CN218973641U

CN218973641U - Infrared thermal imaging instrument

Info

Publication number: CN218973641U
Application number: CN202222540597.1U
Authority: CN
Inventors: 施孟珣
Original assignee: Hangzhou Micro Image Software Co ltd
Current assignee: Hangzhou Micro Image Software Co ltd
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2023-05-05
Anticipated expiration: 2032-09-26

Abstract

The embodiment of the utility model discloses an infrared thermal imager, relates to the technical field of infrared thermal imaging, and aims to solve the problem that the infrared thermal imager is inconvenient to use due to power failure construction in installation or maintenance. The infrared thermal imager comprises a front shell, a rear shell, a thermal imaging module and a printed circuit board; the front shell is connected with the rear shell in a matched manner, a cavity is formed between the front shell and the rear shell, the thermal imaging module and the printed circuit board are arranged in the cavity, and the thermal imaging module is electrically connected with the printed circuit board; the front shell is provided with a through hole corresponding to the thermal imaging module; an antenna module is also arranged in the cavity and is electrically connected with the printed circuit board; the front shell is made of plastic at least at the position corresponding to the antenna module; and a shielding piece for electromagnetic shielding of the printed circuit board is also arranged in the cavity. The utility model is suitable for the application scene of the infrared thermal imaging instrument which needs to be conveniently installed or maintained.

Description

Infrared thermal imaging instrument

Technical Field

The utility model relates to the technical field of infrared thermal imaging. In particular to an infrared thermal imager.

Background

The infrared thermal imager receives infrared radiation energy of a detected target by utilizing an infrared detector and an optical imaging objective lens, and reflects an energy distribution pattern on a photosensitive element of the infrared detector, so that an infrared thermal image is obtained, and the thermal image corresponds to a thermal distribution field on the surface of an object and is widely applied to industry and life.

The shell of the infrared thermal imager is generally made of metal, but in order to reduce production cost, some manufacturers replace the material of the shell of the infrared thermal imager with plastic from metal, but the plastic has weak electromagnetic interference signal shielding capability, and some electromagnetic sensitive elements in the infrared thermal imager may be affected by the electromagnetic interference signals, so that the normal operation of the infrared thermal imager is affected.

Disclosure of Invention

In view of the above, the embodiment of the utility model provides an infrared thermal imager, which is convenient for realizing wireless transmission of thermal imaging data and improving the stability of the infrared thermal imaging data.

In order to achieve the above purpose, the embodiment of the present utility model adopts the following technical scheme:

the embodiment of the utility model provides an infrared thermal imager, which comprises a front shell, a rear shell, a thermal imaging module and a printed circuit board, wherein the front shell is provided with a plurality of thermal imaging modules; the front shell is connected with the rear shell in a matched manner, a cavity is formed between the front shell and the rear shell, the thermal imaging module and the printed circuit board are arranged in the cavity, and the thermal imaging module is electrically connected with the printed circuit board; the front shell is provided with a through hole corresponding to the thermal imaging module; an antenna module is further arranged in the cavity and is electrically connected with the printed circuit board; the front shell is made of plastic at least at the position corresponding to the antenna module; and a shielding piece for electromagnetic shielding of the printed circuit board is also arranged in the cavity.

According to a specific implementation of an embodiment of the utility model, the shield is arranged between the front shell and the printed circuit board; the back shell is made of metal, an electromagnetic shielding space is formed between the back shell and the shielding piece, the printed circuit board is at least partially located in the electromagnetic shielding space, and the thermal imaging module and the antenna module are located outside the electromagnetic shielding space.

According to a specific implementation manner of the embodiment of the utility model, the shielding piece comprises a metal plate body, and a metal plate side wall is formed on the metal plate body and towards one side of the metal plate body; the panel beating side wall with the backshell looks butt, the panel beating body the panel beating side wall with form between the backshell electromagnetic shield space.

According to a specific implementation manner of the embodiment of the utility model, a groove is formed in the inner wall of the rear shell, conductive foam is arranged in the groove, and the sheet metal side wall penetrates into the groove and is abutted against the conductive foam.

According to a specific implementation manner of the embodiment of the utility model, the printed circuit board is provided with a first metal elastic piece and/or a second metal elastic piece; the first metal elastic piece is abutted with the shielding piece, and the second metal elastic piece is abutted with the rear shell.

According to a specific implementation manner of the embodiment of the utility model, the printed circuit board is electrically connected with a plug, and the outer end of the plug extends out of the cavity; the shell of the plug is made of metal; and a conductive piece is lapped between the shell of the plug and the shielding piece and/or the rear shell.

According to a specific implementation manner of the embodiment of the utility model, the front shell is integrally made of plastic, and the inner wall of the front shell is provided with a heat dissipation metal piece.

According to a specific implementation manner of the embodiment of the present utility model, the arrangement area of the heat dissipation metal piece on the inner wall of the front shell is not overlapped with the area corresponding to the antenna module on the inner wall of the front shell.

According to a specific implementation manner of the embodiment of the utility model, a magnetic component is arranged on the rear shell, and a magnetism isolating piece is arranged between the magnetic component and the rear shell; or the outside of the rear shell is connected with a metal backboard, a magnetic component is arranged on the metal backboard, and a magnetism isolating piece is arranged between the magnetic component and the metal backboard.

According to a specific implementation manner of the embodiment of the utility model, the magnetism isolating piece comprises a bottom plate and a side wall, wherein the side wall is positioned on one side of the bottom plate, and a cavity with one closed end and one open end is enclosed together with the bottom plate; the magnetic component is at least partially arranged in the cavity.

According to a specific implementation manner of the embodiment of the utility model, a first heat conduction pad is arranged between the heating device on the first side surface of the printed circuit board and the shielding piece; and a second heat conduction pad is arranged between the heating device on the second side surface of the printed circuit board and the rear shell.

According to a specific implementation manner of the embodiment of the utility model, the antenna module comprises an antenna bracket, the antenna bracket is a plastic piece, an antenna is arranged on the antenna bracket, and the antenna is electrically connected with the printed circuit board.

According to a specific implementation manner of the embodiment of the utility model, the thermal imaging module is located outside the electromagnetic shielding space.

According to a specific implementation manner of the embodiment of the utility model, the arrangement area of the heat dissipation metal sheet on the inner wall of the front shell comprises an area, close to the thermal imaging module, and an area, far away from the thermal imaging module, in the front shell; and the radiating metal sheets arranged in the area close to the thermal imaging module are connected with the radiating metal sheets arranged in the area far away from the thermal imaging module.

According to the infrared thermal imaging instrument provided by the embodiment of the utility model, a cavity is formed between the front shell and the rear shell, the thermal imaging module and the printed circuit board are arranged in the cavity, and the thermal imaging module is electrically connected with the printed circuit board; an antenna module is further arranged in the cavity and is electrically connected with the printed circuit board, and at least the front shell and the antenna module are made of plastic materials. In this way, wireless transmission of thermal imaging data may be achieved through the antenna module. Furthermore, a shielding piece for electromagnetic shielding of the printed circuit board is further arranged in the cavity so as to shield electromagnetic interference signals outside the infrared thermal imager, and the printed circuit board is ensured not to be interfered by the electromagnetic interference signals, so that the stability of the obtained infrared thermal imaging data is improved.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an infrared thermal imaging system according to an embodiment of the present utility model;

FIG. 2 is an exploded perspective view of the thermal infrared imager of FIG. 1;

FIG. 3 is a cross-sectional view of a thermal infrared imager according to an embodiment of the utility model;

FIG. 4 is a cross-sectional view of another thermal infrared imager according to an embodiment of the utility model;

FIG. 5 is a partial cross-sectional view of a thermal infrared imager according to an embodiment of the utility model;

FIG. 6 is a schematic diagram illustrating an internal structure of a front case of a thermal infrared imager according to an embodiment of the present utility model;

FIG. 7 is an exploded perspective view of a thermal infrared imager according to another embodiment of the utility model;

FIG. 8 is a schematic diagram of a bowl-shaped magnetic shield of a thermal infrared imager according to an embodiment of the present utility model;

fig. 9 is an exploded perspective view of a metal back plate of an infrared thermal imaging camera with a magnetic attraction member, a magnetism isolating member and an anti-slip pad according to an embodiment of the present utility model.

Detailed Description

Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

It should be understood that the described embodiments are merely some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 and 2, the thermal infrared imager provided by the embodiment of the utility model comprises a front shell 1, a rear shell 2, a thermal imaging module 3 and a printed circuit board 4; the front shell 1 is connected with the rear shell 2 in a matched manner, a cavity is formed between the front shell 1 and the rear shell 2, the thermal imaging module 3 and the printed circuit board 4 are arranged in the cavity, and the thermal imaging module 3 is electrically connected with the printed circuit board 4; the front shell 1 is provided with a through hole corresponding to the thermal imaging module 3; an antenna module 5 is also arranged in the cavity, and the antenna module 5 is electrically connected with the printed circuit board 4; the front shell 1 is made of plastic at least at the position corresponding to the antenna module 5; a shield 6 is also provided in the chamber for electromagnetic shielding of the printed circuit board 4.

The front shell 1 may also be referred to as a protective cover, a front shell housing, a thermal infrared imager housing, etc. The front case 1 may include a front case body, at an edge of the front case body, a front case side wall is formed toward one side of the front case body, the front case side wall is abutted with the rear case 2, and the chamber is formed between the front case body, the front case side wall and the rear case 2. The front case 1 may be composed of a metal material and a plastic material. For example, the front case 1 includes a first portion and a second portion, the first portion is made of plastic material, and the second portion is made of sheet metal material, wherein the first portion of the front case 1 corresponds to the antenna module 5.

The rear housing 2 may also be referred to as a floor, a baffle, a shield plate, etc. The rear case 2 may have a plate-like structure adapted to the cross-sectional shape of the front case side, or may have a plate-like structure capable of covering the opening of the front case side. The rear case 2 and the front case 1 may be integrally connected by screws.

The thermal imaging module 3 may also be referred to as a thermal imaging lens, a thermal imaging sensor, a thermal imaging image acquisition component, or the like. The printed circuit board (Printed Circuit Board, abbreviated as PCB) 4 may also be referred to as a printed circuit board for processing the infrared signals collected by the thermal imaging module 3.

The antenna module 5, which may also be called a wireless communication module, a wireless signal transmission module, etc., is configured to transmit the thermal imaging data obtained by the processing of the infrared signal by the printed circuit board 4 outwards in a wireless communication manner.

The shielding member 6, which may be called an electromagnetic shielding component, an electromagnetic shielding cover, or the like, is used for electromagnetic shielding of the printed circuit board 4, so as to prevent the thermal infrared imager from being unable to start working due to electromagnetic interference, or from losing a shot picture, blocking a picture, or blocking a screen due to electromagnetic interference in the working process.

Referring to fig. 3, in an embodiment, the shielding member 6 is disposed between the front case 1 and the printed circuit board 4, the rear case 2 is made of metal, an electromagnetic shielding space is formed between the rear case 2 and the shielding member 6, the printed circuit board 4 is at least partially located in the electromagnetic shielding space, and the antenna module 5 is located outside the electromagnetic shielding space.

The printed circuit board 4 may be partially or entirely located in the electromagnetic shielding space to obtain electromagnetic shielding protection. When the printed circuit board 4 is partially located in the electromagnetic shielding space, the portion where the electromagnetic sensitive element related to transmission of an image or the like is mounted is located in the electromagnetic shielding space to ensure normal operation of the printed circuit board 4. Electromagnetic shielding may also be referred to in the art as electromagnetic compatibility (Electromagnetic Compatibility, EMC for short). The antenna module 5 is arranged outside the electromagnetic shielding space, so that the antenna module 5 can send signals to the outside of the thermal infrared imager in a wireless transmission mode.

In order to enhance the imaging effect of the thermal imaging module, in one embodiment, the thermal imaging module 3 is located outside the electromagnetic shielding space. And can be equipped with the camera lens hole corresponding with thermal imaging module 3 on preceding shell 1, the thermal imaging module 3 of setting outside electromagnetic shield space gathers the infrared signal of target position department through the camera lens hole in order to image, can strengthen thermal imaging module 3's imaging.

In one example, the rear case 2 is made of aluminum alloy with a surface paint, and the shield 6 is made of aluminum alloy plate by a sheet metal bending process. The shielding member 6 is integrally connected with the front shell 1 through a screw, and as can be seen from the foregoing, the rear shell 2 and the front shell 1 can be integrally connected through a screw, and when the rear shell 2 and the front shell 1 are integrally connected, the shielding member 6 is abutted against the rear shell 2, so that an electromagnetic shielding space is formed between the rear shell 2 and the shielding member 6. The contact area between the shielding member 6 and the rear case 2 needs to be milled and whitened, or when spraying (e.g., painting) the shielding member 6 and the rear case 2, a shielding treatment is selected to expose the metal body of the contact area between the shielding member 6 and the rear case 2.

Referring to fig. 3 and 4, in an embodiment, the shield 6 includes a sheet metal body 601, and a sheet metal side wall 602 is formed on the sheet metal body 601 on a side facing the sheet metal body 601; the panel beating side wall 602 and backshell 2 looks butt form electromagnetic shield space between panel beating body 601, panel beating side wall 602 and the backshell 2.

The shielding member 6 may be made of aluminum alloy, and is integrally formed, for example, by bending a metal plate to form a metal plate side wall 602 on one side of the metal plate body 601. An electrostatic current may be generated on the shielding member 6, for example, when a magnetic field exists near the thermal infrared imager and the magnetic field is in a fast changing state, because the material of the rear housing 2 is metal, the sheet metal side wall 602 is abutted against the rear housing 2, and the abutting area of the sheet metal side wall 602 and the rear housing 2 is milled and whitened or sprayed, the electrostatic current on the shielding member 6 can be guided onto the rear housing 2 through the sheet metal side wall 602, so that an electromagnetic shielding space is formed among the sheet metal body 601, the sheet metal side wall 602 and the rear housing 2. Thus, the influence of electromagnetic interference outside the infrared thermal imager on the normal operation of the printed circuit board 4 can be reduced or avoided by arranging the printed circuit board 4 between the metal plate body 601, the metal plate side wall 602 and the rear shell 2.

Referring to fig. 4, when the infrared thermal imager is operated in the presence of an alternating power frequency electromagnetic field, for example, when the infrared thermal imager is installed in an electrical cabinet, a high electromagnetic shielding performance is required, in one embodiment, a groove is formed on the inner wall of the rear shell 2, conductive foam 16 is disposed in the groove, and the sheet metal side wall 602 extends into the groove and abuts against the conductive foam 16.

The conductive foam has good surface conductivity, and the metal plate side wall 602 is made to penetrate into the groove and is abutted against the conductive foam 16, so that the contact area between the metal plate side wall 602 and the rear shell 2 can be increased, namely, the electromagnetic conduction area between the metal plate side wall 602 and the rear shell 2 can be increased, and the reliability of electromagnetic shielding performance of an electromagnetic shielding space formed between the metal plate body 601 and the metal plate side wall 602 and the rear shell 2 is enhanced, for example, image blocking or black screen transmission of an infrared thermal imager can be avoided.

If electrostatic current builds up on the printed circuit board, components on the printed circuit board may be burned out, and in order to avoid this, referring to fig. 3 and 4, in an embodiment, the printed circuit board 4 is provided with a first metal elastic member 401 and/or a second metal elastic member 402; the first metal elastic member 401 abuts against the shield 6, and the second metal elastic member 402 abuts against the rear case 2.

An electrostatic current may be generated on the printed circuit board 4, for example, an external electrostatic current that enters the printed circuit board 4 through the plug 7 connected to the printed circuit board 4. By abutting the first metal elastic member 401 against the shield 6, the electrostatic current on the printed circuit board 4 can be guided to the shield 6; by abutting the second metal elastic member 402 against the rear case 2, the electrostatic current on the printed circuit board 4 can be guided onto the rear case 2 to shield the external electrostatic current entering onto the printed circuit board 4 through the plug, protecting the devices on the printed circuit board 4. In one example, the number of the first metal elastic members 401 and the second metal elastic members 402 may be not less than three, and are uniformly distributed on the printed circuit board 4, respectively.

The first metal elastic piece 401 and the second metal elastic piece 402 may be elastic pieces, and the positions, where the first metal elastic piece 401 and the second metal elastic piece are abutted against each other, on the shielding piece 6 are subjected to laser engraving or milling exposure treatment, and laser engraving or laser marking is a surface treatment process by using an optical principle, wherein the milling exposure refers to a process of machining a part with a surface treatment process such as paint spraying and the like on the surface, so that the surface of the part is exposed from original metal, and therefore, the laser engraving and milling exposure treatment can ensure that the first metal elastic piece 401 is in contact with metal on the shielding piece 6, so that conduction between the first metal elastic piece 401 and the shielding piece 6 can be ensured, and the second metal elastic piece 402 is in contact with metal on the rear shell 2, so that conduction between the second metal elastic piece 402 and the rear shell 2 can be ensured, so that electromagnetic interference signals are shielded, and devices on the printed circuit board 4 are protected.

Further, the first metal elastic member 401 is abutted against the shielding member 6 through a conductive member, and the second metal elastic member 402 is abutted against the rear case 2 through a conductive member. The conductive pieces and the metal elastic pieces are arranged in one-to-one correspondence, conductive foam can be selected as the conductive pieces, and the area of each conductive foam is not smaller than 5 mm by 5 mm.

Referring to fig. 5, in order to connect the thermal infrared imager with other devices, in one embodiment, the printed circuit board 4 is electrically connected with a plug 7, and an outer end of the plug 7 protrudes outside the cavity formed between the front case and the rear case; the plug 7 is made of metal; a conductive element 8 is connected between the plug 7 and the shielding 6 and/or the rear housing 2.

The housing of the plug 7 is made of metal, which may be an aviation plug. The conductive member 8 may be conductive foam. A power cord can be arranged inside the plug 7 in a penetrating way so as to supply power for the infrared thermal imaging instrument. The plug 7 can be internally provided with a data line. The thermal imaging data can be transmitted wirelessly through the antenna module, and can also be transmitted in a wired manner through the data line.

When the thermal infrared imager is installed in a small space where there are many electric devices, there may be an induced electric field in the small space, and when the electric field strength of the induced electric field is large, an electrostatic current may be generated between the plug and the thermal infrared imager. Thus, by overlapping the conductive member 8 between the plug 7 and the shield member 6, the electrostatic current can be caused to flow to the shield member 6 through the conductive member 8, and as described above, the shield member 6 abuts against the rear case 2, and therefore, the electrostatic current can flow to the rear case 2 through the shield member 6; by overlapping the conductive member 8 between the plug 7 and the rear case 2, the electrostatic current can be made to flow directly to the rear case 2 through the conductive member 8. In some examples, the rear housing 2 is connected to the metal back plate 12, and the metal back plate 12 is tightly attached to the grounded metal wall surface, so that the rear housing 2 can guide the electrostatic current between the plug 7 and the infrared thermal imager to the ground, thereby avoiding the electrostatic current from being guided to the printed circuit board and damaging components on the printed circuit board.

At least part of the front shell 1 (such as the part corresponding to the antenna module) is made of plastic, the rest part can be made of metal, and the plastic part and the metal part can be connected together in an injection molding mode or in a hot melting mode.

Referring to fig. 6, in order to reduce the production cost of the infrared thermal imager while ensuring the heat dissipation effect, in one embodiment, the front housing 1 is made of plastic material, and a heat dissipation metal member 9 is disposed on the inner wall of the front housing 1.

The heat dissipation metal member 9 is disposed on the inner wall of the front case, and may be a heat dissipation plate gold thermally fused on the inner wall of the front case 1, and the heat dissipation plate gold is made of a high thermal conductivity material, such as brass.

The front shell 1 is integrally made of plastic, so that the antenna module 5 can send wireless signals to the outside of the infrared thermal imager, but the heat conducting performance of the front shell 1 can be seriously affected, the thermal imaging module 3 is positioned in the front shell 1, and the temperature measurement precision of the thermal imaging module 3 can be affected by too high internal temperature, so that the temperature of a cavity formed inside the front shell 1 and the rear shell 2 needs to be reduced. Specifically, the heat dissipation metal piece 9 is disposed on the inner wall of the front shell 1, so that the temperatures of the chambers formed inside the front shell 1 and the rear shell 2 are uniformly distributed, and the temperature at the highest point of the temperature in the chambers, namely the temperature at the thermal imaging module 3, is reduced, so as to ensure the measurement accuracy of the thermal imaging module 3. In addition, on the premise of ensuring the radiating effect of the infrared thermal imager, the front shell 1 is integrally made of plastic, so that the production cost of the infrared thermal imager can be effectively reduced.

The metal influences the transmission of the antenna signal, so that in order to avoid that the heat dissipating metal element interferes with the antenna module, in one embodiment the area of the heat dissipating metal element 9 arranged on the inner wall of the front housing 1 does not overlap with the area on the inner wall of the front housing 1 corresponding to the antenna module 5. As described above, the front case 1 is entirely made of plastic material, so that the antenna module 5 can transmit the video signal obtained by processing the infrared signal by the printed circuit board 4 in a wireless communication manner to the outside through the area corresponding to the antenna module 5 on the inner wall of the front case 1.

When the infrared thermal imaging device works, the thermal imaging module is at the position with the highest temperature in the whole cavity, and the temperature measurement precision of the thermal imaging module can be influenced by the too high internal temperature, so that the temperature of the cavity formed in the front shell and the rear shell needs to be reduced. In an embodiment, the arrangement area of the heat dissipation metal sheet on the inner wall of the front shell 1 comprises an area close to the thermal imaging module 3 and an area far away from the thermal imaging module 3 in the front shell 1; the heat radiation metal sheets 9 arranged in the area close to the thermal imaging module 3 are connected with the heat radiation metal sheets 9 arranged in the area far away from the thermal imaging module 3.

In this way, by connecting the heat dissipation metal piece 9 arranged in the area close to the thermal imaging module 3 with the heat dissipation metal piece 9 arranged in the area far away from the thermal imaging module 3, the heat generated by the thermal imaging module 3 can be guided to other positions in the cavity, so that the temperature of the cavity formed in the front shell 1 and the rear shell 2 is uniformly distributed, and the measurement accuracy of the thermal imaging module is ensured. In one example, the temperature below the printed circuit board (where the heat generating devices on the printed circuit board are primarily disposed above the printed circuit board) is lower throughout the chamber, and the heat dissipating hardware is used to direct heat generated by the thermal imaging module to the lower temperature region below the printed circuit board.

Referring to fig. 6, in one example, the antenna module is disposed on top of the inner side of the front case, the thermal imaging module and the printed circuit board are disposed under the antenna module, and the arrangement area of the heat dissipation metal member on the inner side of the front case is referred to as an area under the antenna module.

To facilitate installation and maintenance of the infrared thermal imager, in one embodiment, the magnetic attraction member 10 is provided on the rear case 2, and in one example, the magnetic attraction member 10 may be provided outside the rear case 2; a magnetism isolating member is provided between the magnetism absorbing member 10 and the rear case 2.

In another embodiment, a metal back plate 12 is connected to the outer side of the rear case 2, and a magnetic attraction member 10 is provided on the metal back plate 12, and in one example, the magnetic attraction member 10 may be provided on the outer side of the metal back plate 12; a magnetism isolating member is provided between the magnetism absorbing member 10 and the metal back plate 12. The metal back plate 12 may be made of aluminum alloy, and may be tightly attached to the rear case 2 and fixedly connected to the rear case by screws.

In the above two embodiments, the magnetic attraction member 10 may be a magnet, such as a neodymium-iron-boron magnet, and the magnetism insulator may be a soft magnetic material, such as SUS430 stainless steel, low carbon steel, electrical pure iron, or the like. Referring to fig. 7, the magnetism insulator may be a sheet magnetism insulator 11a having a sheet shape, specifically, the sheet magnetism insulator 11a is a sheet having a thin thickness and an identical outer shape to the rear case 2.

Compared with the infrared thermal imaging device which is arranged at the target position through the screw, for example, the infrared thermal imaging device is arranged on the infrared thermal imaging device bracket which is fixed in the electric cabinet in advance through the screw, and the infrared thermal imaging device is arranged at the target position through the magnetic component 10, so that the infrared thermal imaging device is more convenient to assemble and disassemble. However, the magnetic field generated by the magnetic attraction component 10 may affect the normal operation of the internal components of the infrared thermal imager, especially the thermal imaging baffle, so a magnetic isolation member may be disposed between the magnetic attraction component 10 and the rear housing 2, or a magnetic isolation member may be disposed between the magnetic attraction component 10 and the metal back plate 12, so as to shield the magnetic field of the magnetic attraction component 10 towards the interior of the infrared thermal imager, and protect the electromagnetic sensitive element in the infrared thermal imager from the magnetic field of the magnetic attraction component. Through the magnetic component 10 and the antenna module 5, the infrared thermal imager provided by the embodiment of the utility model can be used after being attached and disassembled, and can be repaired without power-off installation of an electric cabinet or modification of the structure of the electric cabinet, thereby being convenient for disassembly and assembly of the infrared thermal imager.

The magnetic field is similar to the electric field, the magnetic flux is similar to the electric current, and the magnetic flux always tends to be closed along the path with minimum magnetic resistance, namely the principle of minimum magnetic resistance, so that the magnetism isolating piece can enable the magnetism induction line to conduct along the inside of the magnetism isolating piece, and the magnetism isolating piece can block the conduction of the magnetic field towards the lower part of the bottom plate of the magnetism isolating piece so as to reduce the magnetic field intensity in the direction of the bottom plate, namely the magnetic field intensity towards the inside of the rear shell, so that the electromagnetic sensitive element in the infrared thermal imager is protected from the magnetic field of the magnetism isolating part 10, and the measurement precision of the infrared thermal imager is ensured.

In another example, the thermal infrared imager includes a thermal imaging module, where the thermal imaging module includes a plurality of small-sized detecting units, and under the radiation of an external uniform thermal field, the response outputs of the small-sized detecting units are different, that is, the same uniform temperature object is measured, and the temperature values displayed by the small-sized detecting units are different. Therefore, the baffle and the electromagnet are arranged in the infrared thermal imaging instrument, and the electromagnet can drive the shifting piece on the baffle to rotate, so that the baffle is driven to rotate, and each small detection unit of the thermal imaging module is shielded. The baffle can form an infrared plane with uniform temperature, so that when each small detection unit of the thermal imaging module is shielded by the baffle, the baffle receives uniform infrared radiation signals, and at the moment, a uniform temperature response relationship can be established among the small detection units through a correction algorithm. It can be understood that the magnetic field generated by other magnets can interfere the magnetic field of the electromagnet driving the baffle, so that the baffle cannot normally rotate, and further, the small detection units of the thermal imaging module cannot be shielded by the baffle to establish a uniform temperature response relationship, and the measurement result of the thermal infrared imager is inaccurate. Through setting up magnetism isolating piece, can shield magnetism and inhale part 10 towards the inside magnetic field of infrared thermal imaging system, prevent that magnetism of magnetism inhale part 10 from interfering with the rotation of separation blade to ensure the measurement accuracy of infrared thermal imaging system.

In order to enhance the magnetic field of the shielding magnetic attraction part 10 of the magnetism isolating part facing the infrared thermal imager, in one embodiment, the magnetism isolating part comprises a bottom plate and a side wall, wherein the side wall is positioned on one side of the bottom plate, and a cavity with one closed end and one open end is formed by the side wall and the bottom plate. Referring to fig. 8, in one example, the magnetism insulator is a bowl-shaped magnetism insulator 11b having a bowl-shaped outer shape or a magnetism insulator having a bowl-like shape.

The magnetism isolating piece can be of an integrated structure, for example, the magnetism isolating piece is generated through sheet metal stamping, so that the production cost of the magnetism isolating piece can be reduced, and the production cost of the infrared thermal imager is reduced.

The magnetic component is at least partially arranged in the cavity. The magnetic attraction member 10 may be at least partially disposed in the cavity of the magnetism insulator by dispensing.

Preferably, the magnetic component 10 can be integrally located in the cavity of the magnetism isolating piece, and one side of the magnetic component 10 close to the opening of the cavity can be flush with the opening of the cavity so as to enhance the shielding effect of the magnetism isolating piece. The magnetic attraction component 10 and the magnetism isolating component can be adhered and fixed into a whole through dispensing. The magnetic separator may be a soft magnetic material with low magnetic resistance (i.e., high magnetic permeability) and a large number of lines of magnetic induction (i.e., high magnetic flux density) can be accommodated per unit area.

The magnetic field is similar to the electric field, the magnetic flux is similar to the electric field, and the magnetic flux always tends to be closed along the path with minimum magnetic resistance, namely the principle of minimum magnetic resistance, so that the magnetism isolating piece can enable the magnetism induction line to conduct along the inner part of the magnetism isolating piece, and the magnetism isolating piece can block the conduction of the magnetic field to the lower part of the bottom plate of the magnetism isolating piece so as to reduce the magnetic field intensity in the direction of the bottom plate, namely the magnetic field intensity towards the inner part of the rear shell, and the electromagnetic sensitive element in the infrared thermal imager is protected from the magnetic field of the magnetism isolating part 10. And the magnetic induction line of the magnetic attraction component 10 is conducted along the inner part of the magnetism isolating piece and penetrates out from one end of the opening of the cavity or a port (also called a bowl opening) of the magnetism isolating piece at the side wall, so that the magnetic flux density in the bowl opening direction is increased, the magnetic field is enhanced, and the magnetism isolating piece has magnetism gathering effect at the port. For example, the N pole of the magnetic attraction member 10 faces the bottom plate direction of the magnetism insulator, and the emitted magnetic flux is constant. The magnetic induction line emitted from the N pole is influenced by the magnetism isolating piece, deflected, conducted along the inside of the magnetism isolating piece, not conducted to the lower side of the bottom plate, conducted along the inside of the magnetism isolating piece, penetrated out from the bowl opening direction and returned to the S pole.

The magnitude of the magnetic induction intensity of the magnetic field generated by the magnetic attraction member 10 is proportional to the density of the magnetic induction lines, and the magnetism isolating member with the structure has magnetism gathering effect at the port. Thus, the magnetic induction intensity of the magnetic attraction component 10 at the port of the magnetism isolating component can be increased, and the magnetic attraction force of the magnetic attraction component 10 can be increased.

Referring to fig. 9, in order to facilitate the installation and positioning of the magnetism isolating member on the metal back plate 12, a groove or a through hole is provided on the metal back plate 12, and the magnetism isolating member may be fixed in the groove or the through hole on the metal back plate 12 by glue bonding. The colloid can be heat conducting glue or common structural glue.

Specifically, the magnetic attraction component 10 and the magnetism isolating component are adhered together through colloid, and then the magnetism isolating component is adhered and fixed in a groove on the metal backboard 12 through colloid. When the magnetism isolating piece is adhered and fixed in the groove on the metal backboard 12, the magnetism absorbing part 10 and the magnetism isolating piece are not protruded out of the groove opening of the metal backboard 12, and one sides of the magnetism absorbing part 10 and the magnetism isolating piece, which are close to the groove opening of the metal backboard 12, can be respectively flush with the groove opening of the metal backboard 12, so that one side, provided with the groove, of the metal backboard 12 is kept flat, and the infrared thermal imager is attached to the target position conveniently.

Referring to fig. 7 and 9, further, compared with inserting a sheet-shaped magnetic shielding member 11a having a thin thickness and an identical shape to the rear case 2 between the metal back plate and the rear case 2, the thickness of the thermal infrared imager can be reduced by adhesively fixing the magnetic shielding member including the bottom plate and the side walls in the groove on the metal back plate 12, so that the thermal infrared imager can be installed in a narrow space, particularly, a narrow space with a safety distance requirement between the thermal infrared imager and the object to be measured, for example, the thermal infrared imager is installed in an electric cabinet.

Further, a non-slip mat 15 may be disposed between the magnetic attraction member 10 and the target mounting position, and the non-slip mat 15 may be made of silica gel. The skid pad 15 may be adhered to the metal back plate 12 by a back adhesive between the magnetic attraction member 10 and the target mounting position.

The anti-slip pad 10 does not have the ability to shield the magnetic field, and therefore, the anti-slip pad 10 is provided between the magnetic attraction member 6 and the installation position without changing the strength of the magnetic field generated by the magnetic attraction member 6. The anti-slip pad 10 is arranged between the magnetic component 6 and the metal surface at the installation position, so that the friction force between the magnetic component 6 and the metal surface at the installation position can be increased, the magnetic component 6 is firmly adsorbed on the metal surface at the installation position, and the thermal infrared imager can be firmly adsorbed at the installation position.

Referring to fig. 3 and 4, to further reduce the temperature inside the infrared thermal imager, in one embodiment, a first thermal pad 13 is provided between the heat generating device on the first side of the printed circuit board 4 and the shield 6; a second thermal pad 14 is provided between the heat generating device on the second side of the printed circuit board 4 and the rear case 2.

The first thermal pad 13 and the second thermal pad 14 may be made of thermal conductive silicone rubber.

By arranging the first heat conducting pad 13 between the heat generating device on the first side of the printed circuit board 4 and the shielding member 6, heat generated by the heat generating device on the first side of the printed circuit board 4 can be conducted to the shielding member 6, the shielding member 6 conducts the heat to the rear shell 2, and then the heat is conducted to the outside of the infrared thermal imager through the rear shell 2, so that heat dissipation of the heat generating device on the first side of the printed circuit board 4 is completed. The second heat conducting pad 14 is arranged between the heat generating device on the second side surface of the printed circuit board 4 and the rear shell 2, so that heat generated by the heat generating device on the second side surface of the printed circuit board 4 can be conducted to the rear shell 2, and then conducted to the outside of the infrared thermal imager through the rear shell 2, so that heat dissipation of the heat generating device on the second side surface of the printed circuit board 4 is completed. In this way, heat build-up on the printed circuit board 4 can be avoided, thereby avoiding damage to the components on the printed circuit board 4. In addition, heat can be prevented from being transferred to the thermal imaging module 3 through the connector, so that the temperature measurement precision of the thermal imaging module 3 is ensured. The connector between the printed circuit board 4 and the thermal imaging module 3 may be a flexible circuit board (Flexible Printed Circuit, abbreviated as FPC), which is also called an FPC cable in the technical field.

Further, the heat dissipation area can be increased by arranging the heat dissipation fins 17 on the rear shell 2, so that the convection heat dissipation efficiency is improved, the temperature in the cavity is reduced relative to the temperature of the external environment, and the temperature measurement accuracy is improved. It will be appreciated that when the rear case 2 is connected to the metal back plate 12, the heat radiation fins 17 are provided on the metal back plate 12.

In one example, the heat generating device on the first side of the printed circuit board 4 includes field programmable gate arrays (Field Programmable Gate Array, abbreviated as FPGA) 403 and eMMC (Embedded Multi Media Card), the first thermal pad 13 includes an FPGA thermal pad and an eMMC thermal pad, the FPGA thermal pad is disposed between the FPGA and the shield 6 to complete heat dissipation of the FPGA, and the eMMC thermal pad is disposed between the eMMC and the shield 6 to complete heat dissipation of the eMMC. The heat generating device on the second side of the printed circuit board 4 includes a central processing unit (central processing unit, CPU) 405, and the second thermal pad 14 is disposed between the CPU and the rear case 2 to complete heat dissipation of the CPU.

In one embodiment, the antenna module 5 comprises an antenna bracket, which is a plastic part, and is fixed on the front shell 1, and an antenna is arranged on the antenna bracket and is electrically connected with the printed circuit board 4.

In one example, the antenna mount is fixed to the antenna mounting area 501 of the front case 1 by screws, the antenna is provided on the antenna mount by a laser direct structuring technique, and the antenna is connected to the printed circuit board 4 by spring contact. In another example, the antenna is electrically connected to the printed circuit board 4 through FPC lines. The Laser Direct forming technology is also called as an LDS (Laser-Direct-structuring) Laser carving antenna in the technical field, and the LDS Laser carving antenna is formed by directly plating a metal antenna on an antenna support by utilizing a Laser technology, so that compared with the mode that the metal antenna is wound on the antenna support, the assembly process of an infrared thermal imager can be accelerated through the LDS Laser carving antenna, and the processing and the production of the infrared thermal imager are facilitated. In addition, compare on winding up the metal antenna on the antenna support, LDS radium carving antenna occupies the space less, can reduce the volume of infrared thermal imaging appearance to a certain extent to help installing infrared thermal imaging appearance in narrow and small space.

In addition, the existing thermal infrared imager is generally in a cylinder machine or a sphere machine shape, and through the description about the shapes of the front shell 1 and the rear shell 2, it can be determined that the thermal infrared imager provided by the embodiment of the utility model belongs to a miniaturized card type instrument. In addition, the existing infrared thermal imaging instrument adopts the all-metal shell, so that the wired signal transmission is adopted, and the infrared thermal imaging instrument provided by the embodiment of the utility model adopts the plastic front shell 1 and the antenna module 5, and adopts the wireless signal transmission.

It should be noted that, in this document, emphasis on the solutions described between the embodiments is different, but there is a certain interrelation between the embodiments, and when understanding the solution of the present utility model, the embodiments may refer to each other; additionally, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present utility model should be included in the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims

1. An infrared thermal imager is characterized by comprising a front shell, a rear shell, a thermal imaging module and a printed circuit board;

the front shell is connected with the rear shell in a matched manner, a cavity is formed between the front shell and the rear shell, the thermal imaging module and the printed circuit board are arranged in the cavity, and the thermal imaging module is electrically connected with the printed circuit board; the front shell is provided with a through hole corresponding to the thermal imaging module;

an antenna module is further arranged in the cavity and is electrically connected with the printed circuit board; the front shell is made of plastic at least at the position corresponding to the antenna module;

and a shielding piece for electromagnetic shielding of the printed circuit board is also arranged in the cavity.

2. The thermal infrared imager of claim 1, wherein the shield is disposed between the front housing and the printed circuit board; the rear shell is made of metal, an electromagnetic shielding space is formed between the rear shell and the shielding piece, the printed circuit board is at least partially located in the electromagnetic shielding space, and the antenna module is located outside the electromagnetic shielding space.

3. The infrared imager of claim 2, wherein the shield comprises a sheet metal body on which a sheet metal side wall is formed on a side facing the sheet metal body;

the panel beating side wall with the backshell looks butt, the panel beating body the panel beating side wall with form between the backshell electromagnetic shield space.

4. The infrared thermal imager of claim 3, wherein a groove is formed in the inner wall of the rear shell, conductive foam is arranged in the groove, and the sheet metal side wall penetrates into the groove and is abutted against the conductive foam.

5. The infrared thermal imager as set forth in claim 2, wherein the printed circuit board is provided with a first metal elastic member and/or a second metal elastic member; the first metal elastic piece is abutted with the shielding piece, and the second metal elastic piece is abutted with the rear shell.

6. The infrared thermal imager as set forth in claim 1, wherein the printed circuit board is electrically connected to a plug, an outer end of the plug extending outside the chamber; the shell of the plug is made of metal;

and a conductive piece is lapped between the shell of the plug and the shielding piece and/or the rear shell.

7. The infrared thermal imager as set forth in claim 1, wherein the front housing is integrally formed of a plastic material, and a heat-dissipating metal member is provided on an inner wall of the front housing.

8. The infrared imager of claim 7, wherein the heat dissipating metal has a layout area on the inner wall of the front housing that does not overlap with an area on the inner wall of the front housing corresponding to the antenna module.

9. The infrared thermal imager as set forth in claim 1, wherein a magnetic attraction member is provided on the rear case, and a magnetism blocking member is provided between the magnetic attraction member and the rear case; or alternatively, the process may be performed,

the outer side of the rear shell is connected with a metal backboard, a magnetic component is arranged on the metal backboard, and a magnetism isolating piece is arranged between the magnetic component and the metal backboard.

10. The infrared thermal imager of claim 9, wherein the magnetism isolating member comprises a bottom plate and a side wall, the side wall is positioned at one side of the bottom plate, and a cavity with one closed end and one open end is enclosed together with the bottom plate;

the magnetic component is at least partially arranged in the cavity.

11. The thermal infrared imager of claim 1, wherein a first thermal pad is disposed between the heat generating device on the first side of the printed circuit board and the shield; and a second heat conduction pad is arranged between the heating device on the second side surface of the printed circuit board and the rear shell.

12. The infrared thermal imager of claim 1, wherein the antenna module comprises an antenna mount, the antenna mount being a plastic piece, an antenna being provided on the antenna mount, the antenna being electrically connected to the printed circuit board.

13. The thermal infrared imager of claim 2, wherein the thermal imaging module is located outside the electromagnetic shielding space.

14. The thermal infrared imager of claim 7, wherein the placement area of the heat dissipating metal on the inner wall of the front housing includes an area within the front housing proximate to the thermal imaging module and an area distal to the thermal imaging module;

and the heat dissipation metal piece arranged in the area close to the thermal imaging module is connected with the heat dissipation metal piece arranged in the area far away from the thermal imaging module.