CN219032365U

CN219032365U - Wafer bearing device of chemical vapor deposition equipment

Info

Publication number: CN219032365U
Application number: CN202223299912.2U
Authority: CN
Inventors: 任斌; 刘超; 韦小园
Original assignee: Jiangsu Zishuo Technology Co ltd
Current assignee: Jiangsu Zishuo Technology Co ltd
Priority date: 2022-12-09
Filing date: 2022-12-09
Publication date: 2023-05-16
Anticipated expiration: 2032-12-09

Abstract

The utility model discloses a wafer bearing device of chemical vapor deposition equipment, which comprises a bearing round table, wherein the middle part of the lower part of the bearing round table is fixedly connected with a fixed supporting rod, the outer side of the fixed supporting rod is fixedly connected with a fixed bracket, the fixed bracket is fixedly connected with three electric telescopic rods, the output end of each electric telescopic rod is fixedly connected with a connecting rod, three sliding grooves are formed in the bearing round table in a penetrating manner, three arc-shaped clamping pieces on the round table can move relatively through the bearing round table and an electric telescopic assembly, so that the arc-shaped clamping pieces can be pulled to tighten to a designated position towards the center of the bearing round table, a limiting groove on the inner side is attached to the side surface of a wafer, the wafer is fastened in a relatively bolt-fastening manner, the limiting groove is mainly contacted with the side surface of the wafer, waste of a processing area can be reduced, the limiting is more stable, and the efficiency and the quality of the chemical vapor deposition equipment in cleaning the wafer are improved.

Description

Wafer bearing device of chemical vapor deposition equipment

Technical Field

The utility model relates to the field of semiconductor materials, in particular to a wafer bearing device of chemical vapor deposition equipment.

Background

Chemical vapor deposition is one of the important process technologies in the manufacture of semiconductor devices. The method mainly comprises exposing a wafer to one or more different precursors to cause chemical reactions such as oxidation-reduction on the wafer surface, thereby depositing a thin film on the wafer surface. In the process of chemical vapor deposition, the film thickness uniformity of the film is one of important indexes for determining the quality of the film;

the existing wafer carrying device is provided with a horizontal moving device, if a rotating mechanism is added, the processing efficiency can be further improved; the wafer processing process needs to carry out chemical treatment or heat treatment, a layer of protective liquid is attached to the surface of the wafer, and the surface cleaning process is required to be carried out independently before the wafer is manufactured, so that the existing wafer bearing device has single function and poor adaptability, and cannot simultaneously meet the cleaning process and the processing and manufacturing process; the prior wafer bearing device is used for fastening the wafer by a plurality of bolts, so that a plurality of processing areas are occupied on the surface of the wafer, a plurality of wastes are caused, and the wafer is easily damaged due to the fact that the wafer is thinner.

Disclosure of Invention

The utility model aims to provide a wafer bearing device of chemical vapor deposition equipment, which solves the problems that the existing wafer bearing device in the prior art has single function and poor adaptability and can not simultaneously meet the cleaning procedure and the processing and manufacturing procedure; the prior wafer bearing device is used for fastening the wafer by a plurality of bolts, and occupies a plurality of processing areas on the surface of the wafer, thereby causing a plurality of waste problems.

In order to achieve the above purpose, the utility model adopts the following technical scheme that the wafer bearing device of the chemical vapor deposition equipment comprises a bearing round table, wherein the middle part of the lower part of the bearing round table is fixedly connected with a fixed supporting rod, the outer side of the fixed supporting rod is fixedly connected with a fixed bracket, the fixed bracket is fixedly connected with three electric telescopic rods, the output end of each electric telescopic rod is fixedly connected with a connecting rod, and three sliding grooves are penetrated in the bearing round table;

the upper end of connecting rod runs through the spout and is provided with arc holder, the inboard of arc holder is provided with the spacing groove.

As a further description of the above technical solution: the bottom fixedly connected with rotor plate of fixed bracket, the bottom cooperation of rotor plate is provided with the connection platform, the both ends fixedly connected with U type frame of connection platform.

As a further description of the above technical solution: one side of the U-shaped frame is provided with a driving motor, the output end of the driving motor penetrates through the U-shaped frame and is fixedly connected with the rotating plate, and the other end of the rotating plate is rotationally connected inside the U-shaped frame.

As a further description of the above technical solution: and a liquid leakage groove is formed in one end of the bearing round table.

As a further description of the above technical solution: one side fixedly connected with collecting tank of U type frame, the inside of collecting tank runs through and is provided with the through-hole, the bottom of through-hole corresponds to be provided with the fluid-discharge tube.

As a further description of the above technical solution: the lower part fixedly connected with support frame of U type frame, the bottom fixedly connected with connection base of support frame.

As a further description of the above technical solution: one side fixedly connected with air heater of U type frame, the output of air heater is provided with the outlet duct.

The utility model has the following beneficial effects:

1. compared with the prior art, the wafer bearing device of the chemical vapor deposition equipment can enable the three arc-shaped clamping pieces on the round table to perform relative motion through the bearing round table and the electric telescopic component, so that the arc-shaped clamping pieces can be pulled to tighten to the center of the bearing round table to a designated position, the inner limiting groove is attached to the side surface of the wafer, the wafer is fastened, and the limiting groove is mainly contacted with the side surface of the wafer in a relatively bolt-fastened mode, so that the waste of a processing area can be reduced, the limiting is more stable, and the efficiency and the quality of the chemical vapor deposition equipment in cleaning the wafer are improved;

2. compared with the prior art, the wafer bearing device of the chemical vapor deposition equipment can enable the whole bearing round table to rotate by arranging the driving assembly, and the cleaned chemical liquid can be sent into the liquid collecting tank to be collected by matching with the liquid leakage tank above the driving assembly, so that later recovery and cleaning are facilitated, and convenience of the device is improved;

3. compared with the prior art, the wafer carrying device of the chemical vapor deposition equipment can dry the cleaned wafer by arranging the hot air blower and the air outlet pipe, so that subsequent processing is facilitated, and the processing efficiency of the chemical vapor deposition equipment is improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further illustrated by the following figures and examples;

FIG. 1 is a schematic view of the overall structure of a wafer carrier of a chemical vapor deposition apparatus according to the present utility model;

FIG. 2 is a top view of a wafer carrier of a chemical vapor deposition apparatus according to the present utility model;

FIG. 3 is a perspective view of a wafer carrier of a chemical vapor deposition apparatus according to the present utility model;

FIG. 4 is a schematic diagram of a liquid sump structure of a wafer carrier of a chemical vapor deposition apparatus according to the present utility model.

Legend description:

1. carrying a round table; 2. a driving motor; 3. a support frame; 4. the base is connected; 5. a connection station; 6. a rotating plate; 7. an electric telescopic rod; 8. an air heater; 9. an air outlet pipe; 10. an arc-shaped clamping member; 11. a chute; 12. a liquid leakage groove; 13. a connecting rod; 14. a limit groove; 15. a U-shaped frame; 16. a liquid collecting tank; 17. a through hole; 18. a liquid discharge pipe; 19. a fixing bracket; 20. and fixing the supporting rod.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

Referring to fig. 1-4, one embodiment provided by the present utility model is: the utility model provides a chemical vapor deposition equipment's wafer bears device, including bearing round platform 1, bear round platform 1's below middle part fixedly connected with fixed stay 20, fixed stay 20's outside fixedly connected with fixed bolster 19, fixedly connected with three electric telescopic handle 7 on the fixed bolster 19, electric telescopic handle 7's output fixedly connected with connecting rod 13, can make connecting rod 13 remove through starting electric telescopic handle 7, bear round platform 1's inside and run through and be provided with three spout 11, connecting rod 13's upper end runs through spout 11 and is provided with arc holder 10, arc holder 10's inboard is provided with spacing groove 14. Under the action of the sliding chute 11, the connecting rod 13 can drive the arc-shaped clamping piece 10 at the upper end to move inwards, the arc-shaped clamping piece 10 is pulled to tighten to a designated position towards the center of the bearing round table 1, the limiting groove 14 at the inner side is attached to the side surface of the wafer to fasten the wafer, and the limiting groove 14 is mainly contacted with the side surface of the wafer in a bolt fastening mode, so that the waste of a processing area can be reduced, the limiting is more stable, and the processing efficiency and quality of chemical vapor deposition equipment are improved;

the bottom of the fixed bracket 19 is fixedly connected with the rotating plate 6, the bottom of the rotating plate 6 is provided with the connecting table 5 in a matched manner, two ends of the connecting table 5 are fixedly connected with the U-shaped frames 15, the connecting table 5 is in a trapezoid shape, the bottom of the rotating plate 6 is semicircular and can be matched with an inner groove of the connecting table 5, the rotating plate 6 is not blocked in rotation, and the connecting table 5 can conduct diversion action on waste liquid discharged from the chute 11 and the liquid leakage groove 16, so that the waste liquid is conveniently sent into the liquid collection groove 16 for meal;

one side of the U-shaped frame 15 is provided with a driving motor 2, the output end of the driving motor 2 penetrates through the U-shaped frame 15 and is fixedly connected with the rotating plate 6, the other end of the rotating plate 6 is rotationally connected inside the U-shaped frame 15, the rotating plate 6 can be rotated by starting the driving motor 2, and therefore the whole bearing round table 1 is driven to adjust the angle, waste liquid above the bearing round table is discharged, later collection is facilitated, and cleaning work of the surface of a wafer is realized;

one end of the bearing round table 1 is provided with a liquid leakage groove 12, one side of the U-shaped frame 15 is fixedly connected with a liquid collecting groove 16, a through hole 17 is formed in the liquid collecting groove 16 in a penetrating manner, a liquid discharge pipe 18 is correspondingly arranged at the bottom of the through hole 17, waste liquid after cleaning flows out along the sliding groove 11 and the liquid leakage groove 12, the driving motor 2 is started to enable the rotating plate 6 to drive the whole bearing round table 1 to adjust the angle, so that chemical cleaning liquid in the liquid leakage groove 12 can flow into the liquid collecting groove 16, and finally is discharged through the through hole 17 and the liquid discharge pipe 18;

the below fixedly connected with support frame 3 of U type frame 15, the bottom fixedly connected with of support frame 3 connects one side fixedly connected with air heater 8 of base 4,U type frame 15, and the output of air heater 8 is provided with outlet duct 9, after wasing the completion, can start one side air heater 8 to send into the effect that its was dried to the surface of wafer through outlet duct 9 with hot-blast, makes things convenient for subsequent processing, improves chemical vapor deposition equipment's machining efficiency.

Working principle: when the device is used, the whole device is installed at a proper position through the connection base at the bottom, the normal work of the whole chemical vapor deposition equipment is guaranteed, then the wafer to be cleaned is placed in the middle of the bearing round table 1, then three electric telescopic rods 7 on the fixing bracket 19 are started to drive the connecting rods 13 and the arc clamping pieces 10 to conduct relative motion, the arc clamping pieces 10 are pulled to tighten the center of the bearing round table 1 to the appointed position, the limiting grooves 14 on the inner side are attached to the side surfaces of the wafer, the wafer is fastened, the limiting grooves 14 are mainly in contact with the side surfaces of the wafer in a relatively bolt-fastening mode, the waste of the processing area can be reduced, the limiting is more stable, the processing efficiency and quality of the chemical vapor deposition equipment are improved, then the wafer surface is cleaned through an external spray cleaning assembly, waste liquid after cleaning flows out along the sliding grooves 11 and the liquid leaking grooves 12, the driving motor 2 is started to enable the rotating plate 6 to drive the whole bearing round table 1 to conduct angle adjustment, therefore chemical cleaning liquid inside the liquid leaking grooves 12 can flow into the liquid collecting grooves 16, finally the waste liquid can be discharged through the through holes 17 and the pipes 18, the waste liquid can be cleaned conveniently, and the waste liquid can be cleaned after the wafer can be cleaned.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims

1. The wafer bearing device of the chemical vapor deposition equipment comprises a bearing round table (1), and is characterized in that: the bearing round table is characterized in that a fixed supporting rod (20) is fixedly connected to the middle part of the lower part of the bearing round table (1), a fixed bracket (19) is fixedly connected to the outer side of the fixed supporting rod (20), three electric telescopic rods (7) are fixedly connected to the fixed bracket (19), a connecting rod (13) is fixedly connected to the output end of each electric telescopic rod (7), and three sliding grooves (11) are formed in the bearing round table (1) in a penetrating mode;

the upper end of the connecting rod (13) penetrates through the sliding groove (11) and is provided with an arc clamping piece (10), and the inner side of the arc clamping piece (10) is provided with a limiting groove (14).

2. Wafer carrying device of chemical vapor deposition equipment according to claim 1, characterized in that the bottom of the fixed bracket (19) is fixedly connected with a rotating plate (6), the bottom of the rotating plate (6) is provided with a connecting table (5) in a matching way, and two ends of the connecting table (5) are fixedly connected with U-shaped frames (15).

3. The wafer carrying device of a chemical vapor deposition apparatus according to claim 2, wherein a driving motor (2) is disposed at one side of the U-shaped frame (15), an output end of the driving motor (2) penetrates through the U-shaped frame (15) and is fixedly connected with the rotating plate (6), and the other end of the rotating plate (6) is rotatably connected inside the U-shaped frame (15).

4. Wafer carrying device of a chemical vapor deposition apparatus according to claim 1, characterized in that one end of the carrying circular table (1) is provided with a liquid leakage groove (12).

5. The wafer carrying device of a chemical vapor deposition apparatus according to claim 2, wherein a liquid collecting tank (16) is fixedly connected to one side of the U-shaped frame (15), a through hole (17) is formed in the liquid collecting tank (16) in a penetrating manner, and a liquid drain pipe (18) is correspondingly arranged at the bottom of the through hole (17).

6. The wafer carrying device of a chemical vapor deposition apparatus according to claim 2, wherein a supporting frame (3) is fixedly connected below the U-shaped frame (15), and a connecting base (4) is fixedly connected to the bottom of the supporting frame (3).

7. Wafer carrying device of chemical vapor deposition equipment according to claim 2, characterized in that one side of the U-shaped frame (15) is fixedly connected with a hot air blower (8), and the output end of the hot air blower (8) is provided with an air outlet pipe (9).