CN218957723U

CN218957723U - Semiconductor IC chip packaging structure

Info

Publication number: CN218957723U
Application number: CN202223521683.4U
Authority: CN
Inventors: 杨利明; 曾尚文; 陈久元
Original assignee: Sichuan Jinghui Semiconductor Co ltd
Current assignee: Sichuan Jinghui Semiconductor Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-05-02
Anticipated expiration: 2032-12-28

Abstract

The utility model provides a semiconductor IC chip packaging structure, and belongs to the technical field of chips. The problem of damage caused by post-treatment of pins in the prior art is solved. This semiconductor IC chip packaging structure, including chip, pin and plastic envelope body, the pin is including being located the inside connecting portion of plastic envelope body and spilling the external portion of plastic envelope body, connecting portion are used for connecting the inside the chip of plastic envelope body, external portion is used for connecting external circuit, connecting portion with have the kink between the external portion, the kink is located in the plastic envelope body, external portion is followed the outside extension in plastic envelope body bottom surface, the bottom surface of external portion with plastic envelope body bottom surface parallel and level. The utility model ensures that only a small part of the pins leak outside the chip, and the chip is not damaged by the later cutting and bending steps, thereby avoiding the damage of the internal chip caused by external stress.

Description

Semiconductor IC chip packaging structure

Technical Field

The utility model belongs to the technical field of chips, in particular to a semiconductor IC chip packaging structure.

Background

The chip can be used after being packaged, the packaging plays roles of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and the bridge for communicating the world inside the chip with an external circuit, namely, the joints on the chip are connected to the pins of the packaging shell by leads, and the pins are connected with other devices by leads on the printed board. Thus, packaging plays an important role for the chip.

At present, most of pins of a chip are external, later cutting and bending steps are needed to be carried out on the pins after production, the steps are easy to damage the chip, and in addition, the pins in direct insertion type are easy to fall off.

For example, patent application number 201210470646.7 discloses a semiconductor device, which adopts a plurality of protruding parts on pins to improve the adhesion between the pins and a package body and realize the function of preventing the pins from falling off, but the structure of the pins is complex, which is not beneficial to production and installation.

Therefore, how to avoid the damage caused by post-processing of the pins is a technical problem to be solved in the industry.

Disclosure of Invention

The utility model mainly aims to provide a semiconductor IC chip packaging structure, which adopts built-in pins, does not need post-processing and avoids damage caused by post-processing.

The aim of the utility model can be achieved by the following technical scheme: the utility model provides a semiconductor IC chip packaging structure, includes chip, pin and plastic envelope body, the pin is including being located the inside connecting portion of plastic envelope body and spilling the external portion of plastic envelope body, connecting portion are used for connecting the inside the chip of plastic envelope body, external portion is used for connecting external circuit, connecting portion with have the kink between the external portion, the kink is located in the plastic envelope body, external portion is followed the outside extension in plastic envelope body bottom surface, the bottom surface of external portion with plastic envelope body bottom surface parallel and level.

In some embodiments, the chip is disposed on a lower pad with overhanging leads disposed thereon.

In some embodiments, the bend has a bend in a vertical direction from the connection portion downward toward the circumscribed portion.

In some embodiments, the bend also has a bend in the horizontal direction.

In some embodiments, the bent portions of all pins have bends that are oriented toward the same side in the horizontal direction.

Compared with the prior art, the semiconductor IC chip packaging structure has the following advantages:

the utility model ensures that only a small part of the pins leak outside the chip, and the chip is not damaged by the later cutting and bending steps, thereby avoiding the damage of the internal chip caused by external stress. The pin bending parts are encapsulated in the plastic package body, so that external stress is more difficult to transfer to the chip; the vertical bending and the horizontal bending can provide adhesive force with the plastic package body in multiple dimensions, so that the pins are prevented from being separated, and the plastic package body is simple in structure and convenient to install.

Drawings

In the drawings, like reference numerals may describe similar components in different views in order to facilitate an understanding of the principles thereof and which are not necessarily drawn to scale. The drawings illustrate generally, by way of example and not limitation, embodiments discussed herein.

FIG. 1 is a schematic front view of a chip package structure;

fig. 2 is a schematic side view of a chip package structure.

In the figure, 1, a chip; 2. pins; 3. a plastic package body; 21. a connection part; 22. an external connection part; 23. a bending part; 7. a lower backing plate; 8. suspending the lead; 9. unfilled corners.

Detailed Description

The following are specific examples of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these examples, and the following embodiments do not limit the utility models according to the claims. Furthermore, all combinations of features described in the embodiments are not necessarily essential to the inventive solution.

It will be appreciated by those of ordinary skill in the art that all directional references (e.g., above, below, upward, downward, top, bottom, left, right, vertical, horizontal, etc.) are descriptive of the drawings to aid the reader in understanding, and do not represent (e.g., positional, azimuthal, use, etc.) limitations on the scope of the utility model defined by the appended claims. Additionally, some ambiguous terms (e.g., substantially, certain, generally, etc.) may refer to slight imprecision or slight deviation of conditions, amounts, values, or dimensions, etc., some of which are within manufacturing tolerances or tolerances.

Examples

As shown in fig. 1 and 2, an IC chip 1 package structure includes a chip 1, a pin 2 and a rectangular plastic package body 3, where the vertical section of the plastic package body 3 is a trapezoid structure, the pin 2 includes a connection portion 21 located inside the plastic package body 3 and an external connection portion 22 leaking out of the plastic package body 3, the connection portion 21 is used to connect the chip 1 inside the plastic package body 3, the external connection portion 22 is used to connect an external circuit, a bending portion 23 is located inside the plastic package body 3 between the connection portion 21 and the external connection portion 22, and the external connection portion 22 extends out from the bottom surface of the plastic package body 3, so that only a small portion of the pin 2 leaks outside the chip 1, and no later cutting and bending steps are necessary to damage the chip 1, thereby avoiding the internal chip 1 from being damaged by external stress. The bottom surface of the external connection portion 22 is flush with the bottom surface of the plastic package body 3, so that the pins 2 can be combined with an external circuit board sufficiently, and welding and heat dissipation are facilitated.

The chip 1 is arranged on a rectangular lower pad 7, and suspension leads 8 are connected to a pair of opposite corners of the lower pad 7, the suspension leads 8 being used to provide support for the lower pad 7. One corner of the rectangular plastic package body 3 is provided with a unfilled corner 9 so as to be used as a sign of the direction of the chip 1, the unfilled corner is positioned between the two overhanging leads 8, and the unfilled corner is prevented from influencing the arrangement of the overhanging leads 8.

The pins 2 are located in four directions of the plastic package body 3, and six pins 2 are arranged in each direction.

The bending portion 23 has two-dimensional bending, one of which is a vertical bending from the connecting portion 21 downward toward the external portion 22 in the vertical direction; the second is a horizontal bend in the horizontal direction, and the bending portions 23 of all the pins 2 have bends toward the same side in the horizontal direction. The bending parts are all encapsulated in the plastic package body 3, so that the external stress is more difficult to transfer to the chip 1; the vertical bending and the horizontal bending can provide adhesive force with the plastic package body 3 in multiple dimensions, so that the pins 2 are prevented from being separated, and the plastic package is simple in structure and convenient to install.

Although some terms are used more herein, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the utility model; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present utility model. The order of execution of the operations, steps, and the like in the apparatuses and methods shown in the specification and the drawings may be any order as long as the order is not particularly limited, and the output of the preceding process is not used in the following process. The use of similar ordinal terms (e.g., "first," "then," "second," "again," "then," etc.) for convenience of description does not necessarily imply that they are necessarily performed in such order.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.

Claims

1. The utility model provides a semiconductor IC chip packaging structure, includes chip, pin and plastic envelope body, its characterized in that, the pin is including being located the inside connecting portion of plastic envelope body and spilling the external portion of plastic envelope body, connecting portion are used for connecting the inside the chip of plastic envelope body, external portion is used for connecting external circuit, connecting portion with have the kink between the external portion, the kink is located in the plastic envelope body, external portion is followed the plastic envelope body bottom surface outwards stretches out, the bottom surface of external portion with plastic envelope body bottom surface parallel and level.

2. The semiconductor IC chip package according to claim 1, wherein the chip is provided on a lower pad on which the suspension leads are provided.

3. The semiconductor IC chip package according to claim 1, wherein the bending portion has a bending downward from the connection portion toward the external connection portion in a vertical direction.

4. The semiconductor IC chip package according to claim 3, wherein the bending portion further has a bending in a horizontal direction.

5. The semiconductor IC chip package according to claim 4, wherein the bent portions of all the leads have bends toward the same side in the horizontal direction.