CN218928263U

CN218928263U - Cutting device and dicing saw

Info

Publication number: CN218928263U
Application number: CN202223437885.0U
Authority: CN
Inventors: 钮成杰; 马强
Original assignee: Suzhou Mega Technology Co Ltd
Current assignee: Suzhou Mega Technology Co Ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-04-28
Anticipated expiration: 2032-12-20

Abstract

The utility model discloses a cutting device, comprising: the lifting assembly is used for bearing the wafer and lifting the wafer; the loading and unloading assembly comprises a feeding hole, a clamping part and a workbench, wherein the clamping part is used for clamping and transferring a wafer to the workbench; the detection range at least comprises a feed inlet, the detection direction and the horizontal direction are at a first preset angle, so that the detection end of the first sensor is arranged towards the movement path of the lifting assembly, the first sensor is electrically connected with the lifting assembly, and the lifting assembly is fed back to stop when the feed inlet is detected to be provided with a wafer. According to the cutting device provided by the utility model, the first sensor is arranged at the feed inlet in the feeding and discharging assembly to detect whether the wafer exists at the position of the feed inlet or not, and the feedback lifting assembly stops when the wafer exists at the feed inlet, so that the wafer is prevented from being damaged due to interference with the workbench. The utility model also provides a dicing saw comprising the cutting device.

Description

Cutting device and dicing saw

Technical Field

The utility model relates to the technical field of wafer cutting equipment, in particular to a cutting device and a dicing saw.

Background

In the process of cutting the wafer by using the dicing saw, the wafer is placed in the basket, and the lifting device drives the basket to feed and discharge the wafer, so that the wafer with different heights is clamped by the manipulator conveniently, and the wafer is moved to the inside of the dicing saw for cutting.

However, in the actual operation process, the wafer may slide out from the front end opening of the basket due to the fact that the wafer is not placed in place in the basket or due to the vibration influence in the lifting process of the lifting table, if the actions such as blanking of the wafer are performed at this time, the wafer and the table top of the dicing saw are interfered, so that the wafer is damaged, the production cost of the wafer product is increased, and in addition, equipment is damaged.

Therefore, how to avoid damage to the wafer and equipment caused by the wafer sliding out of the basket is a problem to be solved by those skilled in the art.

Disclosure of Invention

Accordingly, the present utility model is directed to a dicing apparatus for preventing damage to wafers and equipment caused by the wafers sliding out of the basket, which is a problem to be solved by those skilled in the art. In order to achieve the above purpose, the present utility model provides the following technical solutions:

a cutting device, comprising:

the lifting assembly is used for bearing the wafer and lifting the wafer;

the clamping component is used for clamping the wafer in the lifting component and transferring the wafer to the workbench through the feed inlet;

the detection range at least comprises the feeding hole, the detection direction of the first sensor and the horizontal direction are at a first preset angle, so that the detection end of the first sensor faces the movement path of the lifting assembly, the first sensor is electrically connected with the lifting assembly, and the first sensor feeds back the lifting assembly to stop when detecting that the feeding hole is provided with a wafer.

Preferably, in the above cutting device, the cutting device further includes two second sensors, the two second sensors are disposed at the same level, and the second sensors are used for detecting a level state of the wafer at the feed inlet.

Preferably, in the above cutting device, the two second sensors are symmetrically disposed on both sides of the first sensor.

Preferably, in the above cutting device, the first sensor (30) is inclined upward, and the first preset angle is 65 ° -75 °.

Preferably, in the above cutting device, the cutting device further comprises a support member horizontally disposed on the upper surface of the table, and the first sensor is fixed on the support member through a clamping member.

Preferably, in the above cutting device, the clamping member is fixedly disposed on the supporting member by a bolt, the clamping member includes a first clamping portion and a second clamping portion with adjustable intervals, and the first sensor is disposed between the first clamping portion and the second clamping portion to be clamped and fixed.

Preferably, in the above cutting device, the cutting device further includes a connecting member disposed through the first clamping portion and the second clamping portion, and the first clamping portion and the second clamping portion are both in threaded connection with the connecting member.

Preferably, in the above cutting device, the first sensor and/or the second sensor is an optical fiber sensor.

Preferably, in the above cutting device, the lifting assembly includes a basket for carrying a wafer, and a first driving device for driving the basket to lift, and the first sensor is electrically connected with the first driving device to start and stop the first driving device with a feedback signal.

Preferably, in the above cutting device, the basket is opened only in a direction toward the first sensor, the basket includes a mounting position for mounting a wafer, and the wafer is located outside a detection range of the first sensor when located at the mounting position. A dicing saw includes a cutting apparatus provided in any of the above embodiments.

According to the technical scheme, the cutting device comprises the lifting assembly, the feeding and discharging assembly and the first sensor, wherein the lifting assembly is used for bearing a wafer and driving lifting of the wafer, the feeding and discharging assembly comprises the feeding port, the clamping part and the workbench, the feeding port is used for enabling the wafer to enter a region of the feeding and discharging assembly, the clamping part is used for clamping the wafer from the position of the lifting assembly and transferring the wafer to a table top of the workbench through the feeding port, the subsequent process is carried out on the workbench, the cutting device comprises the first sensor, the detection range of the first sensor at least comprises the feeding port so as to detect the state of the wafer at the feeding port, meanwhile, the detection direction of the first sensor and the horizontal direction are at a first preset angle, so that the detection end of the first sensor can be arranged towards a motion path of the lifting assembly, the detection effect of the wafer in the lifting assembly is guaranteed, the first sensor is electrically connected with the lifting assembly, feedback signals are used for stopping the lifting assembly to transfer the wafer to a table top of the workbench, and particularly, when the lifting assembly stops the lifting assembly is used for stopping the wafer, and the wafer is stopped from being damaged when the lifting assembly is in the state of the lifting assembly, and the wafer is stopped, and the wafer is in the lifting assembly. The cutting device provided by the utility model is provided with the first sensor electrically connected with the lifting assembly, the first sensor is used for detecting the state of the wafer at the feeding port, when the first sensor detects that the wafer is at the feeding port, the first sensor feeds back a signal to the lifting assembly to enable the lifting assembly to receive the signal and stop, so that damage caused by collision between the wafer at the feeding port and equipment is avoided, the loss of the wafer processing process is reduced, and the wafer processing can be efficiently executed.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a cutting device according to an embodiment of the present utility model;

fig. 2 is a schematic view of a support structure in a cutting device according to an embodiment of the present utility model;

wherein 10 is lifting assembly, 110 is basket, 20 is feeding and discharging assembly, 210 is feed inlet, 220 is workstation, 30 is first sensor, 40 is second sensor, 50 is support piece, 60 is clamping piece, 610 is first clamping part, 620 is second clamping part, 630 is connecting piece.

Detailed Description

The utility model discloses a cutting device, which is used for avoiding damage of a wafer in the loading and unloading processes and reducing the production cost of a wafer product.

Another core of the present utility model is to disclose a dicing saw comprising the above cutting device.

In order to better understand the solution of the present utility model, the following description of the embodiments of the present utility model refers to the accompanying drawings. Furthermore, the embodiments shown below do not limit the summary of the utility model described in the claims. The whole contents of the constitution shown in the following examples are not limited to the solution of the utility model described in the claims.

As shown in fig. 1 and fig. 2, the cutting device provided in the embodiment of the utility model includes a lifting assembly 10, a loading and unloading assembly 20 and a first sensor 30, wherein the lifting assembly 10 is used for carrying a wafer and driving the wafer to lift, the loading and unloading assembly 20 includes a feed port 210, a clamping member and a workbench 220, wherein the feed port 210 is used for allowing the wafer to enter an area where the loading and unloading assembly 20 is located, the clamping member is used for moving the wafer to a height capable of being transported through the lifting assembly 10, clamping the wafer from the lifting assembly 10 so as to transport the wafer to a table surface of the workbench 220 through the feed port 210, and performing a subsequent process on the workbench 220, wherein the workbench 220 is used for reciprocating between the area of the loading and unloading assembly 20 and a cutting area in the cutting device so as to transport the wafer from the area of the loading and unloading assembly 20 to the cutting area; specifically, the cutting device provided by the embodiment of the utility model includes the first sensor 30, the detection range of the first sensor 30 includes at least the feed port 210 to detect the state of the wafer at the feed port 210, specifically, the first sensor 30 is disposed in a manner that the detection direction of the first sensor 30 forms a first preset angle with the horizontal direction, and it should be noted that the first preset angle is between 0 and 90 degrees, so that the detection direction is neither parallel nor perpendicular to the horizontal direction, so that the detection end of the first sensor 30 can be disposed towards the movement path of the lifting assembly 10, and it should be noted that the detection end of the first sensor 30, that is, the end of the first sensor 30 that is used for receiving the detection information of the wafer, has the advantages that the first sensor 30 detects the wafer on the path of the lifting movement of the lifting assembly 10 of the wafer, can detect the wafer abnormality at the first time when the wafer protrudes from the lifting assembly 10 as the first detection, and is combined with the detection of the first sensor 30 at the feed port 210 to ensure the accuracy of the detection of the state of the wafer; meanwhile, the first sensor 30 is electrically connected with the lifting assembly 10, and the lifting assembly 10 stops moving and is adjusted by a feedback signal, and the specific action mode is that when the first sensor 30 detects that the feeding port 210 has a wafer, that is, the feedback lifting assembly 10 stops, and the first sensor 30 is electrically connected with the lifting assembly 10, wherein the first sensor 30 is directly electrically connected with the lifting assembly 10, and the first sensor 30 is indirectly electrically connected with the lifting assembly 10 through other intermediate components such as a controller.

It should be noted that when the first sensor 30 detects that the wafer is present in the feed port 210, two working conditions may exist, that is, the wafer is transported through the feed port 210 by the clamping member, or the wafer is located at the feed port 210 due to the placement position on the protruding lifting assembly 10, and both working conditions need to avoid the movement of the lifting assembly 10, so as to protect the wafer and avoid the damage caused by the interference between the wafer and the table surface of the table 220.

According to the cutting device provided by the embodiment of the utility model, the first sensor 30 electrically connected with the lifting assembly 10 is arranged, so that the state of the wafer at the feed port 210 is detected by the first sensor 30, when the first sensor 30 detects that the wafer at the feed port 210 is detected by the first sensor 30, the first sensor 30 feeds back a stop signal to the lifting assembly 10, so that the lifting assembly 10 receives the signal and stops running, the wafer at the feed port 210 is prevented from being damaged due to collision, the loss of the wafer is reduced, and the purpose of reducing the production cost of wafer products is achieved.

Further, since the feed port 210 is an opening horizontally arranged, in order to ensure that the wafer can horizontally pass through the feed port 210 and avoid the wafer from colliding with the edge of the feed port 210 due to the shape problem, in one embodiment of the present utility model, two second sensors 40 for detecting the position shape of the wafer are further provided, and the two second sensors 40 are arranged at the same level and keep a space, so as to detect whether the wafer is at the corresponding level, and when the two second sensors 40 at the same level can detect the information of the same wafer, the corresponding wafer is in a horizontal state and can smoothly enter from the feed port 210.

It should be noted that, preferably, the second sensor 40 is electrically connected to the clamping member, and the clamping member receives a signal of the second sensor 40 and operates, when the second sensor 40 detects that the wafer is in a horizontal state, the clamping member operates to clamp the wafer through the feed port 210, and when the second sensor 40 detects that the wafer is not in a horizontal state, the clamping member stops operating, so as to avoid the wafer from being damaged by collision at the edge of the feed port 210.

Further, in a preferred embodiment of the present utility model, the first sensor 30 is disposed at a middle position of the feed port 210, and the two second sensors 40 are symmetrically disposed at two sides of the first sensor 30 to uniformly detect the levelness of the wafer.

Further, the first sensor 30 is disposed in an obliquely upward direction to be disposed toward the movement path of the elevating assembly 10, and at the same time, the first preset angle is 65 ° -75 °, preferably the first preset angle is 70 °.

In order to facilitate the installation of the first sensor 30, the cutting device provided by the embodiment of the utility model further includes a support member 50, wherein the support member 50 is horizontally disposed on the surface of the workbench 220, and meanwhile, the first sensor 30 is fixedly disposed on the support member 50 through the clamping member 60, it should be noted that the arrangement of the support member 50 can avoid the first sensor 30 being directly installed on the workbench 220, so that the assembly, disassembly and replacement of the first sensor 30 are more convenient, and meanwhile, the structure of the support member 50 can be flexibly set to optimize the assembly, disassembly and disassembly of the first sensor 30 without damaging the structure of the workbench 220.

It should be further noted that the second sensor 40 can also be mounted on the support 50.

On the basis of the above embodiment, the specific mechanism that the first sensor 30 is fixedly arranged on the supporting member 50 through the clamping member 60 is that the clamping member 60 is fixedly arranged on the supporting member 50 through a bolt, a screw or a buckle, and the first sensor 30 is clamped and fixed by the clamping member 60, wherein the clamping member 60 is in a U shape and comprises a first clamping portion 610 and a second clamping portion 620 which are arranged at intervals, and the distance between the first clamping portion 610 and the second clamping portion 620 is adjustable so as to ensure that the first sensor 30 can be clamped.

Further, in an embodiment of the present utility model, the clamping member 60 further includes a connecting member 630, the connecting member 630 passes through the first clamping portion 610 and the second clamping portion 620, and the connecting member 630 is connected to the first clamping portion 610 and the second clamping portion 620 in a threaded manner, so that the first clamping portion 610 and the second clamping portion 620 can respectively perform position adjustment on the connecting member 630, and adjustment of the distance between the first clamping portion 610 and the second clamping portion 620 is achieved through a screw structure.

Further, in an embodiment of the present utility model, the first sensor 30 and/or the second sensor 40 is/are an optical fiber sensor, which confirms the wafer information within the detection range thereof through the change of the optical signal, for example, when the optical signal emitted by the first sensor 30 towards the detection range thereof is blocked, the first sensor indicates that the wafer is within the detection range thereof, so as to feed back the stop signal to the lifting assembly 10.

Further, in an embodiment of the present utility model, the lifting assembly 10 includes a basket 110 for carrying a wafer, and a first driving device in transmission connection with the basket 110, where the first driving device is used for driving the lifting of the basket 110 to drive the lifting of the wafer, and correspondingly, the first sensor 30 is electrically connected with the first driving device, and when the first sensor 30 detects that the wafer is located at the feed port 210, a stop signal is fed back to the first driving device to control the first driving device to stop operating, and it should be noted that the first driving device may be a driving motor or a cylinder.

On the basis of the above embodiment, it is preferable that the basket 110 is opened only in the direction toward the first sensor 30 to avoid that the wafer protrudes from other positions of the basket 110 and is not detected by the first sensor 30, specifically, the basket 110 includes a mounting position for stably mounting the wafer, the mounting position is understood as a placement position of the wafer when the wafer is placed in the basket 110 in a normal posture, the basket 110 is lifted after being smoothly placed in the mounting position, and the wafer is out of the detection range of the first sensor 30 when the wafer is smoothly placed in the mounting position, so as to avoid that the lifting group will be abnormally stopped by 10 due to the first sensor 30 detecting the wafer information by mistake.

The utility model also provides a dicing saw, which comprises the cutting device provided by any embodiment.

The terms first and second and the like in the description and in the claims and in the above-described figures are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to the listed steps or elements but may include steps or elements not expressly listed.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cutting device, comprising:

a lifting assembly (10) for carrying a wafer and lifting the wafer;

the loading and unloading assembly (20) comprises a feeding hole (210), a clamping component and a workbench (220), wherein the clamping component is used for clamping a wafer in the lifting assembly (10) and transferring the wafer to the workbench (220) through the feeding hole (210);

the detection range at least comprises the feeding hole (210), the detection direction of the first sensor (30) and the horizontal direction are at a first preset angle, so that the detection end of the first sensor (30) faces the movement path of the lifting assembly (10), the first sensor (30) is electrically connected with the lifting assembly (10), and the first sensor (30) feeds back the lifting assembly (10) to stop when detecting that the feeding hole (210) is provided with a wafer.

2. The cutting device according to claim 1, further comprising two second sensors (40), wherein the two second sensors (40) are disposed at the same level, and the second sensors (40) are configured to detect the level of the wafer at the feed port (210).

3. Cutting device according to claim 2, characterized in that two of said second sensors (40) are symmetrically arranged on both sides of said first sensor (30).

4. Cutting device according to claim 1, wherein the first sensor (30) is inclined upwards, the first preset angle being 65 ° -75 °.

5. The cutting device according to claim 1, further comprising a support member (50) horizontally disposed on an upper surface of the table (220), the first sensor (30) being fixed to the support member (50) by a clamping member (60).

6. The cutting device according to claim 5, wherein the clamping member (60) is fixedly disposed on the supporting member (50) by a bolt, the clamping member (60) includes a first clamping portion (610) and a second clamping portion (620) with an adjustable interval, and the first sensor (30) is disposed between the first clamping portion (610) and the second clamping portion (620) to be clamped and fixed.

7. The cutting device of claim 6, further comprising a connector (630) disposed through the first clamping portion (610) and the second clamping portion (620), wherein the first clamping portion (610) and the second clamping portion (620) are each threadably coupled to the connector (630).

8. Cutting device according to claim 2, wherein the first sensor (30) and/or the second sensor (40) is a fiber optic sensor.

9. Cutting device according to claim 1, wherein the lifting assembly (10) comprises a basket (110) for carrying wafers, and a first driving device for driving the basket (110) to lift, the first sensor (30) being electrically connected to the first driving device for starting and stopping the first driving device with a feedback signal.

10. The dicing apparatus of claim 9, characterized in that the basket (110) is open only in a direction towards the first sensor (30), the basket (110) comprising a mounting position for mounting a wafer, which is outside the detection range of the first sensor (30) when in the mounting position.

11. Dicing saw comprising a cutting device according to any one of claims 1-9.