CN218998373U

CN218998373U - Ceramic heat dissipation substrate

Info

Publication number: CN218998373U
Application number: CN202223240447.5U
Authority: CN
Inventors: 刘年凤; 滕传超; 杨梅英
Original assignee: Jiangsu Zhaoneng Electronic Co ltd
Current assignee: Jiangsu Zhaoneng Electronic Co ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-05-09
Anticipated expiration: 2032-12-05

Abstract

The utility model provides a ceramic heat dissipation substrate, which is made of an electrically insulating ceramic material, the front surface of the substrate is a plane, the back surface of the substrate is provided with concave-convex shapes designed according to heat dissipation and support requirements, the distance between the substrate and a heat dissipation component is designed to be 0.2+/-0.05mm, the electric insulation characteristic of the heat dissipation substrate can effectively reduce the distance between the substrate and the heat dissipation component, obviously reduce the heat resistance, and simultaneously can reduce the overall height of a power module.

Description

Ceramic heat dissipation substrate

Technical Field

The utility model relates to the field of heat dissipation of switching power supplies, in particular to a ceramic heat dissipation substrate.

Background

In the design of a modular switching power supply, heat dissipation measures for power devices are indispensable in order to achieve small-volume and high-efficiency indexes. In conventional heat dissipation measures, a metal heat dissipation substrate is widely used in industry, and generally has a flat surface for coupling with an external heat dissipation interface, and a convex-concave shape on the other surface for coupling with a component to be heat-dissipated through a heat-conducting insulating material. The convex part is close to the power device as far as possible to achieve the optimal heat dissipation effect, and the substrate and the components on the PCB cannot be close to each other due to the conductive characteristic of metal, so that a sufficient safety distance is ensured, and the distance is generally ensured to be more than 0.5mm, so that the overall height of the module is difficult to reduce; in addition, the surface of the metal substrate needs to be subjected to oxidation treatment, so that the problem of environmental pollution exists, the manufacturing period is long, and the cost is high.

The utility model provides the ceramic heat dissipation substrate which has the advantages of reduced height, good heat dissipation effect, short manufacturing period and low cost.

Disclosure of Invention

The utility model aims to provide a ceramic heat dissipation substrate.

The technical scheme adopted by the utility model for solving the technical problems is as follows:

a ceramic heat dissipation substrate is made of an electrically insulating ceramic material, the front surface of the heat dissipation substrate is a plane, the back surface of the heat dissipation substrate is provided with concave-convex shapes designed according to heat dissipation and support requirements, and the distance between the substrate and a component to be heat-dissipated is designed to be 0.2+/-0.05mm.

Further, the back of the heat dissipation substrate is provided with a plurality of positioning columns, the positions and the number of the positioning columns are matched with the substrate holes on the PCB, and the positioning columns are inserted into the substrate holes to be used for positioning the substrate.

Further, the heat dissipation substrate is integrally formed, and no surface treatment process is required.

Further, the heat dissipation substrate further comprises a hollowed-out part which is larger than or equal to one part, the substrate is not required to dissipate heat corresponding to the components on the PCB, and the distance from the top end of the components to the front surface of the substrate is smaller than or equal to 0.3mm.

Further, the front height of the heat dissipation substrate is equal to the height of the highest component on the PCB.

Compared with the prior structural design, the utility model has the following technical effects:

the heat radiation substrate provided by the utility model has the characteristics of electrical insulation, can effectively reduce the distance between the substrate and a part to be heat radiation, obviously reduces the thermal resistance, can reduce the overall height of a power module, is integrally formed with a ceramic substrate, does not need surface treatment, is more environment-friendly, has low cost and short manufacturing period.

Drawings

Fig. 1 is a schematic perspective view of an overall structure of a substrate and a power module provided by the present utility model;

FIG. 2 is a side view of the overall structure of a substrate and a power module provided by the present utility model;

FIG. 3 is a schematic front view of a primary side substrate provided by the present utility model;

FIG. 4 is a schematic back view of a primary side substrate provided by the present utility model;

FIG. 5 is a schematic front view of a secondary side substrate provided by the present utility model;

fig. 6 is a schematic back view of the secondary side substrate provided by the present utility model.

Detailed Description

The following description of the preferred embodiments of the present utility model is given with reference to the accompanying drawings, so as to explain the technical scheme of the present utility model in detail.

In the following fig. 1, 30A, 30B, and 30C are higher components on the front surface of the switching power module, wherein 30C is a magnetic core, and is the highest component on the front surface of the power module, the distance from the top end of the component to the front surface of the component is less than 0.3mm, so that the thickness of the component at 30A, 30B, and 30C is small, and the component is too thin and is easy to deform or break, so that the component at 30A, 30B, and 30C is designed into a hollowed-out shape, and the component is divided into two independent parts: a primary side substrate 10 and a secondary side substrate 20. The heat dissipation substrate is made of ceramic material, the front surface of the heat dissipation substrate is a plane, and the height of the heat dissipation substrate is equal to the height of the highest component 30C on the PCB; the back has the unsmooth shape that designs according to heat dissipation and support needs, because ceramic electric insulation's characteristic, the base plate can press close to by the heat dissipation components and parts, generally designs to 0.2+/-0.05mm, and the base plate is little with by the heat dissipation components and parts distance, has also reduced the whole height of power module after the dress base plate when greatly optimizing the heat dissipation.

In fig. 2 below, 40 is a PCB board and 50 is a PIN of a power module for soldering to a system board of a client. Fig. 3 is a front view of the primary side substrate, and fig. 5 is a front view of the secondary side substrate, wherein the front surfaces of the primary side and secondary side substrates are a plane. Fig. 4 is a back view of a primary side substrate, a convex part 10A and a PCB are in no gap, and play a role of supporting the substrate, a distance between the convex part and the PCB is designed to be 0.2+/-0.05mm, and the convex part and the PCB are coupled with each other through a heat conducting insulating material, so that the heat of the heat-dissipating component can be well dissipated; fig. 6 is a back view of the secondary side substrate, the convex portion 20A and the PCB are not clearance, and serve as a supporting substrate, 20B is above the component to be heat-dissipated, the distance between the two is designed to be 0.2+/-0.05mm, the component to be heat-dissipated is coupled with the component to be heat-dissipated through a heat-conducting insulating material, and 20C is above the component not to be heat-dissipated.

In fig. 4 and 6, reference numeral 60 denotes a plurality of positioning posts, the positions and the number of which are adapted to the substrate holes on the PCB board, and the positioning posts are inserted into the substrate holes to position the substrate.

As can be seen from fig. 1, the ceramic substrate avoids some high components on the power module which do not need substrate heat dissipation, and the front height of the ceramic substrate is equal to the height of the highest part on the power module, so that the overall height of the power module is reduced to the greatest extent, and the severe requirements of certain customer limit heights are met; meanwhile, the distance between the back of the substrate and the components to be cooled is small, so that the heat dissipation characteristic is optimized maximally; in addition, the substrate of the ceramic material provided by the utility model contains the positioning columns and the concave-convex shapes on the back, is integrally processed and molded, does not need surface processing, is environment-friendly, and simultaneously greatly shortens the manufacturing period and reduces the cost.

While particular embodiments of the present utility model have been described above, it will be appreciated by those skilled in the art that these are merely illustrative, and that many changes and modifications may be made to these embodiments without departing from the principles and spirit of the utility model. Accordingly, the scope of the utility model is defined by the appended claims.

Claims

1. The ceramic heat dissipation substrate is characterized in that the heat dissipation substrate is made of an electrically insulating ceramic material, the front surface of the heat dissipation substrate is a plane, the back surface of the heat dissipation substrate is provided with concave-convex shapes designed according to heat dissipation and support requirements, and the distance between the substrate and a component to be heat dissipation is designed to be 0.2+/-0.05mm.

2. The ceramic heat sink substrate of claim 1, wherein the back surface of the heat sink substrate has a plurality of positioning posts positioned and number-matched to substrate holes in the PCB board, the positioning posts being inserted into the substrate holes for positioning the substrate.

3. The ceramic heat sink substrate of claim 1, wherein the heat sink substrate is integrally formed without surface treatment process requirements.

4. The ceramic heat dissipation substrate as defined in claim 1, further comprising a hollowed-out portion, wherein the hollowed-out portion is not required to dissipate heat of the substrate corresponding to the component on the PCB, and a distance from the top of the component to the front of the substrate is less than or equal to 0.3mm.

5. The ceramic heat sink substrate of claim 1, wherein the front side of the heat sink substrate has a height that is level with the height of the highest component on the PCB.