CN219085931U - Processing device for chip - Google Patents
Processing device for chip Download PDFInfo
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- CN219085931U CN219085931U CN202222979415.0U CN202222979415U CN219085931U CN 219085931 U CN219085931 U CN 219085931U CN 202222979415 U CN202222979415 U CN 202222979415U CN 219085931 U CN219085931 U CN 219085931U
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- pressing plate
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Abstract
The utility model discloses a processing device for chips, which is characterized in that a mounting unit is used for transferring chips on a feeding belt to a packaging plate, a lower pressing plate is arranged above the packaging plate and positioned at one side of the mounting unit, a strip plate is arranged between the lower pressing plate and the packaging plate, a plurality of pressing blocks are arranged at intervals along the length direction of the strip plate, a supporting plate is arranged below the packaging plate, a guiding device is arranged between the supporting plate and the lower pressing plate, driving components for driving the lower pressing plate to press down are arranged at two sides of the limiting plate, an electric push rod is arranged parallel to the length direction of the limiting plate, a horizontally arranged sliding rail is positioned between the electric push rod and the supporting plate, a sliding block positioned in the sliding rail is fixedly connected with the movable end of the electric push rod, and a connecting rod is rotatably connected between the sliding block and the lower pressing plate. The utility model realizes the press fit fixation of the chip and the packaging area, and greatly improves the position stability of the chip, thereby improving the welding effect.
Description
Technical Field
The utility model relates to the technical field of chip processing, in particular to a processing device for chips.
Background
Along with the development of the electronic production industry, SMT (Surface Mount Technology ) is also being improved continuously, QFN is a surface mount package, and due to the small size and light weight, and the outstanding electrical and thermal properties, the development cost is also low, and the application is growing rapidly. QFN integrated circuit package is flat leadless package, and the integrated circuit is packaged on the chip by adopting a welding device.
However, in the welding process, the chip is not fixed in the prior art, so that the chip is easy to deviate, and the welding effect is poor.
Disclosure of Invention
The utility model aims to provide a processing device for a chip, which realizes press-fit fixation of the chip and a packaging area, and greatly improves the position stability of the chip, thereby improving the welding effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a processing apparatus for a chip, comprising: the packaging device comprises a conveying belt and packaging plates, wherein the two sides of the conveying belt are respectively provided with a limiting plate, the packaging plates used for placing QFN chips are arranged between the two limiting plates, the bottoms of the packaging plates are in contact with the conveying belt, a mounting unit is arranged in the middle of the conveying belt, a feeding belt is perpendicular to the axis direction of the conveying belt, and the mounting unit is used for transferring the chips on the feeding belt onto the packaging plates;
a lower pressing plate is arranged above the packaging plate and positioned at one side of the mounting unit, a slat is arranged between the lower pressing plate and the packaging plate, a plurality of pressing blocks are arranged at intervals along the length direction of the slat, a supporting plate is arranged below the packaging plate, a guiding device is arranged between the supporting plate and the lower pressing plate, and a driving component for driving the lower pressing plate to press down is arranged at two sides of the limiting plate;
the driving assembly further comprises an electric push rod, a sliding block, a sliding rail and a connecting rod, wherein the electric push rod is parallel to the length direction of the limiting plate, the sliding rail which is horizontally arranged is positioned between the electric push rod and the supporting plate, the sliding block positioned inside the sliding rail is fixedly connected with the movable end of the electric push rod, and the connecting rod is rotationally connected between the sliding block and the lower pressing plate.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the guiding device further comprises a guiding sleeve and a guiding rod, wherein the guiding sleeve arranged at the top of the supporting plate is in sliding connection with the guiding rod arranged at the bottom of the lower pressing plate.
2. In the above scheme, the conveyer belt is symmetrically arranged about the axis of the packaging plate.
3. In the scheme, the electric push rod is arranged on the limiting plate through a fixed block.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model relates to a processing device for chips, which is positioned at one side of a mounting unit and is provided with a lower pressing plate above a packaging plate, a slat is arranged between the lower pressing plate and the packaging plate, a plurality of pressing blocks are arranged at intervals along the length direction of the slat, a supporting plate is arranged below the packaging plate, a guiding device is arranged between the supporting plate and the lower pressing plate, driving components for driving the lower pressing plate to press down are arranged at two sides of a limiting plate, the lower pressing plate is driven by the driving components, so that the pressing blocks on the slat press the chips with corresponding packaging areas, the position stability of the core plate is greatly improved, the welding effect is improved, and the subsequent processing is convenient; further, its electric putter is on a parallel with the length direction setting of limiting plate, the slide rail that the level set up is located between this electric putter and the backup pad, the slider that is located the slide rail is inside is connected with electric putter's expansion end fixed connection, rotate between slider and holding down plate and be connected with the connecting rod, can realize the drive holding down plate and shift up, push down, for the mode that directly set up telescoping device between upper plate and backup pad, the connecting rod through the slope setting passes through the component and acts on the holding down plate, thereby reduced the pressure between holding down plate and the backup pad, avoid the too big circumstances that causes the chip damage of pressure between briquetting and the chip.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a processing apparatus for chips according to the present utility model;
FIG. 2 is an enlarged schematic view of the utility model at A of FIG. 1;
fig. 3 is a schematic view showing a partial structure of a processing apparatus for chips according to the present utility model.
In the above figures: 1. a conveyor belt; 2. a package plate; 3. a limiting plate; 4. a mounting unit; 5. a feed belt; 6. a lower pressing plate; 7. a slat; 8. briquetting; 9. a drive assembly; 10. an electric push rod; 11. a slide block; 12. a slide rail; 13. a connecting rod; 14. a support plate; 15. a guide device; 16. a guide sleeve; 17. a guide rod; 18. and a fixed block.
Detailed Description
The utility model is further described below with reference to the accompanying drawings and examples:
example 1: a processing apparatus for a chip, comprising: the packaging device comprises a conveying belt 1 and packaging plates 2, wherein a limiting plate 3 is arranged on two sides of the conveying belt 1, the packaging plates 2 used for placing QFN chips are arranged between the two limiting plates 3, the bottoms of the packaging plates 2 are in contact with the conveying belt 1, a plurality of packaging areas distributed at equal intervals are formed on the surface of the packaging plates 1, a mounting unit 4 is arranged in the middle of the conveying belt 1, a feeding belt 5 is arranged perpendicular to the axial direction of the conveying belt 1, and the mounting unit 4 is used for transferring chips on the feeding belt 5 onto the packaging plates 2;
coating an adhesive on each packaging area on the packaging plate, then conveying the packaging plate towards the direction of the mounting unit by the conveying belt, placing chips in each packaging area on the packaging plate by the mounting unit until the packaging plate is fully filled with the chips, conveying the packaging plate to the position below the pressing plate by the conveying belt, and pressing down a row of chips by the driving assembly by the pressing plate, so that the chips are pressed in the packaging area and are tightly attached to the packaging plate under the action of the adhesive;
a lower pressing plate 6 is arranged above the packaging plate 2 and positioned at one side of the mounting unit 4, a strip plate 7 is arranged between the lower pressing plate 6 and the packaging plate 2, a plurality of pressing blocks 8 are arranged at intervals along the length direction of the strip plate 7, QFN chips are placed between the pressing blocks 8 and corresponding packaging areas, a supporting plate 14 is arranged below the packaging plate 2, a guiding device 15 is arranged between the supporting plate 14 and the lower pressing plate 6, and a driving component 9 for driving the lower pressing plate 6 to press down is arranged at two sides of the limiting plate 3;
the driving assembly 9 further comprises an electric push rod 10, a sliding block 11, a sliding rail 12 and a connecting rod 13, wherein the electric push rod 10 is parallel to the length direction of the limiting plate 3, the sliding rail 12 which is horizontally arranged is positioned between the electric push rod 10 and the supporting plate 14, the sliding block 11 positioned in the sliding rail 12 is fixedly connected with the movable end of the electric push rod 10, and the connecting rod 13 is rotationally connected between the sliding block 11 and the lower pressing plate 6.
When the pushing driving assembly is driven, the electric push rod drives the sliding block to move in the sliding rail, and the movement of the sliding block drives the connecting rod to move;
the lower pressing plate can be driven to move upwards and downwards, and compared with a mode of directly arranging the telescopic device between the upper pressing plate and the supporting plate, the connecting rod which is obliquely arranged acts on the lower pressing plate through component force, so that the pressure between the lower pressing plate and the supporting plate is reduced, and the situation that the chip is damaged due to overlarge pressure between the pressing block and the chip is avoided.
The guide device 15 further comprises a guide sleeve 16 and a guide rod 17, and the guide sleeve 16 arranged at the top of the support plate 14 is in sliding connection with the guide rod 17 arranged at the bottom of the lower pressure plate 6.
The above-mentioned conveyor belt 1 is arranged symmetrically with respect to the axis of the package plate 2.
The electric push rod 10 is mounted on the limiting plate 3 through a fixed block 18.
Example 2: a processing apparatus for a chip, comprising: the packaging device comprises a conveying belt 1 and packaging plates 2, wherein a limiting plate 3 is arranged on two sides of the conveying belt 1, the packaging plates 2 used for placing QFN chips are arranged between the two limiting plates 3, the bottoms of the packaging plates 2 are in contact with the conveying belt 1, a plurality of packaging areas distributed at equal intervals are formed on the surface of the packaging plates 1, a mounting unit 4 is arranged in the middle of the conveying belt 1, a feeding belt 5 is arranged perpendicular to the axial direction of the conveying belt 1, and the mounting unit 4 is used for transferring chips on the feeding belt 5 onto the packaging plates 2;
a lower pressing plate 6 is arranged above the packaging plate 2 and positioned at one side of the mounting unit 4, a strip plate 7 is arranged between the lower pressing plate 6 and the packaging plate 2, a plurality of pressing blocks 8 are arranged at intervals along the length direction of the strip plate 7, QFN chips are placed between the pressing blocks 8 and corresponding packaging areas, a supporting plate 14 is arranged below the packaging plate 2, a guiding device 15 is arranged between the supporting plate 14 and the lower pressing plate 6, and a driving component 9 for driving the lower pressing plate 6 to press down is arranged at two sides of the limiting plate 3;
when the pressing unit is driven, the pressing driving assembly drives the lower pressing plate to move relative to the supporting plate until the lower pressing plate presses a row of chips on the packaging plate through the buffer assembly, the supporting plate plays a role in locally supporting the packaging plate, and the phenomenon that the supporting plate is sunken when the chips are pressed on the supporting plate is avoided.
The driving assembly 9 further comprises an electric push rod 10, a sliding block 11, a sliding rail 12 and a connecting rod 13, wherein the electric push rod 10 is parallel to the length direction of the limiting plate 3, the sliding rail 12 which is horizontally arranged is positioned between the electric push rod 10 and the supporting plate 14, the sliding block 11 positioned in the sliding rail 12 is fixedly connected with the movable end of the electric push rod 10, and the connecting rod 13 is rotationally connected between the sliding block 11 and the lower pressing plate 6.
The guide device 15 further comprises a guide sleeve 16 and a guide rod 17, and the guide sleeve 16 arranged at the top of the support plate 14 is in sliding connection with the guide rod 17 arranged at the bottom of the lower pressure plate 6.
Two conveyor belts 1 are arranged; the above-mentioned conveyor belt 1 is arranged symmetrically with respect to the axis of the package plate 2.
The working principle of the processing device for chips is that firstly, each packaging area on a packaging plate is coated with an adhesive, then, the packaging plate is conveyed towards a mounting unit by a conveying belt, the chips are placed in each packaging area on the packaging plate by the mounting unit until the packaging plate is fully filled with the chips, the packaging plate is conveyed to the position below a pressing plate by the conveying belt, and a row of chips are pressed down by the pressing plate driven by a driving assembly, so that the chips are pressed in the packaging area and are tightly attached to the packaging plate under the action of the adhesive;
when the pushing driving assembly is driven, the electric push rod drives the sliding block to move in the sliding rail, and the movement of the sliding block drives the connecting rod to move;
when the pressing unit is driven, the pressing driving assembly drives the lower pressing plate to move relative to the supporting plate until the lower pressing plate presses a row of chips on the packaging plate through the buffer assembly, the supporting plate plays a role in locally supporting the packaging plate, the phenomenon that the supporting plate is sunken when the chips are pressed on the supporting plate is avoided, the lower pressing plate can be driven to move upwards and press downwards, and compared with the mode that a telescopic device is directly arranged between the upper pressing plate and the supporting plate, the connecting rod which is obliquely arranged acts on the lower pressing plate through component force, so that the pressure between the lower pressing plate and the supporting plate is reduced, and the situation that the chips are damaged due to overlarge pressure between the pressing plate and the chips is avoided.
By adopting the processing device for the chip, the chip and the packaging area are pressed and fixed, so that the position stability of the chip is greatly improved, the welding effect is improved, and the subsequent processing is convenient; further, the connecting rod which is obliquely arranged acts on the lower pressing plate through component force, so that the pressure between the lower pressing plate and the supporting plate is reduced, and the situation that the chip is damaged due to overlarge pressure between the pressing block and the chip is avoided.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (4)
1. A processing apparatus for a chip, comprising: conveyer belt (1), encapsulation board (2), its characterized in that: the packaging plate (2) for placing QFN chips is arranged between the two limiting plates (3), the bottom of the packaging plate (2) is in contact with the conveying belt (1), a mounting unit (4) is arranged in the middle of the conveying belt (1), a feeding belt (5) is perpendicular to the axis direction of the conveying belt (1), and the mounting unit (4) is used for transferring chips on the feeding belt (5) to the packaging plate (2);
a lower pressing plate (6) is arranged above the packaging plate (2) and positioned at one side of the mounting unit (4), a strip plate (7) is arranged between the lower pressing plate (6) and the packaging plate (2), a plurality of pressing blocks (8) are arranged at intervals along the length direction of the strip plate (7), a supporting plate (14) is arranged below the packaging plate (2), a guiding device (15) is arranged between the supporting plate (14) and the lower pressing plate (6), and a driving component (9) for driving the lower pressing plate (6) to press down is arranged at two sides of the limiting plate (3);
the driving assembly (9) further comprises an electric push rod (10), a sliding block (11), a sliding rail (12) and a connecting rod (13), wherein the electric push rod (10) is parallel to the length direction of the limiting plate (3), the sliding rail (12) which is horizontally arranged is positioned between the electric push rod (10) and the supporting plate (14), the sliding block (11) which is positioned inside the sliding rail (12) is fixedly connected with the movable end of the electric push rod (10), and the connecting rod (13) is rotationally connected between the sliding block (11) and the lower pressing plate (6).
2. The processing apparatus for chips as defined in claim 1, wherein: the guide device (15) further comprises a guide sleeve (16) and a guide rod (17), and the guide sleeve (16) arranged at the top of the supporting plate (14) is in sliding connection with the guide rod (17) arranged at the bottom of the lower pressing plate (6).
3. The processing apparatus for chips as defined in claim 1, wherein: the conveying belt (1) is symmetrically arranged about the axis of the packaging plate (2).
4. The processing apparatus for chips as defined in claim 1, wherein: the electric push rod (10) is arranged on the limiting plate (3) through a fixed block (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222979415.0U CN219085931U (en) | 2022-11-09 | 2022-11-09 | Processing device for chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222979415.0U CN219085931U (en) | 2022-11-09 | 2022-11-09 | Processing device for chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219085931U true CN219085931U (en) | 2023-05-26 |
Family
ID=86398909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222979415.0U Active CN219085931U (en) | 2022-11-09 | 2022-11-09 | Processing device for chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219085931U (en) |
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2022
- 2022-11-09 CN CN202222979415.0U patent/CN219085931U/en active Active
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