CN218415062U - Intelligent wearable device and SIP packaging module thereof - Google Patents
Intelligent wearable device and SIP packaging module thereof Download PDFInfo
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- CN218415062U CN218415062U CN202222792231.3U CN202222792231U CN218415062U CN 218415062 U CN218415062 U CN 218415062U CN 202222792231 U CN202222792231 U CN 202222792231U CN 218415062 U CN218415062 U CN 218415062U
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- adapter
- face
- sip
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- connection
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- 238000004806 packaging method and process Methods 0.000 title claims description 9
- 238000005538 encapsulation Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000002355 dual-layer Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract 1
- 230000001133 acceleration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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Abstract
The utility model discloses an intelligence wearing equipment and SIP encapsulation module thereof, the base plate of SIP encapsulation module have back of the body the A that sets up mutually and connect the face and the face is connected to B, and B is connected and is provided with B on the face and connect face encapsulation portion, is connected with two adapters on the base plate, and an adapter is connected on A connects the face, and another adapter is connected on B connects the face. Connect the face with B with two adapter welding respectively at the A of base plate and connect the face, had so both guaranteed the utility model discloses a normal realization of the function of SIP encapsulation module has reduced the size of SIP encapsulation module again effectively, can satisfy the requirement of product to the space.
Description
Technical Field
The utility model relates to a system in package technical field especially relates to an intelligence wearing equipment and SIP encapsulation module thereof.
Background
Along with the continuous progress in intelligence wearing field, the complete machine size becomes littleer and littleer for SIP module development is also faster and faster. The SIP module is smaller in size, especially, a system-in-package module is adopted, the function is more complex, and each module is connected with an FPC through an adapter. And a part of pins of the adapter are used for connecting some devices which cannot be plastically packaged in the module, and a part of pins are used for testing the functions of the module. The more complex the function of the module, the greater the number of pins of the adapter. The adapter can adopt an interposer or a connector.
Some are high to the space requirement, and the product is dressed to intelligence that the function is complicated, generally adopt system level packaging's module, combine fig. 1 and fig. 2 to show jointly, the B of the base plate 1 of SIP encapsulation module is connected face 12 and is capsulated, A is connected face 11 and does not encapsulate, and adopt two adapters, two adapters are adapter one 3 and adapter two 4 respectively, be connected with FPC board one 5 on the adapter one 3, be connected with FPC board two 6 on the adapter two 4, adapter one 3 and adapter two 4 are the plastic envelope not, can only put at the A that does not encapsulate and connect face 11, this makes SIP encapsulation module size increase, can not satisfy the requirement of product to the space.
Disclosure of Invention
In order to overcome the defects, the utility model provides a first technical problem be, provide a SIP encapsulation module, can reduce the size of SIP encapsulation module, satisfy the requirement of product to the space.
The utility model discloses a SIP encapsulation module, which comprises a substrate, the base plate has the A that sets up back of the body and connects the face and B connection face, B is provided with B on connecting the face and connects face encapsulation portion, be connected with two adapters on the base plate, one the adapter electricity connect in A connects the face, another the adapter electricity connect in B connects the face.
Furthermore, the two adapters are located at the same end of the substrate.
Furthermore, the two adapters are respectively positioned at two ends of the substrate.
Furthermore, an A connecting surface packaging part is arranged on the A connecting surface.
Further, the connection surface sealing portion a extends to one end of the substrate, and the connection surface sealing portion B extends to the other end of the substrate.
Further, the a connection surface encapsulation part and the B connection surface encapsulation part are partially overlapped in space.
Furthermore, the adapter comprises an adapter plate, two opposite sides of the adapter plate are provided with bonding pads, the bonding pads are provided with solder ball pins, one side of the solder ball pins is electrically connected with the substrate, and the other side of the solder ball pins is electrically connected with an external device.
Furthermore, the adapter plate adopts a double-layer plate structure, and the thickness of the adapter plate is 0.18-0.3mm.
Further, the external device is electrically connected with the interposer through an FPC board.
Based on a general inventive concept, the utility model aims to solve the second technical problem that an intelligence wearing equipment is provided, can reduce the size of SIP encapsulation module, satisfies the requirement of product to the space.
An intelligent wearing equipment comprises the SIP packaging module.
After the technical scheme is adopted, the beneficial effects of the utility model are that, SIP encapsulation module's base plate has the A that sets up back of the body and connects the face with B and connect the face, and B is connected and is provided with B on the face and connect face encapsulation portion, is connected with two adapters on the base plate, and an adapter is connected on A connects the face, and another adapter is connected on B connects the face. Weld two adapters respectively at the A of base plate and connect the face and B connect the face, so both guaranteed the utility model discloses a normal realization of the function of SIP encapsulation module has reduced the size of SIP encapsulation module again effectively, can satisfy the requirement of product to the space.
Drawings
Fig. 1 is a schematic structural diagram of an SIP package module in the prior art;
FIG. 2 is a top view of FIG. 1 (with the adapter removed);
fig. 3 is a schematic structural diagram of an embodiment of an SIP package module according to the present invention;
FIG. 4 is a top view of FIG. 3 (with the adapter removed);
fig. 5 is a schematic structural diagram of another embodiment of the SIP package module according to the present invention;
FIG. 6 is a top view of FIG. 5 (with the adapter removed);
in the figure: 1. a substrate; 11. a connecting surface; 12. b, connecting the surface; 2. a connecting the surface packaging part; 3. a first adapter; 4. a second adaptor; 5. a FPC board I; 6. a second FPC board; 7. b connecting the surface packaging part; 8. b connecting the surface device part; 9. a connects the surface device section.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
The first embodiment is as follows:
referring to fig. 3 and 4, an SIP package module includes a substrate 1, the substrate 1 has an a connection surface 11 and a B connection surface 12 opposite to each other, a B connection surface package portion 7 is disposed on the B connection surface 12, two adapters are connected to the substrate 1, one adapter is electrically connected to the a connection surface 11, a connection portion for connecting the adapter is further disposed on the B connection surface 12, and the other adapter is electrically connected to the connection portion of the B connection surface 12.
The adapter comprises an adapter plate, wherein pads are arranged on two opposite sides of the adapter plate, and solder ball pins are arranged on the pads, wherein the solder ball pins on one side are electrically connected with the substrate 1, and the solder ball pins on the other side are electrically connected with an external device (not shown in the figure).
Preferably, the adapter plate is of a double-layer plate structure, and the thickness of the adapter plate is 0.18-0.3mm. The adapter plate is composed of two layers of Printed Circuit Boards (PCBs) with the specification of FR 4.
Further preferably, the external device is connected to the interposer through an FPC board.
The two adapters are adapter one 3 and adapter two 4 respectively, and the adapter one 3 and the adapter two 4 are located at the same end of the substrate 1. The first FPC board 5 is connected with the first adapter 3, and the second FPC board 6 is connected with the second adapter 4.
The structure and operation principle of the external device connected to the adapter through the FPC board are common knowledge to those skilled in the art, and will not be described herein.
Still be provided with A on A connects face device portion 9 on face 11, be provided with acceleration sensor chip, antenna shell fragment etc. according to the demand in A connection face device portion 9, be provided with bluetooth chip, memory chip, charging management chip etc. in B connection face encapsulation portion, bluetooth chip, memory chip, charging management chip etc. and base plate 1 are moulded plastics the encapsulation and are formed B and are connected face encapsulation portion 7.
The second embodiment:
as shown in fig. 5 and fig. 6, the two adapters are respectively located at two ends of the substrate 1, that is, the first adapter 3 and the second adapter 4 are respectively located at two ends of the substrate 1.
In order to ensure the strength of the substrate 1, an a-connection surface encapsulation portion 2 is provided on the a-connection surface 11. The acceleration sensor chip and the like in the first embodiment are partially injection-molded and packaged to form an a-connection-surface package portion 2, and the remaining acceleration sensor chips and the like that are not packaged are provided in an a-connection-surface device portion 9.
The a connection face encapsulation portion 2 extends to one end of the substrate 1, and the B connection face encapsulation portion 7 extends to the other end of the substrate 1.
The a connection face package 2 partially overlaps the B connection face package 7 spatially.
Connect face 11 at A and set up A and connect face encapsulation portion 2, both protected A and connected the device of face encapsulation portion 2, can guarantee again that when can only wearing equipment, can not be with base plate 1 bending, avoid appearing the bad phenomenon of product, reduce the product defective rate, reduce the manufacturing cost of enterprise, improve enterprise economic benefits.
Example three:
the utility model also discloses an intelligence wearing equipment, it includes embodiment one or embodiment two's SIP encapsulation module.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without creative work from the above conception, which falls within the protection scope of the present invention.
Claims (10)
1. The SIP packaging module is characterized by comprising a substrate, wherein the substrate is provided with an A connection surface and a B connection surface which are arranged in a back-to-back mode, a B connection surface packaging portion is arranged on the B connection surface, two adapters are connected to the substrate, one adapter is electrically connected to the A connection surface, and the other adapter is electrically connected to the B connection surface.
2. The SIP package module of claim 1, wherein the two adapters are located at a same end of the substrate.
3. The SIP package module of claim 1, wherein the two adapters are respectively located at two ends of the substrate.
4. The SIP package module of claim 3, wherein the A connection face has an A connection face encapsulation portion disposed thereon.
5. The SIP package module of claim 4, wherein the a connection plane encapsulation extends to one end of the substrate and the B connection plane encapsulation extends to the other end of the substrate.
6. The SIP package module of claim 5, wherein the a-connection face encapsulation partially overlaps the B-connection face encapsulation spatially.
7. The SIP package module of claim 1, wherein the adapter comprises an adapter board having pads disposed on opposite sides of the adapter board, the pads having solder ball pins disposed thereon, one of the solder ball pins being electrically connected to the substrate and the other of the solder ball pins being electrically connected to an external device.
8. The SIP package module of claim 7, wherein the interposer is a dual-layer board, and the thickness of the interposer is 0.18-0.3mm.
9. The SIP package module of claim 7, wherein the external device is electrically connected to the interposer through an FPC board.
10. An intelligent wearable device, comprising the SIP encapsulation module of any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222792231.3U CN218415062U (en) | 2022-10-21 | 2022-10-21 | Intelligent wearable device and SIP packaging module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222792231.3U CN218415062U (en) | 2022-10-21 | 2022-10-21 | Intelligent wearable device and SIP packaging module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218415062U true CN218415062U (en) | 2023-01-31 |
Family
ID=85003546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222792231.3U Active CN218415062U (en) | 2022-10-21 | 2022-10-21 | Intelligent wearable device and SIP packaging module thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218415062U (en) |
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2022
- 2022-10-21 CN CN202222792231.3U patent/CN218415062U/en active Active
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