wire and a bonding pad for assembling and welding electronic elements, and is almost one of important parts of the electronic industry, namely an electronic device, an electronic watch, a calculator, a computer, a communication electronic device and a military weapon system, as long as the electronic elements such as an integrated circuit and the like are arranged, and the printed circuit board is used for electrically interconnecting the elements; the printed circuit board can replace complex wiring to realize electrical connection among elements in a circuit, and along with the increasingly obvious development of light, thin, short and miniaturization of electronic products, the requirements of the PCB gradually develop to multilayering, and the maximum number of layers of the multilayering can reach more than 60 layers.
Through searching, the utility model patent with the publication number of CN214585851U discloses a printed circuit board testing device, and a single-needle double-wire probe mechanism can be adopted to simultaneously detect the resistance of an electric contact on the printed circuit board and whether an open circuit exists; the provided feeding mechanism has small occupied area, high working efficiency and good continuous operability, and can improve the working efficiency.
In order to ensure the accuracy of a test result, the multi-layer printed circuit board conductive test can be conducted by adopting high current, and data are clear, but in the scheme, at least two electric contacts on the printed circuit board to be tested respectively correspond to at least two probe mechanisms respectively including a first pipe body and probes one by one, so that electric connection is realized, and conductive connection of the printed circuit board is realized, but in the test process, the printed circuit board shakes to cause falling of a connecting part, so that the printed circuit board is required to be fixed in an auxiliary way.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a high-current conduction testing device for a multilayer printed circuit board.
The utility model can be realized by the following technical scheme: the high-current conductive testing device for the multilayer printed circuit board comprises a testing jig for placing the multilayer printed circuit board, wherein an L-shaped bending plate is arranged on the surface of the end part of the testing jig, a vacant cavity is arranged on the top surface of the bending plate, a pressing mechanism for assisting in fixing the multilayer printed circuit board is rotatably arranged on the inner end surface of the vacant cavity through a pin shaft, the pressing mechanism comprises a pressing plate, a pressing pad in contact with the top surface of the multilayer printed circuit board is arranged on the bottom surface of the pressing plate, and an arc spring fixedly connected with the inner cavity surface of the vacant cavity is arranged on the top surface of the pressing plate; the top surface of the bending plate is provided with a movable cavity which is communicated with the vacant cavity, and the top surface of the pressing plate is provided with a pull rod which penetrates through the inside of the movable cavity.
The utility model further technically improves that: the pull rod is arranged in a T-shaped structure.
The utility model further technically improves that: the test fixture is characterized in that a buffer pad attached to the bottom surface of the multilayer printed circuit board is arranged on the top surface of the test fixture, and a plurality of heat dissipation holes are formed in the surface of the buffer pad.
The utility model further technically improves that: the multilayer printed circuit board is a thick copper plate base material, and the end part of the multilayer printed circuit board enters the area formed by the bending plate and the test fixture.
The utility model further technically improves that: the front side surface of test fixture is provided with the shrouding, the surface mid-mounting of shrouding has sharp cylinder, and the push pedal of being promoted by sharp cylinder piston rod is installed to the inner chamber of shrouding, be provided with the rubber pad with multilayer printed circuit board terminal surface contact on the surface of push pedal.
The utility model further technically improves that: the surface end of shrouding is equipped with the mounting hole, be equipped with on the front side surface of test fixture and bending plate with the collineation of mounting hole screw, screw and the inside common screw thread of mounting hole install the fastener.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the pull rod moves in the movable cavity and drives the pressing plate, so that the end part of the pressing plate and the vacant cavity rotate, the arc-shaped spring is extruded while the pressing plate enters the vacant cavity, the multilayer printed circuit board is then arranged in the cavity formed by the test jig and the bending plate, and when the tensile force acting on the pull rod is removed, the pressing plate resets, so that the pressing pad is tightly attached to the top surface of the multilayer printed circuit board, the multilayer printed circuit board is quickly fixed in an auxiliary way, the stability of the multilayer printed circuit board in current test is improved, and the accuracy of test data is improved;
2. when the pressing plate connected with the pull rod is out of contact with the multilayer printed circuit board, the linear air cylinder pushes the push plate, the push plate pushes the multilayer printed circuit board to be moved out of the area formed by the test jig and the bending plate, and the damage of the end part of the multilayer printed circuit board during pushing is avoided by the contact of the rubber pad on the surface of the push plate and the multilayer printed circuit board, so that the multilayer printed circuit board is convenient to leave the inside of the test jig.
Drawings
The present utility model is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic view of the structural connection of the pressure plate and the arcuate springs of the present utility model;
fig. 3 is a schematic view of structural connection of a seal plate and a push plate according to the present utility model.
In the figure: 1. testing a jig; 2. a cushion pad; 3. a heat radiation hole; 4. a bending plate; 5. a movable cavity; 6. a pull rod; 7. a sealing plate; 8. a straight line cylinder; 9. a hollow cavity; 10. an arc spring; 11. a pressing plate; 12. a pressing pad; 13. a mounting hole; 14. a push plate; 15. and a rubber pad.
Detailed Description
In order to further describe the technical means and effects adopted by the utility model for achieving the preset aim, the following detailed description is given below of the specific implementation, structure, characteristics and effects according to the utility model with reference to the attached drawings and the preferred embodiment.
Referring to fig. 1-3, the utility model provides a high-current conductive testing device for a multilayer printed circuit board, which comprises a testing jig 1 for placing the multilayer printed circuit board, wherein an L-shaped bending plate 4 is arranged on the surface of the end part of the testing jig 1, a vacant cavity 9 is arranged on the top surface of the bending plate 4, a pressing mechanism for assisting in fixing the multilayer printed circuit board is rotatably arranged on the inner end surface of the vacant cavity 9 through a pin shaft, the pressing mechanism comprises a pressing plate 11, a pressing pad 12 which is in fit contact with the top surface of the multilayer printed circuit board is arranged on the bottom surface of the pressing plate 11, and an arc spring 10 fixedly connected with the surface of the inner cavity of the vacant cavity 9 is arranged on the top surface of the pressing plate 11; the top surface of the bending plate 4 is provided with a movable cavity 5 communicated with the vacant cavity 9, the top surface of the pressing plate 11 is provided with a pull rod 6 penetrating through the inside of the movable cavity 5, in the high-current conduction test of the multilayer circuit printed board, the pull rod 6 is firstly stirred, the pull rod 6 moves in the movable cavity 5 and drives the pressing plate 11, the end part of the pressing plate 11 and the vacant cavity 9 rotate, at the moment, the pressing plate 11 rotates to enter the inside of the vacant cavity 9, the pressing plate 11 enters the vacant cavity 9 and simultaneously presses the arc-shaped spring 10, the arc-shaped spring 10 contracts in the vacant cavity 9 to generate elastic deformation, then the multilayer circuit printed board is filled into a cavity formed by the test fixture 1 and the bending plate 4, when the tensile force acting on the pull rod 6 is removed, the arc-shaped spring 10 recovers the elastic deformation, at the moment, the pressing plate 11 resets to enable the pressing pad 12 to be tightly attached to the top surface of the multilayer circuit printed board, further the rapid auxiliary fixing of the multilayer circuit printed board is improved, the stability of the current test of the multilayer circuit printed board is improved, and the accuracy of test data is improved.
The pull rod 6 is arranged in a T-shaped structure, so that the pull rod 6 is pulled conveniently.
The multilayer printed circuit board is a thick copper plate base material, the end part of the multilayer printed circuit board enters the area formed by the bending plate 4 and the test jig 1, the current carrying capacity of the thick copper plate is strong, the loadable current of a circuit is in direct proportion to the thickness of the circuit, and the thicker the circuit board is, the larger the loadable current is; the test fixture 1 is provided with the blotter 2 that laminates mutually with multilayer printed circuit board bottom surface on the top surface, be equipped with a plurality of louvre 3 on the surface of blotter 2, thick copper has very big heat dissipation, through the design of a plurality of louvre 3, the heat dispersion of multilayer printed circuit board when the test has been improved, in the heavy current conduction test to multilayer printed circuit board, mainly through the contact of test line and two conductive ends of multilayer printed circuit board, can test out the heavy current conduction performance of multilayer printed circuit board, and then detect out the conductive quality of multilayer printed circuit board, the current conduction technique of multilayer printed circuit board is the ripe technical means of this application, nevertheless describe in this application.
The front side surface of the test fixture 1 is provided with a sealing plate 7, a linear cylinder 8 is arranged in the middle of the outer surface of the sealing plate 7, a push plate 14 pushed by a piston rod of the linear cylinder 8 is arranged in an inner cavity of the sealing plate 7, and a rubber pad 15 contacted with the end surface of the multilayer printed circuit board is arranged on the surface of the push plate 14; the surface tip of shrouding 7 is equipped with mounting hole 13, be equipped with on the front side surface of test fixture 1 and bending plate 4 with mounting hole 13 collineation's screw, screw and the inside common screw thread installation of mounting hole 13 have the fastener, at first with mounting hole 13 on the shrouding 7 with screw butt joint laminating installation, install the fastener screw thread embedding in mounting hole 13 and screw, realized shrouding 7, after multilayer printed circuit board testing, stir pull rod 6, make the clamp plate 11 that pull rod 6 connects lose contact with the multilayer printed circuit board, the sharp cylinder 8 promotes push pedal 14 this moment, promote the multilayer printed circuit board by push pedal 14 and shift out in the region that test fixture 1 and bending plate 4 formed, contact with the multilayer printed circuit board through the rubber pad 15 on push pedal 14 surface, avoid the damage of multilayer printed circuit board tip when promoting, the multilayer printed circuit board of being convenient for leaves inside test fixture 1.
When the multi-layer printed circuit board testing device is used, the pull rod 6 moves in the movable cavity 5 and drives the pressing plate 11, so that the end part of the pressing plate 11 and the vacant cavity 9 rotate, the arc-shaped spring 10 is extruded while the pressing plate 11 enters the vacant cavity 9, the multi-layer printed circuit board is then put into a cavity formed by the testing jig 1 and the bending plate 4, and when the pulling force acting on the pull rod 6 is removed, the pressing plate 11 resets, so that the pressing pad 12 is tightly attached to the top surface of the multi-layer printed circuit board, the multi-layer printed circuit board is further quickly fixed in an auxiliary mode, the stability of the multi-layer printed circuit board in current testing is improved, and the accuracy of testing data is improved;
the clamp plate 11 that pull rod 6 connects loses the contact with the multilayer printed circuit board, and sharp cylinder 8 promotes push pedal 14 this moment, promotes the multilayer printed circuit board by push pedal 14 and shifts out in the region that test fixture 1 and bending plate 4 formed, through the contact of the rubber pad 15 on push pedal 14 surface and multilayer printed circuit board, avoids the damage of multilayer printed circuit board tip when promoting, and the multilayer printed circuit board of being convenient for leaves inside test fixture 1.
The present utility model is not limited to the above embodiments, but is capable of modification and variation in all aspects, including those of ordinary skill in the art, without departing from the spirit and scope of the present utility model.
Claims (6)
1. The utility model provides a high-current conduction testing arrangement of multilayer printed circuit board, is including being used for test fixture (1) that multilayer printed circuit board placed, its characterized in that: the testing jig is characterized in that a bent plate (4) with an L-shaped structure is arranged on the end surface of the testing jig (1), a vacant cavity (9) is arranged on the top surface of the bent plate (4), a pressing mechanism for assisting in fixing the multilayer printed circuit board is rotatably arranged on the inner end surface of the vacant cavity (9) through a pin shaft, the pressing mechanism comprises a pressing plate (11), a pressing pad (12) in fit contact with the top surface of the multilayer printed circuit board is arranged on the bottom surface of the pressing plate (11), and an arc-shaped spring (10) fixedly connected with the inner cavity surface of the vacant cavity (9) is arranged on the top surface of the pressing plate (11); the top surface of the bending plate (4) is provided with a movable cavity (5) communicated with the vacant cavity (9), and the top surface of the pressing plate (11) is provided with a pull rod (6) penetrating through the inside of the movable cavity (5).
2. The high-current conduction test apparatus of a multilayer printed circuit board according to claim 1, wherein the tie bar (6) is provided in a T-shaped structure.
3. The high-current conductive testing device for the multilayer printed circuit board according to claim 1, wherein a buffer pad (2) attached to the bottom surface of the multilayer printed circuit board is arranged on the top surface of the testing jig (1), and a plurality of heat dissipation holes (3) are formed in the surface of the buffer pad (2).
4. The high-current conduction testing apparatus of a multilayer printed circuit board according to claim 1, wherein the multilayer printed circuit board is a thick copper plate substrate, and an end portion of the multilayer printed circuit board enters into a region formed by the bending plate (4) and the testing jig (1).
5. The high-current conductive testing device for the multilayer printed circuit board according to claim 1, wherein a sealing plate (7) is arranged on the front side surface of the testing jig (1), a linear cylinder (8) is arranged in the middle of the outer surface of the sealing plate (7), a pushing plate (14) pushed by a piston rod of the linear cylinder (8) is arranged in an inner cavity of the sealing plate (7), and a rubber pad (15) in contact with the end face of the multilayer printed circuit board is arranged on the surface of the pushing plate (14).
6. The high-current conductive testing device for the multilayer printed circuit board according to claim 5, wherein the surface end part of the sealing plate (7) is provided with a mounting hole (13), screw holes which are collinear with the mounting hole (13) are formed in the front side surfaces of the testing jig (1) and the bending plate (4), and fasteners are mounted in the screw holes and the mounting hole (13) in a threaded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223103053.5U CN219105093U (en) | 2022-11-22 | 2022-11-22 | High-current conduction testing device for multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223103053.5U CN219105093U (en) | 2022-11-22 | 2022-11-22 | High-current conduction testing device for multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219105093U true CN219105093U (en) | 2023-05-30 |
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ID=86431030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223103053.5U Active CN219105093U (en) | 2022-11-22 | 2022-11-22 | High-current conduction testing device for multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219105093U (en) |
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2022
- 2022-11-22 CN CN202223103053.5U patent/CN219105093U/en active Active
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