CN219097106U - Novel film coating device of heterojunction battery - Google Patents
Novel film coating device of heterojunction battery Download PDFInfo
- Publication number
- CN219097106U CN219097106U CN202222954564.1U CN202222954564U CN219097106U CN 219097106 U CN219097106 U CN 219097106U CN 202222954564 U CN202222954564 U CN 202222954564U CN 219097106 U CN219097106 U CN 219097106U
- Authority
- CN
- China
- Prior art keywords
- assembly
- guide rail
- automatic
- automatic overturning
- vertical guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a novel film laminating device of a heterojunction battery, which comprises the following components: the device comprises a first film covering assembly, a transmission assembly, an automatic overturning assembly and a second film covering assembly; the transmission assembly is connected with the first film covering assembly and the second film covering assembly respectively, and the automatic overturning assembly is positioned between the first film covering assembly and the second film covering assembly; the automatic overturning assembly comprises a base, a first automatic overturning assembly and a second automatic overturning assembly; the base is positioned below the transmission assembly, one side of the surface of the base is connected with the first automatic overturning assembly in a sliding manner, the other side of the base is connected with the second automatic overturning assembly in a sliding manner, and the first automatic overturning assembly and the second automatic overturning assembly are respectively positioned on opposite side surfaces of the transmission assembly; the device can carry out rapid bearing on the silicon wafer through the first automatic overturning assembly and the second automatic overturning assembly, and the silicon wafer can be overturned automatically, so that the labor and time cost is reduced effectively, the fragment rate is reduced, and the production stability of the silicon wafer is improved.
Description
Technical Field
The utility model relates to the technical field of battery production equipment, in particular to a novel film coating device of a heterojunction battery.
Background
With the continuous development of science and technology, solar cells are widely applied to daily life and industry of people, in recent years, the production technology of solar cells is continuously improved, the production cost is continuously reduced, the conversion efficiency is continuously improved, and the application of solar cells for power generation is increasingly wide and becomes an important energy source for power supply. Since the rapid development of economy in recent years causes the environment to be destroyed to various extents, the contradiction between the large demand for energy and environmental pollution has become a global problem that is urgently needed to be solved. In the preparation of double-sided heterojunction solar cells, 2 film coating devices are required to avoid cross contamination, one for the I/N film coating on one side of the silicon wafer and the other for the I/P film coating on the other side of the silicon wafer. When the existing equipment is connected between two film laminating equipment, manual transmission and turnover are adopted mostly, the breakage rate of the silicon wafer and the instability of the silicon wafer can be increased, the silicon wafer is easy to pollute, and therefore the novel film laminating device of the heterojunction battery is provided.
Disclosure of Invention
In order to solve the problems, the utility model provides a novel film laminating device of a heterojunction battery, so as to solve the problems that when the existing equipment is connected between two film laminating devices, manual transmission and turnover are adopted mostly, the chip rate and instability are increased, and a silicon wafer is easily polluted.
The utility model provides a novel film laminating device of a heterojunction battery, which comprises the following components: the device comprises a first film covering assembly, a transmission assembly, an automatic overturning assembly and a second film covering assembly; the transmission assembly is connected with the first film covering assembly and the second film covering assembly respectively, and the automatic overturning assembly is positioned between the first film covering assembly and the second film covering assembly; the automatic overturning assembly comprises a base, a first automatic overturning assembly and a second automatic overturning assembly; the base is located transmission subassembly below, base surface one side sliding connection first automatic upset subassembly, base opposite side sliding connection second automatic upset subassembly, first automatic upset subassembly and second automatic upset subassembly are located respectively transmission subassembly opposite side.
Further, the first automatic overturning assembly comprises a mounting table, an adjusting assembly and an overturning assembly; one surface of the mounting table is in sliding connection with the base, the other surface of the mounting table is in sliding connection with the adjusting component in a moving way, and the middle sections of the two sides of the moving component are respectively in sliding connection with the two sides of the overturning component.
Further, the adjusting component comprises a vertical guide rail frame, a first motor and an adjusting rod; one end of the vertical guide rail frame is in sliding connection with the mounting table, one end position of each of two sides of the vertical guide rail frame is fixedly connected with one end of the first motor, the other end of each of the first motors is fixedly connected with one end of the adjusting rod, the other end of each of the adjusting rods is movably connected with the other end position of one side of the vertical guide rail frame, and the middle section positions of the two adjusting rods are respectively in sliding connection with two sides of the overturning assembly.
Further, a first guide rail groove is formed in one end of the vertical guide rail frame and is connected with the mounting table in an adaptive mode, a vertical guide rail is arranged on two sides of the vertical guide rail frame, a first bearing block used for mounting the first motor is arranged at one end position of the side face of the vertical guide rail, and a second bearing block connected with the adjusting rod in a sliding mode is arranged at the other end of the side face of the vertical guide rail.
Further, the overturning assembly comprises an overturning frame, a second motor, a connecting piece and a silicon wafer basket; the two ends of the roll-over stand are respectively and movably connected with the two adjusting rods, the second motor is installed on the roll-over stand, the second motor is fixedly connected with one end of the connecting piece, the other end of the connecting piece is fixedly connected with the silicon wafer flower basket, the connecting piece penetrates through the middle position of the roll-over stand, and the connecting piece is movably connected with the roll-over stand.
Further, a first mounting hole matched with the connecting piece is formed in the middle of one face of the roll-over stand, second guide rail grooves matched and connected with the vertical guide rail stand are formed in two sides of the other face of the roll-over stand, first adjusting blocks matched and connected with the adjusting rods are arranged on the side faces of the second guide rail grooves, and third bearing blocks used for bearing a second motor are arranged on the other face of the roll-over stand.
Further, the two sides of the surface of the base are respectively provided with a first guide rail which is connected with the first automatic overturning assembly and the second automatic overturning assembly in an adapting way.
Further, the first automatic overturning component and the second automatic overturning component are identical in structure.
The utility model has the beneficial effects that: the device can carry out rapid bearing on the silicon wafer through the first automatic overturning assembly and the second automatic overturning assembly, and the silicon wafer can be overturned automatically, so that the labor and time cost is reduced effectively, the fragment rate is reduced, and the production stability of the silicon wafer is improved.
Drawings
FIG. 1 is an overall view of a novel heterojunction cell lamination device of the present utility model;
FIG. 2 is an overall block diagram of the automatic flipping assembly of the present utility model;
FIG. 3 is an overall block diagram of a first automatic flip assembly of the present utility model;
FIG. 4 is an overall block diagram of a first automatic flip assembly of the present utility model;
in the figure: the device comprises a first film covering component 1, a transmission component 2, an automatic overturning component 3, a second film covering component 4, a base 31, a first automatic overturning component 32, a second automatic overturning component 33, a mounting table 321, an adjusting component 322, an overturning component 323, a vertical guide rail frame 3221, a first motor 3222, an adjusting rod 3223, an overturning frame 3231, a second motor 3232, a connecting piece 3233 and a silicon wafer basket 3234.
Description of the embodiments
In order to more clearly and completely describe the technical scheme of the utility model, the utility model is further described below with reference to the accompanying drawings.
Referring to fig. 1-4, the present utility model provides a novel film coating device for heterojunction battery, comprising: the device comprises a first film covering assembly 1, a transmission assembly 2, an automatic overturning assembly 3 and a second film covering assembly 4; the device is further provided with a controller, the controller is electrically connected with the first film coating component 1, the transmission component 2, the automatic overturning component 3 and the second film coating component 4, the controller can be a control device for producing the existing silicon wafers, the transmission component 2 is connected with the first film coating component 1 and the second film coating component 4 respectively, the transmission component 2 is a conveying mechanism for conveying the existing silicon wafers, the first film coating component 1 and the second film coating component 4 are film coating mechanisms for respectively depositing an intrinsic amorphous silicon layer and a doped amorphous microcrystalline layer on the front side and the back side of the silicon wafers after texturing and cleaning, the automatic overturning component 3 is positioned between the first film coating component 1 and the second film coating component 4, and the transmission component 2 and the automatic overturning component 3 are further provided with mechanisms for placing the existing silicon wafers between a silicon wafer flower 3234 and a silicon wafer conveying mechanism; the automatic turning-over assembly 3 includes a base 31, a first automatic turning-over assembly 32, and a second automatic turning-over assembly 33; the base 31 is positioned below the transmission assembly 2, one side of the surface of the base 31 is slidably connected with the first automatic overturning assembly 32, the other side of the base 31 is slidably connected with the second automatic overturning assembly 33, and the first automatic overturning assembly 32 and the second automatic overturning assembly 33 are respectively positioned on opposite side surfaces of the transmission assembly 2; the two sides of the surface of the base 31 are respectively provided with a first guide rail which is connected with the first automatic overturning assembly 32 and the second automatic overturning assembly 33 in an adapting way.
In the implementation, after a silicon wafer is moved to a first film covering component 1 by a transmission device, sequentially depositing a first intrinsic amorphous silicon film layer with the thickness of 3-10 microns and a first doped n-type non (or micro) crystalline silicon film layer with the thickness of 5-18 microns on the front surface of the silicon wafer subjected to the flocking by a low-temperature chemical vapor deposition technology by the first film covering component 1; then the silicon wafer is transported to the first automatic turnover assembly 32 by the transmission assembly 2, after the silicon wafer on the first automatic turnover assembly 32 reaches a certain number, the first automatic turnover assembly 32 and the second turnover assembly 323 move on the base 31, the positions of the first automatic turnover assembly 32 and the second turnover assembly 323 are replaced, the position replacement is specifically the front-back position sequential conversion, specifically the position of the first automatic turnover assembly 32 is automatically close to the position of the second film coating assembly 4, the second automatic turnover assembly 33 moves to the position close to the first film coating assembly 1, the second automatic turnover assembly 33 collects the silicon wafer coated by the first film coating assembly 1, the first automatic turnover assembly 32 and the second automatic turnover assembly 33 are sequentially and circularly matched for use, when the first automatic turnover assembly 32 moves to the position of the second film coating assembly 4, the turned silicon wafer is moved to the second film coating assembly 4 by the transmission assembly 2, the second film coating assembly 4 sequentially deposits a second intrinsic amorphous silicon film layer, the thickness of 3-10 micrometers, the second film coating assembly is 3-10 micrometers thick, the second film coating assembly is capable of reducing the labor efficiency of the silicon wafer, the wafer is reduced by the second film coating assembly (the second film coating assembly is 18 micrometers), the labor efficiency of the silicon wafer is reduced, the production cost is reduced, and the labor efficiency is reduced, and the cost is increased by the labor efficiency is reduced.
In this embodiment, the first automatic flipping assembly 323 includes a mounting table 321, an adjustment assembly 322, and a flipping assembly 323; one surface of the mounting table 321 is in sliding connection with the base 31, the base 31 is connected with the mounting table 321 through a first guide rail, and all elements and functions of the existing numerical control guide rail type operation are also arranged on the mounting table 321; the other side of the mounting table 321 is movably and slidably connected with the adjusting component 322, the connecting position of the mounting table 321 and the adjusting component 322 is also connected through a guide rail, and the mounting table 321 and the adjusting component 322 have the complete mechanism and functions of the existing numerical control guide rail; the first guide rail on the base 31 is crossed with the guide rail of the installation table 321 connected with the adjusting component 322, and the first guide rail is parallel to the moving direction of the transmission component 2; the middle sections of the two sides of the moving assembly are respectively and slidably connected with the two sides of the overturning assembly 323; the first automatic flipping assembly 32 is identical in structure to the second automatic flipping assembly 33.
In a specific implementation, when the positions of the first automatic turning component 32 and the second automatic turning component 33 need to be sequentially replaced, the controller controls the adjusting components 322 on the first automatic turning component 32 and the second automatic turning component 33 to move on the mounting table 321, the two adjusting components 322 move away from the transmission component 2, so that the two turning components 323 do not overlap in the moving direction of the transmission component 2, the two automatic turning components 3 turn over the silicon wafer, then the first automatic turning component 32 and the second automatic turning component 33 respectively move along the first guide rail on the base 31, and the positions of the first automatic turning component 32 and the second automatic turning component 33 are sequentially replaced with each other.
In this embodiment, the adjustment assembly 322 includes a vertical rail frame 3221, a first motor 3222, and an adjustment rod 3223; one end of the vertical guide rail frame is connected with the mounting table 321 in a sliding manner, and the vertical guide rail frame is connected with the upper guide rail of the mounting table 321 in a sliding manner through a first guide rail groove; one end of each of the two sides of the vertical guide rail frame is fixedly connected with one end of a first motor 3222, the other end of each of the first motors 3222 is fixedly connected with one end of an adjusting rod 3223, the other end of each adjusting rod 3223 is movably connected with the other end of one side of the vertical guide rail frame, and the middle sections of the two adjusting rods 3223 are respectively and slidably connected with two sides of the turnover assembly 323; the first motor 3222 is a stepping motor, and the adjusting rod 3223 is a screw rod; one end of the vertical guide rail frame is provided with a first guide rail groove which is connected with the mounting table 321 in an adapting way, two sides of the vertical guide rail frame are respectively provided with a vertical guide rail, one end position of the side surface of the vertical guide rail is provided with a first bearing block for mounting the first motor 3222, and the other end of the side surface of the vertical guide rail is provided with a second bearing block which is connected with the adjusting rod 3223 in a sliding way.
In the implementation, when the silicon wafer is transferred from the first film covering assembly 1 to the second film covering assembly 4 through the first automatic overturning assembly 32 and the second automatic overturning assembly 33, the two first motors 3222 rotate to drive the two adjusting rods 3223 to rotate, the adjusting rods 3223 drive the overturning assembly 323 to move upwards or downwards, specifically, in order to adapt to the process that one silicon wafer is collected by the overturning assembly 323 or enters the next stage from the overturning assembly 323, the silicon wafer on the silicon wafer basket 3234 can be increased or reduced, and the silicon wafer loading and unloading mechanism of the silicon wafer basket 3234 can be understood.
In this embodiment, the flipping assembly 323 includes a flipping frame 3231, a second motor 3232, a connector 3233, and a silicon basket 3234; two ends of the roll-over stand 3231 are respectively and movably connected with two adjusting rods 3223, a second motor 3232 is arranged on the roll-over stand 3231, a transmission shaft of the second motor 3232 is fixedly connected with one end of a connecting piece 3233, the other end of the connecting piece 3233 is fixedly connected with a silicon wafer basket 3234, the second motor 3232 is a stepping motor, the connecting piece 3233 penetrates through the middle position of the roll-over stand 3231, the connecting piece 3233 is movably connected with the roll-over stand 3231, the movable connecting positions can be added with the existing friction-reducing elements according to actual requirements, and the elements such as bearings and the like can be added at the rotating connecting positions; the connecting piece 3233 can be a whole fixed with the silicon wafer basket 3234, or the connecting piece 3233 can be an existing clamping component with an automatic clamping function, and can clamp and unclamp the silicon wafer basket 3234; the middle position of one surface of the roll-over frame 3231 is provided with a first mounting hole matched with the connecting piece 3233, two sides of the other surface of the roll-over frame 3231 are respectively provided with a second guide rail groove matched and connected with the vertical guide rail frame 3221, the side surface of the second guide rail groove is provided with a first adjusting block matched and connected with the adjusting rod 3223, the first adjusting block is a moving element matched and connected with a screw rod, and the other surface of the roll-over frame 3231 is provided with a third bearing block used for bearing the second motor 3232.
In specific implementation, when the adjusting rod 3223 rotates forward or backward, under the action of the first adjusting block, the turnover assembly 323 moves upwards or downwards, when the silicon wafer needs to be turned over, the second motor 3232 rotates, the second motor 3232 drives the connecting piece 3233 to rotate, and the connecting piece 3233 drives the silicon wafer basket 3234 to rotate, so that the effect of turning over the silicon wafer is achieved.
Of course, the present utility model can be implemented in various other embodiments, and based on this embodiment, those skilled in the art can obtain other embodiments without any inventive effort, which fall within the scope of the present utility model.
Claims (8)
1. Novel tectorial membrane of heterojunction battery device, its characterized in that includes: the device comprises a first film covering assembly, a transmission assembly, an automatic overturning assembly, a second film covering assembly and a moving assembly; the transmission assembly is connected with the first film covering assembly and the second film covering assembly respectively, and the automatic overturning assembly is positioned between the first film covering assembly and the second film covering assembly; the automatic overturning assembly comprises a base, a first automatic overturning assembly and a second automatic overturning assembly; the base is located transmission subassembly below, base surface one side sliding connection first automatic upset subassembly, base opposite side sliding connection second automatic upset subassembly, first automatic upset subassembly and second automatic upset subassembly are located respectively transmission subassembly opposite side.
2. The novel heterojunction cell laminating device of claim 1, wherein the first automatic overturning component comprises a mounting table, an adjusting component and an overturning component; one surface of the mounting table is in sliding connection with the base, the other surface of the mounting table is in sliding connection with the adjusting component in a moving way, and the middle sections of the two sides of the moving component are respectively in sliding connection with the two sides of the overturning component.
3. The novel heterojunction cell laminating device of claim 2, wherein the adjusting assembly comprises a vertical guide rail frame, a first motor and an adjusting rod; one end of the vertical guide rail frame is in sliding connection with the mounting table, one end position of each of two sides of the vertical guide rail frame is fixedly connected with one end of the first motor, the other end of each of the first motors is fixedly connected with one end of the adjusting rod, the other end of each of the adjusting rods is movably connected with the other end position of one side of the vertical guide rail frame, and the middle section positions of the two adjusting rods are respectively in sliding connection with two sides of the overturning assembly.
4. The novel heterojunction battery laminating device according to claim 3, wherein one end of the vertical guide rail frame is provided with a first guide rail groove which is connected with the mounting table in an adapting mode, two sides of the vertical guide rail frame are provided with vertical guide rails, one end position of the side face of each vertical guide rail is provided with a first bearing block for mounting the first motor, and the other end of the side face of each vertical guide rail is provided with a second bearing block which is connected with the adjusting rod in a sliding mode.
5. The novel heterojunction cell laminating device of claim 3, wherein the turnover assembly comprises a turnover frame, a second motor, a connecting piece and a silicon wafer basket; the two ends of the roll-over stand are respectively and movably connected with the two adjusting rods, the second motor is installed on the roll-over stand, the second motor is fixedly connected with one end of the connecting piece, the other end of the connecting piece is fixedly connected with the silicon wafer flower basket, the connecting piece penetrates through the middle position of the roll-over stand, and the connecting piece is movably connected with the roll-over stand.
6. The film laminating device of the novel heterojunction battery according to claim 5, wherein a first mounting hole matched with the connecting piece is formed in the middle position of one face of the roll-over stand, second guide rail grooves matched and connected with the vertical guide rail frames are formed in two sides of the other face of the roll-over stand, first adjusting blocks matched and connected with the adjusting rods are arranged on the side faces of the second guide rail grooves, and third bearing blocks used for bearing the second motor are arranged on the other face of the roll-over stand.
7. The novel heterojunction cell laminating device of claim 1, wherein first guide rails connected with the first automatic overturning assembly and the second automatic overturning assembly in an adapting mode are respectively arranged on two sides of the surface of the base.
8. The novel heterojunction cell laminating device of claim 1, wherein the first automatic overturning component and the second automatic overturning component are identical in structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222954564.1U CN219097106U (en) | 2022-11-07 | 2022-11-07 | Novel film coating device of heterojunction battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222954564.1U CN219097106U (en) | 2022-11-07 | 2022-11-07 | Novel film coating device of heterojunction battery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219097106U true CN219097106U (en) | 2023-05-30 |
Family
ID=86466202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222954564.1U Active CN219097106U (en) | 2022-11-07 | 2022-11-07 | Novel film coating device of heterojunction battery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219097106U (en) |
-
2022
- 2022-11-07 CN CN202222954564.1U patent/CN219097106U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109449252B (en) | Manufacturing process of half polycrystalline solar cell | |
| CN201693302U (en) | Welding device of focus solar battery chip component | |
| KR20080091655A (en) | Photovoltaic device and fabrication method thereof | |
| CN104900762B (en) | Automatic film photovoltaic dispensing interconnection system and method | |
| JP2020161509A (en) | Wafer removal and separation device and method | |
| CN219097106U (en) | Novel film coating device of heterojunction battery | |
| CN111917363A (en) | High-efficient solar photovoltaic power generation device of building | |
| US4735909A (en) | Method for forming a polycrystalline monolayer | |
| CN103531663A (en) | Preparation method of absorbing layer of CuInS2 thin-film solar cell | |
| CN106114968A (en) | A kind of photovoltaic battery panel vanning switching mechanism | |
| CN111153588A (en) | A base-material cutting former for photovoltaic cell board processing | |
| CN212713812U (en) | Electroplating clamp for solar cell | |
| CN201966235U (en) | Thin layer edge removing mechanism | |
| CN209880638U (en) | Intelligent horizontal flexible adjusting platform | |
| CN102110745B (en) | Device and method for clearing edge of thin-film layer | |
| CN204334444U (en) | A kind of two-dimensional motion mechanism of balancing weight | |
| WO2020015739A1 (en) | Wafer extracting and separating device and method | |
| CN112743121A (en) | Two-position four-axis synchronous drilling device | |
| KR20130076441A (en) | Needle scribing apparatus for fabricating thin film solar cell | |
| CN106191863A (en) | A kind of manufacture of solar cells quick thinning device of technique silicon chip | |
| CN201211738Y (en) | Reflecting film laser marking equipment | |
| CN217691196U (en) | Mechanical fixture for processing solar panel | |
| CN109755353B (en) | Intelligent horizontal flexible adjusting platform and method | |
| CN210945775U (en) | Switching component for solar cell amorphous silicon thin film deposition equipment | |
| CN117352584B (en) | Efficient passivation contact solar cell structure, preparation method and preparation equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |