CN115783385A - Semiconductor film sticking machine - Google Patents

Abstract

The invention discloses a semiconductor film sticking machine, which comprises a base, wherein a slide rail is fixedly connected to the side wall of the top of the base, which is close to the middle position, a moving block is connected to the slide rail in a sliding manner, a driven plate is fixedly connected to the side wall of the top of the moving block, a mounting plate is fixedly connected to the side wall of the top of the driven plate, a workbench is arranged below one side of the mounting plate, a telescopic cylinder is arranged right below the workbench, a cutting platform is movably connected to the telescopic cylinder, a film separator is fixedly connected to the side wall of one side of the mounting plate, which is positioned above one end of the workbench, the side wall of one end, which is far away from the workbench, of the film separator is provided with an inlet in a through manner, the side wall of one end, which is far away from the inlet, of the film separator is provided with an outlet in a through manner, an air inlet is formed in the side wall of one end, which is positioned at the outlet, of the film separator is uniformly provided with an air blowing port, and the side wall of the bottom of the film separator is fixedly connected with a heating plate, and the invention has the beneficial effects that: the separation is performed by passing the film through a membrane separator.

Description

Semiconductor film sticking machine

The technical field is as follows:

the invention belongs to the technical field of a technical film sticking machine, and particularly relates to a semiconductor film sticking machine.

Background art:

a semiconductor is a material based on a conductor and an insulator at normal temperature, which is often used in the fields of lighting, integrated circuits, communication systems, etc., wherein the semiconductor material to be tested is silicon, germanium, gallium arsenide, etc., and wherein silicon is one of the most influential materials, but at the same time, a semiconductor is one of the more precise materials, and in order to protect the semiconductor material and avoid scratches, a thin film is covered on the semiconductor material to protect the semiconductor material.

The existing film pasting machine is set up for manually covering the film on a substrate and then fixing the film through automatic or semi-automatic cold and hot pressing, so that the manual film pasting efficiency is low and the pasting accuracy is low.

The invention content is as follows:

in order to solve the above problems, the present invention provides a technical solution: the utility model provides a semiconductor film sticking machine, includes the base, base top lateral wall is close to intermediate position fixedly connected with slide rail, sliding connection has the movable block on the slide rail, movable block top lateral wall fixedly connected with driven plate, driven plate top lateral wall fixedly connected with mounting panel, the workstation has been established to one side below of mounting panel, telescopic cylinder has been established under the workstation, the last swing joint of telescopic cylinder has cutting platform, mounting panel one side just is located the lateral wall fixedly connected with film splitter of workstation one end top, the one end lateral wall of keeping away from the workstation of film splitter link up and has seted up the import, the one end lateral wall that the import was kept away from to the film splitter link up and has seted up the export, the one end of film splitter is opened and is link up and has seted up the air inlet, the one end lateral wall that the film splitter is located the export is even has seted up the mouth of blowing, the bottom lateral wall fixedly connected with hot plate of film splitter.

Preferably, a cutting knife is fixedly connected to a side wall of one end of the cutting platform, a movable groove is formed in one end of the workbench in a penetrating mode, the cutting knife is inserted into the movable groove in a sliding mode, a groove is formed in the middle of the workbench, and a semiconductor board is placed in the groove.

The film can be cut by the established cutting knife, the film is separated from the attached part, the established groove can ensure the stability of the semiconductor board, and the film laminating effect is prevented from being influenced by the driving of the groove.

As preferred, the mounting panel just is connected with driving motor with the workstation relatively and near the position on one side border, the top of mounting panel just is close to one corner top and has been established and unreel the roller, one side lateral wall of unreeling the roller rotates and is connected with the stand, and unreels the roller and pass through stand fixed connection on one side lateral wall of mounting panel, it has accomodate the roller to establish below one side of unreeling the roller, and accomodate the roller and rotate and connect on the mounting panel, the mounting panel is located and is rotated and is connected with four auxiliary rolls on accomodating the below lateral wall of roller, driving motor's output passes mounting panel fixedly connected with action wheel, the action wheel rotates through the belt and is connected with the follower wheel, the follower wheel is established to one side has little rolling wheel, and little rolling wheel rotates through the belt and is connected with from the driving wheel, from the one end fixed connection that the mounting panel was passed with accomodating the roller.

The drive through driving motor can be to separating the transmission of coming down the film and carrying out the rolling via action wheel, follower wheel and follow driving wheel, avoids influencing normal tectorial membrane.

Preferably, a die cutting pinch roller is arranged on one side of the membrane separator, a film pasting pinch roller is arranged on one side, away from the membrane separator, of the die cutting pinch roller, driving cylinders are fixedly connected to the side walls of the tops of the die cutting pinch roller and the film pasting pinch roller, a fixing plate is detachably connected between the two driving cylinders through screws, and the fixing plate is fixedly connected to the side wall of the mounting plate through one end.

The film is pressed by the film pasting press wheel, the film is covered on the semiconductor board through the movement of the mounting board, then the film is pressed on the film through the cutting press wheel, and finally the film is cut through the cutting knife.

Preferably, fixedly connected with piling bin on the base top and the lateral wall that is close to its one end, one side of piling bin has been established and has been placed the platform, below is established and has been established the locating lever in the middle of placing the platform, swing joint has the claw of taking on the locating lever, the base top has just been kept away from the position of locating lever and has been established the temporary storage platform, below is established and has been promoted the cylinder in the middle of the temporary storage platform, promotion cylinder top one end fixedly connected with push pedal, place the platform and the temporary storage platform is located the both sides of mounting panel respectively.

The semiconductor board on the stacking rack can be taken out to the placing table through the taking claw, and the processed semiconductor board is fed into the stacking rack through the push plate and the pushing cylinder.

Preferably, the base top is close to three vertical plates of even fixedly connected with in position on one side border, vertical plate top one side lateral wall fixedly connected with linking plate, the lateral wall fixedly connected with guide rail of one side that the vertical plate was kept away from to linking plate, sliding connection has the slider on the guide rail, the one end lateral wall fixedly connected with follow-up block of slider, the one end below of follow-up block is connected with through the screw is detachable and is snatched the claw.

The semiconductor plate can be carried by the gripping claw via the slider and the guide rail.

The invention has the beneficial effects that: through separating the film in passing through the membrane separator, then suppress film one end on the semiconductor board through the pad pasting pinch roller, along with the mounting panel removes the rotation that cooperates the pad pasting pinch roller and can laminate the film on the semiconductor board, need not the manual work and carry out the pad pasting, the effectual efficiency that improves the pad pasting, and can effectual assurance pad pasting accurate nature through mechanical control.

Description of the drawings:

for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic side-view perspective of the present invention;

FIG. 3 is a schematic top perspective view of the present invention;

FIG. 4 is a front plan view of the mounting plate of the present invention;

FIG. 5 is a schematic perspective exploded view of the worktable of the present invention;

FIG. 6 is a schematic side view of a film-separating head according to the present invention;

fig. 7 is a schematic front perspective view of the film separation head of the present invention.

In the figure: 1. a base; 2. a vertical plate; 3. a connector tile; 4. a guide rail; 5. a slider; 6. a follower block; 7. a placing table; 8. positioning a rod; 10. a work table; 11. a slide rail; 12. a moving block; 13. a driven plate; 14. cutting a die pinch roller; 15. pasting a film pressing wheel; 16. stacking racks; 17. mounting a plate; 18. a receiving roller; 19. unwinding the roller; 20. an auxiliary roller; 21. grabbing claws; 22. taking a claw; 23. a telescopic cylinder; 24. cutting the platform; 25. a membrane separator; 26. a drive motor; 27. a driving wheel; 28. a push cylinder; 29. pushing a plate; 30. a temporary storage table; 31. a follower wheel; 32. a driven wheel; 33. a fixing plate; 34. a driving cylinder; 35. a cutting knife; 36. a movable groove; 37. an inlet; 38. an air inlet; 39. an outlet; 40. an air blowing port; 41. and heating the plate.

The specific implementation mode is as follows:

as shown in fig. 1-7, the following technical solutions are adopted in the present specific embodiment, a semiconductor film sticking machine includes a base 1, a slide rail 11 is fixedly connected to a top side wall of the base 1 near a middle position, a moving block 12 is slidably connected to the slide rail 11, a driven plate 13 is fixedly connected to a top side wall of the moving block 12, a mounting plate 17 is fixedly connected to a top side wall of the driven plate 13, a workbench 10 is arranged below one side of the mounting plate 17, a telescopic cylinder 23 is arranged under the workbench 10, a cutting platform 24 is movably connected to the telescopic cylinder 23, a film splitter 25 is fixedly connected to a side wall on one side of the mounting plate 17 and above one end of the workbench 10, an inlet 37 is formed through a side wall of one end of the film splitter 25, which is far away from the workbench 10, an outlet 39 is formed through a side wall of one end of the film splitter 25, an air inlet 38 is formed through a side wall of one end of the film splitter 25, an air blowing port 40 is uniformly formed through a side wall of one end of the film splitter 25, which is located at the outlet 39, and a heating plate 41 is fixedly connected to a bottom side wall of the film splitter 25.

Mounting panel 17 is relative with workstation 10 and is connected with driving motor 26 near the position on one side border, mounting panel 17's top is just being close to one corner top and has been established and unreel roller 19, one side lateral wall that unreels roller 19 rotates and is connected with the stand, and unreel roller 19 passes through stand fixed connection on one side lateral wall of mounting panel 17, it has accomodate roller 18 to establish below 19 one side of unreeling roller, and accomodate roller 18 and rotate and connect on mounting panel 17, mounting panel 17 is located and rotates on the below lateral wall of accomodating roller 18 and is connected with four auxiliary rollers 20, driving motor 26's output passes mounting panel 17 fixedly connected with action wheel 27, action wheel 27 rotates through the belt and is connected with follower wheel 31, the little running wheel has been established on one side of follower wheel 31, and the little running wheel rotates through the belt and is connected with from driving wheel 32, from the one end fixed connection that driving wheel 32 and accomodating roller 18 passed mounting panel 17.

The film roll is placed on the unwinding roller 19, one end of the film is pulled around two auxiliary rollers 20 close to the cutting die pinch roller 14, the film enters the film separator 25 through the inlet 37, the film comes out of the outlet 39, the transparent protective film on the film is torn off and is pulled away below the outlet 39 of the film separator 25, the transparent protective film is finally wound on the storage roller 18 around the other two auxiliary rollers 20, and one end of the film without the transparent protective film is attached to the rotating wheel of the film pasting pinch roller 15. In order to improve the separation speed of the film and the transparent protective film, the side wall of the bottom of the film separator 25 is connected with a heating plate 41, the heating plate 41 is an electric heating plate 41, then hot air is blown to the film through an air blowing opening 40, air can enter the film separator 25 through an air inlet 38 which is formed, finally the air is blown out from the air blowing opening 40 so as to blow the hot air to the film, the film is heated to reduce the adhesion with the transparent protective film, and therefore the transparent protective film is smoothly torn off from the film.

In the process of carrying out actual pad pasting, can make through driving motor 26 via the transmission of action wheel 27, follower 31 and follow driving wheel 32 and accomodate the roller 18 and rotate, can twine the rolling with the transparent protection film that is separated out through the rotation of accomodating roller 18, guarantee that transparent protection film is in the state of tightening, avoid influencing the normal attached of film.

Wherein to guarantee to cut apart the film after the subsides, one end lateral wall fixedly connected with cutting knife 35 at cutting platform 24, movable groove 36 has been seted up to the one end of workstation 10 link up, and cutting knife 35 slides and pegs graft in movable groove 36, the recess has been seted up in the middle of the workstation 10, and the semiconductor board has been placed in the recess, guarantee to place into at the semiconductor board through the recess of seting up after, the lateral wall that the semiconductor board was processed can make workstation 10 top lateral wall be in the coplanar, and the recess can be injectd the semiconductor board, it leads to the pad pasting failure to avoid the semiconductor board to take place the displacement at the pad pasting in-process, establish cutting die pinch roller 14 in one side of membrane separator 25, one side that cutting die pinch roller 14 kept away from membrane separator 25 establishes pad pasting pinch roller 15, cutting die pinch roller 14 and the equal fixedly connected with in pad pasting pinch roller 15 top lateral wall drive actuating cylinder 34, two drive actuating cylinder 34 middle screw detachably connected with fixed plate 33, fixed plate 33 is through one end fixed connection on the lateral wall of mounting panel 17.

When attaching, the moving block 12 is driven by a driver to move along the sliding rail 11, so that the mounting plate 17 is driven to move, the film-attaching pinch roller 15 is moved to one end of the workbench 10 and is positioned at one end of the semiconductor board, then one end of the film is driven by the rotating wheel on the film-attaching pinch roller 15 to be pressed at one end of the semiconductor board through the driving of the driving cylinder 34, then the mounting plate 17 is driven to move reversely by the direction driving sliding rail 11, the rotating wheel moving along with the film-attaching pinch roller 15 rotates on the semiconductor board, so that the film is pressed and leveled on the semiconductor board, the film is pulled out under the driving of pulling, then the film is stably pressed on the semiconductor board through the rotating wheel of the film-attaching pinch roller 15, when the film-attaching is attached to the other end of the semiconductor board, the driving cylinder 34 is used for pressing the driving the cutting die-attaching pinch roller 14 at one end of the film, then the cutting platform 24 and the cutting platform 35 are driven to move through the telescopic cylinder 23, the film is cut through the cutting knife 35, and the film-attaching completion cutting knife is completed.

Example two

As shown in figures 1-2:

for carrying the semiconductor plate, fixedly connected with piling bin 16 on the lateral wall at base 1 top and be close to its one end, one side of piling bin 16 is established and is placed platform 7, below is established and is had locating lever 8 in the middle of placing platform 7, swing joint takes claw 22 on locating lever 8, base 1 top and the position of keeping away from locating lever 8 are established and are kept in storage platform 30, below is established and is had promotion cylinder 28 in the middle of keeping in storage platform 30, promotion cylinder 28 top one end fixedly connected with push pedal 29, place platform 7 and keep in storage platform 30 and be located the both sides of mounting panel 17 respectively, base 1 top and the even three vertical boards of fixedly connected with 2 in position that are close to one side border, vertical board 2 top one side lateral wall fixedly connected with link plate 3, link plate 3 keeps away from vertical board 2 one side lateral wall fixedly connected with guide rail 4, sliding connection has slider 5 on guide rail 4, slider 5's one end lateral wall fixedly connected with follow-up piece 6, follow-up piece 6's one end below is connected with through the screw is snatched claw 21.

Firstly, the taking claw 22 is driven by the positioning rod 8 to move to one end of the stacking rack 16, and one end of the semiconductor board is ensured to be positioned in the middle of the clamping jaw of the taking claw 22, the semiconductor board is then gripped by the gripper jaws of the take-out claws 22, and subsequently the parking bars 8 are driven in reverse to pull the semiconductor board onto the placing table 7, after the semiconductor board is completely placed on the placing table 7, the grasping claws 21 are lowered, and in order to ensure that the placing table 7, the grasping claws 21 and the work table 10 can be better fitted, through grooves corresponding to the claws of the grabbing claws 21 are formed in the placing table 7 and the temporary storage table 30, the claws are inserted into the corresponding through grooves along with the descending of the grabbing claws 21, then the claw is driven by the cylinder to contract to clamp the semiconductor plate, and the claw is of an L-shaped structure, so that the clamping stability can be effectively improved, after the clamping, the semiconductor board is lifted by raising the gripping claw 21, and then the slide 5 is moved along the guide rail 4 to above the table 10, then, the grasping claws 21 are lowered to release the claws to place the semiconductor board on the table 10, and then the film attaching is performed, after the film-pasting is finished, the semiconductor board after the film-pasting is conveyed to the temporary storage table 30 through the grabbing claw 21, then the pushing plate 29 is driven by the pushing cylinder 28 to push the semiconductor board, the semiconductor board is sent into the corresponding piling rack 16 for storage, then a new semiconductor board is sent to the working table 10 through the grabbing claw 21, when the grabbing claw 21 carries a new semiconductor plate, the taking claw 22 will pull out the next semiconductor plate from the stacking rack 16, so as to ensure the production efficiency, the jacking and settling mechanisms are arranged in the two stacking racks 16, so that the stacking racks 16 can be lifted or lowered, the semiconductor boards and the layers in the stacking racks 16 are ensured to correspond to the taking claws 22 and the push plate 29, and the semiconductor boards can be smoothly extracted, pushed and stored.

In addition, used drive assembly in this pad pasting equipment is the guide rail cylinder like guide rail 4, locating lever 8, promotion cylinder 28 moving part drive principle, and snatch claw 21 and take claw 22 and then be the pneumatic operation principle of grabbing hand, and slide rail 11 and movable block 12 then rotate the theory of operation as drive power for the motor drive lead screw, and above-mentioned several principles are ripe prior art, consequently do not describe in this application file in detail.

While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.

Claims (8)

1. A semiconductor film sticking machine comprises a base (1) and is characterized in that a slide rail (11) is fixedly connected to the side wall of the top of the base (1) close to the middle position, a moving block (12) is connected to the slide rail (11) in a sliding mode, a driven plate (13) is fixedly connected to the side wall of the top of the moving block (12), a mounting plate (17) is fixedly connected to the side wall of the top of the driven plate (13), a workbench (10) is arranged below one side of the mounting plate (17), a telescopic cylinder (23) is arranged under the workbench (10), a cutting platform (24) is movably connected to the telescopic cylinder (23), a film splitter (25) is fixedly connected to the side wall of one side of the mounting plate (17) and located above one end of the workbench (10), an inlet (37) is formed in a penetrating manner in the side wall of one end, far away from the workbench (10), of the film splitter (25), an outlet (39) is formed in a penetrating manner in the side wall of one end, far away from the inlet (37), and an outlet (38) is formed in a penetrating manner;

the side wall of one end, located at the outlet (39), of the film separator (25) is uniformly provided with an air blowing opening (40), and the side wall of the bottom of the film separator (25) is fixedly connected with a heating plate (41).

2. The semiconductor film laminator according to claim 1, wherein: the cutting device is characterized in that a cutting knife (35) is fixedly connected to the side wall of one end of the cutting platform (24), a movable groove (36) is formed in one end of the workbench (10) in a penetrating mode, the cutting knife (35) is inserted into the movable groove (36) in a sliding mode, a groove is formed in the middle of the workbench (10), and a semiconductor board is placed in the groove.

3. The semiconductor film laminator according to claim 1, wherein: mounting panel (17) just are connected with driving motor (26) with workstation (10) relative position that is close to one side border, the top of mounting panel (17) just is close to one corner top and has been established and unreel roller (19), one side lateral wall of unreeling roller (19) rotates and is connected with the stand, and unreels roller (19) through stand fixed connection on one side lateral wall of mounting panel (17), it has set up to unreel roller (19) one side below and accomodates roller (18), and accomodate roller (18) and rotate and connect on mounting panel (17), rotation is connected with four auxiliary roller (20) on mounting panel (17) is located the below lateral wall of accomodating roller (18).

4. The semiconductor film laminator according to claim 3, wherein: the output end of the driving motor (26) penetrates through a driving wheel (27) fixedly connected with the mounting plate (17), the driving wheel (27) is connected with a driven wheel (31) in a rotating mode through a belt, a small rotating wheel is arranged on one side of the driven wheel (31), the small rotating wheel is connected with a driven wheel (32) in a rotating mode through the belt, and the driven wheel (32) is fixedly connected with one end, penetrating through the mounting plate (17), of the containing roller (18).

5. The semiconductor film laminator according to claim 1, wherein: establish one side of membrane separator (25) and cut die pinch roller (14), one side that membrane separator (25) were kept away from in cut die pinch roller (14) has been established pad pasting pinch roller (15), the equal fixedly connected with in top lateral wall of cut die pinch roller (14) and pad pasting pinch roller (15) drives actuating cylinder (34), two drive and have fixed plate (33) through the screw detachable connection in the middle of actuating cylinder (34), fixed plate (33) are through one end fixed connection on the lateral wall of mounting panel (17).

6. The semiconductor film laminator according to claim 1, wherein: the automatic taking device is characterized in that a stacking rack (16) is fixedly connected to the side wall, close to one end of the base, of the top of the base (1), a placing table (7) is arranged on one side of the stacking rack (16), a positioning rod (8) is arranged below the middle of the placing table (7), and a taking claw (22) is movably connected to the positioning rod (8).

7. The semiconductor film laminator according to claim 1, wherein: the device is characterized in that a temporary storage table (30) is arranged at the top of the base (1) and far away from the positioning rod (8), a pushing cylinder (28) is arranged below the middle of the temporary storage table (30), one end of the top of the pushing cylinder (28) is fixedly connected with a push plate (29), and the placing table (7) and the temporary storage table (30) are respectively arranged on two sides of the mounting plate (17).

8. The semiconductor film laminator according to claim 1, wherein: the automatic grabbing device is characterized in that three vertical plates (2) are fixedly connected to the top of the base (1) and are close to the edge of one side of the base and are evenly fixed to the position of the edge of one side of the base, a connecting plate (3) is fixedly connected to the side wall of one side of the top of the vertical plate (2), a guide rail (4) is fixedly connected to the side wall of one side of the connecting plate (3) away from the vertical plate (2), a sliding block (5) is connected to the guide rail (4) in a sliding mode, a follow-up block (6) is fixedly connected to the side wall of one end of the slide block (5), and a grabbing claw (21) is detachably connected to the lower portion of one end of the follow-up block (6) through screws.

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