CN218929945U

CN218929945U - Semiconductor film sticking machine

Info

Publication number: CN218929945U
Application number: CN202223123884.9U
Authority: CN
Inventors: 吴桂荣
Original assignee: Suzhou Rongweihao Electronic Technology Co ltd
Current assignee: Suzhou Rongweihao Electronic Technology Co ltd
Priority date: 2022-11-24
Filing date: 2022-11-24
Publication date: 2023-04-28
Anticipated expiration: 2032-11-24

Abstract

The utility model discloses a semiconductor film sticking machine, which comprises a base, wherein a sliding rail is fixedly connected to the side wall of the top of the base close to the middle position, a moving block is connected to the sliding rail in a sliding way, a driven plate is fixedly connected to the side wall of the top of the moving block, a mounting plate is fixedly connected to the side wall of the top of the driven plate, a workbench is arranged below one side of the mounting plate, a telescopic cylinder is arranged right below the workbench, a cutting platform is movably connected to the telescopic cylinder, a film separator is fixedly connected to the side wall of one side of the mounting plate and above one end of the workbench, an inlet is formed in a penetrating way on the side wall of one end, far from the inlet, of the film separator, an outlet is formed in a penetrating way on the side wall of one end, and an air inlet is uniformly formed in a penetrating way on the side wall of one end, and a heating plate is fixedly connected to the side wall of the bottom of the film separator. The separation is performed by passing the film through a film separator.

Description

Semiconductor film sticking machine

Technical field:

the utility model belongs to the technical field of a technical film sticking machine, and particularly relates to a semiconductor film sticking machine.

The background technology is as follows:

semiconductor is a material based on a conductor and an insulator at normal temperature, and is often used in the fields of lighting, integrated circuits, communication systems and the like, wherein the semiconductor material to be inspected is silicon, germanium, gallium arsenide and the like, and silicon is one of the more important materials, but at the same time, the semiconductor is also one of the more precise materials, and in order to protect the semiconductor material from scratches, a thin film is covered on the semiconductor material for protecting the semiconductor material.

The existing film is manually covered on a substrate, then is fixed through automatic or semi-automatic cold and hot pressing, the manual film pasting efficiency is low, and the attaching accuracy is low, so that a film pasting machine is established.

The utility model comprises the following steps:

in order to solve the problems, the utility model provides a technical scheme that: the utility model provides a semiconductor film sticking machine, includes the base, base top lateral wall is close to intermediate position fixedly connected with slide rail, sliding connection has the movable block on the slide rail, movable block top lateral wall fixedly connected with driven plate, driven plate top lateral wall fixedly connected with mounting panel, the workstation has been set up to one side below of mounting panel, set up flexible cylinder under the workstation, swing joint has the cutting platform on the flexible cylinder, the lateral wall fixedly connected with divides the membrane ware of mounting panel one side and being located workstation one end top, the one end lateral wall that keeps away from of membrane ware has link up and has seted up the import, the one end lateral wall that divides the membrane ware to keep away from the import has link up and has seted up the export, the one end that divides the membrane ware has been seted up and has been seted up the air inlet, the one end lateral wall that divides the membrane ware to be located the export is even has seted up the gas blowing mouth, the bottom lateral wall fixedly connected with hot plate of membrane ware.

Preferably, a cutting knife is fixedly connected to the side wall of one end of the cutting platform, a movable groove is formed in the end of the workbench in a penetrating mode, the cutting knife is inserted into the movable groove in a sliding mode, a groove is formed in the middle of the workbench, and a semiconductor plate is placed in the groove.

The film can be cut through the established cutting knife, so that the attached part of the film is separated from the attached part, and the established groove can ensure the stability of the semiconductor plate and avoid the influence of the driven groove on the film covering effect.

Preferably, the mounting plate is connected with a driving motor at a position opposite to the workbench and close to one side edge, an unreeling roller is arranged at the top end of the mounting plate and close to one corner upper side, a stand column is rotationally connected to one side wall of the unreeling roller, the unreeling roller is fixedly connected to one side wall of the mounting plate through the stand column, a storage roller is arranged below one side of the unreeling roller, the storage roller is rotationally connected to the mounting plate, the mounting plate is located on the lower side wall of the storage roller and is rotationally connected with four auxiliary rollers, the output end of the driving motor penetrates through the mounting plate and is fixedly connected with a driving wheel, the driving wheel is rotationally connected with a follow-up wheel through a belt, a small rotating wheel is arranged on one side of the follow-up wheel and is rotationally connected with a driven wheel through the belt, and the driven wheel and the storage roller penetrate through one end of the mounting plate.

The separated film can be rolled up through the transmission of the driving wheel, the follow-up wheel and the driven wheel by the driving of the driving motor, so that the normal film coating is prevented from being influenced.

Preferably, a die cutting press wheel is arranged on one side of the film separator, a film pasting press wheel is arranged on one side of the die cutting press wheel away from the film separator, driving cylinders are fixedly connected to the side walls of the tops of the die cutting press wheel and the film pasting press wheel, a fixing plate is detachably connected to the middle of each driving cylinder through screws, and the fixing plate is fixedly connected to the side wall of the mounting plate through one end.

The film is pressed by the film pasting pinch roller, the film is covered on the semiconductor board by the movement of the mounting plate, then the film is pressed on the film by the cutting pinch roller, and finally the film is cut by the cutting knife.

Preferably, a stacking rack is fixedly connected to the top of the base and is close to the side wall of one end of the base, a placing table is arranged on one side of the stacking rack, a positioning rod is arranged below the middle of the placing table, a taking claw is movably connected to the positioning rod, a temporary storage table is arranged at the top of the base and far away from the positioning rod, a pushing cylinder is arranged below the middle of the temporary storage table, a pushing plate is fixedly connected to one end of the top of the pushing cylinder, and the placing table and the temporary storage table are respectively located on two sides of the mounting plate.

The semiconductor plates on the stacking frame can be taken out to the placing table through the taking claw, and the processed semiconductor plates are fed to the stacking frame through the pushing plate and the pushing cylinder.

Preferably, the three boards of erectting of even fixedly connected with in position of base top and being close to one side border, erect board top one side lateral wall fixedly connected with linking board, one side lateral wall fixedly connected with guide rail of erectting the board is kept away from to the linking board, sliding connection has the slider on the guide rail, the one end lateral wall fixedly connected with follow-up piece of slider, the one end below of follow-up piece is connected with through the screw detachable and snatchs the claw.

The semiconductor board can be carried by the gripper via the slider and the guide rail.

The utility model has the beneficial effects that: through separating the film through separating in the membrane ware, then suppress film one end on the semiconductor plate through the pad pasting pinch roller, along with the rotation of mounting panel removal cooperation pad pasting pinch roller can laminate the film on the semiconductor plate, need not the manual work and carry out the pad pasting, the effectual efficiency that has improved the pad pasting, and can effectually guarantee the accuracy of pad pasting through mechanical control.

Description of the drawings:

for ease of illustration, the utility model is described in detail by the following detailed description and the accompanying drawings.

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic side view of the present utility model;

FIG. 3 is a schematic top perspective view of the present utility model;

FIG. 4 is a schematic front plan view of the mounting plate of the present utility model;

FIG. 5 is a schematic view of a three-dimensional exploded structure of a workbench according to the utility model;

FIG. 6 is a schematic side view of a split head of the present utility model;

fig. 7 is a schematic front perspective view of the membrane separation head of the present utility model.

In the figure: 1. a base; 2. erecting a plate; 3. a splice plate; 4. a guide rail; 5. a slide block; 6. a follower block; 7. a placement table; 8. a positioning rod; 10. a work table; 11. a slide rail; 12. a moving block; 13. a driven plate; 14. cutting a die pressing wheel; 15. a film pasting pinch roller; 16. a stacking rack; 17. a mounting plate; 18. a receiving roller; 19. an unreeling roller; 20. an auxiliary roller; 21. gripping claws; 22. a taking claw; 23. a telescopic cylinder; 24. a cutting platform; 25. a membrane separator; 26. a driving motor; 27. a driving wheel; 28. a pushing cylinder; 29. a push plate; 30. a temporary storage table; 31. a follower wheel; 32. driven wheel; 33. a fixing plate; 34. a driving cylinder; 35. a cutting knife; 36. a movable groove; 37. an inlet; 38. an air inlet; 39. an outlet; 40. an air blowing port; 41. and (5) heating the plate.

The specific embodiment is as follows:

as shown in fig. 1-7, this embodiment adopts the following technical scheme, a semiconductor film sticking machine includes base 1, base 1 top lateral wall is close to intermediate position fixedly connected with slide rail 11, sliding connection has movable block 12 on the slide rail 11, movable block 12 top lateral wall fixedly connected with driven plate 13, driven plate 13 top lateral wall fixedly connected with mounting panel 17, workstation 10 has been set up to one side below of mounting panel 17, telescopic cylinder 23 has been set up under workstation 10, be connected with cutting platform 24 on the telescopic cylinder 23, the lateral wall fixedly connected with membrane separator 25 of mounting panel 17 one side and being located workstation 10 one end top, the one end lateral wall of membrane separator 25 that keeps away from workstation 10 link up and has seted up import 37, the one end lateral wall of membrane separator 25 that keeps away from import 37 link up and has been seted up export 39, the one end of membrane separator 25 is opened and has been seted up air inlet 38, the one end lateral wall of membrane separator 25 that is located export 39 evenly has been seted up the gas blowing mouth 40, the bottom lateral wall fixedly connected with 41 of membrane separator 25.

The mounting panel 17 is relative and be close to the position of one side border with workstation 10 and be connected with driving motor 26, the top of mounting panel 17 just is close to one corner top and has been set up unreel roller 19, one side lateral wall rotation of unreel roller 19 is connected with the stand, and unreel roller 19 passes through stand fixed connection on one side lateral wall of mounting panel 17, unreel roller 19 one side below has set up the storage roller 18, and storage roller 18 rotates to be connected on mounting panel 17, mounting panel 17 is located the below lateral wall of storage roller 18 and rotates and be connected with four auxiliary rollers 20, driving motor 26's output passes mounting panel 17 fixedly connected with action wheel 27, action wheel 27 rotates through the belt and is connected with follower 31, follower 31 one side has set up little rotation wheel, and little rotation wheel rotates through the belt and is connected with driven wheel 32, driven wheel 32 and storage roller 18 pass the one end fixed connection of mounting panel 17.

The film roll is put on the unreeling roller 19, one end of the film is pulled around the two auxiliary rollers 20 close to the die cutting pinch roller 14, the film enters the film separator 25 through the inlet 37, the film is discharged from the outlet 39, the transparent protective film on the film is pulled around the lower part of the outlet 39 of the film separator 25, the transparent protective film is finally wound around the other two auxiliary rollers 20 on the collecting roller 18, and one end of the film losing the transparent protective film is attached to the rotating wheel of the film attaching pinch roller 15. In order to increase the separation speed of the film and the transparent protective film, a heating plate 41 is connected to the bottom side wall of the film separator 25, the heating plate 41 is an electric heating plate 41, then hot air is blown onto the film through an air blowing port 40, air can enter the film separator 25 through the opened air inlet 38 and finally be blown out of the air blowing port 40 to blow the hot air onto the film, the film is heated to reduce the adhesiveness with the transparent protective film, and the transparent protective film is torn off from the film smoothly.

In the process of actual film sticking, the storage roller 18 can be rotated through the driving of the driving motor 26 through the driving wheel 27, the follow-up wheel 31 and the driven wheel 32, and the separated transparent protective film can be wound and rolled through the rotation of the storage roller 18, so that the transparent protective film is in a tight state, and the normal sticking of the film is prevented from being influenced.

In order to ensure that the attached film can be divided, a cutting knife 35 is fixedly connected to the side wall at one end of the cutting platform 24, a movable groove 36 is formed in a penetrating manner at one end of the working platform 10, the cutting knife 35 is inserted into the movable groove 36 in a sliding manner, a groove is formed in the middle of the working platform 10, a semiconductor plate is placed in the groove, the processed side wall of the semiconductor plate can enable the side wall at the top of the working platform 10 to be in the same plane after the semiconductor plate is placed in the groove, the groove can limit the semiconductor plate, the phenomenon that the semiconductor plate is displaced in a film pasting process to cause film pasting failure is avoided, a cutting die pressing wheel 14 is arranged at one side of the film divider 25, a film pasting pressing wheel 15 is arranged at one side of the cutting die pressing wheel 14 away from the film divider 25, driving cylinders 34 are fixedly connected to the side walls at the top of the cutting die pressing wheel 14 and the film pasting pressing wheel 15, a fixing plate 33 is detachably connected to the middle of the two driving cylinders 34 through screws, and the fixing plate 33 is fixedly connected to the side wall of the mounting plate 17 through one end.

When the film is attached, the driver drives the moving block 12 to move along the sliding rail 11, so as to drive the mounting plate 17 to move, the film attaching pinch roller 15 is moved to one end of the workbench 10 and is positioned on one end of the semiconductor plate, then the driving cylinder 34 drives the rotating wheel on the film attaching pinch roller 15 to drive one end of the film to be pressed on one end of the semiconductor plate, then the sliding rail 11 is driven to drive the mounting plate 17 to move reversely, the rotating wheel along with the film attaching pinch roller 15 rotates on the semiconductor plate, so that the film is pressed and leveled on the semiconductor plate, the film is pulled out under the driving of pulling, then the film is stably pressed on the semiconductor plate through the rotating wheel of the film attaching pinch roller 15, and when the film attaching pinch roller is attached to the other end of the semiconductor plate, the driving cylinder 34 is used for driving the cutting pinch roller 14 to be pressed on one end of the film, then the cutting platform 24 and the cutting knife 35 are driven to move through the telescopic cylinder 23, and the film is cut through the cutting knife 35, so that the film attaching is completed.

Example two

As shown in fig. 1-2:

for carrying the semiconductor board, a stacking rack 16 is fixedly connected to the top of the base 1 and the side wall close to one end of the stacking rack 16, a placing table 7 is arranged on one side of the stacking rack 16, a positioning rod 8 is arranged below the middle of the placing table 7, a taking claw 22 is movably connected to the positioning rod 8, a temporary storage table 30 is arranged at the top of the base 1 and far away from the positioning rod 8, a pushing cylinder 28 is arranged below the middle of the temporary storage table 30, a push plate 29 is fixedly connected to one end of the pushing cylinder 28, the placing table 7 and the temporary storage table 30 are respectively positioned on two sides of the mounting plate 17, three vertical plates 2 are uniformly and fixedly connected to the top of the base 1 and the side wall close to one side edge, a connecting plate 3 is fixedly connected to one side wall of the vertical plate 2, a guide rail 4 is fixedly connected to one side wall of the connecting plate 3, a sliding block 5 is connected to the guide rail 4, a follow-up block 6 is fixedly connected to one end side wall of the sliding block 5, and the grabbing claw 21 is detachably connected to the lower end of the follow-up block 6 through a screw.

Firstly, the taking claw 22 is driven to move to one end of the stacking frame 16 through the positioning rod 8, meanwhile, one end of the semiconductor board is ensured to be positioned in the middle of the clamping claw 22, then the semiconductor board is clamped through the clamping claw 22, then the positioning rod 8 is driven reversely to pull the semiconductor board onto the placing table 7, after the semiconductor board is completely positioned on the placing table 7, the grabbing claw 21 is lowered, in order to ensure that the placing table 7, the grabbing claw 21 and the workbench 10 can be matched better, through grooves corresponding to the grabbing claw 21 are formed in the placing table 7 and the temporary storage table 30, the semiconductor board is clamped through the shrinkage of the cylinder driving claw along with the falling claw of the grabbing claw 21 into the corresponding through groove, the clamping stability of the clamping can be effectively improved, after the clamping, the grabbing claw 21 is raised to lift the semiconductor board, the slide block 5 moves to the upper part of the workbench 10 along the guide rail 4, then the grabbing claw 21 is lowered to loosen the claw, the semiconductor board is placed on the workbench 10, then film pasting is carried out, after film pasting is finished, the semiconductor board after film pasting is carried to the temporary storage table 30 through the grabbing claw 21, then the pushing plate 29 is driven by the pushing cylinder 28 to push the semiconductor board, the semiconductor board is sent to the corresponding stacking rack 16 for storage, then a new semiconductor board is sent to the workbench 10 through the grabbing claw 21, when the grabbing claw 21 carries the new semiconductor board, the taking claw 22 also pulls out the next semiconductor board from the stacking rack 16, the production efficiency is ensured, the jacking and sedimentation mechanisms are arranged in the two stacking racks 16, the stacking rack 16 can be lifted or lowered, the semiconductor board and layering in the stacking rack 16 are ensured to correspond to the taking claw 22 and the pushing plate 29, can ensure that the semiconductor plate is extracted, pushed and stored smoothly.

In addition, the driving components used in the film laminating equipment, such as the guide rail 4, the positioning rod 8 and the pushing cylinder 28, are all of the guide rail cylinder, the grabbing claw 21 and the taking claw 22 are of the pneumatic gripper operation principle, the sliding rail 11 and the moving block 12 are of the motor driving screw rod rotation driving working principle, and the above principles are all of the mature prior art, so that the description is not repeated in the present application.

While the basic principles and main features of the present utility model and advantages of the present utility model have been shown and described, it will be understood by those skilled in the art that the present utility model is not limited by the foregoing embodiments, which are described in the foregoing specification merely illustrate the principles of the present utility model, and various changes and modifications may be made therein without departing from the spirit and scope of the utility model, which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor film sticking machine, includes base (1), its characterized in that, base (1) top lateral wall is close to intermediate position fixedly connected with slide rail (11), sliding connection has movable block (12) on slide rail (11), movable block (12) top lateral wall fixedly connected with driven plate (13), driven plate (13) top lateral wall fixedly connected with mounting panel (17), workstation (10) have been established to one side below mounting panel (17), telescopic cylinder (23) have been established under workstation (10), swing joint has cutting platform (24) on telescopic cylinder (23), lateral wall fixedly connected with membrane separator (25) of lateral wall one side and being located workstation (10) one end top of mounting panel (17), inlet (37) have been seted up in a link up to the one end lateral wall of membrane separator (25) that keeps away from workstation (10), outlet (39) have been seted up in a link up to the one end lateral wall of membrane separator (25) that keeps away from inlet (37), air inlet (38) have been seted up in a link up;

the membrane separator (25) is located at one end of the outlet (39), the side wall of the end of the membrane separator (25) is uniformly provided with an air blowing port (40), and the side wall of the bottom of the membrane separator (25) is fixedly connected with a heating plate (41).

2. A semiconductor die bonder as claimed in claim 1, wherein: the utility model discloses a semiconductor device, including cutting platform (24), workstation, semiconductor board, cutting platform, movable groove (36) have been seted up in the one end lateral wall fixedly connected with cutting blade (35) of cutting platform (24), the one end of workstation (10) link up, and cutting blade (35) slip grafting is in movable groove (36), set up flutedly in the middle of workstation (10), and placed the semiconductor board in the recess.

3. A semiconductor die bonder as claimed in claim 1, wherein: the utility model discloses a machine tool is characterized in that a driving motor (26) is connected to the position of a side edge, which is opposite to and close to a workbench (10), of a mounting plate (17), an unreeling roller (19) is arranged at the top end of the mounting plate (17) and close to a corner top, a side wall of the unreeling roller (19) is rotationally connected with a stand column, the unreeling roller (19) is fixedly connected to a side wall of the mounting plate (17) through the stand column, a storage roller (18) is arranged below one side of the unreeling roller (19), the storage roller (18) is rotationally connected to the mounting plate (17), and the mounting plate (17) is located on the side wall below the storage roller (18) and rotationally connected with four auxiliary rollers (20).

4. A semiconductor die bonder as claimed in claim 3, wherein: the output end of the driving motor (26) penetrates through the mounting plate (17) and is fixedly connected with a driving wheel (27), the driving wheel (27) is rotationally connected with a follow-up wheel (31) through a belt, a small rotating wheel is arranged on one side of the follow-up wheel (31), the small rotating wheel is rotationally connected with a driven wheel (32) through the belt, and the driven wheel (32) and the storage roller (18) penetrate through one end of the mounting plate (17) and are fixedly connected.

5. A semiconductor die bonder as claimed in claim 1, wherein: a die cutting press wheel (14) is arranged on one side of the film separator (25), a film pasting press wheel (15) is arranged on one side, far away from the film separator (25), of the die cutting press wheel (14) and the film pasting press wheel (15), driving air cylinders (34) are fixedly connected to the side walls of the tops of the die cutting press wheel (14) and the film pasting press wheel (15), a fixing plate (33) is detachably connected to the middle of the driving air cylinders (34) through screws, and the fixing plate (33) is fixedly connected to the side wall of the mounting plate (17) through one end.

6. A semiconductor die bonder as claimed in claim 1, wherein: the automatic feeding device is characterized in that a stacking rack (16) is fixedly connected to the top of the base (1) and close to the side wall of one end of the base, a placing table (7) is arranged on one side of the stacking rack (16), a positioning rod (8) is arranged below the middle of the placing table (7), and a taking claw (22) is movably connected to the positioning rod (8).

7. A semiconductor die bonder as claimed in claim 1, wherein: the utility model discloses a temporary storage device, including base (1), locating lever (8), pushing cylinder (28) are set up to the position that just keeps away from locating lever (8) in base (1) top, pushing cylinder (28) intermediate below has been set up, pushing cylinder (28) top one end fixedly connected with push pedal (29), place platform (7) and temporary storage platform (30) and be located the both sides of mounting panel (17) respectively.

8. A semiconductor die bonder as claimed in claim 1, wherein: three boards (2) are erect to the even fixedly connected with in position of base (1) top and being close to one side border, erect board (2) top one side lateral wall fixedly connected with linking board (3), one side lateral wall fixedly connected with guide rail (4) of erectting board (2) are kept away from to linking board (3), sliding connection has slider (5) on guide rail (4), one end lateral wall fixedly connected with follower block (6) of slider (5), one end below of follower block (6) is connected with through the screw detachable and snatchs claw (21).