CN218916651U

CN218916651U - Fuel evaporation pressure sensor packaging semi-finished product

Info

Publication number: CN218916651U
Application number: CN202222828493.0U
Authority: CN
Inventors: 梁厚勋; 段红军; 汪文; 曹小军; 许腾辉; 李萧萧
Original assignee: Shanghai Wenxiang Automotive Sensors Co Ltd
Current assignee: Shanghai Wenxiang Automotive Sensors Co Ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-04-25
Anticipated expiration: 2032-10-26

Abstract

The utility model relates to a fuel evaporation pressure sensor packaging semi-finished product, which comprises a PCB (printed circuit board), a limiting block, a pressure sensing bare chip, a binding wire and a calibration chip, wherein a positioning hole is formed in one side of the top surface of the PCB; the limiting block comprises a supporting seat and a positioning column, the positioning column is arranged on the top surface of the supporting seat, the limiting block is provided with an air inlet channel, the air inlet channel penetrates through the supporting seat and the positioning column, the positioning column is matched with the positioning hole, and the top surface of the supporting seat is connected with the top surface of the PCB; the pressure sensing bare chip is connected with the bottom surface of the supporting seat; one end of the binding wire is connected with the pressure sensing bare chip, and the other end of the binding wire is connected with the PCB; the calibration chip is arranged on the other side of the top surface of the PCB and is electrically connected with the PCB. The support base provides a bonding surface for the pressure sensing bare chip, high-strength support is provided, the positioning columns are matched with the positioning holes for positioning, and assembly deviation of the pressure sensing bare chip is reduced.

Description

Fuel evaporation pressure sensor packaging semi-finished product

Technical Field

The utility model belongs to the technical field of automobile sensors, and particularly relates to a semi-finished product of a fuel evaporation pressure sensor package.

Background

The fuel evaporation pressure sensor is used for detecting the change of the vacuum degree in the fuel evaporation system of the automobile when the engine electronic control module diagnoses the fuel evaporation system, so as to judge whether the system meets the fuel vapor leakage standard specified by regulations.

The fuel vapor pressure sensor provides an analog voltage signal to the engine electronic control module to characterize the vapor state within the fuel vapor system. The engine electronic control module may detect a pressure change within the fuel vaporization system by shutting down the fuel vaporization system. Thus, the fuel vapor pressure sensor is an important component in indicating the status of the fuel vapor system relative to the current atmospheric pressure, and is also a major component of the fuel vapor subsystem in the engine management system.

Most of the current pressure integrated chips in the market have complex process and high manufacturing cost.

Disclosure of Invention

The utility model mainly aims to provide a semi-finished product of a fuel evaporation pressure sensor package, which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the utility model is realized by the following technical scheme:

a semi-finished product for packaging a fuel evaporation pressure sensor comprises

A locating hole is formed in one side of the top surface of the PCB;

the limiting block comprises a supporting seat and a positioning column, the positioning column is fixedly arranged on the top surface of the supporting seat, an air inlet channel is formed in the limiting block, the air inlet channel penetrates through the supporting seat and the positioning column, the positioning column is matched with the positioning hole, and the top surface of the supporting seat is fixedly connected with the top surface of the PCB;

the pressure sensing bare chip is fixedly connected with the bottom surface of the supporting seat;

one end of the binding wire is electrically connected with the pressure sensing bare chip, and the other end of the binding wire is electrically connected with the PCB; a kind of electronic device with high-pressure air-conditioning system

And the calibration chip is fixedly arranged on the other side of the top surface of the PCB and is electrically connected with the PCB.

Preferably, the peripheries of the limiting block, the pressure sensing bare chip and the binding wire are provided with fences, and protective glue is filled in the fences;

preferably, the limiting block is made of ceramic materials.

Preferably, the binding wire is a gold wire.

Preferably, the top surface of the supporting seat is fixedly connected with the top surface of the PCB board through adhesive.

Preferably, the pressure sensing bare chip is fixedly connected with the bottom surface of the supporting seat through adhesive.

Preferably, the supporting seat is a cylinder or a cube.

The utility model provides a fuel evaporation pressure sensor packaging semi-finished product, which has the following beneficial effects;

the support seat provides a bonding surface for the pressure sensing bare chip, high-strength support is provided at the same time, the positioning column is matched with the positioning hole for positioning, assembly deviation of the pressure sensing bare chip can be reduced, testing precision of the pressure sensing bare chip is improved, the air inlet channel is communicated with the pressure sensing bare chip, external pressure can be transmitted to the pressure sensing bare chip, the limiting block and the binding wire are protected from being corroded by the outside by filling and sealing protective glue in the fence, service life and corrosion resistance of a product are improved.

Drawings

FIG. 1 is a schematic view of the internal structure of a packaged semi-finished product according to the present utility model;

FIG. 2 is an exploded view of the packaged semi-finished product of the present utility model;

FIG. 3 is a schematic view of a stopper according to the present utility model;

FIG. 4 is a perspective view of a packaged semi-finished product of the present utility model;

fig. 5 is a block diagram of the assembly of the packaged semi-finished product of the present utility model with different housings.

In the figure: 1. a protective adhesive; 2. binding wires; 3. a pressure sensing die; 4. a limiting block; 41. positioning columns; 42. a support base; 43. an air intake passage; 5. a fence; 6. a PCB board; 61. positioning holes; 7. the chip is calibrated.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the present utility model.

The technical solutions of the present utility model will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. Furthermore, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

1-4, a semi-finished product of a fuel evaporation pressure sensor package comprises a PCB (printed circuit board) 6, a limiting block 4, a pressure sensing bare chip 3, a binding wire 2 and a calibration chip 7, wherein a positioning hole 61 is formed in one side of the top surface of the PCB 6; the limiting block 4 is of a boss structure and comprises a supporting seat 42 and a positioning column 41, the positioning column 41 is fixedly arranged on the top surface of the supporting seat 42, an air inlet channel 43 is formed in the limiting block 4, the air inlet channel 43 penetrates through the supporting seat 42 and the positioning column 41, the positioning column 41 is matched with the positioning hole 61, and the top surface of the supporting seat 42 is fixedly connected with the top surface of the PCB 6; the pressure sensing bare chip 3 is fixedly connected with the bottom surface of the supporting seat 42; one end of the binding wire 2 is electrically connected with the pressure sensing bare chip 3, and the other end is electrically connected with the PCB 6; the calibration chip 7 is fixedly mounted on the other side of the top surface of the PCB 6 and is electrically connected with the PCB 6.

The supporting seat 42 provides a bonding surface for the pressure sensing die 3, high-strength support is provided at the same time, the positioning column 41 is matched with the positioning hole 61 for positioning, so that assembly deviation of the pressure sensing die 3 can be reduced, testing precision of the pressure sensing die 3 is improved, the air inlet channel 43 is communicated with the pressure sensing die 3, and external pressure can be transmitted to the pressure sensing die 3.

In a specific embodiment, the periphery of the limiting block 4, the pressure sensing bare chip 3 and the binding wire 2 is provided with a fence 5, the protective glue 1 is encapsulated in the fence 5, the encapsulating protective glue 1 ensures that the pressure sensing bare chip 3, the limiting block 4 and the binding wire 2 are prevented from being corroded by the outside, and the service life and corrosion resistance of the product are improved.

In a specific embodiment, the limiting block 4 is made of a ceramic material, preferably a ceramic material with a small thermal expansion coefficient and a thermal expansion coefficient close to that of the pressure sensing bare chip 3, the ceramic material has good mechanical properties, almost no damage is generated after a thermal shock test and a temperature cycle test, the moisture resistance is good, microcracks are not easily generated, the insulation performance and the air tightness are good, the inner chip of the semiconductor element is prevented from being corroded and damaged under the influence of external impurities and moisture, the deformation of the packaged semi-finished product in the compression process is small, the deformation of the pressure sensing bare chip 3 caused by overlarge deformation in the compression process of the PCB 6 is prevented from being influenced, the deformation of the pressure sensing bare chip 3 is inaccurate, and the test precision is reduced.

In a specific embodiment, the binding-wire 2 is a gold wire.

In a specific embodiment, the top surface of the supporting seat 42 is fixedly connected with the top surface of the PCB 6 through adhesive.

In a specific embodiment, the pressure sensing die 3 is fixedly connected to the bottom surface of the support base 42 by an adhesive.

In a specific embodiment, the support base 42 is a cylinder or a cube.

The assembly method of the utility model comprises the following steps: the circumference department of locating hole 61 of PCB board 6 drips the bonding adhesive, the reference column 41 stretches into locating hole 61 and matches with locating hole 61, the top surface (step face) of supporting seat 42 is in the same place through bonding adhesive with the top surface of PCB board 6, thereby assemble stopper 4 on PCB board 6, then the circumference department of the air inlet channel 43 of supporting seat 42 drips the bonding adhesive, glue the bottom surface of supporting seat 42 again with pressure perception bare chip 3, the bonding adhesive of stopper 4 and PCB board 6 as an organic whole, after the solidification of glue, connect pressure perception bare chip 3 and PCB board 6 with the wiring 2 again, realize pressure perception bare chip 3 and PCB board 6 circuit signal communication, assemble rail 5 on PCB board 6 again, embeds protection glue 1 in the inner chamber of rail 5, finally weld calibration chip 7 on PCB board 6, with calibration chip 7 and PCB board 6 electric connection.

The working principle of the utility model is as follows: the packaging semi-finished product can be assembled with shells of different shapes to manufacture a corresponding fuel evaporation pressure sensor as an integral module, can be matched with most of shells of fuel evaporation pressure sensors in the market, is fixed into the shells through bonding glue or rubber sealing rings as shown in a common structure in fig. 5, is communicated with an air inlet channel 43 of a limiting block 4 through a pipeline (not shown) of the shells, and is electrically connected with a pin (not shown) on the calibration chip 7 and the shells to realize signal output. During operation, gas transmits pressure to the pressure sensing bare chip 3 from the pipeline of the shell through the air inlet channel 43, the pressure sensing bare chip 3 generates deformation after sensing the pressure of the gas and then generates an initial pressure signal, the initial pressure signal is transmitted to the PCB 6 through the binding wire 2 and then transmitted to the calibration chip 7 through the PCB 6, and the calibration chip 7 outputs a final pressure signal after amplifying, adjusting, analog-to-digital converting, digital operation and temperature compensation of the initial pressure signal and is transmitted to the control unit of the engine through the contact pin on the shell.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The semi-finished product of the fuel evaporation pressure sensor package is characterized in that: comprising

A locating hole is formed in one side of the top surface of the PCB;

2. A fuel vapor pressure sensor package blank as set forth in claim 1 wherein: and the peripheries of the limiting block, the pressure sensing bare chip and the binding wires are provided with fences, and protective glue is filled in the fences.

3. A fuel vapor pressure sensor package blank as set forth in claim 1 wherein: the limiting block is made of ceramic materials.

4. A fuel vapor pressure sensor package blank as set forth in claim 1 wherein: the binding wire is a gold wire.

5. A fuel vapor pressure sensor package blank as set forth in claim 1 wherein: the top surface of supporting seat with the top surface of PCB board passes through bonding glue fixed connection.

6. A fuel vapor pressure sensor package blank as set forth in claim 1 wherein: the pressure sensing bare chip is fixedly connected with the bottom surface of the supporting seat through adhesive.

7. A fuel vapor pressure sensor package blank as set forth in claim 1 wherein: the supporting seat is a cylinder or a cube.