KR100759080B1 - A socket for testing electonic module - Google Patents

A socket for testing electonic module Download PDF

Info

Publication number
KR100759080B1
KR100759080B1 KR1020060061399A KR20060061399A KR100759080B1 KR 100759080 B1 KR100759080 B1 KR 100759080B1 KR 1020060061399 A KR1020060061399 A KR 1020060061399A KR 20060061399 A KR20060061399 A KR 20060061399A KR 100759080 B1 KR100759080 B1 KR 100759080B1
Authority
KR
South Korea
Prior art keywords
electronic module
socket
inspection
connector
pin assembly
Prior art date
Application number
KR1020060061399A
Other languages
Korean (ko)
Inventor
김호진
Original Assignee
주식회사 엔티에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엔티에스 filed Critical 주식회사 엔티에스
Priority to KR1020060061399A priority Critical patent/KR100759080B1/en
Application granted granted Critical
Publication of KR100759080B1 publication Critical patent/KR100759080B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Abstract

A socket for testing an electronic module is provided to simplify a test work and have excellent work efficiency. An electronic module is safely received in a body part(120). An operating part(130) is combined to the body part(120) to be capable of rising and falling. A rising and falling guide(150) guides the vertical rising and falling of the operating part(130). A pin assembly(140) is located at one side of the operating part(130), and is connected to a connector pin of the electronic module. A PCB(Printed Circuit Board) is connected with the pin assembly(140). A connection wiring(190) connects the PCB with a test device. A clip part(170) fixes the operating part(130) to maintain a state that the operating part(130) is fallen.

Description

전자모듈 검사용 소켓{A socket for testing electonic module}A socket for testing electonic module

도 1은 종래의 전자모듈 검사 방식을 나타낸 개념도1 is a conceptual diagram showing a conventional electronic module inspection method

도 2는 본 발명에 따른 전자모듈 검사용 소켓을 나타낸 사시도,2 is a perspective view showing an electronic module inspection socket according to the present invention;

도 3은 본 발명에 다른 전자모듈 검사용 소켓의 작동을 설명하기 위한 측면도,Figure 3 is a side view for explaining the operation of another electronic module inspection socket in the present invention,

도 4는 본 발명에 따른 전자모듈 검사용 소켓의 고정구조 및 접속구조를 나타낸 개략적인 단면도임.Figure 4 is a schematic cross-sectional view showing a fixing structure and a connection structure of the socket for an electronic module inspection according to the present invention.

* 도면의 주요 부분에 관한 부호의 설명 *Explanation of symbols on main parts of the drawings

10 : 전자모듈10: electronic module

100 : 전자모듈 검사용 소켓100: electronic module inspection socket

120 : 몸체부120: body

130 : 작동부130: operating part

140 : 핀조립체140: pin assembly

150 : 승하강가이드150: descending guide

160 : 펌프연결관160: pump connector

170 : 클립부170: clip portion

본 발명은 소형 전자모듈을 검사하기 위한 검사용 소켓에 관한 것으로, 소형 커넥터의 핀에 프로브 핀으로 접속되는 전자모듈 검사용 소켓에 관한 것이다.The present invention relates to an inspection socket for inspecting a small electronic module, and relates to an electronic module inspection socket connected to a pin of a small connector with a probe pin.

전자제품을 제조함에 있어서, 각종 전자소자를 사용한 부품들을 모듈화하여 서로 커넥터로 조립하여 완성한다. 그런데, 하나의 모듈이라도 불량이 있으면 완제품 전체가 불량이 되어버리기 때문에 각각의 전자모듈은 조립전에 모두 성능검사를 거치게 된다. 그런데, 전자모듈은 그 자체만으로는 성능을 검사할 수 없기 때문에 별도의 검사장치에 각각의 전자모듈은 접속시켜 검사를 수행한다.In manufacturing electronic products, components using various electronic devices are modularized and completed by assembling with connectors. However, if one module is defective, the entire finished product is defective, so each electronic module is subjected to a performance test before assembly. However, since the electronic module cannot test its performance by itself, each electronic module is connected to a separate test apparatus to perform the test.

도 1은 종래의 검사모듈 검사방법을 나태낸 개념도이다.1 is a conceptual diagram showing a conventional inspection module inspection method.

도시된 바와 같이, 전자모듈(10)에는 조립을 위한 커넥터(12)를 구비하고 있다. 검사장치(20)측에 상기 커넥터(12)에 대응하는 대응커넥터(22)를 부착하여, 전자모듈(12)의 커넥터(12)를 대응커넥터(22)에 끼움으로써 검사장치와 접속시켜 전자모듈(10)의 성능 검사를 수행하고 있었다.As shown, the electronic module 10 is provided with a connector 12 for assembly. Attach the corresponding connector 22 corresponding to the connector 12 to the inspection device 20 side, and connect the connector 12 of the electronic module 12 to the corresponding connector 22 to connect with the inspection device to the electronic module. The performance test of (10) was performed.

그런데, 커넥터(12)에 대응커넥터(22)는 금속박판으로 이루어진 탄성력을 가진 커넥터핀(미도시)으로 접속되는 것으로 탈부착 과정에서 전자모듈(10)측 커넥터(12)에 손상이 가해질 수 있으며, 대응커넥터(22)의 수명이 짧아서 그 주기마다 대응커넥터(22)를 교체하고 검사를 수행해야 하는 문제점을 가지고 있었다.By the way, the connector 22 to the connector 12 is connected to the connector pin (not shown) having an elastic force made of a thin metal plate may be damaged to the connector 12 of the electronic module 10 in the detachable process, Since the life of the mating connector 22 is short, the mating connector 22 has to be replaced and the inspection performed every cycle.

또한, 부품이 작기 때문에 커넥터에 대응커넥터를 끼웠다 빼는 탈부착 작업이 번거로와 검사작업의 효율성이 좋지 못한 문제점을 가지고 있었다.In addition, since the parts are small, the attaching and detaching of the corresponding connector to the connector is cumbersome and the inspection work efficiency is not good.

본 발명은 상술한 바와 같은 종래의 문제점을 해결하기 위한 것으로, 본 발명의 기술적 과제는 전자모듈 커넥터에 손상을 주지 않는 전자모듈 검사용 소켓을 제공함에 있다.The present invention is to solve the conventional problems as described above, the technical problem of the present invention is to provide an electronic module inspection socket that does not damage the electronic module connector.

본 발명의 다른 기술적 과제는 검사작업이 간편하여 작업효율이 우수한 전자모듈 검사용 소켓을 제공함에 있다.Another technical problem of the present invention is to provide a socket for inspecting an electronic module having excellent work efficiency due to simple inspection work.

이러한 목적을 달성하기 위한 본 발명은 검사 대상물인 전자모듈이 안착되는 몸체부; 상기 몸체에 승하강가능하게 결합되어 있는 작동부; 상기 작동부가 수직방향 승하강을 안내하는 승하강 가이드; 상기 작동부의 일측에 위치하며 전자모듈의 커넥터핀에 접속되는 핀조립체; 상기 핀조립체와 접속되는 인쇄회로기판; 상기 인쇄회로기판과 검사장치를 연결하는 연결배선; 및 상기 작동부가 하강한 상태를 유지하도록 고정하는 클립부;를 포함하여 이루어지는 전자모듈 검사용 소켓을 제공한다.The present invention for achieving the above object is the body portion to which the electronic module to be tested; An operating part coupled to the body to be movable up and down; A lifting guide for guiding the lifting unit in the vertical direction; A pin assembly positioned at one side of the operation unit and connected to the connector pin of the electronic module; A printed circuit board connected to the pin assembly; A connection wiring connecting the printed circuit board and the inspection apparatus; And a clip part fixed to maintain the lowered state of the operation part.

상기 몸체부의 일측에 전자모듈의 형상에 대응하는 안착홈을 형성하고 있는 안착판을 더 구비하는 것이 바람직하며, 상기 몸체부의 일측에 진공펌프에 연결하기위한 펌프연결관을 더 구비하고, 상기 안착홈의 내부에 상기 펌프연결관과 연결되어 있는 흡입공을 더 구비하면 더욱 바람직하다.It is preferable to further include a seating plate forming a seating groove corresponding to the shape of the electronic module on one side of the body portion, further comprising a pump connection pipe for connecting to the vacuum pump on one side of the body portion, the seating groove It is more preferable to further include a suction hole connected to the inside of the pump connection pipe.

또한, 상기 승하강가이드는 상기 몸체에 수직방향으로 장착되어 있는 한쌍의 수직봉과, 상기 수직봉의 둘레에 장착된 탄성부재와, 상기 수직봉의 상단에 부착되어 있는 고정판을 포함하여 구성되는 것이 바람직하다.In addition, the elevating guide is preferably configured to include a pair of vertical rods mounted in the vertical direction to the body, an elastic member mounted around the vertical rods, and a fixed plate attached to the upper end of the vertical rods.

이하, 본 발명의 바람직한 실시예를 첨부된 도면들에 의거하여 상세하게 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 전자모듈 검사용 소켓의 사시도이다.2 is a perspective view of an electronic module inspection socket according to the present invention.

도시된 바와 같이, 본 발명에 따른 전자모듈 검사용 소켓(100)은 작업대 역할을 수행하는 몸체부(120)와 몸체부(120)의 상면에 부착되어 몸체부(120)측으로 승하강하는 작동부(130)와, 상기 작동부(130)의 승하강 작동을 가이드하는 승하강가이드(150)와, 작동부(130)의 일측에 구비되어 전자모듈의 커넥터에 접속하는 핀조립체(140)와, 일측은 핀조립체(140)에 접속되고 타측은 검사장치(미도시)에 접속되는 연결배선(190)을 포함하여 구성된다.As shown, the electronic module inspection socket 100 according to the present invention is attached to the upper surface of the body portion 120 and the body portion 120 serving as a work table to move up and down to the body portion 120 side (130), the elevating guide 150 for guiding the elevating operation of the operation unit 130, the pin assembly 140 provided on one side of the operation unit 130 and connected to the connector of the electronic module, One side is connected to the pin assembly 140 and the other side is configured to include a connection wiring 190 connected to the inspection device (not shown).

몸체부(120)에는 별도의 안착판(125)을 구비하는 것이 바람직하다. 전자모듈은 다양한 형상을 가질 수 있으므로, 안착판(125)에 전자모듈의 형상에 대응하는 안착홈(127)을 형성하면, 안착판(125)을 교체하는 것만으로 전자모듈의 형상에 대응할 수 있게 된다. Body 120 is preferably provided with a separate seating plate (125). Since the electronic module may have various shapes, when the mounting groove 127 corresponding to the shape of the electronic module is formed in the mounting plate 125, the electronic module may correspond to the shape of the electronic module only by replacing the mounting plate 125. do.

안착홈(127)의 안쪽에는 흡입공(129)이 구비되어 있으며, 흡입공(129)은 몸체의 일측에 형성된 펌프연결관(160)과 연결되어 있다. 펌프연결관(160)에 진공펌프(미도시)를 연결하면 상기 흡입공(129)에 음압이 생겨 전자모듈을 견고하게 안착홈(127)에 고정할 수 있다.The suction hole 129 is provided inside the seating groove 127, and the suction hole 129 is connected to the pump connection pipe 160 formed on one side of the body. When a vacuum pump (not shown) is connected to the pump connection pipe 160, negative pressure is generated in the suction hole 129 to firmly fix the electronic module to the seating groove 127.

클립부(170)는 작동부(130)를 몸체부(120)에 밀착한 상태로 고정시켜 주는 역할을 하는 것으로, 탄성부재를 구비하여 작동부를 고정하는 방향으로 탄성력이 작용한다. 따라서 작동부(130)를 하강시키면 상기 클립부(170)가 탄성력으로 작동부(130)를 물어 고정한다. 고정을 해제하고자 할 때에는 작업자가 클립부(170)의 아래쪽을 눌러 벌려주면 승하강가이드(150)의 탄성부재(154)의 복원력에 의하여 작동부(130)가 상승하는 구조이다.The clip unit 170 serves to fix the operating unit 130 in close contact with the body unit 120, and has an elastic member so that an elastic force acts in the direction of fixing the operating unit. Therefore, when the operation unit 130 is lowered, the clip unit 170 bites and fixes the operation unit 130 with elastic force. When the operator wants to release the fixing, the operator presses the lower portion of the clip unit 170 to open it, and the operating unit 130 is raised by the restoring force of the elastic member 154 of the elevating guide 150.

도 3은 본 발명에 따른 전자모듈 검사용 소켓의 작동을 설명하기 위한 측면도이다.3 is a side view for explaining the operation of the electronic module inspection socket according to the present invention.

도시된 바와 같이, 작동부(130)는 승하강 가이드(150)에 의하여 몸체부(120)의 위쪽에서 상하 운동을 할 수 있도록 구성된 것으로, 실선으로 도시한 바와 같이 작동부(130)가 상승한 상태에서 전자모듈을 안착홈(127)에 장착한 후, 점섬으로 도시한 바와 같이 작동부(130)를 하강시켜 상기 작동부(130)의 일측에 구비되어 있는 핀조립체(140)가 피검사물이 전자모듈의 커넥터에 접속되도록 한다.As shown, the operation unit 130 is configured to move up and down on the upper portion of the body portion 120 by the elevating guide 150, as shown in the solid line operating unit 130 is raised After mounting the electronic module in the seating groove 127, as shown by the point is lowered the operating unit 130 as shown in the pin assembly 140 provided on one side of the operating unit 130 is inspected electronic Make sure that it is connected to the module's connector.

승하강가이드(150)는 몸체부(120)에 수직으로 부착되어 있는 한쌍의 수직봉(152)과, 상기 수직봉(152)의 외주면에 배치되어 있는 탄성부재(154)를 포함하여 이루어진다.The elevating guide 150 includes a pair of vertical rods 152 vertically attached to the body portion 120, and an elastic member 154 disposed on an outer circumferential surface of the vertical rods 152.

작동부(130)를 손으로 눌러 하강시키면 탄성부재(154)가 압축되면서 작동부(130)가 하강하다가 작동부(130)의 양측에 형성된 걸림돌기(134)가 클립부(170)의 걸림턱(172)에 걸리게 된다. 이렇게 작동부(130)를 하강 고정시킨 상태에서 모듈의 검사작업이 완료되면, 작업자가 클립부(170)의 손잡이(174)를 눌러 걸림턱(172)을 벌려주면, 탄성부재(154)의 복원력으로 작동부(130)가 다시 상승하게 된다.When the operation unit 130 is pressed down by hand, the elastic member 154 is compressed and the operation unit 130 is lowered, and then the locking projections 134 formed on both sides of the operation unit 130 are caught by the clip unit 170. (172). When the inspection work of the module is completed in the state in which the operating unit 130 is fixed downward, the operator presses the handle 174 of the clip unit 170 to open the locking jaw 172, and the restoring force of the elastic member 154 is achieved. The operating unit 130 is raised again.

수직봉(152)의 위쪽에는 고정판(156)을 부착하여 작동부(130)가 수직봉(152)을 이탈하지 않도록 하는 것이 바람직하다.It is preferable that the fixing plate 156 is attached above the vertical bar 152 so that the operation unit 130 does not leave the vertical bar 152.

이러한 전자모듈 고정구조는 작업자가 전자모듈을 안착홈(127)에 올려놓고 작동부(130)를 하강시키는 것만으러 장착과 접속이 이루어지므로, 작업성이 우수하여 검사시간을 단축시켜 준다.The electronic module fixing structure is mounted and connected only by the operator placing the electronic module in the seating groove 127 and lowering the operation unit 130, thereby reducing the inspection time due to excellent workability.

도 4는 본 발명에 따른 전자모듈 검사용 소켓의 고정구조 및 접속구조를 나타낸 개략적인 단면도이다.4 is a schematic cross-sectional view showing a fixing structure and a connection structure of an electronic module inspection socket according to the present invention.

먼저 고정구조를 살펴보면, 도시된 바와 같이 전자모듈(10)을 안착판(125)의 안착홈(127)에 놓으면, 흡입공(129) 안쪽의 음압에 의하여 전자모듈(10)이 상기 안착홈(127)에 밀착고정된다.Looking at the first fixed structure, as shown in the electronic module 10 is placed in the mounting groove 127 of the mounting plate 125, the electronic module 10 by the negative pressure inside the suction hole 129 the mounting groove ( 127).

다음으로 접속구조를 살펴보면, 도 3의 점선으로 표시한 바와 같이 작동부(130)가 몸체부(120)에 밀착된 상태로 고정된며, 전자모듈(10)의 커넥터(12)에 는 몸체부(120)의 일측에 구비된 핀조립체(140)가 접속된다.Next, looking at the connection structure, as shown by the dotted line in Figure 3, the operating unit 130 is fixed in close contact with the body portion 120, the body portion to the connector 12 of the electronic module 10 The pin assembly 140 provided on one side of the 120 is connected.

핀조립체(140)는 커넥터핀 하나하나에 대응하는 프로브핀(142)이 구비되어 있어서, 각각의 커넥터핀에 접속된다. 이 프로브핀(142)은 핀조립체(140) 뒤쪽의 인쇄회로기판(PCB)(195)에 접속되고, 인쇄회로기판(195)은 다시 FPCB(Flexible printed circuit board) 또는 전선다발로 이루어진 연결배선(190)에 접속되어 있고, 연결배선(190)은 다시 검사장치(미도시)에 연결되는 접속구조를 가진다.The pin assembly 140 is provided with probe pins 142 corresponding to each connector pin, and is connected to each connector pin. The probe pin 142 is connected to a printed circuit board (PCB) 195 behind the pin assembly 140, and the printed circuit board 195 is connected to a flexible printed circuit board (FPCB) or a bundle of wires again. 190 is connected, and the connection wiring 190 has a connection structure connected to an inspection device (not shown) again.

이러한 프로브핀(142)에 의한 접속구조는 커넥터핀에 손상을 주지 않으며, 아울러 프로브핀에도 손상이 가지 않기 때문에 소모부품의 잦은 교체 없이 검사작업을 수행할 수 있다.The connection structure by the probe pin 142 does not damage the connector pin, and also does not damage the probe pin can perform the inspection work without frequent replacement of consumable parts.

본 발명은 전자모듈 커넥터에 손상을 주지 않고 전자모듈을 검사할 수 있는 전자모듈 검사용 소켓을 제공하는 효과가 있다.The present invention has the effect of providing an electronic module inspection socket that can inspect the electronic module without damaging the electronic module connector.

또한 본 발명은 전자모듈을 안착하고 전자모듈에 접속하는 작업이 용이하여 작업효율이 우수한 전자모듈 검사용 소켓을 제공한다.In another aspect, the present invention provides a socket for an electronic module inspection excellent in work efficiency by mounting the electronic module and easy connection to the electronic module.

Claims (4)

검사 대상물인 전자모듈이 안착되는 몸체부;A body part on which an electronic module as an inspection object is seated; 상기 몸체부에 승하강가능하게 결합되어 있는 작동부;An operating part coupled to the body part in such a manner as to be movable up and down; 상기 작동부의 수직방향 승하강을 안내하는 승하강 가이드;An elevating guide for guiding the elevating direction of the operating unit; 상기 작동부의 일측에 위치하며 전자모듈의 커넥터핀에 접속되는 핀조립체;A pin assembly positioned at one side of the operation unit and connected to the connector pin of the electronic module; 상기 핀조립체와 접속되는 인쇄회로기판;A printed circuit board connected to the pin assembly; 상기 인쇄회로기판과 검사장치를 연결하는 연결배선; 및A connection wiring connecting the printed circuit board and the inspection apparatus; And 상기 작동부가 하강한 상태를 유지하도록 고정하는 클립부;를 포함하여 이루어지는 전자모듈 검사용 소켓.And a clip unit for fixing the operating unit to maintain the lowered state. 제 1항에 있어서,The method of claim 1, 상기 몸체부의 일측에 전자모듈의 형상에 대응하는 안착홈을 형성하고 있는 안착판을 더 구비하는 것을 특징으로 하는 전자모듈 검사용 소켓.The socket for an electronic module inspection, characterized in that it further comprises a seating plate forming a mounting groove corresponding to the shape of the electronic module on one side of the body portion. 제 2항에 있어서,The method of claim 2, 상기 몸체부의 일측에 진공펌프에 연결하기위한 펌프연결관을 더 구비하고,Further provided with a pump connection pipe for connecting to the vacuum pump on one side of the body portion, 상기 안착홈의 내부에 상기 펌프연결관과 연결되어 있는 흡입공을 더 구비하 는 것을 특징으로 하는 전자모듈 검사용 소켓.And a suction hole connected to the pump connection pipe in the seating groove. 제 1항에 있어서,The method of claim 1, 상기 승하강가이드는 상기 몸체에 수직방향으로 장착되어 있는 한쌍의 수직봉과, 상기 수직봉의 둘레에 장착된 탄성부재와, 상기 수직봉의 상단에 부착되어 있는 고정판을 포함하는 것을 특징으로 하는 전자모듈 검사용 소켓.The elevating guide includes a pair of vertical rods mounted in the vertical direction to the body, an elastic member mounted around the vertical rods, and a fixing plate attached to an upper end of the vertical rods. socket.
KR1020060061399A 2006-06-30 2006-06-30 A socket for testing electonic module KR100759080B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020060061399A KR100759080B1 (en) 2006-06-30 2006-06-30 A socket for testing electonic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060061399A KR100759080B1 (en) 2006-06-30 2006-06-30 A socket for testing electonic module

Publications (1)

Publication Number Publication Date
KR100759080B1 true KR100759080B1 (en) 2007-09-19

Family

ID=38737972

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060061399A KR100759080B1 (en) 2006-06-30 2006-06-30 A socket for testing electonic module

Country Status (1)

Country Link
KR (1) KR100759080B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200471076Y1 (en) 2013-07-25 2014-01-29 (주) 네스텍코리아 Socket for testing electronics
KR101514304B1 (en) * 2013-10-01 2015-04-22 (주)매트릭스 Pin Block for Preventing False Defect and Part Probe Station Using the Same
KR101865884B1 (en) * 2017-03-23 2018-06-08 윤근환 Connecter for test

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000024407A (en) * 2000-02-12 2000-05-06 장성환 Apparatus and Method of Testing Module Devices
KR20000008808U (en) * 1998-10-28 2000-05-25 김영환 Probe Device for Semiconductor Package
KR20000058879A (en) * 2000-07-04 2000-10-05 우상엽 Apparatus for testing semiconductor memory module
KR20010081820A (en) * 2000-02-19 2001-08-29 윤종용 Module test handler
KR20040003910A (en) * 2002-07-04 2004-01-13 삼성전자주식회사 Socket for module test

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000008808U (en) * 1998-10-28 2000-05-25 김영환 Probe Device for Semiconductor Package
KR20000024407A (en) * 2000-02-12 2000-05-06 장성환 Apparatus and Method of Testing Module Devices
KR20010081820A (en) * 2000-02-19 2001-08-29 윤종용 Module test handler
KR20000058879A (en) * 2000-07-04 2000-10-05 우상엽 Apparatus for testing semiconductor memory module
KR20040003910A (en) * 2002-07-04 2004-01-13 삼성전자주식회사 Socket for module test

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200471076Y1 (en) 2013-07-25 2014-01-29 (주) 네스텍코리아 Socket for testing electronics
KR101514304B1 (en) * 2013-10-01 2015-04-22 (주)매트릭스 Pin Block for Preventing False Defect and Part Probe Station Using the Same
KR101865884B1 (en) * 2017-03-23 2018-06-08 윤근환 Connecter for test

Similar Documents

Publication Publication Date Title
KR100759081B1 (en) A socket for testing electonic camera module
KR101186204B1 (en) Test apparatus for Flexible Printed Circuit Board
KR100759080B1 (en) A socket for testing electonic module
KR100648014B1 (en) Pcb jig of probe unit for flat display panel
KR101466739B1 (en) Pcb substrate inspection device
KR102304572B1 (en) Display pannel test device
KR100782168B1 (en) A socket for testing electonic module
KR100782169B1 (en) A socket for testing electonic module
CN201163699Y (en) Density converter for PCB test
JP2007263630A (en) Inspection tool and inspection unit for printed circuit board
KR100785309B1 (en) Fpcb test jig
CN208654190U (en) A kind of electronic product carrier
TW200716994A (en) Circuit board inspecting apparatus and circuit board inspecting method
CN2590004Y (en) Switch probe for printed circuit board testing arrangement
CN212586505U (en) FPCA universal test frame
CN215415762U (en) Circuit board detection equipment
JP2010038862A (en) Substrate object for inspection and inspection apparatus
CN216696572U (en) Testing device for semiconductor chip
CN210155264U (en) PCB testing jig
CN216560669U (en) Testing device and mobile phone testing equipment
CN215005052U (en) Double-station test fixture for integrated test of multiple functions of PCB (printed circuit board)
CN211955724U (en) PCBA board tester of twenty passageways
CN210243786U (en) PCB automatic detection jig
CN213210431U (en) Connecting pulling flat cable testing device
CN213816476U (en) PCBA B2B Connector switching structure

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130613

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20140610

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20150603

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20170911

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20180906

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20190909

Year of fee payment: 13