CN201387470Y - Electron and circuit board detecting device - Google Patents

Electron and circuit board detecting device Download PDF

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Publication number
CN201387470Y
CN201387470Y CN200920135008U CN200920135008U CN201387470Y CN 201387470 Y CN201387470 Y CN 201387470Y CN 200920135008 U CN200920135008 U CN 200920135008U CN 200920135008 U CN200920135008 U CN 200920135008U CN 201387470 Y CN201387470 Y CN 201387470Y
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CN
China
Prior art keywords
probe
dials
circuit board
detecting
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200920135008U
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Chinese (zh)
Inventor
王云阶
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Individual
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Individual
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Filing date
Publication date
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Priority to CN200920135008U priority Critical patent/CN201387470Y/en
Application granted granted Critical
Publication of CN201387470Y publication Critical patent/CN201387470Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an electron and circuit board detecting device, which is provided with an insulating detecting plates of a plurality of inserting holes, and probe assemblies and wires in the inserting holes, and further comprises a transfer socket, wherein each of the detecting plates comprises an upper dial, a spring disc, a lower dial and a base which are orderly overlapped up and down in a combining mode, insulating elastic cloth used for clamping probes is further arranged in each of the dials, and is clamped between an upper and a lower laminated boards, each of the probe assemblies comprises a first probe, a spring and a second probe which are respectively located in through holes of the upper dial, the spring disc and the lower dial, and are orderly contacted up and down, the other ends of the wires are fixed in a through hole of the base, and are correspondingly contacted with the tail end of the second probe, all the second probes adopt straight probes, and in a plurality of the probe assemblies, the first probes used for detecting the probe assemblies in an IC solder pad adopt the straight probes whose diameter is consistent with that of the corresponding second probes. The device can reduce the cost, increases the testing density, can realize absolutely vertical tests, and is conveniently replaced and maintained.

Description

Electronics and circuit board detection device
Technical field
The utility model relates to a kind of electronics and circuit board detection device.
Background technology
Existing a kind of electronics and circuit board detection device comprise the insulation detecting plate that is provided with some jacks and place the some probe assemblies and the lead of jack respectively, described detecting plate is connected to form up and down by a dials, a spring holder and a base, each probe assembly is made of a probe and a spring, they are contained in the through hole of dials and spring holder respectively and offset up and down and are connected, and it is interior and weld together with the afterbody of spring that an end of lead is contained in the through hole of base.For probe is located in dials, all probes adopt the little probe of middle part external diameter big both sides external diameter, are stuck in the corresponding dials through hole.Above-mentioned this pick-up unit since the external diameter of probe be not easy to do little, so test density is limited; Spring must with wire bonds together, its external diameter also is unfit to do little, test density is limited, the welding difficulty is bigger, cost height, also easy-maintaining not.
Summary of the invention
The purpose of this utility model is the problem that exists at above-mentioned a kind of electronics and circuit board detection device, and a kind of test density, electronics and circuit board detection device easy to maintenance of increasing is provided.
The purpose of this utility model is achieved in that the utility model comprises insulation detecting plate and some probe assembly and the leads that places jack that is provided with some jacks, also comprise multi-tap, one end of lead is connected with the binding post on the multi-tap, described detecting plate is by the last dials that is provided with some through holes, spring holder, following dials and base up and down successively stack combinations form, the corresponding up and down back of their through hole constitutes jack, the described dials of going up, following dials comprises two or multilayer board respectively, in each dials, also be provided with the insulation elastic force cloth that is used to block probe, it is pressed on up and down between the two-ply, each probe assembly comprises first probe, the spring and second probe, they lay respectively at dials, spring holder, also corresponding up and down successively contact in the through hole of following dials, the other end of described lead be fixed in the through hole of base and with the corresponding contact of tail end of second probe, described second probe all adopts staight needle, in described some probe assemblies, first probe that is used for detecting the probe assembly of IC pad adopts and the consistent staight needle of the corresponding second probe thickness.
Technique effect of the present utility model is:
1, the utility model medi-spring and lead need not weld, and be easy for installation, reduces defective products, can reduce cost.
2, raising along with the usage ratio of the raising of circuit board precision and surface mount elements, the counting of IC pad that needs to detect also correspondingly improved, the ratio of IC pad in total check point that causes needing in the circuit board of middle and high end to detect surpasses 80%, adopt staight needle (needle body external diameter unanimity of same probe) owing to be used for detecting first probe of the probe assembly of IC pad in the utility model, can reduce the probe cost greatly, and be convenient to the making of meticulous probe, thereby can use the littler probe of external diameter, spring does not need and the littler spring of wire bonds external diameter yet easy to use simultaneously, therefore test density can be increased, and absolute vertical checkout can be accomplished.
3, probe and spring are consumable accessory, and the utility model repair and replacement are convenient.
4, being used for detecting probe assembly first probe of IC pad in the utility model can shared corresponding second probe, can reduce the specification of probe.
Description of drawings
Fig. 1 is the structure diagram of embodiment one.
Embodiment
Referring to Fig. 1, present embodiment comprises the insulation detecting plate that is provided with some jacks and places the some probe assemblies and the lead of jack, also be provided with multi-tap, only draw probe assembly and a lead that is used to detect the IC pad among Fig. 1 and done signal, the probe assembly of other purposes can adopt the various probes of existing other shape, detecting plate is by last dials 2, spring holder 3, following dials 4 and base 5 up and down successively stack combinations form, at last dials 2, spring holder 3, following dials 4 and base 5 are respectively equipped with some through holes, their through hole connects into jack up and down, go up dials 2 in the present embodiment, following dials 4 comprises three ply board respectively, second thin in the last dials 2 laminate is a guide plate 21, second thin in the following dials 4 laminate is a guide plate 41, guide plate 21, the through hole of guide plate 41 is little than corresponding all the other two-plies, be convenient to the installation of thickness probe, also being provided with one deck insulation elastic force cloth 1 in last dials 2 is pressed between the ground floor and second layer guide plate 21 of dials 2, also being provided with one deck insulation elastic force cloth 1 in playing dials 4 is pressed between the ground floor and second layer guide plate 41 of following dials 4, insulation elastic force cloth 1 is owing to have elastic force, probe can be blocked after probe passes locatees it in dials, spring holder 3 is made up of three ply board, the thin and through hole of its first laminate and three ply board is little than intermediate plate, thereby spring is positioned in the spring holder 3, base 4 comprises two-ply and pillar, each probe assembly comprises first probe 6, the spring 7 and second probe 8, they lay respectively at dials 2, spring holder 3, also corresponding up and down successively contact in the through hole of following dials 4, the head of first probe 6 stretches out in the end face of dials 2, the corresponding contact of the afterbody of first probe 6 with the top of spring 7, the corresponding contact of head of the bottom of spring 7 and second probe 8, one end of lead 9 is fixed in the through hole of base 5 with viscose glue 10, and the corresponding contact of afterbody of its top and second probe 8, the other end of lead is connected with binding post on the multi-tap, multi-tap connects test machine, probe assembly among Fig. 1 is used to detect the IC pad, its first probe 6 adopts head and afterbody to be pointed staight needle, and the thickness of shaft is consistent with corresponding second probe, and second all among the embodiment probes 8 all adopt staight needle.
The head of first probe that is used for detecting the probe assembly of IC pad in the utility model can adopt tip, tack, pawl head, round end or triangular head.
Go up in the utility model dials, down dials by two or multilayer board form; Spring holder is made up of three ply board or more multi-layered plate.Each laminate of last dials, following dials, spring holder and base is insulcrete, and they are fixed together by pin and screw rod.
The utility model also can be provided with one deck vertical conduction film (also claiming vertical conduction rubber) at the end face of last dials, to strengthen electric conductivity, contacts better with tested point on the circuit board under test.The vertical conduction film can be adsorbed on the end face of dials.
Probe assembly first probe that is used for detecting the IC pad in the utility model can adopt second probe (promptly second probe also can be used for detecting first probe in the probe assembly of IC pad when mounted) when mounted, can reduce the specification of probe, be convenient to the making of meticulous probe, be convenient to install.

Claims (5)

1. electronics and circuit board detection device, comprise the insulation detecting plate and some probe assembly and the leads that places jack that are provided with some jacks, also comprise multi-tap, one end of lead is connected with the binding post on the multi-tap, it is characterized in that: described detecting plate is by the last dials that is provided with some through holes, spring holder, following dials and base up and down successively stack combinations form, the corresponding up and down back of their through hole constitutes jack, the described dials of going up, following dials comprises two or multilayer board respectively, in each dials, also be provided with the insulation elastic force cloth that is used to block probe, it is pressed on up and down between the two-ply, each probe assembly comprises first probe, the spring and second probe, they lay respectively at dials, spring holder, also corresponding up and down successively contact in the through hole of following dials, the other end of described lead be fixed in the through hole of base and with the corresponding contact of tail end of second probe, described second probe all adopts staight needle, in described some probe assemblies, first probe that is used for detecting the probe assembly of IC pad adopts and the consistent staight needle of the corresponding second probe thickness.
2. electronics according to claim 1 and circuit board detection device is characterized in that: first probe of the described probe assembly that is used for detecting the IC pad and the head of second probe adopt tip, tack, pawl head, round end or triangular head.
3. electronics according to claim 1 and 2 and circuit board detection device is characterized in that: an end of described lead is fixed in the through hole of base with viscose glue.
4. electronics according to claim 1 and 2 and circuit board detection device is characterized in that: the end face of dials also is provided with one deck vertical conduction film on described.
5. electronics according to claim 1 and 2 and circuit board detection device is characterized in that: described probe assembly first probe that is used for detecting the IC pad can shared corresponding second probe.
CN200920135008U 2009-02-23 2009-02-23 Electron and circuit board detecting device Expired - Fee Related CN201387470Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200920135008U CN201387470Y (en) 2009-02-23 2009-02-23 Electron and circuit board detecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200920135008U CN201387470Y (en) 2009-02-23 2009-02-23 Electron and circuit board detecting device

Publications (1)

Publication Number Publication Date
CN201387470Y true CN201387470Y (en) 2010-01-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200920135008U Expired - Fee Related CN201387470Y (en) 2009-02-23 2009-02-23 Electron and circuit board detecting device

Country Status (1)

Country Link
CN (1) CN201387470Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111213061A (en) * 2017-09-08 2020-05-29 恩普乐股份有限公司 Socket for electric connection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111213061A (en) * 2017-09-08 2020-05-29 恩普乐股份有限公司 Socket for electric connection

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100120

Termination date: 20120223