CN219099369U - Circuit board copper plating structure with even copper plating layer - Google Patents
Circuit board copper plating structure with even copper plating layer Download PDFInfo
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- CN219099369U CN219099369U CN202320123122.4U CN202320123122U CN219099369U CN 219099369 U CN219099369 U CN 219099369U CN 202320123122 U CN202320123122 U CN 202320123122U CN 219099369 U CN219099369 U CN 219099369U
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- circuit board
- copper plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The utility model provides a circuit board copper plating structure with even copper plating layer, which comprises an electrolyte copper plating groove, a groove body supporting bottom, a circuit board fixing frame, a traction structure, a pre-copper plating circuit board and a copper plating anode, wherein: the bottom of the groove body support is welded and fixed at the bottom of the electrolyte copper plating groove, the circuit board fixing frame is suspended in the electrolyte copper plating groove through a traction structure, and one end of the traction structure is fixed at the top end of the circuit board fixing frame through a bolt; the other end of the traction structure is fixed on the roof surface of a building through bolts, a pre-plated copper circuit board is placed in the circuit board fixing frame, and the copper plating anode is fixed on the surface of the groove body supporting bottom through bolts. The circuit board fixing frame, the traction structure and the copper plating anode are arranged, copper plating of the circuit board is uniform, and copper plating of the circuit board can be performed in a large scale.
Description
Technical Field
The utility model relates to the technical field of copper plating of circuit boards, in particular to a copper plating structure of a circuit board with a uniform copper plating layer.
Background
After the circuit board is processed by the drilling procedure, the circuit board is required to be placed in a copper plating groove for copper plating, so that the upper surface and the lower surface of the circuit board are covered with a copper layer, and workers after copper plating convey the circuit board to subsequent processing equipment for processing, so that the finished circuit board can be obtained. At present, the traditional circuit board copper plating method is that a worker stacks the circuit board in a copper plating tank, the electroplating solution in the copper plating tank electroplates the circuit board, and after a proper time, the worker takes out the circuit board from the copper plating tank. However, the existing copper plating of the circuit board still has the problem that the copper plating of the circuit board is uneven and the copper plating work of the circuit board cannot be carried out in a large batch.
Therefore, it is necessary to provide a circuit board copper plating structure having a uniform copper plating layer.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a circuit board copper plating structure with a uniform copper plating layer, which solves the problems that the copper plating of the circuit board is uneven and the copper plating of the circuit board cannot be performed in a large scale in the prior circuit board copper plating. The utility model provides a even circuit board copper plating structure of copper-plating layer, includes electrolyte copper-plating groove, cell body support bottom, circuit board mount, tows the structure, pre-copper plating circuit board and copper-plating positive pole, wherein: the bottom of the groove body support is welded and fixed at the bottom of the electrolyte copper plating groove, the circuit board fixing frame is suspended in the electrolyte copper plating groove through a traction structure, and one end of the traction structure is fixed at the top end of the circuit board fixing frame through a bolt; the other end of the traction structure is fixed on the roof surface of a building through bolts, a pre-plated copper circuit board is placed in the circuit board fixing frame, and the copper plating anode is fixed on the surface of the groove body supporting bottom through bolts.
The circuit board fixing frame comprises a top end supporting body, a circuit board fixing plate, a parallel connection conducting circuit and a cathode communication circuit, wherein the circuit board fixing plate is fixed at the bottom of the top end supporting body through bolts; the cathode communication circuit is fixed on the surface of the parallel connection conducting circuit through bolts and is welded and connected with the parallel connection conducting circuit through wires.
The copper plating anode comprises an anode immersed plate, an insulating support rod, a parallel connection plate and an anode communication circuit, wherein the insulating support rod is inlaid in the anode immersed plate and fixed through bolts, and the insulating support rod is fixed on the surface of the bottom of the tank body support through bolts; the parallel connection plate is welded at one end of the bottom of the anode immersed plate, and the anode communication circuit is fixed on the surface of the parallel connection plate through bolts and is in dare connection with the parallel connection plate through a wire.
The circuit board fixing frame adopts a plurality of brackets which are mutually parallel, the circuit board fixing frame adopts a steel metal plate, and the circuit board fixing plate adopts a group of copper metal frames; the circuit board fixing plate is connected in parallel through a parallel connection circuit and is connected into a power supply cathode through a cathode communication circuit; the circuit board fixing frame can be driven by the traction structure to move in the vertical direction and is used for forming a cathode in a circuit board copper plating system, copper plating work is conveniently carried out on the inside copper plating pre-plated circuit boards, a plurality of circuit board fixing frames are connected in parallel to form a copper plating pre-plated circuit board capable of being placed in large quantity simultaneously, copper plating treatment of a large number of copper plating pre-plated circuit boards can be carried out at one time, the distance between the copper plating pre-plated circuit boards is consistent, copper plating pre-plated circuit boards can be contacted with copper sulfate, and copper plating work can be uniformly carried out on each copper plating pre-plated circuit board.
The traction structure adopts a group of traction motors and a steel cable, the steel cable in the traction structure is wound in the traction motors, and the steel cable in the traction structure is fixed at the top of the circuit board fixing frame through a bolt with a circular ring at the tail part; the traction motor in the traction structure is fixed on the roof surface of a building through bolts and is used for driving the circuit board fixing frame to move in the vertical direction, so that the circuit board fixing frame can be completely immersed into the copper sulfate in the electrolyte copper plating tank.
The copper plating anode adopts a plurality of copper metal plates which are parallel to each other and are respectively positioned in the gaps between the circuit board fixing frames, the anode immersed plates are connected in parallel through the parallel connection plates, and the anode is connected with a power supply through an anode communication circuit, so that the anode in the circuit board copper plating system is formed, the interval between the copper plating anode and each group of circuit board fixing frames is completely consistent, the copper thickness of the copper plating circuit board is prevented from being inconsistent due to inconsistent interval, and the uneven situation occurs.
Compared with the prior art, the utility model has the following beneficial effects:
1. the circuit board fixing frame is used for forming the cathode in the circuit board copper plating system, copper plating work is conveniently carried out on the pre-copper plating circuit boards inside the circuit board fixing frame, a plurality of circuit board fixing frames are connected in parallel to form a circuit board capable of simultaneously placing a large number of pre-copper plating circuit boards, copper plating treatment of a large number of pre-copper plating circuit boards can be carried out at one time, the intervals among the pre-copper plating circuit boards are consistent, the pre-copper plating circuit boards can be contacted with copper sulfate, and each pre-copper plating circuit board can uniformly carry out copper plating work.
2. The traction structure is used for driving the circuit board fixing frame to move in the vertical direction, so that the circuit board fixing frame can be completely immersed into the copper sulfate in the electrolyte copper plating tank.
3. The arrangement of the copper plating anode is used for forming the anode in the copper plating system of the circuit board, the distance between the copper plating anode and each group of circuit board fixing frames is completely consistent, and the condition that the copper thickness of the preplating copper circuit board is inconsistent and uneven due to inconsistent distance is prevented.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is an enlarged view at a of the present utility model.
Fig. 3 is an enlarged view of the utility model at B.
In the figure:
the electrolytic copper plating tank 1, the tank body supporting base 2, the circuit board fixing frame 3, the top supporting body 31, the circuit board fixing plate 32, the parallel connection conducting circuit 33, the cathode communication circuit 34, the traction structure 4, the pre-copper plating circuit board 5, the copper plating anode 6, the anode immersed plate 61, the insulating supporting rod 62, the parallel connection connecting plate 63 and the anode communication circuit 64.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution of the embodiments of the present utility model will be clearly and completely described below, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
As shown in fig. 1 to 3.
The utility model provides a circuit board copper plating structure with even copper plating layer, which comprises an electrolyte copper plating tank 1, a tank body supporting bottom 2, a circuit board fixing frame 3, a traction structure 4, a pre-copper plating circuit board 5 and a copper plating anode 6, wherein: the cell body supporting bottom 2 is welded and fixed at the bottom of the electrolyte copper plating cell 1, the circuit board fixing frame 3 is suspended in the electrolyte copper plating cell 1 through a traction structure 4, and one end of the traction structure 4 is fixed at the top end of the circuit board fixing frame 3 through a bolt; the other end of the traction structure 4 is fixed on the roof surface of a building through bolts, a pre-plated copper circuit board 5 is placed in the circuit board fixing frame 3, and the copper plating anode 6 is fixed on the surface of the groove body supporting bottom 2 through bolts.
The circuit board fixing frame 3 comprises a top end supporting body 31, a circuit board fixing plate 32, a parallel connection conducting circuit 33 and a cathode communication circuit 34, wherein the circuit board fixing plate 32 is fixed at the bottom of the top end supporting body 31 through bolts, and the parallel connection conducting circuit 33 is fixed at one end of the top end supporting body 31 through bolts and is welded with the circuit board fixing plate 32 through wires; the cathode communication circuit 34 is fixed on the surface of the parallel connection conducting circuit 33 through a bolt, and is connected with the parallel connection conducting circuit 33 through a wire in a welding way.
The copper-plated anode 6 comprises an anode immersed plate 61, an insulating support rod 62, a parallel connection plate 63 and an anode communication circuit 64, wherein the insulating support rod 62 is embedded in the anode immersed plate 61 and fixed by bolts, and the insulating support rod 62 is fixed on the surface of the tank body support bottom 2 by bolts; the parallel connection plate 63 is welded to one end of the bottom of the anode immersed plate 61, and the anode communication circuit 64 is fixed to the surface of the parallel connection plate 63 by bolts and is connected with the parallel connection plate 63 by wires.
According to the circuit board copper plating structure with uniform copper plating layers, the electrolyte copper plating groove 1 and the groove body supporting bottom 2 form a rectangular groove, and a large amount of copper sulfate is stored in the rectangular groove, so that the subsequent circuit board copper plating work is facilitated; the circuit board fixing frame 3 adopts a plurality of mutually parallel brackets, the circuit board fixing frame 3 adopts a steel metal plate, and the circuit board fixing plate 32 adopts a group of copper metal frames; the circuit board fixing plate 32 is internally provided with a plurality of parallel grooves, and the circuit board fixing plate 32 is connected in parallel through a parallel connection circuit 33 and connected into a power supply cathode through a cathode communication circuit 34; the circuit board fixing frames 3 can be driven by the traction structure 4 to move in the vertical direction and used for forming a cathode in a circuit board copper plating system, copper plating work is conveniently carried out on the inside pre-copper plating circuit boards 5 of the circuit board fixing frames, a plurality of circuit board fixing frames 3 are connected in parallel to form a circuit board capable of simultaneously placing a large number of pre-copper plating circuit boards 5, copper plating treatment of a large number of pre-copper plating circuit boards 5 can be carried out at one time, the intervals among the pre-copper plating circuit boards 5 are consistent, the pre-copper plating circuit boards 5 can be contacted with copper sulfate, and copper plating work can be uniformly carried out on each pre-copper plating circuit board 5; the traction structure 4 adopts a group of traction motors and a steel cable, the steel cable in the traction structure 4 is wound in the traction motors, and the steel cable in the traction structure 4 is fixed at the top of the circuit board fixing frame 3 through a bolt with a circular ring at the tail part; the traction motor in the traction structure 4 is fixed on the roof surface of a building through bolts and is used for driving the circuit board fixing frame 3 to move in the vertical direction, so that the circuit board fixing frame 3 can be completely immersed into the copper sulfate in the electrolyte copper plating tank 1; the copper plating anode 6 adopts a plurality of copper metal plates which are parallel to each other and are respectively positioned in the gaps between the circuit board fixing frames 3, the anode immersed plates 61 are connected in parallel through the parallel connection plates 63 and are connected with the anode of a power supply through the anode communication circuit 64, the anode is used for forming the anode in the circuit board copper plating system, the spacing between the copper plating anode 6 and each group of circuit board fixing frames 3 is completely consistent, and the occurrence of inconsistent copper thickness and non-uniformity of plating of the preplating copper circuit board 5 caused by inconsistent spacing is prevented.
By utilizing the technical scheme of the utility model or under the inspired by the technical scheme of the utility model, a similar technical scheme is designed by a person skilled in the art, so that the technical effects are achieved, and the technical scheme falls into the protection scope of the utility model.
Claims (6)
1. A circuit board copper plating structure with even copper plating layer is characterized in that: including electrolyte copper plating tank (1), cell body support end (2), circuit board mount (3), traction structure (4), copper preplating circuit board (5) and copper plating positive pole (6), wherein: the groove body supporting bottom (2) is welded and fixed at the bottom of the electrolyte copper plating groove (1), the circuit board fixing frame (3) is suspended in the electrolyte copper plating groove (1) through the traction structure (4), and one end of the traction structure (4) is fixed at the top end of the circuit board fixing frame (3) through a bolt; the other end of the traction structure (4) is fixed on the roof surface of a building through bolts, a pre-copper plating circuit board (5) is placed in the circuit board fixing frame (3), and the copper plating anode (6) is fixed on the surface of the groove body supporting bottom (2) through bolts.
2. The copper plating structure of a circuit board having a uniform copper plating layer as defined in claim 1, wherein: the circuit board fixing frame (3) comprises a top end supporting body (31), a circuit board fixing plate (32), a parallel connection conducting circuit (33) and a cathode communication circuit (34), wherein the circuit board fixing plate (32) is fixed at the bottom of the top end supporting body (31) through bolts, and the parallel connection conducting circuit (33) is fixed at one end of the top end supporting body (31) through bolts and is welded with the circuit board fixing plate (32) through wires; the cathode communication circuit (34) is fixed on the surface of the parallel connection conducting circuit (33) through a bolt, and is connected with the parallel connection conducting circuit (33) through a wire in a welding mode.
3. The copper plating structure of a circuit board having a uniform copper plating layer as defined in claim 1, wherein: the copper plating anode (6) comprises an anode immersed plate (61), an insulating support rod (62), a parallel connection plate (63) and an anode communication circuit (64), wherein the insulating support rod (62) is embedded in the anode immersed plate (61) and fixed through bolts, and the insulating support rod (62) is fixed on the surface of the tank body support bottom (2) through bolts; the parallel connection plate (63) is welded at one end of the bottom of the anode immersed plate (61), and the anode communication circuit (64) is fixed on the surface of the parallel connection plate (63) through bolts and is in dare connection with the parallel connection plate (63) through wires.
4. A circuit board copper plating structure having a uniform copper plating layer as defined in claim 2, wherein: the circuit board fixing frame (3) adopts a plurality of brackets which are mutually parallel, the circuit board fixing frame (3) adopts a steel metal plate, and the circuit board fixing plate (32) adopts a group of copper metal frames; the circuit board fixing plate (32) is internally provided with a plurality of grooves which are parallel to each other, and the circuit board fixing plate (32) is connected in parallel through a parallel connection circuit (33) and is connected into a power supply cathode through a cathode communication circuit (34); the circuit board fixing frame (3) can be driven by the traction structure (4) to move in the vertical direction.
5. The copper plating structure of a circuit board having a uniform copper plating layer as defined in claim 1, wherein: the traction structure (4) adopts a group of traction motors and a steel cable, the steel cable in the traction structure (4) is wound in the traction motors, and the steel cable in the traction structure (4) is fixed at the top of the circuit board fixing frame (3) through a bolt with a circular ring at the tail part; the traction motor inside the traction structure (4) is fixed on the roof surface of a building through bolts.
6. A circuit board copper plating structure having a uniform copper plating layer as defined in claim 3, wherein: the copper plating anode (6) is made of a plurality of copper metal plates which are parallel to each other and are respectively positioned in the gaps between the circuit board fixing frames (3), the anode immersed plates (61) are connected in parallel through parallel connection plates (63), and the anode is connected into the anode of the power supply through an anode communication circuit (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320123122.4U CN219099369U (en) | 2023-01-12 | 2023-01-12 | Circuit board copper plating structure with even copper plating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320123122.4U CN219099369U (en) | 2023-01-12 | 2023-01-12 | Circuit board copper plating structure with even copper plating layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219099369U true CN219099369U (en) | 2023-05-30 |
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ID=86455324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320123122.4U Active CN219099369U (en) | 2023-01-12 | 2023-01-12 | Circuit board copper plating structure with even copper plating layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219099369U (en) |
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2023
- 2023-01-12 CN CN202320123122.4U patent/CN219099369U/en active Active
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