CN218974419U - IC electronic element test fixture with sub-mother board structure - Google Patents
IC electronic element test fixture with sub-mother board structure Download PDFInfo
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- CN218974419U CN218974419U CN202223228959.XU CN202223228959U CN218974419U CN 218974419 U CN218974419 U CN 218974419U CN 202223228959 U CN202223228959 U CN 202223228959U CN 218974419 U CN218974419 U CN 218974419U
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Abstract
The utility model discloses an IC electronic element test fixture of a sub-mother board structure, which belongs to the technical field of electronic element test and comprises a test clamping plate, wherein two groups of connection row seats are arranged on the surface of the test clamping plate, one end of the test clamping plate is provided with a connection end connected with a tester, a sub-board is connected to the connection row seats, the test clamping plate is a PCB test board of a sorting machine, the sub-board is an application board of the tester, fixing screws penetrate through the outer surface of the test clamping plate, and the test clamping plate is electrically connected with the tester through the fixing screws. The utility model has the beneficial effects that the testing clamp plate of the sorting machine is changed into the mother plate in the form of 78PIN ports and then is directly connected with the resources of the testing machine, the improved PCB mother plate is added with two 20PIN rows of seats for connecting the daughter boards, the peripheral circuit can be designed on the daughter boards, the improved mother plate can be fixed on the base of the sorting machine without detaching, if other IC elements are tested, only the daughter boards are needed to be replaced, the cost is low after improvement, the short stability of the testing loop is high, and the replacement is convenient.
Description
Technical Field
The utility model relates to the technical field of electronic element testing, in particular to an IC electronic element testing fixture with a sub-motherboard structure.
Background
The electronic component test braid system consists of two devices, namely a tester and a sorter, wherein in a test link, the tester is responsible for testing and judging whether components are good or bad, the sorter is responsible for placing the components, the IC tester is provided with a standard test PCB application board, corresponding peripheral circuits are built according to the test difference of the IC components, the input end of the application board is a 78PIN interface, the output end of the application board is a 25PIN interface, the sorter is also provided with a standard PCB test board, the input end of the application board is a 24PIN, and the output end of the application board is a test piece in direct contact with the components. During the test, the signals of the tester are transmitted to the application board and are connected to the standard board of the sorting machine, and each different test method is additionally designed on the application board as shown in the physical figures 1 and 2.
The above test method has the following drawbacks: 1. the cost is high; 2. because the signal connection line is longer, the signal connection line is easy to be interfered, so that the test result is unstable; the PCB test board is usually fixed on the tester by bolts, and the mounting position of the PCB test board is easy to loose or damage the structure when the PCB test board is vibrated, so that the IC electronic component test fixture with the sub-mother board structure is proposed.
Disclosure of Invention
The present utility model is directed to an IC electronic device testing jig with a sub-motherboard structure, so as to solve the above-mentioned problems in the prior art.
The technical scheme of the utility model is as follows:
including test splint, test splint surface is provided with two sets of connection row seats, test splint one end sets up the link of being connected with the test machine, connection row seat department is connected with the daughter board, test splint is sorter PCB test board, the daughter board is the test machine application board, test splint surface runs through has the fixed screw, test splint passes through the fixed screw and is connected with the test machine electricity.
Further, the outside of the fixed screw is provided with a rubber ring.
Further, the outer surface of the rubber ring is corrugated.
Further, the rubber ring is connected with the test clamping plate in a clamping way.
Further, the surface of the rubber ring is provided with a clamping ring, and the lower surface of the test clamping plate is provided with a clamping groove matched with the clamping ring.
Compared with the prior art, the IC electronic element testing clamp with the sub-mother board structure provided by the utility model has the following improvements and advantages:
the method comprises the following steps: the utility model changes the testing clamp plate of the sorting machine into the mother plate in the form of 78PIN port and then directly connects with the testing machine resource, the improved PCB mother plate is added with two 20PIN row seats for connecting with the daughter board, the peripheral circuit can be designed on the daughter board, the improved mother plate can be fixed on the base of the sorting machine without detaching, if the daughter board is only needed to be replaced when other IC elements are tested, the cost is low after improvement, the testing circuit is short, stable and convenient to be replaced.
And two,: according to the utility model, the mounting screw is provided with the rubber ring with the corrugated structure, so that the vibration force between the test clamping plate and the testing machine can be effectively reduced, the abrasion of the vibration force to the position of the connecting port is avoided, the mounting firmness is ensured, the clamping ring is arranged on the surface of the rubber ring, the clamping groove matched with the clamping ring is arranged on the lower surface of the test clamping plate, and the rubber ring can be clamped with the clamping groove through the clamping ring, so that the subsequent disassembly and replacement are facilitated.
Drawings
The utility model is further explained below with reference to the drawings and examples:
FIG. 1 is a schematic diagram of a PCB test board structure of a prior art sorter;
FIG. 2 is a schematic diagram of a connection structure between a PCB test board and an application board of a separator in the prior art;
FIG. 3 is a schematic view of the structure of the test clamping plate of the present utility model;
FIG. 4 is a schematic diagram of the connection structure of the test clamping plate and the application plate according to the present utility model;
FIG. 5 is a schematic view of the rubber ring connection structure of the present utility model;
fig. 6 is a circuit diagram of the present utility model.
Reference numerals illustrate: 1. testing the clamping plate; 2. connecting the row seats; 3. a connection end; 4. a sub-board; 5. a set screw; 6. a rubber ring; 7. and a clasp.
Detailed Description
The following detailed description of the present utility model will provide clear and complete description of the technical solutions of the embodiments of the present utility model, with reference to fig. 1 to 5, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides an IC electronic element test clamp with a sub-mother board structure by improving, as shown in fig. 1-4, the IC electronic element test clamp comprises a test clamp plate 1, two groups of connection row seats 2 are arranged on the surface of the test clamp plate 1, one end of the test clamp plate 1 is provided with a connection end 3 connected with a tester, a sub-board 4 is connected at the connection row seat 2, the test clamp plate 1 is a PCB test board of a sorting machine, the sub-board 4 is an application board of the tester, a fixing screw 5 penetrates through the outer surface of the test clamp plate 1, the test clamp plate 1 is electrically connected with a testing machine through the fixing screw 5, the test clamp plate 1 of the sorting machine is changed into a mother board in the form of 78PIN ports and then is directly connected with a testing machine resource, two 20PIN row seats are added on the improved PCB mother board for connecting the sub-board 4, a peripheral circuit can be designed on the sub-board 4, the improved mother board can be fixed on the base of the sorting machine without detaching, if other IC elements are tested, the cost is low after improvement, the test circuit is short, and the stability is high, and the replacement is convenient.
As shown in fig. 6, the motherboard operates:
the J1A-J1D is 78PIN interface, which is the input port of the application board and connected with the connecting line of the tester;
JP1 and JP2 are input row seats JP2 of two 40PIN of the daughter board, and whether the row seats are installed or not is selected according to actual needs;
the PIN_SORT is an output row seat of a 40PIN subplate, and effective signals are connected with 8 PINs of the test piece;
SOCKET is a test piece terminal, and the mounted test piece is in direct contact with the IC element;
the circuit relays K6-K13 control connection of signals of the test machines APU 0-APU 7 and PINs of the IC elements PIN 1-PIN 8, voltage or current signals are provided for the PINs of the elements, and the relays K6-K13 are respectively used as control signals of the CBIT 6-CBIT 13. When a certain pin needs to be signaled, a relay is closed, and the test machine APU is enabled to provide corresponding voltage or current.
As shown in fig. 5, the rubber ring 6 is arranged outside the fixing screw 5, the outer surface of the rubber ring 6 is corrugated, and the rubber ring 6 with the corrugated structure can effectively reduce vibration force between the test clamping plate 1 and the test machine, avoid abrasion of the vibration force on the connecting port, and ensure installation firmness.
The rubber ring 6 is connected with the test clamping plate 1 in a clamping way, the clamping ring 7 is arranged on the surface of the rubber ring 6, the clamping groove matched with the clamping ring 7 is formed in the lower surface of the test clamping plate 1, and the rubber ring 6 can be clamped with the clamping groove through the clamping ring 7, so that the follow-up disassembly and replacement are facilitated.
Working principle: according to the method, the test clamping plate 1 of the sorting machine is changed into a mother plate in the form of a 78PIN port and then is directly connected with tester resources, two 20PIN row seats are added on the improved PCB mother plate to be used for connecting the daughter board 4, a peripheral circuit can be designed on the daughter board 4, the improved mother plate can be fixed on a base of the sorting machine without detaching, if other IC elements are tested, only the daughter board 4 is required to be replaced, the cost is low after improvement, the short stability of a test loop is high, and the replacement is convenient.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. An IC electronic component test fixture of a daughter-mother board structure, characterized in that: including test splint (1), test splint (1) surface is provided with two sets of connection row seat (2), test splint (1) one end sets up link (3) of being connected with the test machine, connect row seat (2) department and be connected with daughter board (4), test splint (1) are sorter PCB test board, daughter board (4) are the test machine application board, test splint (1) surface runs through there is fixed screw (5), test splint (1) are connected with the test machine is electric through fixed screw (5).
2. The IC electronic component testing jig of a sub-motherboard structure according to claim 1, wherein: the outside of the fixed screw (5) is provided with a rubber ring (6).
3. The IC electronic component test fixture of the sub-motherboard structure of claim 2, wherein: the outer surface of the rubber ring (6) is corrugated.
4. The IC electronic component test fixture of the sub-motherboard structure of claim 2, wherein: the rubber ring (6) is connected with the test clamping plate (1) in a clamping way.
5. The IC electronic component testing jig of a sub-motherboard structure according to claim 4, wherein: the surface of the rubber ring (6) is provided with a clamping ring (7), and the lower surface of the test clamping plate (1) is provided with a clamping groove matched with the clamping ring (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223228959.XU CN218974419U (en) | 2022-12-02 | 2022-12-02 | IC electronic element test fixture with sub-mother board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223228959.XU CN218974419U (en) | 2022-12-02 | 2022-12-02 | IC electronic element test fixture with sub-mother board structure |
Publications (1)
Publication Number | Publication Date |
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CN218974419U true CN218974419U (en) | 2023-05-05 |
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CN202223228959.XU Active CN218974419U (en) | 2022-12-02 | 2022-12-02 | IC electronic element test fixture with sub-mother board structure |
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2022
- 2022-12-02 CN CN202223228959.XU patent/CN218974419U/en active Active
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