CN114473280A - Chip packaging wire welding device - Google Patents
Chip packaging wire welding device Download PDFInfo
- Publication number
- CN114473280A CN114473280A CN202210168095.2A CN202210168095A CN114473280A CN 114473280 A CN114473280 A CN 114473280A CN 202210168095 A CN202210168095 A CN 202210168095A CN 114473280 A CN114473280 A CN 114473280A
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- welding head
- welding
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- die
- wire
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- 238000003466 welding Methods 0.000 title claims abstract description 193
- 238000004806 packaging method and process Methods 0.000 title abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 36
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 8
- 239000007789 gas Substances 0.000 description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000006872 improvement Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 208000028659 discharge Diseases 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 230000003578 releasing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0252—Steering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to the technical field of chip packaging, in particular to a chip packaging wire welding device which comprises a rack, wherein a first welding head is arranged on the rack, a second welding head is arranged on one side of the first welding head, the second welding head comprises a second welding head die, a pressing ring is arranged at one end of the second welding head die, and a gap is formed in one side of the pressing ring; the second welding head is arranged for assisting the first welding head in welding, when the lead is welded to the first welding point, the pressing ring can press the spherical head of the lead to the first welding point, the spherical head is temporarily and fixedly connected with the first welding point through the pressing acting force, so that the first welding head can directly route the lead to the second welding point without waiting for the lead to be completely welded and fixed with the first welding point, and the effect of improving the welding efficiency is achieved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a chip packaging wire bonding device.
Background
The chip is also called microcircuit, microchip, integrated circuit, refers to a silicon chip containing integrated circuit, has small volume, and is often a part of computer or other electronic equipment; the wire bonding machine is used for realizing surface welding of different media and is a physical change process; during wire welding, firstly, high-voltage discharge treatment is carried out on the head end of the lead, then preheating treatment is carried out on the welded metal surface, then the lead generates plastic deformation on the metal welding surface under the combined action of time and pressure, so that two media are reliably contacted, and a metal bond is formed between two metal atoms under the action of atomic affinity through ultrasonic friction vibration, so that the welding of the lead is realized.
The prior art has the following problems:
the bonding tool needs to pass through a set path after welding the first welding spot of the chip, move up earlier, then walk reverse distance with the reverse angle of keeping away from the second welding spot, move to the second welding spot with the arc route that moves down towards the position of second welding spot again, form an arched lead wire at last, its in-process, the reverse distance is walked to reverse angle to the bonding tool, be for reserving length, prevent that direct forward from walking the line and lead to the lead wire to be dragged the fracture or drop, but this process, the displacement distance and the time of bonding tool have also been increased simultaneously, lead to welding efficiency to reduce.
Disclosure of Invention
The present invention is directed to a chip package bonding wire apparatus to solve the above problems.
The technical scheme of the invention is as follows: a chip packaging wire welding device comprises a rack, wherein a first welding head is arranged on the rack, a second welding head is arranged on one side of the first welding head, the second welding head comprises a second welding head die, a pressing ring is arranged at one end of the second welding head die, and a gap is formed in one side of the pressing ring;
the second welding head is connected with a second longitudinal and transverse moving table in a liftable mode, and the second longitudinal and transverse moving table is rotatably arranged on the rack.
Further, the first welding head comprises a first welding head die, one side of the lower end of the first welding head die is provided with a wedge-shaped bulge, the angle of the wedge-shaped bulge distributed along the circumferential direction of the lower end of the first welding head die is larger than 90 degrees, and the height of the bottom of the wedge-shaped bulge is larger than that of the lower end of the first welding head die;
the lower end of the first welding head die is conical, a circular through hole is formed in the center of the first welding head die, a first amplitude transformer is connected to one side of the first welding head die, and a first energy converter is connected to one end of the first amplitude transformer.
Furthermore, one side of the first energy converter is connected with a first lifting frame, one side of the first lifting frame is provided with a first telescopic cylinder, one end of the first telescopic cylinder is connected with a rotating frame, and the rotating frame is rotatably connected with the rack.
Furthermore, the periphery of the rotating frame is annular, a circular hole is formed in the middle of the rack, the rotating frame is arranged in the circular hole, and the outer wall of the rotating frame is rotatably connected with the inner wall of the circular hole;
and a first longitudinal and transverse moving table is arranged at the bottom of one side of the rack.
Furthermore, the diameter of the round hole in the middle of the compression ring corresponds to the diameter of the through hole in the center of the first welding head die, and the width of the notch on one side of the compression ring corresponds to the diameter of the round hole.
Furthermore, one side of the second welding head die is connected with a second amplitude transformer, one end of the second amplitude transformer is connected with a second energy converter, one side of the second energy converter is connected with a second lifting frame, a second telescopic cylinder is arranged on the second lifting frame, and one end of the second telescopic cylinder is connected with a second longitudinal and transverse moving table.
Furthermore, the second vertical and horizontal moving platform comprises a horizontal screw rod sliding table and a vertical screw rod sliding table which are arranged in a crossed manner, and the horizontal screw rod sliding table is connected with one end of the second telescopic cylinder.
Furthermore, a sparking rod and a protective gas output pipe are respectively arranged on two sides of the compression ring, and are fixedly arranged on the rotating frame;
the wire barrel is arranged on the rack, a lead is wound on the wire barrel, and one end, far away from the wire barrel, of the lead penetrates through the middle of the pressing ring and the first welding head die.
Furthermore, a threading hole is formed in the rack, the position of the threading hole is vertically aligned with a through hole in the middle of the first welding head die, an automatic wire clamp is arranged on the threading hole, the automatic wire clamp comprises 2 clamping blocks, a gas transmission channel, a cylindrical cavity, a piston and a reset spring, the 2 clamping blocks are symmetrically arranged on two sides of the threading hole, one sides, far away from the 2 clamping blocks, of the 2 clamping blocks extend into the cylindrical cavities on two sides of the threading hole respectively, one ends, located in the cylindrical cavity, of the clamping blocks are connected with the piston, the piston is in sliding connection with the cylindrical cavity, one ends, far away from the threading hole, of the cylindrical cavity are communicated with the gas transmission channel, and the gas transmission channels on two sides of the threading hole are communicated with each other;
one side of the piston, which is close to the threading hole, is connected with a return spring, and one end of the return spring is propped against the inner wall of one end of the cylindrical cavity.
Furthermore, the machine frame is provided with wire clamping positioning wheels, the wire clamping positioning wheels are provided with a plurality of groups, each group is provided with 2 wire clamping positioning wheels, the 2 wire clamping positioning wheels in each group are symmetrically arranged on two sides of the lead, and the wire clamping positioning wheels in at least one group are connected with a motor;
the multi-group wire clamping positioning wheels comprise a longitudinal distribution group and a transverse distribution group, and the longitudinal distribution group and the transverse distribution group are distributed in a staggered mode at intervals.
The invention provides a chip packaging wire bonding device through improvement, compared with the prior art, the chip packaging wire bonding device has the following improvement and advantages:
one is as follows: according to the invention, the second welding head is used for assisting in being matched with the first welding head to weld, when the lead is welded to the first welding point, the pressing ring can press the spherical head of the lead at the position of the first welding point, and the spherical head is temporarily and fixedly connected with the first welding point through the pressing acting force, so that the first welding head can directly route the lead to the second welding point without waiting for the complete welding and fixation of the lead and the first welding point, and the effect of improving the welding efficiency is achieved;
the second step is as follows: according to the invention, the cross section of the compression ring is circular, when the lead is pulled to one side of the compression ring, the arc-shaped outer wall surface of the compression ring can provide a uniform and smooth supporting effect for the lead, the lead does not need to go through a reverse angle and a reverse distance, a shape supply path can be stably formed, and the lead is not broken or dropped by direct pulling, so that the purpose of reducing the moving path of the lead is achieved, the moving path is shorter, the speed of moving a first welding head to a second welding point is higher, the effect of improving the welding efficiency is achieved, the shorter moving path is provided, the consumable material of each lead is lower, and after direct pulling, the lead arch height is lower, the lower the arch height is, the lead joint length is reduced, and the insertion loss is also smaller;
and thirdly: in the invention, the pressure ring is driven by the second welding head die of the second welding head to independently weld the first welding point, the first welding head can directly move to the second welding point during the welding of the first welding point, and the first welding head and the second welding head can independently operate and are matched with each other, so that the welding efficiency is higher;
fourthly, the method comprises the following steps: according to the invention, when the lead wire is welded with the second welding spot by the first welding head die, the wedge-shaped bulge can be pressed on the connecting end of the lead wire and the second welding spot, and the bonding surface of the lead wire and the second welding spot is larger due to the wedge-shaped pressing surface, so that the purpose of improving the bonding strength of the lead wire and the second welding spot is achieved;
and fifthly: according to the threading device, the gas transmission channel is connected with the gas pump, gas can simultaneously enter the cylindrical cavities on two sides of the threading hole through the gas transmission channel to extrude the piston, so that the piston can simultaneously push 2 clamping blocks to the middle of the threading hole, and thus a lead penetrating through the middle of the threading hole can be automatically clamped, and the lead can be kept stable when needed;
and the sixth step: according to the wire clamping and pushing device, the plurality of groups of wire clamping and positioning wheels which are longitudinally distributed and transversely distributed can clamp and push the lead wires from a plurality of angles, so that the lead wires can be ensured to be vertical, and the lead wires are prevented from being deviated.
Drawings
The invention is further explained below with reference to the figures and examples:
FIG. 1 is a front view of the present invention;
FIG. 2 is an enlarged schematic view of the invention at A in FIG. 1;
FIG. 3 is a schematic view of the distribution structure of the positions of the sparking rod and the shielding gas outlet pipe and the pressure ring according to the present invention;
FIG. 4 is a schematic view of a routable angle of the pressure ring of the present invention;
FIG. 5 is an elevation view of a second bonding tool mold and pressure ring of the present invention;
FIG. 6 is a cross-sectional view of a first weld head die and wedge projection of the present invention;
FIG. 7 is a cross-sectional view taken at c-c of FIG. 6 of the present invention;
FIG. 8 is a schematic drawing of the lead of the present invention in a pulled state after it has been bonded to a first bond pad;
FIG. 9 is a structural view illustrating a cut-off state of a lead wire bonded to a second bonding pad according to the present invention;
FIG. 10 is an enlarged view of the structure of FIG. 1 at B in accordance with the present invention;
FIG. 11 is a top view of the housing of the present invention;
fig. 12 is an enlarged schematic view of the structure of fig. 11 at D according to the present invention.
Description of reference numerals: 1. the welding device comprises a rack, 2, a first longitudinal and transverse moving platform, 3, a sparking rod, 4, a second telescopic cylinder, 5, a second lifting frame, 6, a second welding head, 61, a second transducer, 62, a second amplitude transformer, 63, a second welding head mould, 631, a pressing ring, 7, a second longitudinal and transverse moving platform, 71, a transverse lead screw sliding table, 72, a longitudinal lead screw sliding table, 8, a first welding head, 81, a first transducer, 82, a first amplitude transformer, 83, a first welding head mould, 831, a wedge-shaped bulge, 9, an automatic wire clamp, 91, an air transmission channel, 92, a cylindrical cavity, 93, a piston, 94, a reset spring, 95, a clamping block, 10, a wire clamping positioning wheel, 101, a motor, 11, a rotating frame, 12, a first lifting frame, 13, a first telescopic cylinder, 14, a wire barrel, 15, a protective gas output pipe, 16 and a lead wire.
Detailed Description
The present invention is described in detail below, and technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a chip packaging wire welding device through improvement, as shown in fig. 1-12, the chip packaging wire welding device comprises a frame 1, wherein a first welding head 8 is arranged on the frame 1, a second welding head 6 is arranged on one side of the first welding head 8, the second welding head 6 comprises a second welding head mold 63, a press ring 631 is arranged at one end of the second welding head mold 63, and a notch is arranged on one side of the press ring 631;
the second welding head 6 is connected with a second longitudinal and transverse moving platform 7 in a lifting way, and the second longitudinal and transverse moving platform 7 is rotatably arranged on the rack 1.
The second welding head 6 is used for assisting in being matched with the first welding head 8 to weld, when the lead 16 is welded to the first welding point, the pressing ring 631 can press the spherical head of the lead 16 at the position of the first welding point, and the spherical head is temporarily and fixedly connected with the first welding point through the pressing acting force, so that the first welding head 8 can move away from the first welding head 8 without waiting for a certain time for the existing welding when the lead 16 is completely welded and fixed with the first welding point, and the wire can be directly routed to the second welding point, and the effect of improving the welding efficiency is achieved;
the cross section of clamping ring 631 is circular, when lead 16 was pulled to its one side, its convex outer wall surface can provide even smooth supporting effect for lead 16, let lead 16 need not to walk reverse angle and reverse distance, also can be stable form a confession shape route, direct traction can not break and drop, thereby reach the purpose that reduces lead 16 movement path, shorter movement path, let first soldered connection 8 move to the speed of second solder joint faster, thereby reach the effect that improves welding efficiency, and shorter movement path, let the consumptive material of every lead wire lower, and direct pull back, lead 16 arch height is lower, the lower lead bonding length of arch height reduces, insertion loss is also littleer.
And the second bonding tool mould 63 through second bonding head 6 drives clamping ring 631 and carries out independent welding to first solder joint position, and in first solder joint welding was gone on, first bonding head 8 alright directly move towards the second solder joint, and first bonding head 8 and the operation that second bonding head 6 can be independent, and mutually support to let welding efficiency higher.
The first welding head 8 has an angular range of at least 90 °, as shown in fig. 4, within which 90 ° the first welding head 8 can move directly, and the outer wall surface of the pressure ring 631 can provide a complete support effect for the drawn wire.
The first welding head 8 comprises a first welding head die 83, a wedge-shaped protrusion 831 is arranged on one side of the lower end of the first welding head die 83, the angle of the wedge-shaped protrusion 831 distributed along the circumferential direction of the lower end of the first welding head die 83 is larger than 90 degrees, and the height of the bottom of the wedge-shaped protrusion 831 is larger than that of the lower end of the first welding head die 83; the wedge-shaped protrusions 831 distributed at 90 degrees can enable the first welding head die 83 to form wedge-shaped pressing on the lead 16 at least without changing directions when the first welding head die moves to an angle range of 90 degrees at will, and enable the angle range of the wedge-shaped pressing of the first welding head 8 to be larger;
the lower end of the first horn die 83 is conical, a circular through hole is formed in the center of the first horn die 83, a first amplitude transformer 82 is connected to one side of the first horn die 83, and a first transducer 81 is connected to one end of the first amplitude transformer 82.
When the first bonding tool mold 83 bonds the lead 16 with the second welding point, the wedge-shaped protrusion 831 can press the connecting end of the lead 16 and the second welding point, and the wedge-shaped pressing surface enables the bonding surface of the lead 16 and the second welding point to be larger, so that the purpose of improving the bonding strength of the lead 16 and the second welding point is achieved.
One side of the first transducer 81 is connected with a first lifting frame 12, one side of the first lifting frame 12 is provided with a first telescopic cylinder 13, one end of the first telescopic cylinder 13 is connected with a rotating frame 11, and the rotating frame 11 is rotatably connected with the rack 1; the telescopic cylinder 13 can be an air cylinder or an electric cylinder, the first telescopic cylinder 13 can be lifted and lowered by stretching and pushing the first transducer 81, so that the first welding head mold 83 is lifted and lowered, and the rotating frame 11 can adjust the working angle of the first welding head mold 83 by rotation.
The periphery of the rotating frame 11 is annular, a circular hole is formed in the middle of the rack 1, the rotating frame 11 is arranged in the circular hole, and the outer wall of the rotating frame 11 is rotatably connected with the inner wall of the circular hole; a gear ring is sleeved outside the rotating frame 11, one side of the gear ring is meshed and connected with a gear, the gear is driven by a driving motor to rotate, and the rotating frame 11 can stably rotate on the rack 1;
the bottom of one side of frame 1 is provided with first vertical transverse mobile station 2, and the structural principle of first vertical transverse mobile station 2 is the same with the structural principle of second vertical transverse mobile station 7, comprises two lead screw slip tables that the cross distributes, and it can drive first soldered connection 8 and second soldered connection 6 vertical and transverse displacement simultaneously.
The diameter of the circular hole in the middle of the pressure ring 631 corresponds to the diameter of the through hole in the center of the first welding head die 83, and the width of the gap on one side of the pressure ring 631 corresponds to the diameter of the circular hole; the notch is used for allowing the lead 16 to pass through, so that the pressing ring 631 can be sleeved on the lead 16, and the lead 16 can be separated from the pressing ring 631.
One side of the second welding head die 63 is connected with a second amplitude transformer 62, one end of the second amplitude transformer 62 is connected with a second energy converter 61, one side of the second energy converter 61 is connected with a second lifting frame 5, a second telescopic cylinder 4 is arranged on the second lifting frame 5, and one end of the second telescopic cylinder 4 is connected with a second longitudinal and transverse moving table 7; the second energy converter 61 can be driven to lift by the telescopic pushing and pulling of the second telescopic cylinder 4, and the second vertical and horizontal moving platform 7 can enable the second lifting frame 5 to longitudinally and transversely displace.
The second longitudinal and transverse moving table 7 comprises a transverse screw rod sliding table 71 and a longitudinal screw rod sliding table 72 which are arranged in a crossed manner, and the transverse screw rod sliding table 71 is connected with one end of the second telescopic cylinder 4; the transverse screw sliding table 71 is matched with the longitudinal screw sliding table 72, so that the second longitudinal and transverse moving table 7 can accurately and automatically adjust transverse and longitudinal displacement distances.
The two sides of the compression ring 631 are respectively provided with a sparking rod 3 and a protective gas output pipe 15, and the sparking rod 3 and the protective gas output pipe 15 are both fixedly arranged on the rotating frame 11;
a bobbin 14 is arranged on the frame 1, a lead 16 is wound on the bobbin 14, and one end of the lead 16, which is far away from the bobbin 14, is arranged between the press ring 631 and the first welding head die 83 in a penetrating manner; the striking rod 3 can emit high voltage electricity to melt the lead 16 at the lower end of the protruding pressure ring 631, the molten metal liquid at the lower end of the lead 16 can be solidified into a ball due to the surface tension, the shielding gas output pipe 15 is used for outputting inert gas, and the melting and welding of the shielding lead 16 are safe and stable.
A threading hole is formed in the rack 1, the position of the threading hole is vertically aligned with a through hole in the middle of the first welding head die 83, an automatic wire clamp 9 is arranged on the threading hole, the automatic wire clamp 9 comprises 2 clamping blocks 95, a gas transmission channel 91, a cylindrical cavity 92, a piston 93 and a reset spring 94, wherein the 2 clamping blocks 95 are symmetrically arranged at two sides of the threading hole, one sides, far away from the 2 clamping blocks 95, of the 2 clamping blocks respectively extend into the cylindrical cavities 92 at two sides of the threading hole, one ends, located in the cylindrical cavities 92, of the clamping blocks 95 are connected with the piston 93, the piston 93 is in sliding connection with the cylindrical cavities 92, one ends, far away from the threading hole, of the cylindrical cavities 92 are communicated with the gas transmission channel 91, and the gas transmission channels 91 at two sides of the threading hole are communicated with each other; the gas transmission channel 91 is connected with the gas pump, gas can simultaneously enter the cylindrical cavities 92 at two sides of the threading hole through the gas transmission channel 91 to extrude the piston 93, so that the piston 93 simultaneously pushes the 2 clamping blocks 95 to the middle of the threading hole, and the lead 16 penetrating in the middle of the threading hole can be automatically clamped, and the lead 16 can be kept stable when needed;
one side of the piston 93 close to the threading hole is connected with a return spring 94, and one end of the return spring 94 is propped against the inner wall of one end of the cylindrical cavity 92; the return spring 94 can push the piston 93 back to the original position after exhausting in the cylindrical cavity 92, and the wire clamping releasing effect is achieved.
The wire clamping positioning wheels 10 are arranged on the rack 1, the wire clamping positioning wheels 10 are provided with a plurality of groups, each group is provided with 2, the 2 wire clamping positioning wheels 10 in each group are symmetrically arranged on two sides of the lead 16, and the wire clamping positioning wheels 10 in at least one group are connected with a motor 101;
the plurality of groups of wire clamping positioning wheels 10 comprise a longitudinal distribution group and a transverse distribution group, and the longitudinal distribution group and the transverse distribution group are distributed in a staggered mode at intervals; the plurality of groups of wire clamping positioning wheels 10 which are longitudinally distributed and transversely distributed can clamp and push the lead 16 from a plurality of angles, so that the lead 16 can be ensured to be vertical, the lead 16 is prevented from being deviated, the lead 16 can be automatically pushed, the lead 16 is pushed to be unfolded and extended, or the lead 16 is pushed back, and the lead 16 is slightly contracted.
The working principle is as follows: conveying a chip to be welded to the lower part of the rack 1, pushing the rack 1 to horizontally displace by the first longitudinal and transverse moving table 2, and aligning the lower ends of the pressing ring 631 and the first welding head 8 in an initial state to ensure that the pressing ring 631 of the second welding head mold 63 and the lower end of the first welding head 8 are simultaneously aligned with the first welding point;
the wire clamping positioning wheel 10 pushes the lead 16 to slightly extend out of the lower end of the pressing ring 631, then the ignition rod 3 discharges high-voltage current to the lower end of the extended lead 16, the lead 16 protruding out of the lower end part of the pressing ring 631 is melted, molten metal at the lower end of the lead 16 is solidified into a spherical head under the surface tension relationship, and in the process, the protective gas output pipe 15 continuously outputs inert gas to protect the safety and stability of the melting process of the lead 16;
then, the second telescoping cylinder 4 pushes the pressing ring 631 to descend, so that the pressing ring 631 presses the solidified spherical head at the lower end of the lead 16, the first welding point of the spherical head and the chip is pressed and fixed, then the second transducer 61 of the second welding head 6 operates, and the pressing ring 631 of the second welding head mold 63 generates high-frequency vibration to the spherical head, so that the spherical head at the lower end of the lead 16 and the first welding point of the chip are welded;
the first welding head 8 and the second welding head 6 operate in a matched mode and operate simultaneously, when the lead 16 is welded to the first welding point, the pressing ring 631 presses the spherical head of the lead 16 to the first welding point, and the spherical head and the first welding point form temporary fixed connection through pressing acting force, so that the first welding head 8 can directly route to the second welding point without waiting for the lead 16 to be completely welded and fixed with the first welding point, and the effect of improving welding efficiency is achieved;
and the cross section of clamping ring 631 is circular, when lead 16 is drawn to its one side, its convex outer wall can provide even smooth supporting effect for lead 16, let lead 16 need not to walk reverse angle and reverse distance, also can stable formation a confession shape route, direct drawing can not break and drop, thereby reach the purpose that reduces lead 16 movement path, shorter movement path, let first soldered connection 8 move to the speed of second solder joint faster, thereby reach the effect that improves welding efficiency, and shorter movement path, let the consumptive material of every lead lower, and after direct drawing, lead 16 arch height is lower, the arch height is lower the lower lead bonding length reduces, insertion loss is also littleer.
The pressing ring 631 is driven by the second welding head die 63 of the second welding head 6 to independently weld the first welding point, the first welding head 8 can directly move to the second welding point during the welding of the first welding point, and the first welding head 8 and the second welding head 6 can independently operate and are matched with each other, so that the welding efficiency is higher;
after the first welding head die 83 pulls the lead 16 to be welded with the second welding point, the first telescopic cylinder 13 extends to push the first welding head die 83 to move downwards, so that the lead 16 is clamped and fixed between the first welding head die 83 and the second welding point, and the first transducer 81 drives the first welding head die 83 to weld the lead 16 with the second welding point;
in the process, when the first bonding tool die 83 pulls the lead 16 to be bonded with the second welding point, the wedge-shaped protrusion 831 can press the connecting end of the lead 16 and the second welding point, and the bonding surface of the lead 16 and the second welding point is larger due to the wedge-shaped pressing surface, so that the purpose of improving the bonding strength of the lead 16 and the second welding point is achieved;
the angle of the wedge-shaped protrusion 831 of the first bonding tool mold 83 distributed along the circumferential direction of the lower end of the first bonding tool mold 83 is larger than 90 degrees, and the wedge-shaped protrusion 831 distributed at 90 degrees can enable the first bonding tool mold 83 to form wedge-shaped pressing to the lead 16 at least without changing directions when the first bonding tool mold 83 moves to the angle range of 90 degrees at will, so that the angle range of the wedge-shaped pressing of the first bonding tool 8 is larger;
the transverse displacement of the first welding head 8 is driven by the first longitudinal and transverse moving table 2 to operate, the second longitudinal and transverse moving table 7 and the first longitudinal and transverse moving table 2 operate reversely and synchronously in the process, the moving directions of the first longitudinal and transverse moving table 2 and the second longitudinal and transverse moving table 7 are opposite, but the displacement speed and the length are the same, so that the second welding head 6 can always keep a fixed position
Finally, after the lead 16 is welded with the second welding point, the wire clamping positioning wheel 10 pulls the lead 16 to slightly shrink, so that the lead 16 is disconnected with the second welding point;
the first welding head 8 moves to the next welding point, and at the same time, the second welding head 6 moves to the next welding point after being transversely displaced and drawn away from the first welding point, and the steps are repeated.
Claims (10)
1. The utility model provides a chip package bonding wire device, includes frame (1), be provided with first soldered connection (8) on frame (1), its characterized in that: a second welding head (6) is arranged on one side of the first welding head (8), the second welding head (6) comprises a second welding head die (63), a pressing ring (631) is arranged at one end of the second welding head die (63), and a notch is formed in one side of the pressing ring (631);
the second welding head (6) is connected with a second longitudinal and transverse moving platform (7) in a lifting mode, and the second longitudinal and transverse moving platform (7) is rotatably arranged on the rack (1).
2. The die attach apparatus of claim 1, wherein: the first welding head (8) comprises a first welding head die (83), one side of the lower end of the first welding head die (83) is provided with a wedge-shaped protrusion (831), the angle of the wedge-shaped protrusion (831) distributed along the circumferential direction of the lower end of the first welding head die (83) is larger than 90 degrees, and the height of the bottom of the wedge-shaped protrusion (831) is larger than that of the lower end of the first welding head die (83);
the lower end of the first welding head die (83) is conical, a circular through hole is formed in the center of the first welding head die (83), a first amplitude transformer (82) is connected to one side of the first welding head die (83), and a first energy converter (81) is connected to one end of the first amplitude transformer (82).
3. The die attach apparatus of claim 2, wherein: one side of the first energy converter (81) is connected with a first lifting frame (12), one side of the first lifting frame (12) is provided with a first telescopic cylinder (13), one end of the first telescopic cylinder (13) is connected with a rotating frame (11), and the rotating frame (11) is rotatably connected with the rack (1).
4. The die attach apparatus of claim 3, wherein: the periphery of the rotating frame (11) is annular, a circular hole is formed in the middle of the rack (1), the rotating frame (11) is arranged in the circular hole, and the outer wall of the rotating frame (11) is rotatably connected with the inner wall of the circular hole;
the bottom of one side of the rack (1) is provided with a first longitudinal and transverse moving platform (2).
5. The die attach apparatus of claim 2, wherein: the diameter of the round hole corresponds with the diameter of the through hole at the center of the first welding head mold (83) in the middle of the pressing ring (631), and the width of the notch on one side of the pressing ring (631) corresponds to the diameter of the round hole.
6. The die attach apparatus of claim 1, wherein: one side of the second welding head die (63) is connected with a second amplitude transformer (62), one end of the second amplitude transformer (62) is connected with a second energy converter (61), one side of the second energy converter (61) is connected with a second lifting frame (5), a second telescopic cylinder (4) is arranged on the second lifting frame (5), and one end of the second telescopic cylinder (4) is connected with a second longitudinal and transverse moving table (7).
7. The die attach apparatus of claim 1, wherein: the second longitudinal and transverse moving table (7) comprises a transverse lead screw sliding table (71) and a longitudinal lead screw sliding table (72) which are arranged in a crossed manner, and the transverse lead screw sliding table (71) is connected with one end of the second telescopic cylinder (4).
8. The die attach apparatus of claim 3, wherein: the two sides of the compression ring (631) are respectively provided with a sparking rod (3) and a protective gas output pipe (15), and the sparking rod (3) and the protective gas output pipe (15) are fixedly arranged on the rotating frame (11);
the welding head is characterized in that a wire barrel (14) is arranged on the rack (1), a lead (16) is wound on the wire barrel (14), and one end, far away from the wire barrel (14), of the lead (16) penetrates through the middle of the pressing ring (631) and the first welding head mold (83).
9. The die attach apparatus of claim 1, wherein: the machine frame (1) is provided with a threading hole, the position of the threading hole is vertically aligned with a through hole in the middle of the first welding head die (83), and an automatic wire clamp (9) is arranged on the threading hole, the automatic wire clamp (9) comprises 2 clamping blocks (95), a gas transmission channel (91), a cylindrical cavity (92), a piston (93) and a return spring (94), wherein 2 clamping blocks (95) are symmetrically arranged at two sides of the threading hole, one sides of the 2 clamping blocks (95) far away from each other respectively extend into the cylindrical cavities (92) at two sides of the threading hole, and one end of the clamping block (95) positioned in the cylindrical cavity (92) is connected with a piston (93), the piston (93) is connected with the cylindrical cavity (92) in a sliding way, one end, far away from the threading hole, of the cylindrical cavity (92) is communicated with a gas transmission channel (91), and the gas transmission channels (91) on two sides of the threading hole are mutually communicated;
one side of the piston (93) close to the threading hole is connected with a return spring (94), and one end of the return spring (94) is propped against the inner wall of one end of the cylindrical cavity (92).
10. The die attach apparatus of claim 1, wherein: the wire clamping positioning wheel (10) is arranged on the rack (1), a plurality of groups of wire clamping positioning wheels (10) are arranged, each group is provided with 2 wire clamping positioning wheels, 2 wire clamping positioning wheels (10) in each group are symmetrically arranged on two sides of the lead (16), and the wire clamping positioning wheels (10) in at least one group are connected with a motor (101);
the multi-group wire clamping positioning wheel (10) comprises a longitudinal distribution group and a transverse distribution group, and the longitudinal distribution group and the transverse distribution group are distributed in a staggered mode at intervals.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210168095.2A CN114473280B (en) | 2022-02-23 | 2022-02-23 | Chip packaging bonding wire device |
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| CN202210168095.2A CN114473280B (en) | 2022-02-23 | 2022-02-23 | Chip packaging bonding wire device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115116916A (en) * | 2022-08-29 | 2022-09-27 | 遂宁合芯半导体有限公司 | Lead welding device for semiconductor packaging |
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| Publication number | Publication date |
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| CN114473280B (en) | 2023-11-24 |
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