CN219085954U

CN219085954U - Wafer adsorption carrier

Info

Publication number: CN219085954U
Application number: CN202122949520.5U
Authority: CN
Inventors: 刘钦源; 郑少宇
Original assignee: Presys Suzhou Intelligent Technology Co ltd
Current assignee: Presys Suzhou Intelligent Technology Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2023-05-26
Anticipated expiration: 2031-11-29

Abstract

The utility model discloses a wafer adsorption carrier, which comprises: a carrier plate; at least two first locating grooves which are concentrically arranged are positioned on the carrier plate so as to contain and locate wafers with different sizes; the vacuum cavities are positioned on the carrier plate and are arranged back to the first positioning grooves, the vacuum cavities correspond to the first positioning grooves one by one, and the vacuum cavities are provided with adsorption holes penetrating to the bottoms of the first positioning grooves; the support plate is provided with a plurality of vacuum channels, and the vacuum channels are respectively communicated with different vacuum cavities. The utility model is provided with a plurality of positioning grooves so as to be compatible with various wafers, and can control the adsorption holes on different positioning grooves to generate or cancel the adsorption force according to the requirement, so that the adsorption holes are prevented from being in an empty state, and the energy consumption during the operation of the carrier is saved.

Description

Wafer adsorption carrier

Technical Field

The utility model relates to the technical field of semiconductor wafer measurement, in particular to a wafer adsorption carrier.

Background

In the wafer measurement process, the wafer is usually fixed on the carrier by adopting a clamping mode, and the method for fixing the wafer has certain defects, such as the original shape of the wafer is easy to change due to larger clamping force. In addition, the wafer is adsorbed by the vacuum adsorption carrier in a vacuum adsorption mode, and as a plurality of adsorption holes for adsorbing the wafer and vacuum channels communicated with the adsorption holes are required to be formed in the adsorption carrier, the adsorption holes synchronously adsorb or release the wafer through the vacuum channels, and when the adsorption carrier is required to be compatible with wafers with various sizes, part of the adsorption holes are always in an empty state, so that waste is caused.

Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art.

Disclosure of Invention

The utility model aims to provide a wafer adsorption carrier which effectively utilizes adsorption holes and can be compatible with wafers with different sizes.

The utility model aims at realizing the following technical scheme: a wafer chucking stage, comprising: a carrier plate; at least two first locating grooves which are concentrically arranged are positioned on the carrier plate so as to contain and locate wafers with different sizes; the vacuum cavities are positioned on the carrier plate and are arranged back to the first positioning grooves, the vacuum cavities correspond to the first positioning grooves one by one, and the vacuum cavities are provided with adsorption holes penetrating to the bottoms of the first positioning grooves; the support plate is provided with a plurality of vacuum channels, and the vacuum channels are respectively communicated with different vacuum cavities.

Further, the vacuum cavity is a cavity formed along the circumferential direction of the first positioning groove, and a plurality of vacuum cavities are concentrically arranged.

Further, the vacuum channel extends from the side of the carrier plate to the vacuum chamber along an axis direction perpendicular to the first positioning groove.

Further, the vacuum cavity comprises a first vacuum cavity and a second vacuum cavity positioned outside the first vacuum cavity, the second vacuum cavity comprises a third vacuum cavity half part and a fourth vacuum cavity half part which are independent, and a first avoiding part for avoiding interference with the vacuum channel is formed between the third vacuum cavity half part and the fourth vacuum cavity half part.

Further, the carrier plate has a symmetry axis, and the third vacuum cavity half and the fourth vacuum cavity half are symmetrically distributed on two sides of the symmetry axis.

Further, the third vacuum cavity half and the fourth vacuum cavity half are respectively connected with one vacuum channel.

Further, the first vacuum cavity comprises a first vacuum cavity half part and a second vacuum cavity half part which are independent, the first vacuum cavity half part and the second vacuum cavity half part are symmetrically distributed on two sides of the symmetry axis, one side, away from the first avoidance part, of the first vacuum cavity and the second vacuum cavity is provided with a second avoidance part, and the carrier plate is provided with a notch for the first positioning groove to enter and exit the wafer along the direction of the symmetry axis at the second avoidance part.

Further, a third avoidance part is arranged on one side, close to the first avoidance part, of the first vacuum cavity half part and the second vacuum cavity half part, and a sensor for detecting whether a wafer exists or not is arranged at the third avoidance part.

Further, the carrier plate and one surface of the first positioning groove facing back are concavely formed with a vacuum groove, and a cover plate is detachably arranged on the vacuum groove to form the vacuum cavity.

Further, the first vacuum chamber and the second vacuum chamber are opened along the axial direction of the first positioning groove, and the depths are the same.

Compared with the prior art, the utility model has the following beneficial effects: according to the utility model, the plurality of locating grooves which are concentrically arranged are arranged on the carrier plate, and the locating grooves with different sizes can respectively contain and locate different wafers so as to improve the compatibility of the carrier; in addition, be equipped with a plurality of vacuum chambers and the vacuum channel that is linked together with different vacuum chambers respectively on the support plate to order about the independent evacuation of different vacuum chambers, thereby can control the absorption hole on the different constant head tanks as required and produce or cancel the adsorption affinity, in order to avoid the absorption hole to be in the empty state, the energy consumption when practicing thrift the microscope carrier operation.

Drawings

FIG. 1 is a schematic view of a wafer chucking stage according to the present utility model.

Fig. 2 is a schematic view of the structure of the wafer suction carrier in the other direction.

Fig. 3 is a partial enlarged view of fig. 2 at a.

FIG. 4 is a schematic cross-sectional view of a wafer chucking stage according to the present utility model.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The terms "comprising" and "having" and any variations thereof herein are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Referring to fig. 1 to 4, a wafer adsorption stage according to a preferred embodiment of the present utility model includes: a carrier plate 100; at least two concentric positioning slots 10 on the carrier 100 for receiving and positioning wafers 200 of different sizes; at least two vacuum cavities 20 are positioned on the carrier plate 100 and are arranged back to the positioning grooves 10, the vacuum cavities 20 are in one-to-one correspondence with the positioning grooves 10, and the vacuum cavities 20 are provided with adsorption holes 201 penetrating to the bottoms of the positioning grooves 10; the carrier 100 is provided with a plurality of vacuum channels 30, and the plurality of vacuum channels 30 are respectively communicated with different vacuum chambers 20.

According to the utility model, the plurality of locating grooves 10 which are concentrically arranged are arranged on the carrier plate 100, and the locating grooves 10 with different sizes can respectively contain and locate different wafers 200, so that the compatibility of the carrier is improved; in addition, the carrier plate 100 is provided with a plurality of vacuum chambers 20 and vacuum channels 30 respectively communicated with different vacuum chambers 20, so that the different vacuum chambers 20 are driven to independently vacuumize, and therefore the adsorption holes 201 on different positioning slots 10 can be controlled to generate or cancel adsorption force according to the needs, the adsorption holes 201 are prevented from being in a vacant state, and the energy consumption during the operation of the carrier is saved.

Further, the positioning groove 10 is an annular structure formed by recessing from the bearing end surface of the carrier 100, in this embodiment, the positioning groove 10 includes a first positioning groove 11 and a second positioning groove 12 concentrically disposed at the periphery of the first positioning groove 11, so as to respectively accommodate wafers 200 with two sizes, and the bottom of the second positioning groove 12 is higher than the bottom of the first positioning groove 11. Indeed, in other embodiments, more positioning slots 10 may be provided as needed to accommodate wafers 200 of more sizes.

Further, the vacuum chambers 20 are chambers formed along the circumferential direction of the positioning groove 10, and a plurality of vacuum chambers 20 are concentrically arranged. The adsorption holes 201 are arranged at intervals along the circumferential direction of the vacuum chamber 20 such that the adsorption holes 201 are uniformly distributed at the bottom of the positioning groove 10 to uniformly and reliably adsorb the bottom of the wafer 200.

Because the vacuum chamber 20 is of an annular structure, in order to facilitate processing of the vacuum chamber 20, the carrier plate 100 and a surface opposite to the bearing end surface thereof are concavely formed with the vacuum groove 202, the vacuum groove 202 is detachably provided with the cover plate 300, and the cover plate 300 is matched with the vacuum groove 202 to form the vacuum chamber 20. The cover plate 300 and the carrier plate 100 may be fixed by bolts, magnetic attraction or adhesion. Preferably, in order to facilitate accurate placement of the cover plate 300 at the designated position of the vacuum tank 202, a cover plate groove 203 is concavely formed on the outer edge of the vacuum tank 202 on the carrier plate 100, and the cover plate 300 may be positioned in the cover plate groove 203.

Further, the vacuum chamber 20 includes a first vacuum chamber 21 and a second vacuum chamber 22 located outside the first vacuum chamber 21, the first vacuum chamber 21 is disposed corresponding to the first positioning groove 11, and the second vacuum chamber 22 is disposed corresponding to the second positioning groove 12. The first vacuum chamber 21 and the second vacuum chamber 22 are opened along the axial direction of the positioning groove 10, and have the same depth. By providing the first vacuum chamber 21 and the second vacuum chamber 22 to the same depth, the machining process can be simplified and the machining efficiency can be improved.

Further, in order to facilitate forming of the vacuum channel 30, in the present embodiment, the vacuum channel 30 extends from the side of the carrier plate 100 to the side wall of the vacuum chamber 20 along the axial direction of the vertical positioning groove 10, so as to achieve communication between the vacuum channel 30 and the vacuum chamber 20. Since the first vacuum chamber 21 and the second vacuum chamber 22 are of concentric ring structures, in order to avoid that the vacuum channel 30 communicating with the first vacuum chamber 21 passes through the second vacuum chamber 22 and thus interferes with the second vacuum chamber 22, in this embodiment, the second vacuum chamber 22 includes a third vacuum chamber half 221 and a fourth vacuum chamber half 222, and a first avoiding portion 204 for avoiding interference with the vacuum channel 30 is formed between the third vacuum chamber half 221 and the fourth vacuum chamber half 222. In the present embodiment, the carrier plate 100 has a symmetry axis 400 along the opening direction of the vacuum channel 30, and the third vacuum cavity half 221 and the fourth vacuum cavity half 222 are symmetrically distributed on two sides of the symmetry axis 400. A vacuum channel 30 is connected to the third vacuum chamber half 221 and the fourth vacuum chamber half 222, respectively, to evacuate the third vacuum chamber half 221 and the fourth vacuum chamber half 222, respectively. By providing the second vacuum chamber 22 as a third vacuum chamber half 221 and a fourth vacuum chamber half 222 independent of each other, it is also possible to improve the evacuation efficiency, facilitating rapid suction of the wafer 200.

Further, in the present embodiment, the first vacuum chamber 21 includes a first vacuum chamber half 211 and a second vacuum chamber half 212 which are independent, and the first vacuum chamber half 211 and the second vacuum chamber half 212 are symmetrically distributed on both sides of the symmetry axis 400. The first vacuum chamber half 211 and the second vacuum chamber half 212 are respectively connected with a vacuum channel 30 to evacuate the first vacuum chamber half 211 and the second vacuum chamber half 212, respectively.

Further, the first vacuum chamber 21 and the second vacuum chamber 22 have a second avoiding portion 205 at a side far away from the first avoiding portion 204, the carrier 100 is provided with a notch 40 for the positioning groove 10 to enter and exit the wafer 200 along the direction of the symmetry axis 400 at the second avoiding portion 205, the notch 40 penetrates the carrier 100 along the axis direction of the positioning groove 10, and an operator or a manipulator can pick and place the wafer 200 from the notch.

In addition, a third avoidance portion 206 is provided between the first vacuum chamber half 211 and the second vacuum chamber half 212 near one side of the first avoidance portion 204, a detection hole 50 is provided at the third avoidance portion 206 along the axial direction of the positioning groove 10, a sensor 500 is provided at the third avoidance portion 206, the sensor 500 is provided corresponding to the detection hole 50, and the sensor 500 can detect whether the wafer 200 exists or not through the detection hole 50.

Further, the vacuum channel 30 is externally connected with a vacuum pumping mechanism (not shown) through a connecting pipe (not shown), and when the wafer 200 is placed on the first positioning groove 11, the vacuum pumping mechanism performs vacuum pumping on the vacuum channel 30 connected with the first vacuum cavity 21; when the wafer 200 is placed on the second positioning groove 12, the vacuum-pumping mechanism pumps vacuum through the vacuum channel 30 connected to the second vacuum chamber 22.

The foregoing is merely one specific embodiment of the utility model, and any modifications made in light of the above teachings are intended to fall within the scope of the utility model.

Claims

1. A wafer chucking stage, comprising:

a carrier plate (100);

at least two first positioning grooves (10) which are concentrically arranged and are positioned on the carrier plate (100) so as to accommodate and position wafers (200) with different sizes;

the vacuum cavities (20) are positioned on the carrier plate (100) and are arranged back to the first positioning grooves (10), the vacuum cavities (20) are in one-to-one correspondence with the first positioning grooves (10), and the vacuum cavities (20) are provided with adsorption holes (201) penetrating through the bottoms of the first positioning grooves (10);

the support plate (100) is provided with a plurality of vacuum channels (30), and the vacuum channels (30) are respectively communicated with different vacuum cavities (20).

2. The wafer suction carrier according to claim 1, wherein the vacuum chambers (20) are chambers formed along a circumferential direction of the first positioning groove (10), and a plurality of the vacuum chambers (20) are concentrically arranged.

3. The wafer chucking stage of claim 2, wherein said vacuum channel (30) extends from an edge side of said carrier plate (100) to said vacuum chamber (20) along a direction perpendicular to an axis of said first positioning groove (10).

4. The wafer chucking stage of claim 3, wherein said vacuum chamber (20) comprises a first vacuum chamber (21) and a second vacuum chamber (22) located outside of said first vacuum chamber (21), said second vacuum chamber (22) comprising separate third and fourth vacuum chamber halves (221, 222), said third and fourth vacuum chamber halves (221, 222) having a first relief (204) formed therebetween for avoiding interference with said vacuum channel (30).

5. The wafer chucking stage of claim 4, wherein said carrier plate (100) has an axis of symmetry (400), said third vacuum chamber half (221) and said fourth vacuum chamber half (222) being symmetrically disposed on opposite sides of said axis of symmetry (400).

6. The wafer chucking stage of claim 4, wherein said third vacuum chamber half (221) and said fourth vacuum chamber half (222) are each connected to one of said vacuum channels (30).

7. The wafer adsorption carrier according to claim 5, wherein the first vacuum chamber (21) comprises a first vacuum chamber half (211) and a second vacuum chamber half (212) which are independent, the first vacuum chamber half (211) and the second vacuum chamber half (212) are symmetrically distributed on two sides of the symmetry axis (400), one side of the first vacuum chamber (21) and one side of the second vacuum chamber (22) away from the first avoiding portion (204) are provided with a second avoiding portion (205), and the carrier plate (100) is provided with a notch (40) for the first positioning groove (10) to enter and exit the wafer (200) at the second avoiding portion (205) along the direction of the symmetry axis (400).

8. The wafer adsorption stage according to claim 7, wherein a third avoidance portion (206) is provided on a side of the first vacuum chamber half portion (211) and the second vacuum chamber half portion (212) close to the first avoidance portion (204), and a sensor (500) for detecting the presence or absence of the wafer (200) is provided at the third avoidance portion (206).

9. The wafer adsorption carrier according to claim 2, wherein a vacuum groove (202) is formed by recessing a back surface of the carrier plate (100) and the first positioning groove (10), and a cover plate (300) is detachably disposed on the vacuum groove (202) to form the vacuum cavity (20).

10. The wafer suction carrier of claim 4, wherein the first vacuum chamber (21) and the second vacuum chamber (22) are opened along an axial direction of the first positioning groove (10) and have the same depth.