CN115116916B - Lead welding device for semiconductor packaging - Google Patents
Lead welding device for semiconductor packaging Download PDFInfo
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- CN115116916B CN115116916B CN202211036884.7A CN202211036884A CN115116916B CN 115116916 B CN115116916 B CN 115116916B CN 202211036884 A CN202211036884 A CN 202211036884A CN 115116916 B CN115116916 B CN 115116916B
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- lead
- fixedly connected
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- welding
- welding head
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- 238000003466 welding Methods 0.000 title claims abstract description 119
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 239000000463 material Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000005096 rolling process Methods 0.000 description 26
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Resistance Welding (AREA)
Abstract
The invention discloses a lead welding device for semiconductor packaging, which belongs to the technical field of semiconductor packaging and comprises a welding head and a lead, wherein the top end of the welding head is fixedly connected with two connecting rods, the two connecting rods are jointly and slidably connected with a supporting rod, the mode that the lead stretches from a first welding point to the lead is changed into the mode that two first rollers convey the lead outwards from the welding head, so that the descending of the welding head is in direct proportion to the conveying of the lead, then the welding head stretches the first welding point after being completely reset from the inside of the supporting rod, and the first welding point cannot be directly stretched in the period that the welding head is not completely reset, so that the cooling time of the first welding point after being formed is prolonged, the stability of the connection of the first welding point and the lead is improved, and the problem that the welding quality is influenced by the falling of the lead and a chip of the first welding point due to the fact that the traction force is larger when the supporting rod and the welding head lift is prevented.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a lead welding device for semiconductor packaging.
Background
In the field of semiconductor packaging, leads are generally used to connect the leads, the lead frame and the chip inside the package body to achieve electrical conduction, and the leads are generally made of gold wires or copper wires and are welded and connected in an extrusion manner.
In the process of chip hot-press welding, after a welding head descends to weld a lead and a chip, namely a first welding point is formed, the welding head needs to be lifted, then the lead in the welding head is pulled out through the first welding point, the other end of the lead falls onto the joint of a pin to be welded to form a second welding point, and therefore the lead can connect the lead and the chip; however, after the welding of one end of the lead and the chip is completed, the welding head needs to be lifted upwards to stretch the lead, so that one end of the lead extends out of the welding head, and the first welding point needs to be stretched when the welding head is lifted upwards, so that the lead of the first welding point easily falls off from the chip when being subjected to a large traction force, and the quality and the efficiency of the lead welding are affected.
In view of the above, the present invention provides a wire bonding apparatus for semiconductor package to solve the above problems.
Disclosure of Invention
The present invention is directed to a wire bonding apparatus for semiconductor packaging to solve the above-mentioned problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme: a lead welding device for semiconductor packaging comprises a welding head and a lead, wherein the top end of the welding head is fixedly connected with two connecting rods, the two connecting rods are jointly and slidably connected with a supporting rod, the lead is slidably connected with the welding head and the supporting rod, and a resetting group is arranged between the two connecting rods and the supporting rod; the reset group is used for resetting the welding head, two adjusting pieces are fixedly connected to the side wall of the connecting rod close to the U-shaped rod, the two adjusting pieces are symmetrically arranged about the U-shaped rod, the bottom ends of the two adjusting pieces are bent and the bent portions extend towards the direction far away from the lead wire, the U-shaped rod is arranged above the adjusting pieces and fixedly connected to the inner wall of the supporting rod, two first limiting blocks are connected to the inner wall of the supporting rod in the U-shaped rod in a sliding mode, a second spring is fixedly connected between the two first limiting blocks and the inner wall of the U-shaped rod, the two first limiting blocks are located on the two sides of the lead wire respectively, one side of each of the two first limiting blocks is rotatably connected with a first roller, one side wall of each of the two first rollers is fixedly connected with a gear, the side wall of the connecting rod close to the gear is fixedly connected with a rack rod, the other side of each of the two first limiting blocks is rotatably connected with a rotating shaft, and the two rotating shafts are located on the inner sides of the two adjusting pieces.
As a further scheme of the invention, wedge-shaped blocks are arranged above the two connecting rods, the two wedge-shaped blocks are fixedly connected with limiting rods, the two limiting rods are connected with cross rods in a sliding mode, third springs are fixedly connected between the two limiting rods and the inner walls of the cross rods, the two cross rods are fixedly connected to the inner side walls of the supporting rods, and the two limiting rods are connected with second idler wheels in a rotating mode.
As a further scheme of the invention, the limiting rod is rectangular.
As a further scheme of the invention, the top ends of the two connecting rods are rotatably connected with third rollers.
According to a further scheme of the invention, the supporting rod is provided with a limiting groove, round rods are arranged below the two gears, push rods are fixedly connected to the two round rods, a second limiting block is fixedly connected to the two push rods, the two push rods are respectively located on two sides of a lead wire, a fourth spring is fixedly connected between the two second limiting blocks and the inner wall of the limiting groove, abutting pieces are arranged below the two round rods, the two abutting pieces are fixedly connected with the connecting rod, the two abutting pieces are respectively located on the outer sides of the two round rods, connecting pieces are rotatably connected to the bottom ends of the two abutting pieces, torsion springs are sleeved on rotating shafts of the two connecting pieces, and limiting pieces are fixedly connected to the bottom ends of the two abutting pieces.
As a further aspect of the present invention, the second roller is H-shaped, and a concave position of the second roller is the same as a width of the lead.
As a further aspect of the present invention, the first roller and the second roller are made of rubber.
The reset group comprises a first spring which is fixedly connected to the top end of the connecting rod and the inner wall of the supporting rod.
Compared with the prior art, the invention has the beneficial effects that:
1. the mode that stretches out the lead wire from the soldered connection is from the direct tensile mode that first solder joint to the lead wire changed into two first gyro wheels earlier from the mode of outside transport among the soldered connection of lead wire for the decline of soldered connection is directly proportional with the transport of lead wire, then the soldered connection is at tensile first solder joint after the bracing piece resets completely from the bracing piece is inside, can not directly stretch first solder joint in this period that the soldered connection resets completely, the cooling time of first solder joint after forming has been prolonged, the steadiness of first solder joint and pin junction has been improved, thereby prevent that the traction force when bracing piece and soldered connection lift greatly causes the lead wire and the chip of first solder joint to drop and influence welding quality's problem.
2. Two first gyro wheels carry the lead wire down when pressing from both sides tight lead wire during gear revolve for the length that two first gyro wheels slided down in the bracing piece of branch soldered connection follow is directly proportional with the length that two first gyro wheels carried the lead wire down, and the lead wire is outwards carried simultaneously when bracing piece lifting and soldered connection descend promptly, makes first solder joint always in the below of soldered connection, can extrude first solder joint when preventing that the soldered connection from sliding down and cause first solder joint to damage.
3. Lead wire and chip just contact the time can extrude first spring through the connecting rod along with the decline soldered connection of bracing piece to make the soldered connection cushion the dynamics of the direct push down of chip, cause the chip impaired when preventing that the soldered connection from directly pushing down.
Drawings
FIG. 1 is a partial schematic view of the general structure of the present invention;
FIG. 2 is a partial cross-sectional view of a brace in accordance with the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic view of the position relationship between the wedge block and the stop lever according to the present invention;
FIG. 5 is a side view of the adjustment tab of the present invention in positional relationship to the pivot;
FIG. 6 is a schematic view of the position relationship between the first stopper and the U-shaped rod according to the present invention;
FIG. 7 is a schematic view showing the positional relationship and connection relationship between the supporting sheet and the round bar according to the present invention;
fig. 8 is a partial enlarged view of fig. 7 at B.
In the drawings, the components represented by the respective reference numerals are listed below:
1. welding a head; 2. a connecting rod; 3. a support bar; 4. a first spring; 5. a rack bar; 6. a regulating sheet; 7. a U-shaped rod; 8. a first stopper; 9. a first roller; 10. a gear; 11. a rotating shaft; 12. a wedge block; 13. a limiting rod; 14. a cross bar; 15. a second roller; 16. a second spring; 17. a third roller; 18. a round bar; 19. a limiting groove; 20. a push rod; 21. a second limiting block; 22. a fourth spring; 23. pressing the slices; 24. a connecting member; 25. a torsion spring; 26. a limiting sheet; 27. a lead wire; 28. and a third spring.
Detailed Description
Referring to fig. 1-8, the present invention provides a technical solution: a lead welding device for semiconductor packaging comprises a welding head 1 and a lead 27, wherein the top end of the welding head 1 is fixedly connected with two connecting rods 2, the two connecting rods 2 are jointly and slidably connected with a supporting rod 3, the lead 27 is slidably connected with the welding head 1 and the supporting rod 3, and resetting groups are arranged between the two connecting rods 2 and the supporting rod 3; the reset group is used for resetting the welding head 1, two adjusting pieces 6 and two adjusting pieces 6 are fixedly connected to the side wall of the connecting rod 2 close to the U-shaped rod 7, the adjusting pieces 6 are symmetrically arranged and two are arranged on the U-shaped rod 7, the bottom end of each adjusting piece 6 is bent and extends towards the direction far away from the lead 27, the U-shaped rod 7 is arranged above the adjusting piece 6, the U-shaped rod 7 is fixedly connected to the inner wall of the supporting rod 3, two first limiting pieces 8 and two first limiting pieces 8 are slidably connected to the U-shaped rod 7, two second springs 16 are fixedly connected to the inner walls of the first limiting pieces 8 and the U-shaped rod 7 respectively, the first limiting pieces 8 are located on two sides of the lead 27 respectively, two first limiting pieces 8 are rotationally connected to one side of each first limiting piece 9, two first idler wheels 9 are fixedly connected to the side wall of each first idler wheel 9, a gear 10 is close to the connecting rod 2, the side wall of the gear 10 is fixedly connected to the rack bar 5, two the other sides of the first limiting pieces 8 are rotationally connected to the pivot 11, and the pivot 11 is located on two inner sides of the adjusting pieces 6.
When the scheme is put into practical use, the supporting rod 3 is connected with the wire welding device, the supporting rod 3 descends to drive the welding head 1 to descend after the chip is placed, after the lead 27 is contacted with the top of the chip, the welding head 1 can slide and ascend towards the inside of the supporting rod 3 through the two connecting rods 2 and compress the resetting group when ascending, the two connecting rods 2 can drive the rack rod 5 and the two adjusting sheets 6 to oppositely ascend with the U-shaped rod 7 when sliding towards the inside of the supporting rod 3, the welding head 1 can continuously press the lead 27 when sliding towards the inside of the supporting rod 3, the resetting group can be slowly compressed to the limit position by the connecting rods 2 along with the continuous descending of the supporting rod 3, and the bottom ends of the two adjusting sheets 6 also ascend to the upper parts of the two rotating shafts 11, when the bottom ends of the two adjusting pieces 6 are about to rise or do not rise above the two rotating shafts 11, the bottom ends of the two adjusting pieces 6 are positioned at the inner sides of the two rotating shafts 11, the two rotating shafts 11 can be pushed to slide for a short distance along the U-shaped rod 7 in the direction away from the lead 27 along with the rising of the connecting rod 2 when the inclined parts of the bottom ends of the two adjusting pieces 6 rise to be in contact with the two rotating shafts 11, the two rotating shafts 11 drive the two first rollers 9 and the two gears 10 to move through the two first limiting blocks 8 when sliding outwards, the two first rollers 9 are not in contact with the lead 27 under the conventional condition, and the two first rollers 9 can reset to the initial positions under the action of the second spring 16 when the bottom ends of the two adjusting pieces 6 rise above the two rotating shafts 11;
the lead 27 is heated in the process that the welding head 1 presses the lead 27 downwards, so that the contact position of the lead 27 and a chip becomes a first welding point, the support rod 3 is lifted after the first welding point is formed, the reset group gradually pushes the connecting rod 2 and the welding head 1 to reset when the support rod 3 is lifted, at the moment, the connecting rod 2 and the welding head 1 relative to the support rod 3 descend, the connecting rod 2 drives the rack bar 5 and the two adjusting sheets 6 to descend when descending, the inclined ends of the bottom ends of the two adjusting sheets 6 push the two rotating shafts 11 to move towards the direction close to the lead 27 and stretch the second spring 16 when descending, the two rotating shafts 11 drive the two first rollers 9 to extrude the lead 27 through the two first limiting blocks 8 when moving, at the moment, the two gears 10 are meshed with the position of the rack bar 5 close to the bottom end, the adjusting sheets 6 limit the rotating shafts 11, the rack bar 5 descends between the two gears 10 along with the descending of the welding head 1 and drives the two gears 10 to rotate, when the gears 10 rotate, the two first rollers 9 clamp the lead 27 and simultaneously convey the lead 27 downwards, so that the welding point is lifted directly proportional to the length of the first welding head 1 when the welding head 1 is conveyed, and the first welding head 1 is prevented from being conveyed outwards; the mode that the lead 27 extends out of the welding head 1 is changed from the mode that the lead 27 is directly stretched by a first welding point to the mode that the two first rollers 9 firstly convey the lead 27 outwards from the welding head 1, so that the descending of the welding head 1 is in direct proportion to the conveying of the lead 27, then the welding head 1 is completely reset from the inside of the supporting rod 3, the first welding point is stretched, the first welding point cannot be directly stretched in the period that the welding head 1 is not completely reset, the cooling time of the first welding point after being formed is prolonged, the stability of the connection of the first welding point and the lead 27 is improved, the problem that the lead 27 of the first welding point is separated from a chip to influence the welding quality due to the fact that the traction force is large when the supporting rod 3 and the welding head 1 are lifted is solved, the supporting rod 3 is required to be lowered again after the welding head 1 moves to the position of a second welding point, and the welding head 1 is laterally separated to cut off the welding wire after the second welding point is formed;
in addition, as seen from the schematic diagram, the lead 27 between the two first rollers 9 and the top of the bonding head 1 is sleeved with a limiting sleeve, so that the lead 27 is prevented from being bent in the conveying process.
As a further scheme of the invention, wedge-shaped blocks 12 are arranged above the two connecting rods 2, both the two wedge-shaped blocks 12 are fixedly connected with limiting rods 13, both the two limiting rods 13 are slidably connected with cross rods 14, a third spring 28 is fixedly connected between the two limiting rods 13 and the inner walls of the cross rods 14, the two cross rods 14 are fixedly connected on the inner side walls of the supporting rods 3, and the two limiting rods 13 are jointly and rotatably connected with second rollers 15.
Above-mentioned scheme is at the during operation, bracing piece 3 is when pressing soldered connection 1 down, soldered connection 1 can be to bracing piece 3 inside slip, the lead wire 27 between bracing piece 3 and two first gyro wheels 9 can buckle or the more mixed and disorderly condition appears when soldered connection 1 slides to bracing piece 3 inside through two connecting rods 2, two wedge 12 can be promoted on two connecting rod 2 tops when soldered connection 1 slides to bracing piece 3 inside, two wedge 12 can slide along the direction to being close to lead wire 27 through gag lever post 13 respectively when two connecting rod 2 promote two wedge 12, can extrude third spring 28 and drive second gyro wheel 15 contact lead wire 27 when two wedge 12 slide, drag lead wire 27 through second gyro wheel 15, prevent that lead wire 27 from appearing the degree of buckling great and influencing subsequent use.
As a further scheme of the invention, the limiting rod 13 is rectangular.
Above-mentioned scheme is at the during operation, and the gag lever post 13 of rectangle can also carry out self spacing when gag lever post 13 is inside to slide.
As a further scheme of the invention, the top ends of the two connecting rods 2 are rotatably connected with third rollers 17.
When the scheme works, when the welding head 1 slides and rises along the support rod 3 through the two connecting rods 2, the two connecting rods 2 are in contact with the wedge block 12 through the two third rollers 17 and push the wedge block 12, and the friction force can be reduced through the third rollers 17.
As a further scheme of the present invention, a limiting groove 19 is formed in the support rod 3, round rods 18 are respectively disposed below the two gears 10, push rods 20 are respectively fixedly connected to the two round rods 18, second limiting blocks 21 are respectively fixedly connected to the two push rods 20, the two push rods 20 are respectively located at two sides of a lead 27, fourth springs 22 are respectively fixedly connected between the two second limiting blocks 21 and an inner wall of the limiting groove 19, abutting pieces 23 are respectively disposed below the two round rods 18, the two abutting pieces 23 are fixedly connected to the connecting rod 2, the two abutting pieces 23 are respectively located at outer sides of the two round rods 18, connecting pieces 24 are respectively rotatably connected to bottom ends of the two abutting pieces 23, torsion springs 25 are respectively sleeved on rotating shafts of the two connecting pieces 24, and limiting pieces 26 are respectively fixedly connected to bottom ends of the two abutting pieces 23.
When the scheme works, under the action of the two fourth springs 22, the two second limiting blocks 21 are in clamping with the lead 27 under the initial condition, when the connecting rod 2 slides and rises relative to the supporting rod 3, the two abutting pieces 23 are driven to rise, when the two abutting pieces 23 rise, the two connecting pieces 24 are driven to rise, when the two connecting pieces 24 rise to be in contact with the two round rods 18, the two connecting pieces 24 are stirred by the round rods 18 and rotate around the rotating shafts, when the two connecting pieces 24 rotate around the rotating shafts, the torsion springs 25 are compressed, when the two connecting rods 2 slide to the limit positions, the two connecting pieces 24 are located above the round rods 18, at the moment, the adjusting pieces 6 are also located above the two rotating shafts 11, the supporting rod 3 is lifted after the first welding point is formed, when the supporting rod 3 is lifted, the two connecting rods 2 and the welding head 1 slide and fall relative to the supporting rod 3, when the connecting rod 2 slides and falls relative to the supporting rod 3, the two abutting pieces 23 and the two connecting pieces 24 are driven to fall, when the two connecting pieces 24 fall, the two connecting pieces 24 can be in contact with the two round rods 18 move towards the direction close to the lead 27 when the second limiting blocks 21 are removed from the second limiting blocks 21, so that the lead 21 is far away from the second limiting blocks 21 and the second limiting blocks 27, so that the second lead 27 are far away from the second lead 27, and the second lead is transported by the second limiting blocks 21, thereby, and the second limiting blocks 27, and the second push rod 27, thereby enabling the second push rod to be separated from the second push rod 27;
when the two second limiting blocks 21 clamp the lead 27, the lead 27 with the first welding point formed cannot be pulled upwards when the second roller 15 plays a role in drawing the lead 27, so that the welding quality of the first welding point is prevented from being influenced.
As a further aspect of the present invention, the second roller 15 has an H shape, and the recessed position of the second roller 15 is the same as the width of the lead 27.
When the scheme works, the second roller 15 is in an H shape, when the second roller 15 is in contact with the lead 27, the functions of traction and tension can be achieved, the lead 27 is contained and limited, and therefore the lead 27 is prevented from inclining.
As a further aspect of the present invention, the first roller 9 and the second roller 15 are both made of rubber.
When the scheme works, the rubber first roller 9 and the rubber second roller 15 have large friction force and can avoid static electricity, and the first roller 9 is prevented from idling when the lead 27 is conveyed through the rubber first roller 9.
The reset group comprises a first spring 4, and the first spring 4 is fixedly connected to the top end of the connecting rod 2 and the inner wall of the support rod 3.
When the reset group works, the lead 27 just contacts with the chip, the welding head 1 can extrude the first spring 4 through the connecting rod 2 along with the descending of the supporting rod 3, so that the welding head 1 can buffer the force of directly pressing the chip, and the chip is prevented from being damaged when the welding head 1 directly presses down.
The working principle is as follows: the supporting rod 3 is connected with a wire bonding device, after a chip is placed, the supporting rod 3 descends to drive the welding head 1 to descend, after the lead 27 is in contact with the top of the chip, the welding head 1 can slide and ascend towards the inside of the supporting rod 3 through the two connecting rods 2 and compress the reset group when ascending, the two connecting rods 2 can drive the rack rod 5 and the two adjusting sheets 6 to be opposite to each other and the U-shaped rod 7 to ascend when sliding towards the inside of the supporting rod 3, the welding head 1 can continuously press down the lead 27 when sliding towards the inside of the supporting rod 3, the reset group can be slowly compressed to the limit position along with continuous descending of the supporting rod 3, the bottom ends of the two adjusting sheets 6 also ascend above the two rotating shafts 11 at the moment, when the bottom ends of the two adjusting sheets 6 are about to ascend or do not ascend above the two rotating shafts 11, the bottommost ends of the two adjusting sheets 6 are located at the inner sides of the two rotating shafts 11, when the inclined parts of the bottom ends of the two adjusting sheets 6 ascend with the connecting rod 2 are in contact with the two rotating shafts 11, the two rotating shafts 11 can push the two rotating shafts 11 to slide a distance along the U-shaped rod 7 towards the direction away from the lead 27, when the inclined parts of the two first adjusting sheets 8 and the two rollers 9 are not used for driving the first rolling wheels 9, and when the two rolling wheels 9, and the two rolling wheels 9 are used as the first rolling wheels 16, and when the two rolling wheels 9, when the two rolling wheels are used for moving, and when the two rolling wheels 11 are used as the first rolling wheels 16, when the two rolling wheels and the two rolling wheels 9, when the two rolling wheels 11 are used for moving, the first rolling wheels 9, and when the first rolling wheels 9, the two rolling wheels are used for moving, when the two rolling wheels 9, the first rolling wheels 11 are used for moving, the second rolling wheels 16, the first rolling wheels are used for moving, and the second rolling wheels 16, when the second rolling wheels are used for moving, when the first rolling wheels 11, when the first rolling wheels 9, and the second rolling wheels 11 for moving, when the second rolling wheels 9, when the first rolling wheels 11 is used for moving, when the first rolling wheels, when the first;
the lead 27 is heated in the process that the welding head 1 presses the lead 27 downwards, so that the contact position of the lead 27 and a chip becomes a first welding point, the support rod 3 is lifted after the first welding point is formed, the reset group gradually pushes the connecting rod 2 and the welding head 1 to reset when the support rod 3 is lifted, at the moment, the connecting rod 2 and the welding head 1 relative to the support rod 3 descend, the connecting rod 2 drives the rack bar 5 and the two adjusting sheets 6 to descend when descending, the inclined ends of the bottom ends of the two adjusting sheets 6 push the two rotating shafts 11 to move towards the direction close to the lead 27 and stretch the second spring 16 when descending, the two rotating shafts 11 drive the two first rollers 9 to extrude the lead 27 through the two first limiting blocks 8 when moving, at the moment, the two gears 10 are meshed with the position of the rack bar 5 close to the bottom end, the adjusting sheets 6 limit the rotating shafts 11, the rack bar 5 descends between the two gears 10 along with the descending of the welding head 1 and drives the two gears 10 to rotate, when the gears 10 rotate, the two first rollers 9 clamp the lead 27 and simultaneously convey the lead 27 downwards, so that the welding point is lifted directly proportional to the length of the first welding head 1 when the welding head 1 is conveyed, and the first welding head 1 is prevented from being conveyed outwards; the mode that the lead 27 extends out of the welding head 1 is changed from the mode that the lead 27 is directly stretched by a first welding point to the mode that the two first rollers 9 firstly convey the lead 27 outwards from the welding head 1, so that the descending of the welding head 1 is in direct proportion to the conveying of the lead 27, then the welding head 1 is completely reset from the inside of the supporting rod 3, the first welding point is stretched, the first welding point cannot be directly stretched in the period that the welding head 1 is not completely reset, the cooling time of the first welding point after being formed is prolonged, the stability of the connection of the first welding point and the lead 27 is improved, the problem that the lead 27 of the first welding point is separated from a chip to influence the welding quality due to the fact that the traction force is large when the supporting rod 3 and the welding head 1 are lifted is solved, the supporting rod 3 is required to be lowered again after the welding head 1 moves to the position of a second welding point, and the welding head 1 is laterally separated to cut off the welding wire after the second welding point is formed;
in addition, as seen from the schematic diagram, the lead 27 between the two first rollers 9 and the top of the bonding head 1 is sleeved with a limiting sleeve, so that the lead 27 is prevented from being bent in the conveying process.
Claims (8)
1. A wire bonding apparatus for semiconductor packaging, comprising a bonding head (1) and a wire (27), characterized in that: the top end of the welding head (1) is fixedly connected with two connecting rods (2), the two connecting rods (2) are jointly connected with a supporting rod (3) in a sliding mode, the lead (27) is connected with the welding head (1) and the supporting rod (3) in a sliding mode, and a resetting group is arranged between the two connecting rods (2) and the supporting rod (3); the resetting group is used for resetting the welding head (1), the side walls of the connecting rods (2) close to the U-shaped rods (7) are fixedly connected with two adjusting pieces (6), the two adjusting pieces (6) are symmetrically arranged relative to the U-shaped rods (7), the bottom ends of the two adjusting pieces (6) are bent and the bent portions extend in the direction away from the lead 27, the U-shaped rods (7) are arranged above the adjusting pieces (6), the U-shaped rods (7) are fixedly connected to the inner walls of the supporting rods (3), the U-shaped rods (7) are slidably connected with two first limiting blocks (8), two second springs (16) are fixedly connected between the first limiting blocks (8) and the inner walls of the U-shaped rods (7), the two first limiting blocks (8) are respectively located on two sides of the lead (27), one sides of the first limiting blocks (8) are respectively rotatably connected with first idler wheels (9), the side walls of the two first idler wheels (9) are respectively fixedly connected with gears (10), the side walls of the connecting rods (2) close to the gears (10) are fixedly connected with rack rods (5), the two first limiting blocks (8) are respectively rotatably connected with the other sides of the first idler wheels (8), and the two rotating shafts (11) are respectively located on the inner sides of the two adjusting pieces (11), and the two adjusting pieces (11) are respectively located on the inner sides of the rotating shafts (11).
2. A wire bonding apparatus for a semiconductor package according to claim 1, wherein: two connecting rod (2) top all is provided with wedge (12), two equal fixedly connected with gag lever post (13), two of wedge (12) equal sliding connection has horizontal pole (14), two fixedly connected with third spring (28), two between gag lever post (13) and horizontal pole (14) inner wall horizontal pole (14) fixed connection is on bracing piece (3) inside wall, two gag lever post (13) rotate jointly and are connected with second gyro wheel (15).
3. A wire bonding apparatus for semiconductor packages according to claim 2, wherein: the limiting rod (13) is rectangular.
4. A wire bonding apparatus for a semiconductor package according to claim 1, wherein: the top ends of the two connecting rods (2) are rotatably connected with third rollers (17).
5. A wire bonding apparatus for a semiconductor package according to claim 1, wherein: spacing groove (19) have been seted up in bracing piece (3), two gear (10) below all is provided with round bar (18), two equal fixedly connected with push rod (20) in round bar (18), two equal fixedly connected with second stopper (21) in push rod (20), two push rod (20) are located the both sides of lead wire (27) respectively, two equal fixedly connected with fourth spring (22), two between second stopper (21) and spacing groove (19) inner wall round bar (18) below all is provided with supports film-making (23), two support film-making (23) and connecting rod (2) fixed connection, two support film-making (23) and be located two respectively the outside of round bar (18), two it all rotates to be connected with connecting piece (24) to support film-making (23) bottom, two torsional spring (25), two have all been cup jointed to the axis of rotation of connecting piece (24) the equal fixedly connected with spacing piece (26) in bottom of support film-making (23).
6. A wire bonding apparatus for semiconductor packages according to claim 2, wherein: the second roller (15) is H-shaped, and the concave position of the second roller (15) is the same as the width of the lead (27).
7. A wire bonding apparatus for semiconductor packages according to claim 2, wherein: the first roller (9) and the second roller (15) are made of rubber materials.
8. A wire bonding apparatus for a semiconductor package according to claim 1, wherein: the reset group comprises a first spring (4), and the first spring (4) is fixedly connected to the top end of the connecting rod (2) and the inner wall of the supporting rod (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211036884.7A CN115116916B (en) | 2022-08-29 | 2022-08-29 | Lead welding device for semiconductor packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211036884.7A CN115116916B (en) | 2022-08-29 | 2022-08-29 | Lead welding device for semiconductor packaging |
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| CN115116916A CN115116916A (en) | 2022-09-27 |
| CN115116916B true CN115116916B (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211036884.7A Active CN115116916B (en) | 2022-08-29 | 2022-08-29 | Lead welding device for semiconductor packaging |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116604227A (en) * | 2023-05-04 | 2023-08-18 | 江苏纳沛斯半导体有限公司 | Lead wire welding mechanism for semiconductor packaging |
| CN117644329B (en) * | 2023-12-22 | 2024-08-06 | 泰州市亚源电子科技有限公司 | Lead welding equipment based on semiconductor integrated circuit packaging process |
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| CN115116916A (en) | 2022-09-27 |
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Address after: 629000 No. 2 Suharitao Science and Technology Park, 73 Chunxiao Road, East of Rose Avenue, Chuanshan Logistics Port, Suining City, Sichuan Province Patentee after: Sichuan Xinhe Microelectronics Co.,Ltd. Address before: 629000 No. 2 Suharitao Science and Technology Park, 73 Chunxiao Road, East of Rose Avenue, Chuanshan Logistics Port, Suining City, Sichuan Province Patentee before: Suining Hexin Semiconductor Co.,Ltd. |