CN219016876U

CN219016876U - Portable small computer with good heat dissipation

Info

Publication number: CN219016876U
Application number: CN202223493347.3U
Authority: CN
Inventors: 黎国权
Original assignee: Guangdong Xinjufeng Technology Co ltd
Current assignee: Guangdong Xinjufeng Technology Co ltd
Priority date: 2022-12-27
Filing date: 2022-12-27
Publication date: 2023-05-12
Anticipated expiration: 2032-12-27

Abstract

The utility model discloses a portable small computer with good heat dissipation, which comprises a case and a heat dissipation unit; the upper end of the case is provided with a case upper cover through bolts, the inner bottom wall of the case is provided with a miniature main board, and the miniature main board is provided with a central processing unit and a memory strip; a hard disk and a control switch are arranged on the upper cover of the case; the heat dissipation unit is arranged in the case and comprises an upper heat conduction seat and a lower heat conduction seat, the upper heat conduction seat is arranged on the lower surface of the upper cover of the case, the lower end of the upper heat conduction seat is in sliding connection with the lower heat conduction seat, and the lower surface of the lower heat conduction seat is in contact with the upper surface of the central processing unit. The utility model ensures the portability of the small computer through the handle; the heat in the chassis is discharged through the heat radiation fan, and air circulation is realized at the same time; and heat is dissipated through the lower heat conducting seat, the lower heat conducting fin, the upper heat conducting seat and the heat dissipating fin, and heat of the upper heat conducting fin and the lower heat conducting fin is taken away through the heat dissipating fan, so that dual heat dissipation of the computer is realized, and the heat dissipation effect is improved.

Description

Portable small computer with good heat dissipation

Technical Field

The utility model relates to the technical field of computers, in particular to a portable small computer with good heat dissipation.

Background

Nowadays, computers are integrated with aspects of social production, efficient operation of various industries is not supported by computer technology, along with development of software ecology, connection of computers and people's work and life becomes more and more compact, functions and characteristics of the computers are not replaced by mobile equipment such as mobile phones and tablets, and particularly, operation of some professional software must be finished by a computer host.

Traditional notebook computer and desktop host computer, though the operational capability is strong, but the volume is too heavy, inconvenient carry, the performance and the security of lease computer are difficult to obtain the guarantee again, and then the producer has produced the microcomputer, and small computer internally mounted has miniature mainboard, has the box constitution of small, generally utilizes radiator fan to dispel the heat during the use, but the inner space is compact, the fluxion of air is relatively poor and the heat dissipation method is single, and then the radiating effect is not good, and generally lack the subassembly that the hand was carried, it is harder to need the hand to use great dynamics to hold the computer during carrying, therefore, we propose a portable type small-size computer that the heat dissipation is good.

Disclosure of Invention

The utility model aims to overcome the existing defects, and provides a portable small computer with good heat dissipation, which is provided with a handle, can be lifted and pulled, is convenient to carry, and can utilize a heat dissipation unit to conduct dual heat dissipation, so that the heat dissipation effect is improved.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a portable small computer with good heat dissipation comprises a case, a miniature main board, a control switch, a memory bank, a central processing unit and a heat dissipation unit; the upper end of the case is provided with a case upper cover through bolts, the inner bottom wall of the case is provided with a miniature main board, the miniature main board is provided with a central processing unit, and the rear end of the upper surface of the miniature main board is also provided with a memory strip;

the lower surface of the upper cover of the case is provided with a hard disk; the front end of the upper surface of the upper cover of the case is also provided with a control switch;

the control switch, the central processing unit, the hard disk and the memory strip are all in bidirectional electrical connection with the miniature main board;

the heat dissipation unit is arranged in the case and comprises an upper heat conduction seat and a lower heat conduction seat, the upper heat conduction seat is arranged on the lower surface of the upper cover of the case,

the lower end of the upper heat conduction seat is in sliding connection with the lower heat conduction seat, and the lower surface of the lower heat conduction seat is in contact with the upper surface of the central processing unit.

Preferably, the upper heat conducting seat comprises an upper heat conducting plate and a plurality of upper heat conducting sheets, and the upper heat conducting sheets are uniformly arranged at the lower end of the upper heat conducting plate.

Preferably, the lower heat conducting seat comprises a lower heat conducting plate and a plurality of lower heat conducting sheets, and the lower heat conducting sheets are uniformly arranged at the upper end of the lower heat conducting plate.

Preferably, the lower heat conducting fins at the two most ends are further provided with corresponding clamping blocks, the lower heat conducting fins at the two most ends are correspondingly clamped in clamping grooves of the upper heat conducting fins at the two most ends through the clamping blocks on the lower heat conducting fins, and the other upper heat conducting fins are inserted between the two adjacent lower heat conducting fins.

Preferably, a second spring piece is further arranged on the lower heat conducting plate between two adjacent lower heat conducting fins, and the upper end of the second spring piece is abutted against the lower surface of the corresponding upper heat conducting fin.

Preferably, the left side surface of the lower heat conducting seat is also provided with a first spring piece, and the first spring piece is matched with the upper heat conducting seat.

Preferably, the heat dissipation unit further comprises a heat dissipation fan arranged at the rear side wall of the case, the input end of the heat dissipation fan is electrically connected with the output end of the miniature main board, and the front side surface and the rear side surface of the case are provided with heat dissipation holes which are uniformly distributed.

Preferably, a plurality of cooling fins are uniformly distributed on the upper surface of the upper cover of the case.

Preferably, the front side of the case is also provided with a sliding hole, a handle is arranged in the sliding hole, the handle is connected with a sliding strip positioned in the sliding hole, a stop block is arranged at the other end of the sliding strip, the stop block is positioned in the case, and the width of the stop block is larger than that of the sliding hole.

Preferably, magnets are symmetrically arranged on one side of the handle close to the case, and the magnets are magnetically adsorbed with the case.

Compared with the prior art, the utility model has the beneficial effects that:

1. when the portable computer is carried, the handle is pulled out from the case, the magnet on the handle is separated from the case, and the handle drives the sliding strip to slide along the sliding hole on the front side surface of the case, so that the portability of the portable computer is ensured;

2. according to the utility model, hot air in the case can be discharged through the cooling fan, and meanwhile, external air flow enters the case through the cooling holes on the front side and flows to the rear side, so that parts in the case are cooled;

3. the heat generated by the CPU is transferred to the lower heat conducting seat upwards, the lower heat conducting seat transfers the heat to the lower heat conducting fin, the heat of the lower heat conducting fin and the heat of the lower heat conducting seat are transferred to the upper cover of the case through the upper heat conducting fin and the upper heat conducting seat, the upper cover of the case dissipates the outside through the heat radiating fin, the heat radiating surface area of the upper cover of the case is increased, and the air flow passing through the case can pass through the space between the upper heat conducting fin and the lower heat conducting fin, so that the heat of the upper heat conducting fin and the lower heat conducting fin can be taken away, double heat radiation is carried out on a computer, and the heat radiating effect is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of a heat dissipating unit according to the present utility model;

FIG. 3 is an enlarged schematic view of the structure of the present utility model at A;

FIG. 4 is an enlarged schematic view of the structure of the present utility model at B;

FIG. 5 is a schematic view of the structure of the upper heat conducting base of the present utility model;

fig. 6 is a schematic structural diagram of the lower heat conducting base of the present utility model.

In the figure: 1-a case; 2-a case upper cover; 3-a miniature motherboard; 4-controlling a switch; 5-memory banks; 6-heat dissipation holes; 7-a heat radiation fan; 8-a central processing unit; 9-a heat dissipation unit;

10-a hard disk; 11-heat sink; 12-slide bar; 13-handle; 14-magnet; 15-a stop block;

91-upper heat conducting seat; 92-lower heat conducting seat; 93-upper heat conducting fins; 94-lower thermally conductive sheet; 95-a first spring piece; 96-second spring piece; 97-upper heat-conducting plate; 98-a lower heat-conducting plate; 99-clamping blocks; 100-clamping grooves;

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-6, the present embodiment provides: a portable small computer with good heat dissipation comprises a case 1, a miniature main board 3, a control switch 4, a memory bank 5, a central processing unit 8 and a heat dissipation unit 9; the upper end of the case 1 is provided with a case upper cover 2 through bolts, the inner parts are protected through the case 1, the bottom wall of the case 1 is provided with a miniature main board 3, the middle part of the upper surface of the miniature main board 3 is provided with a central processing unit 8, the rear end of the upper surface of the miniature main board 3 is provided with a memory strip 5, the lower surface of the case upper cover 2 is provided with a hard disk 10, and the front end of the upper surface of the case upper cover 2 is also provided with a control switch 4; the control switch 4, the central processing unit 8, the hard disk 10 and the memory strip 5 are all in bidirectional electrical connection with the miniature main board 3. The external power supply supplies power to the micro-motherboard 3, and then the micro-motherboard 3 supplies power to the central processor 8, the hard disk 10 and the memory bank 5, and the central processor 8, the hard disk 10 and the memory bank 5 and the micro-motherboard 3 operate.

As shown in fig. 2, the heat dissipation unit 9 is disposed in the chassis 1, and the heat dissipation unit 9 includes an upper heat conduction seat 91 and a lower heat conduction seat 92, the upper heat conduction seat 91 contacts with the lower surface of the upper cover 2 of the chassis, the lower end of the upper heat conduction seat 91 is slidably connected with the lower heat conduction seat 92, and the lower surface of the lower heat conduction seat 92 contacts with the upper surface of the central processor 8.

As a preferred embodiment, as shown in fig. 2, the upper heat conducting base 91 includes an upper heat conducting plate 97 and a plurality of upper heat conducting fins 93, and the plurality of upper heat conducting fins 93 are uniformly disposed at the lower end of the upper heat conducting plate 97.

As a preferred embodiment, as shown in fig. 2, the lower heat conducting base 92 includes a lower heat conducting plate 98 and a plurality of lower heat conducting fins 94, and the plurality of lower heat conducting fins 94 are uniformly disposed at the upper end of the lower heat conducting plate 98.

As shown in fig. 2, 3, 5 and 6, the lower heat conducting fin 94 at the two most ends is further provided with a corresponding clamping block 99, the lower heat conducting fin 94 at the two most ends is correspondingly clamped in the clamping groove 100 of the upper heat conducting fin 93 at the two most ends by the clamping block 99 thereon, and the other upper heat conducting fins 93 are inserted between two adjacent lower heat conducting fins 94 and are in close contact with the lower heat conducting fins 94.

As a preferred embodiment, the lower heat conducting plate 98 between two adjacent lower heat conducting fins 94 is further provided with a second spring piece 96, and the upper end of the second spring piece 96 abuts against the lower surface of the corresponding upper heat conducting fin 93. The spring piece II 96 applies a downward pressing acting force to the lower heat conduction seat 92, so that the lower heat conduction seat 92 is ensured to be in close contact with the CPU 8, and a good heat conduction effect is achieved.

As a preferred embodiment, the left side surface of the lower heat conducting seat 92 is further provided with a first spring piece 95, and the first spring piece 95 is matched with the upper heat conducting seat 91. The lower heat conductive sheet 94 is brought into close contact with the upper heat conductive sheet 93 by the first spring sheet 95 to have a good heat conductive effect.

As a preferred embodiment, the heat dissipating unit 9 further includes a heat dissipating fan 7 disposed at a rear side wall of the chassis 1, an input end of the heat dissipating fan 7 is electrically connected to an output end of the micro motherboard 3, and heat dissipating holes 6 are uniformly distributed on front and rear sides of the chassis 1.

As a preferred embodiment, the upper surface of the chassis upper cover 2 is provided with a plurality of heat dissipation fins 11 which are uniformly distributed.

As shown in fig. 4, the front side of the case 1 is further provided with a sliding hole, a handle 13 is disposed in the sliding hole, the handle 13 is connected with a sliding bar 12 disposed in the sliding hole, a stop block 15 is disposed at the other end of the sliding bar 12, the stop block 15 is disposed in the case 1, and the width of the stop block 15 is larger than that of the sliding hole.

As a preferred embodiment, the side of the handle 13 near the chassis 1 is symmetrically provided with magnets 14, and the magnets 14 are magnetically attracted with the chassis 1. When the portable computer is carried, the handle 13 can be lifted forward, the magnet 14 on the handle 13 is separated from the computer case 1, the handle 13 drives the slide bar 12 to slide along the slide hole on the front side surface of the computer case 1, and then the computer case 1 can be carried by lifting the handle 13 with fingers, so that the portability of the computer is ensured.

The heat that central processing unit 8 produced can upwards transmit for lower heat conduction seat 92, lower heat conduction seat 92 will heat transfer for lower heat conduction piece 94, lower heat conduction piece 94 and lower heat conduction seat 92's heat can be through last heat conduction piece 93 and last heat conduction seat 91 transmit for quick-witted case upper cover 2, quick-witted case upper cover 2 dispels the heat to the external world through fin 11, has increased self radiating surface to the air current that passes through machine case 1 can pass from between last heat conduction piece 93 and the lower heat conduction piece 94, can take away last heat conduction piece 93 and lower heat conduction piece 94 heat, and then has good radiating effect.

It should be noted that, in the above embodiment, the micro-motherboard 3, the memory bank 5, the cooling fan 7, the cpu 8 and the hard disk 10 may be freely configured according to the practical application scenario, the micro-motherboard 3 may be a micro-motherboard with a model of B450NH, the cpu 8 may be a cpu with a model of 5600G, and the control switch 4 is provided with a switch button corresponding to the micro-motherboard 3 one by one for controlling the switch operation thereof.

The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims

1. A portable small computer with good heat dissipation comprises a case (1), a miniature main board (3), a control switch (4), a memory bank (5), a central processing unit (8) and a heat dissipation unit (9); the upper end of the case (1) is provided with a case upper cover (2) through bolts, the inner bottom wall of the case (1) is provided with a miniature main board (3), the miniature main board (3) is provided with a central processing unit (8), and the rear end of the upper surface of the miniature main board (3) is also provided with a memory strip (5);

the lower surface of the upper cover (2) of the case is provided with a hard disk (10); the front end of the upper surface of the upper cover (2) of the case is also provided with a control switch (4);

the control switch (4), the central processing unit (8), the hard disk (10) and the memory strip (5) are electrically connected with the miniature main board (3) in a bidirectional manner;

the method is characterized in that: the heat dissipation unit (9) is arranged in the case (1), the heat dissipation unit (9) comprises an upper heat conduction seat (91) and a lower heat conduction seat (92), the upper end of the upper heat conduction seat (91) is contacted with the lower surface of the upper cover (2) of the case,

the lower end of the upper heat conduction seat (91) is in sliding connection with the lower heat conduction seat (92), and the lower surface of the lower heat conduction seat (92) is in contact with the upper surface of the central processing unit (8).

2. The thermally well-cooled portable microcomputer of claim 1, wherein: the upper heat conducting seat (91) comprises an upper heat conducting plate (97) and a plurality of upper heat conducting fins (93), and the upper heat conducting fins (93) are uniformly arranged at the lower end of the upper heat conducting plate (97).

3. The thermally well-cooled portable microcomputer of claim 1, wherein: the lower heat conduction seat (92) comprises a lower heat conduction plate (98) and a plurality of lower heat conduction sheets (94), and the lower heat conduction sheets (94) are uniformly arranged at the upper end of the lower heat conduction plate (98).

4. A thermally robust portable microcomputer according to claim 3, wherein: the lower heat conducting fins (94) at the two most ends are further provided with corresponding clamping blocks (99), the lower heat conducting fins (94) at the two most ends are correspondingly clamped in clamping grooves (100) of the upper heat conducting fins (93) at the two most ends through the clamping blocks (99) on the lower heat conducting fins, and the other upper heat conducting fins (93) are inserted between the two adjacent lower heat conducting fins (94) and are in tight contact with the lower heat conducting fins (94).

5. The thermally well-cooled portable microcomputer of claim 4, wherein: and a second spring piece (96) is further arranged on the lower heat conducting plate (98) between two adjacent lower heat conducting fins (94), and the upper end of the second spring piece (96) is abutted against the lower surface of the corresponding upper heat conducting fin (93).

6. A thermally robust portable microcomputer according to claim 3, wherein: the left side face of the lower heat conduction seat (92) is also provided with a first spring piece (95), and the first spring piece (95) is matched with the upper heat conduction seat (91).

7. The thermally well-cooled portable microcomputer of claim 2, wherein: the heat dissipation unit (9) also comprises a heat dissipation fan (7) arranged at the rear side wall of the case (1), the input end of the heat dissipation fan (7) is electrically connected with the output end of the miniature main board (3), and the front side surface and the rear side surface of the case (1) are provided with heat dissipation holes (6) which are uniformly distributed.

8. The thermally well-cooled portable microcomputer of claim 1, wherein: the upper surface of the chassis upper cover (2) is provided with a plurality of radiating fins (11) which are uniformly distributed.

9. The thermally well-cooled portable microcomputer of claim 7, wherein: the front side of the case (1) is also provided with a sliding hole, a handle (13) is arranged in the sliding hole, the handle (13) is connected with a sliding bar (12) positioned in the sliding hole, a stop block (15) is arranged at the other end of the sliding bar (12), the stop block (15) is positioned in the case (1), and the width of the stop block (15) is larger than that of the sliding hole.

10. The thermally well-cooled portable microcomputer of claim 9, wherein: magnets (14) are symmetrically arranged on one side of the handle (13) close to the case (1), and the magnets (14) are magnetically adsorbed with the case (1).