CN220602795U - Pressure core unit, pressure sensor, pressure core assembly and differential pressure sensor - Google Patents

Abstract

The application discloses a pressure core unit and pressure sensor and differential pressure sensor based on the same. The pressure core unit includes: the chip mounting seat is provided with a frame body which is integrally made of metal materials or ceramic materials, a flat mounting surface is arranged on the upper side of the frame body, an inner cavity is formed in the frame body, and a circle of first cylinder body which extends downwards is formed in the inner cavity; a plurality of second metal pins which are fixed on the chip mounting seat in an insulating way, one end of each second metal pin upwards penetrates through the chip mounting seat, and the other end of each second metal pin is positioned in the inner cavity; the pressure chip is fixed at the top of the inner cavity and is electrically connected to the other end of the second metal pin; wherein the inner cavity is filled with a first protective gel. The pressure core unit and the pressure core assembly can protect the pressure chip when being used for a pressure sensor or a differential pressure sensor, and have the advantages of being low in cost and high in universality.

Description

Pressure core unit, pressure sensor, pressure core assembly and differential pressure sensor

Technical Field

The application relates to the technical field of pressure sensors, in particular to a pressure core unit, a pressure sensor, a pressure core assembly and a pressure difference sensor.

Background

Pressure sensors are sensors for measuring the pressure of an environment or medium, and MEMS (microelectromechanical systems) are currently widely used due to low cost and small volume, which measure the pressure by the piezoresistive effect of semiconductor silicon. The middle part of the silicon pressure core body is provided with a film shape, the pressure applied to the silicon film on two sides changes the resistance value of the doped resistor on the silicon film, and a current or voltage signal output by a measuring circuit formed by connecting a plurality of resistors can be further processed by a conditioning circuit and then the measuring result is output. When a vacuum cavity is arranged on one side of the diaphragm in the silicon chip, the measured pressure is the pressure applied by the other side relative to the vacuum pressure, namely the absolute pressure; when atmospheric pressure is introduced into one side of the diaphragm, the measured pressure is the pressure relative to the atmosphere, namely gauge pressure; when other pressures are respectively introduced to the two sides of the diaphragm, the measured pressure is the difference between the pressures of the two sides, namely the differential pressure. The pressure core can be arranged on a ceramic matrix or a metal matrix with a special thermal expansion coefficient to avoid precision reduction and even stress damage caused by temperature expansion coefficient mismatch, and the conditioning circuit is arranged on a printed circuit board fixed with the matrix.

Under severe working conditions such as high temperature, vibration and the like, the pressure core of the pressure sensor is more easily damaged by temperature stress to fail when the temperature changes. For example, to meet the national six emission standards, diesel engines typically require an EGR (exhaust gas recirculation) loop, where the exhaust gas Gao Wenjiao typically has an exhaust gas temperature of 130 ℃ that is 30-40 ℃ higher; at this time, the life of the printed circuit board may be significantly reduced.

One of the applicant's assumptions is to mount the pressure core on a ceramic substrate or a metal substrate of a particular thermal expansion coefficient to reduce the risk of damage to temperature stresses, but due to cost and technical considerations, it is preferable that the ceramic or metal substrate is glued to the printed circuit board and the pressure core is fixed to the pads on the printed circuit board by Jin Sibang after the glue has cured. However, the two are not firmly fixed due to adhesion, so that the risk of breakage and desoldering of the gold wire caused by displacement and false touch occurs during production and assembly or use is caused; on the other hand, the tightness of the sensor is reduced at high temperature, so that the medium to be measured (such as high-temperature tail gas) is more likely to invade the cavity where the electronic element is located, and the service life of the sensor is further reduced.

The statements in this section merely provide background information related to the present application and may not constitute prior art.

Disclosure of Invention

In view of the deficiencies of the prior art, the present application is directed to providing a pressure sensor that is capable of improving its manufacturability while protecting the circuitry.

In order to achieve the above purpose, the present application provides the following technical solutions: a pressure core unit, comprising: the chip mounting seat is provided with a frame body which is integrally made of metal materials or ceramic materials, a flat mounting surface is arranged on the upper side of the frame body, an inner cavity is formed in the frame body, and a circle of first cylinder body which extends downwards is formed in the inner cavity; a plurality of second metal pins which are fixed on the chip mounting seat in an insulating way, one end of each second metal pin upwards penetrates through the chip mounting seat, and the other end of each second metal pin is positioned in the inner cavity; the pressure chip is fixed at the top of the inner cavity and is electrically connected to the other end of the second metal pin; wherein the inner cavity is filled with a first protective gel.

Preferably, the frame body comprises a horizontal frame bottom and a circle of first cylinder body formed by downwards protruding the frame bottom, a pin hole is formed in the frame bottom, and a second metal pin and the pin hole are fixed and sealed in the pin hole through fired glass; the pressure chip is adhered to the lower surface of the frame bottom; the lower end of the first cylinder is fixedly connected with a second cylinder made of plastic.

Preferably, the upper part of the second cylinder is fixedly sleeved on the first cylinder, and the middle part of the second cylinder laterally protrudes to form a supporting part to prop against the lower end of the first cylinder.

Preferably, the pressure chip is electrically and correspondingly connected to the other ends of the second metal pins through a plurality of first wires.

The application also claims a pressure sensor comprising: a housing; a first pressure introduction passage provided on the housing for introducing a pressure to be measured into an inner cavity of the housing; the circuit board is provided with a plurality of second electric connection parts; and the pressure core unit is characterized in that one end of the second metal pin upwards penetrates through the chip mounting seat and is electrically connected with a second electric connection part; the flat mounting surface of the chip mounting seat is adhered to the lower surface of the circuit board; the first cylinder body of the pressure core unit is fixed in a sealing groove formed at the bottom of the inner cavity of the shell through bonding sealant, the pressure core unit of the pressure core unit is electrically connected to one ends of a plurality of leading-out pins fixed on the shell, and the other ends of the leading-out pins penetrate through the shell outwards.

The application also claims a pressure core assembly for a differential pressure sensor comprising: two of the above pressure core units.

Preferably, the frames of the two pressure core units are integrally connected.

Preferably, the second metal pin is embedded and fixed on the frame body.

The application also claims a pressure sensing assembly comprising: the circuit board is provided with a plurality of second electric connection parts; the pressure core component is characterized in that one end of the second metal pin upwards penetrates through the chip mounting seat and is electrically connected with a second electric connection part; the flat mounting surface of the chip mounting seat is adhered to the lower surface of the circuit board.

The application also claims a differential pressure sensor comprising: a housing defining a mounting chamber, the housing being provided with two pressure tubes communicating into the mounting chamber; the pressure sensing assembly is arranged in the mounting cavity and divides the mounting cavity into an upper part and a lower part, the lower part of the mounting cavity comprises two separated pressure cavities, the upper ends of the pressure cavities are provided with through holes, and the two first cylinders of the pressure sensing assembly are correspondingly covered and sealed at the upper ends of the through holes corresponding to the two pressure cavities one by one.

Preferably, the two first cylinders of the pressure sensing assembly are fixed in two second sealing grooves formed on the shell in a one-to-one correspondence manner through bonding sealant, the pressure core unit of the pressure core unit is electrically connected to one end of a plurality of first metal pins fixed on the shell, and the other end of each first metal pin penetrates through the shell outwards.

The pressure core unit and the pressure core assembly can protect the pressure chip when being used for a pressure sensor or a differential pressure sensor, and have the advantages of being low in cost and high in universality.

Drawings

FIG. 1 is an exploded schematic view of a differential pressure sensor according to a first embodiment of the present application;

FIG. 2 is a perspective cross-sectional view (with the upper cover removed) of a differential pressure sensor according to a first embodiment of the present application;

fig. 3 is a perspective view of an upper cover according to a first embodiment of the present application;

FIG. 4 is a perspective view of a pressure sensing assembly according to a first embodiment of the present application;

FIG. 5 is a perspective cross-sectional view of a pressure sensing assembly of a first embodiment of the present application;

FIG. 6 is a cross-sectional view of a pressure sensing assembly according to a variation of the first embodiment of the present application;

FIG. 7 is a perspective view of a pressure sensing assembly according to a second embodiment of the present application;

FIG. 8 is a perspective cross-sectional view of a pressure sensing assembly according to a second embodiment of the present application;

FIG. 9 is a perspective cross-sectional view (with the upper cover removed) of a differential pressure sensor according to a first embodiment of the present application;

fig. 10 is a cross-sectional view of a pressure sensor using a pressure core unit 1200 of a second embodiment of the present application;

FIG. 11 is a top view of a pressure sensing assembly according to a third embodiment of the present application;

FIG. 12 is a cross-sectional view of a pressure sensing assembly according to a third embodiment of the present application;

in the figure: 100. a differential pressure sensor; 102. a mounting part; 103. a bushing; 104. an electrical connector; 1051. a first pressure chamber; 1052. an inner cavity; 105. a first pressure tube; 1061. a second pressure chamber; 1062. an inner cavity; 106. a second pressure tube; 1071. a yielding slot; 1072. an inner peripheral wall; 1073. a peripheral wall; 107. a first seal groove; 1081. a first end; 1082. a second end; 1083. a third metal pin; 108. a first metal pin; 1091. a via hole; 109. a support surface; 110. a housing; 113. a second seal groove; 1200. a pressure core unit; 1201. a frame; 1202. a first protective gel; 1203. a substrate; 1204. a pressure chip; 1205. a first wire; 1206. a second wire; 1207. a second metal pin; 1208. a frame bottom; 1209. a first cylinder; 120. a pressure sensing assembly; 1210. welding spots; 1211. a first electrical connection; 1212. a second electrical connection; 1213. protruding ridges; 1214. an adapter; 1215. a second cylinder; 1216. a support part; 1217. glass seeds; 121. a circuit board; 129. an electronic component; 130. an upper cover; 131. a cover plate; 132. a flange; 133. a protrusion; 134. steel balls; 135. reinforcing ribs; 136. fool-proof positioning part; 140. a lower cover; 200. a pressure sensor; 201. a housing; 202. a first pressure introduction passage; 203. a flexible circuit board; 204. leading out the contact pin;

Detailed Description

The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. The following examples are illustrative only and are not to be construed as limiting the present application. In the following description, the same reference numerals are used to designate the same or equivalent elements, and duplicate descriptions are omitted.

In the description of the present application, it should be understood that the azimuth or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "left", "right", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship in which the product of the present application is conventionally put in use, or the azimuth or positional relationship as is conventionally understood by those skilled in the art, are merely for convenience of description of the present application and for simplification of description, and are not indicative or implying that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application.

In addition, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application can be understood as appropriate by one of ordinary skill in the art.

It should be further understood that the term "and/or" as used in this specification and the corresponding claims refers to any and all possible combinations of one or more of the listed items.

As shown in fig. 1 to 5. In a first preferred embodiment of the present application, the differential pressure sensor 100 includes a housing consisting of a housing 110 and an upper cover 130 snap-fitted downward onto the housing 110. The housing 110 and the upper cover 130 together define a mounting cavity (not labeled).

The pressure sensing component 120 is disposed in the mounting cavity and partitions the mounting cavity into an upper portion and a lower portion. The pressure sensing assembly 120 includes two pressure core units 1200. Each pressure core unit 1200 includes a frame 1201, a base 1203, and at least one pressure chip 1204. The frame 1201 is made of an insulating material and is fixed to one circuit board 121. The circuit board 121 may be disposed horizontally, and the frame 1201 includes a plate-shaped frame bottom 1208 having a flat mounting surface (not labeled) disposed on an upper side, and a ring of first cylinders 1209 formed by protruding edges of the frame bottom 1208 toward a lower side. The flat mounting surface is fixed on the lower surface of the circuit board 121, and the frame bottom 1208 and the first cylinder 1209 enclose a semi-open inner cavity 1052/1062 with a lower end opening at the lower end for placing the substrate 1203. The base plate 1203 may be disposed horizontally in the cavity and may be adhered to the underside surface of the base plate 1203, and the pressure chip 1204 may be adhered and fixed in a positioning groove (not labeled) opened on the underside surface of the frame bottom 1208. The pressure die 1204 is electrically connected to the substrate 1203 by a first wire 1205 (e.g., a bonded gold wire). The substrate 1203 is provided with conductive lines for conducting the first conductive lines 1205 and the second conductive lines 1206; in other embodiments, pressure die 124 may be electrically connected directly to second plurality of metal pins 1207 through first plurality of wires 1205. The substrate 1203 and the frame 1201 are combined to form a chip mount, or are part of the chip mount.

The plurality of second metal pins 1207 are fixed to the frame 1201, and a part of the second metal pins 1207 is inserted into the circuit board 121 toward the upper side and electrically connected to the circuit board 121, for example, may be electrically connected to second electrical connection portions 1212 provided on the circuit board 121 in a one-to-one correspondence manner, and the plurality of second metal pins 1207 are arranged side by side at intervals in the horizontal direction. The second electrical connection 1212 may be a metallized via that may be electrically connected to the second metal pin 1207 through a solder joint 1210 formed by soldering. The second metal pin 1207 may be an L-shaped pin, and includes a horizontal portion and a vertical portion, wherein a downward connection surface may be disposed on the horizontal portion to be electrically connected to one end of the second wire 1206, and the other end of the first wire 1205 is electrically connected to the lower surface of the substrate 1203; the vertical portion is electrically connected to the second electrical connection portion 1212 in an upward direction, and the second electrical connection portion 1212 may be a metallized via hole. To protect the pressure chip 1204 and the first and second leads 1205, 1206, the cavity is filled with a first protective gel 1202, and the first protective gel 1202 may be a fluorosilicone gel.

Referring to fig. 6 in combination, in a variation of the first embodiment, the frame 1201 of the two pressure core units 1200 may be integrally formed. Further preferably, the ceramic substrate 1203 may be molded together with the frame 1201 so as to be fitted in the frame 1201. More preferably, the ceramic base plates 1203 of the two pressure core units 1200 are integrally connected and pass through the adjacent first cylinders 1209 of the two frame bodies 1201, at this time, the middle of the lower surface of the base plate 1203 is outwards protruded to form a convex edge 1213, and the convex edge 1213 is embedded and wrapped in the adjacent side walls of the first cylinders 1209 of the two frame bodies 1201, so as to improve the isolation tightness between the inner cavities of the two sides, and enhance the binding force between the frame bodies 1201 and the base plate 1203, so as to prevent the unexpected displacement between the frame bodies 1201 and the base plate 1203; the first cylinder 1209 of the two frames 1201 may share an adjacent sidewall. Accordingly, the width of the bottom of the first cylinder 1209 adjacent to the two frames 1201 can be appropriately increased to sufficiently wrap the ridge 1213. At this time, the second metal pins 1207 of the two pressure core units 1200 may be disposed on opposite sides of the substrate 1203, so as to keep a sufficient distance for easy mounting on the circuit board 121. The base plate 1203 is combined with the frame 1201 as a chip mount or as a part of a chip mount.

The pressure chip 1204 may be an absolute pressure chip, one side of a diaphragm of the absolute pressure chip is a vacuum cavity, and the other side is a sensing surface for receiving pressure to be measured; or the pressure chip 1204 is a gage pressure chip, one side of which is a first sensing surface receiving an equal pressure (e.g., atmospheric pressure) (e.g., a channel (not shown) is easily provided in the circuit board 121, the frame bottom 1208, and the substrate 1203 so that the first sensing surface receives the atmospheric pressure or the pressure in the cavity of the upper portion of the mounting cavity) and the other side is a second sensing surface receiving the pressure to be measured.

The lower portion of the mounting chamber includes a first pressure chamber 1051 and a second pressure chamber 1061 that are isolated. The inner cavities 1052 and 1062 are downward one-to-one and are in communication with the first and second pressure chambers 1051 and 1061.

The differential pressure sensor 100 of the present application further comprises a first pressure tube 105 for introducing a first pressure into the first pressure chamber 1051 and a second pressure tube 106 for introducing a second pressure into the second pressure chamber 1061, the first pressure tube 105 and the second pressure tube 106 being integrally connectable to the housing 110.

The frame 1201 is fixedly supported on the housing 110 downward by a sealant. The lower end openings of the two second chambers 1272 communicate with the first pressure chamber 1051 and the second pressure chamber 1061 in one-to-one correspondence. Preferably, a fisheye structure is formed on the first end 1081 of the first metal pin 108, and the first electrical connection portion 1211 is configured as a metallized via, and the fisheye structure is tightly matched with the metallized via, so that the circuit board 121 and the housing 110 can be mechanically fixed in an auxiliary manner while the two electrical connections are achieved. In other embodiments, at least one third metal pin 1083 may be fixed to the housing 110 (the third metal pin 1083 and the first metal pin 108 are preferably disposed on opposite sides of the circuit board 121) such that a fisheye structure is formed on the first end 1081 of the first metal pin 108, and a plurality of metallized vias are additionally disposed on the circuit board 121, and the fisheye structure is tightly matched with the metallized vias, so that an auxiliary mechanical fixation is performed between the opposite side of the circuit board 121 and the housing 110.

In other embodiments, the upper cover 130 may preferably include a cover plate 131 and a flange 132 formed by downwardly protruding a horizontal edge of the cover plate 131, and an upper end edge of the housing 110 may correspondingly form a circle of the first sealing groove 107, and inner and outer sides of the first sealing groove 107 correspondingly form a circle of the inner peripheral wall 1072 and a circle of the outer peripheral wall 1073. The flange 132 is inserted into the first seal groove 107, and other portions in the first seal groove 107 are filled with a sealant. Wherein the outer wall of the flange 132 may be outwardly convex to form a plurality of protrusions 133 to form a tight fit with the inner wall of the peripheral wall 1073.

The opposite ends of the housing 110 may be fixedly connected with the electrical connector 104 and the mounting portion 102, the mounting portion 102 is provided with a mounting hole, and the mounting hole is provided with a bushing 103. The electrical connector 104 is fixedly provided with a plurality of first metal pins 108, and first ends 1081 of the first metal pins 108 extend inward into an upper portion of the mounting cavity and are electrically connected with first electrical connection portions 1211 provided on the circuit board 121, preferably, a fisheye structure is formed on the first ends 1081, the first electrical connection portions 1211 are provided as metallized vias, and the fisheye structure is tightly matched with the metallized vias, so that the circuit board 121 and the housing 110 can be additionally fixed while the two are electrically connected. The second end 1082 of the first metal pin 108 is located within the electrical connector 104. Other electronic components 129 besides the pressure chip 1204 may be disposed on the upper surface of the circuit board 121, and a second enclosure 1291 may be enclosed around the periphery of the electronic components, and the second enclosure 1291 may be filled with a second protective gel (not shown).

In other embodiments, the lower surface of the cover plate 131 may be preferably provided with a reinforcing rib 135, and the inner wall 1072 is provided with a relief notch 1071 for relieving the reinforcing rib 135. The upper cover 130 may be further provided with a fool-proof positioning portion 136 (e.g., a flat edge) at one corner thereof, so as to prevent misorientation during installation. The cover plate 131 can be provided with steel ball holes, and the steel ball holes are sealed by steel balls 134.

Wherein, the substrate 122 may be a ceramic circuit board. The frame 1201 and the second enclosure 1291 may be made of plastic material. The first protective gel and the second protective gel may be fluorosilicone gels, which may be the same or different.

Referring to fig. 7 to 9, in the second embodiment (the first protective gel is not shown in the drawings) of the present application, compared to the first embodiment, the plurality of second metal pins 1207 of each pressure core unit 1200 are spaced apart from each other in the horizontal direction and are changed to surround the corresponding pressure chip 1204, so that the vertical portions of the second metal pins 1207 are conveniently arranged in a limited space and have sufficient spacing, and meanwhile, the horizontal portions of the second metal pins 1207 can radially surround the pressure chip 1204, so that the horizontal portions of the second metal pins 1207 are more compactly arranged, and the horizontal portions can be directly connected with the pressure chip 1204 through the shorter first wires 1205 (such as bonded gold wires) to reduce the material cost and the difficulty of the bonding process.

In this embodiment, the support surface 109 is provided with a second seal groove 113 to accommodate the first cylinder 1209 of the frame 1201, and the second seal groove 113 is filled with a sealant, so that the frame 1201 can be conveniently sealed and fixed on the support surface 109 by an adhesive manner. The support surface 109 is provided with two through holes 1091, and the two through holes 1091 extend in the housing 110 and are communicated with the first pressure chamber 1051 and the second pressure chamber 1061 in a one-to-one correspondence.

Preferably, the substrate 1203 is made of a ceramic material so that it is closer to the thermal expansion coefficient of the pressure chip 1204. The frame 1201 is made of an insulating material, which may be plastic, for example, to ensure low material and manufacturing costs, while facilitating co-molding with the base plate 1203 to secure the upper end of the base plate 1203 to the frame bottom 1208 of the frame 1201.

In the pressure sensing component 120 of each embodiment, when the pressure chip 1204 can be disposed on the ceramic circuit board by a relatively simple bonding method, the pressure chip 1204 and the circuit board 121 can be electrically connected conveniently, and have relatively matched thermal expansion coefficients. Compared with the structural configuration of the circuit board 121 and the substrate 1203, the pressure core unit 1200 can be prefabricated to simplify the design and manufacturing process, thereby improving the universality of parts and reducing the cost.

The pressure core unit 1200 in the above embodiments may also be used as an independent prefabricated component for other types of pressure sensors, as shown in fig. 10, where the pressure core unit 1200 may be used as a general component of a general pressure sensor, and these pressure sensors 200 include at least one housing 201, a first pressure introducing channel 202 is provided on the housing 201 to introduce the pressure to be measured into the inner cavity of the housing 201, the pressure core unit 1200 is fixed in the inner cavity of the housing 201, and the lower end opening of the frame 1201 of the pressure core unit 1200 is fixedly covered at the inner side end of the first pressure introducing channel 202. A seal groove may be provided around one end of the inner side of the first pressure introduction passage 202, and the first cylinder or the second cylinder of the frame 1201 is fixed in a seal groove formed at the bottom of the inner cavity of the housing 201 by adhesive sealant. The circuit board 121 of the pressure core unit 1200 is electrically connected to one end of a plurality of extraction pins 204 fixed on an electrical connector of the housing 201 through the flexible circuit board 203, and the other end of the extraction pins 204 is outwardly penetrated through the housing 201. Of course, the circuit board 121 may also be fixed to the housing 201 by the first metal pins 108 and the third metal pins 1083 similar to those in the first embodiment, and will be electrically connected to the outside of the housing 110 by the first metal pins 108 instead of the lead pins 204.

The pressure chip of the pressure sensor 200 may be an absolute pressure chip or a gauge pressure chip. When the pressure chip is a gage pressure chip, a second pressure introducing channel (not shown) for introducing a reference pressure on the upper side of the gage pressure chip may be disposed on the substrate 1203, the frame bottom 1208, and the circuit board 121 of the pressure core unit 1200, for example, the upper side of the gage pressure chip may be connected to the inner cavity of the pressure sensor 200 through the second pressure introducing channel, and the inner cavity of the pressure sensor 200 is connected to the external atmosphere through an air vent to introduce the atmospheric pressure as the reference pressure. When the pressure core units 1200 are used as general components of a general pressure sensor, the pressure core units can be assembled as pressure sensing components only by welding with corresponding circuit boards, and the pressure core units are very convenient in designing and assembling the pressure sensor.

When used in a differential pressure sensor, two such pressure core units may be combined into a single pressure core assembly, and the frame 1201 of the two pressure core units 1200 may be preferably integrally formed, so as to enhance manufacturability, and the second metal pin 1207 may be formed together with the frame 1201. In this way, the circuit board 121 has a structure that is easy to process, and thus has a strong versatility for the differential pressure sensor.

Referring to fig. 11 to 12 in combination, a third embodiment of the present application provides a pressure sensing component 120 that is modified from the second embodiment. In this embodiment, the pressure core unit 1200 of the pressure sensing component 120 includes a die mount. The chip mount includes a frame 1201, and the frame 1201 includes a first cylinder 1209 having a bottom 1208 protruding downward from an edge of the bottom 1208. Wherein, the frame bottom 1208 is integrally connected with the first cylinder 1209 and made of ceramic material, and the pressure chip 1204 can be directly adhered to the lower surface of the frame bottom 1208 and located in the inner cavity 1052/1062 with a lower end opening surrounded by the frame bottom 1208 and the first cylinder 1209. The upper ends of the plurality of second pins 1207 are electrically connected to second electrical connections 1212 provided on the circuit board 121. The second electrical connection portion 1212 may be a metallized via, and the upper end of the second pin 1207 passes through the second electrical connection portion 1212 upwards and is electrically connected to the second electrical connection portion 1212 through soldering or a wire. Second pin 1207 may be inserted into pin holes provided in frame bottom 1208 and sealingly secured to frame bottom 1208 with pin holes by fired glass 1217. The pressure chip 1204 is electrically connected to the lower end of the frame bottom 1208 directly by a first wire 1205. Thus, compared with the second embodiment, only one frame 1201 made of ceramic can be provided, i.e., the first protective gel 1202 can be accommodated and used as a mounting base for the pressure chip 1204.

Since the second pin 1207 and the frame 1201 are insulated by the glass 1217, the frame may be made of a metal material such as stainless steel, and the metal frame has a lower material and manufacturing cost than the frame made of ceramic.

In this embodiment, the first cylinder 1209 may be annular, and is downwardly inserted into the second sealing groove 113, and the second sealing groove 113 is filled with adhesive sealant. The frame bases 1208 of the two pressure core units 1200 may be integrally connected, for example, may be integrally formed by stamping, and can be easily positioned and installed. In other embodiments, to ensure the bonding force with the adhesive sealant, the chip mount may further include a plastic adaptor 1214 fixedly sleeved on the lower end of the first cylinder 1209, the adaptor 1214 includes a vertically disposed second cylinder 1215, the upper portion of the second cylinder 1215 is fixedly sleeved on the first cylinder 1209, the middle portion of the second cylinder 1215 protrudes laterally to form a supporting portion 1216 to prop against the lower end of the first cylinder 1209, the second cylinder 1215 is inserted into the second sealing groove 113, and the adhesive sealant is filled in the second sealing groove 113. The inner end of the support 1216 is inwardly passed over the inner edge of the first cylinder 1209, so that the first protective gel 1202 can be supported upward to some extent to avoid accidental release of the first protective gel 1202 in the inner cavity.

In the above embodiments, the differential pressure sensor 100 may further include a lower cover 140 fastened to the lower end of the housing 110, and the first pressure tube 105 and the second pressure tube 106 are correspondingly connected to the first pressure chamber 1051 and the second pressure chamber 1061 in the horizontal direction, so that the housing 110 can be molded and demolded conveniently.

The scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.

Claims (10)

1. A pressure core unit, comprising:

the chip mounting seat is provided with a frame body (1201) which is integrally made of metal materials or ceramic materials, a flat mounting surface is arranged on the upper side of the frame body (1201), an inner cavity is formed in the frame body, and a circle of first cylinder bodies (1209) which extend downwards are arranged in the inner cavity;

a plurality of second metal pins (1207) which are fixed on the chip mounting seat in an insulating way, one end of each second metal pin upwards penetrates through the chip mounting seat, and the other end of each second metal pin is positioned in the inner cavity;

and a pressure chip (124) fixed on the top of the cavity and electrically connected to the other end of the second metal pin (1207);

wherein the lumen is filled with a first protective gel (1202).

2. The pressure core unit according to claim 1, wherein the frame (1201) comprises a horizontal frame bottom (1208) and a circle of first cylinder (1209) formed by the frame bottom (1208) protruding downwards, pin holes are formed on the frame bottom (1208), and the second metal pins (1207) and the pin holes are fixed and sealed in the pin holes through fired glass (1217); the pressure chip (124) is adhered to the lower surface of the frame bottom (1208); a second cylinder (1215) made of plastic is fixedly connected to the lower end of the first cylinder (1209).

3. The pressure core unit according to claim 2, wherein the upper portion of the second cylinder (1215) is fixedly sleeved on the first cylinder (1209), and the middle portion of the second cylinder (1215) protrudes laterally to form a supporting portion (1216) to prop against the lower end of the first cylinder (1209).

4. The pressure core unit of claim 2, wherein the pressure chip (124) is electrically connected to the other ends of the plurality of second metal pins (1207) via a plurality of first wires (1205).

5. A pressure sensor, comprising:

a housing (201);

a first pressure introduction passage (202) provided on the housing (201) for introducing a pressure to be measured into an inner cavity of the housing (201);

a circuit board (121), wherein a plurality of second electrical connection parts (1212) are arranged on the circuit board (121);

and the pressure core unit according to any one of claims 1 to 4, wherein one end of the second metal pin (1207) is upward penetrating through the chip mounting seat and is electrically connected with a second electrical connection part (1212); the flat mounting surface of the chip mounting seat is adhered to the lower surface of the circuit board (121); the first cylinder of the pressure core unit is fixed in a sealing groove formed at the bottom of the inner cavity of the shell (201) through bonding sealant, the pressure core unit (1200) of the pressure core unit is electrically connected to one end of a plurality of leading-out pins (204) fixed on the shell (201), and the other ends of the leading-out pins (204) penetrate through the shell (201) outwards.

6. A pressure core assembly for a differential pressure sensor, comprising: two pressure core units according to any of claims 1 to 4.

7. The pressure core assembly for a differential pressure sensor according to claim 6, characterized in that the frames (1201) of two of the pressure core units are integrally connected.

8. The pressure core assembly for a differential pressure sensor of claim 7, wherein the second metal pin (1207) is affixed to the frame (1201).

9. A differential pressure sensor, comprising:

a housing defining a mounting chamber, the housing being provided with two pressure tubes communicating into the mounting chamber;

and a pressure sensing assembly (120) mounted within and separating the mounting cavity into upper and lower portions, comprising a circuit board (121) and the pressure core assembly of claim 8; the circuit board (121) is provided with a plurality of second electric connection parts (1212); one end of the second metal pin (1207) of the pressure core component upwards penetrates through the chip mounting seat and is electrically connected with a second electrical connection part (1212); the flat mounting surface of the chip mounting seat is adhered to the lower surface of the circuit board (121); the lower part of the mounting cavity comprises two pressure cavities which are isolated; the upper ends of the pressure chambers are provided with through holes (1091), and the two first cylinders (1209) of the pressure sensing assembly (120) are correspondingly covered and sealed at the upper ends of the through holes (1091) corresponding to the two pressure chambers one by one.

10. The differential pressure sensor of claim 9, wherein the two first cylinders of the pressure sensing component (120) are fixed in two second sealing grooves formed on the housing (201) in a one-to-one correspondence manner through bonding sealant, the pressure core unit (1200) of the pressure core unit is electrically connected to one end of a plurality of first metal pins (108) fixed on the housing (201), and the other end of the first metal pins (108) is penetrated outwards through the housing (201).