CN218915455U

CN218915455U - Refrigerating equipment

Info

Publication number: CN218915455U
Application number: CN202222689742.2U
Authority: CN
Inventors: 申孟亮; 郝银鸽
Original assignee: Hubei Midea Refrigerator Co Ltd
Current assignee: Hubei Midea Refrigerator Co Ltd
Priority date: 2022-10-09
Filing date: 2022-10-09
Publication date: 2023-04-25
Anticipated expiration: 2032-10-09

Abstract

The application discloses refrigeration equipment, this refrigeration equipment includes: the first refrigerating device comprises an evaporator pipeline and a first accommodating cavity, and the evaporator pipeline is used for refrigerating the first accommodating cavity; the heat conducting guide rail is attached to the inner wall of the first accommodating cavity, a channel is arranged in the heat conducting guide rail, and two ends of the channel are respectively connected with the evaporator pipeline; the heat dissipation part of the second refrigeration device is arranged on the heat conduction guide rail, and the second refrigeration device is configured to move in the first accommodating cavity along the heat conduction guide rail under the action of external force; the heat conducting guide rail is used for conducting heat on the heat radiating piece; wherein the second refrigerating device is a semiconductor refrigerating device. By the mode, the accommodating cavity in the second refrigerating device can reach a lower temperature.

Description

Refrigerating equipment

Technical Field

The application relates to the technical field of refrigeration equipment, in particular to refrigeration equipment.

Background

A refrigeration system of a refrigeration apparatus, such as a refrigerator, needs to be newly built on the basis of the related art to achieve a lower temperature.

The inventors of the present application have long studied and found that in practice, not the whole refrigeration apparatus has a lower temperature requirement, but only some chambers have a lower temperature requirement.

Disclosure of Invention

The application provides a refrigeration device, which can enable a containing cavity in a second refrigeration device to reach a lower temperature.

In order to solve the technical problems, one technical scheme adopted by the application is as follows: there is provided a refrigeration apparatus comprising: the first refrigerating device comprises an evaporator pipeline and a first accommodating cavity, and the evaporator pipeline is used for refrigerating the first accommodating cavity; the heat conducting guide rail is attached to the inner wall of the first accommodating cavity, a channel is arranged in the heat conducting guide rail, and two ends of the channel are respectively connected with the evaporator pipeline; the heat dissipation part of the second refrigeration device is arranged on the heat conduction guide rail, and the second refrigeration device is configured to move in the first accommodating cavity along the heat conduction guide rail under the action of external force; the heat conducting guide rail is used for conducting heat on the heat radiating piece; wherein the second refrigerating device is a semiconductor refrigerating device.

Wherein the second refrigeration device comprises: a second accommodation chamber; a refrigeration chip; the cooling piece is adhered to the first end face of the refrigeration chip and used for absorbing heat of the second accommodating cavity; the heat dissipation piece is attached to the second end face of the refrigeration chip and used for dissipating heat absorbed from the second accommodating cavity.

Wherein the second refrigeration device comprises: the heat preservation, the heat preservation sets up around the second holding chamber, and refrigeration chip sets up in the heat preservation.

Wherein the second refrigeration device comprises: the shell, the heat preservation, the refrigeration chip, the second accommodation cavity, the cooling piece and the cooling piece are arranged in the shell.

The heat dissipation part and the first end face of the refrigeration chip are coated with heat conduction materials, and/or the heat dissipation part and the second end face of the refrigeration chip are coated with heat conduction materials.

Wherein the heat conducting material is heat conducting silicone grease or heat conducting oil.

Wherein the channel in the heat conducting guide rail is composed of a plurality of parallel sub-channels.

Wherein the channel in the heat conducting guide rail is a roundabout channel.

Wherein, be provided with the bellying on the heat conduction guide rail, be provided with the recess on the radiating member, the radiating member passes through the bellying cooperation of recess and heat conduction guide rail, makes second refrigerating plant follow the heat conduction guide rail and removes in first holding intracavity under the exogenic action.

Wherein, be provided with the recess on the heat conduction guide rail, be provided with the bellying on the radiating member, the radiating member passes through the bellying and cooperates with the recess of heat conduction guide rail, makes second refrigerating plant follow heat conduction guide rail and removes in first holding intracavity under the exogenic action.

In prior art, the refrigeration plant that this application provided is provided with the passageway in heat conduction guide rail, and the both ends of passageway are connected with the evaporimeter pipeline respectively, and the radiating part sets up on heat conduction guide rail, utilizes the heat that the evaporimeter pipeline transmission second refrigerating plant produced to accelerate the heat transfer of second refrigerating plant, make the holding chamber in the second refrigerating plant reach lower temperature. And the second refrigerating device is configured to move along the heat conducting guide rail in the first accommodating cavity under the action of external force, so that the movement flexibility of the second refrigerating device is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:

FIG. 1 is a schematic view of an embodiment of a refrigeration apparatus provided herein;

FIG. 2 is a schematic diagram of an embodiment of a second refrigeration apparatus provided herein;

FIG. 3 is a schematic view of another embodiment of a second refrigeration apparatus provided herein;

FIG. 4 is a schematic view of a disassembled structure of a heat sink provided in the present application;

FIG. 5 is a schematic view of the heat sink of FIG. 4 after mating;

FIG. 6 is a schematic view of another embodiment of a refrigeration appliance provided herein;

FIG. 7 is a schematic view of another embodiment of a second refrigeration apparatus provided herein;

FIG. 8 is a schematic view of another embodiment of a second refrigeration apparatus provided herein;

FIG. 9 is a schematic structural view of an embodiment of a channel A provided in the present application;

FIG. 10 is a schematic view of another embodiment of the channel A provided in the present application;

FIG. 11 is a schematic view of another embodiment of a refrigeration appliance provided herein;

fig. 12 is a schematic structural diagram of an embodiment of a second cooling device and a heat-conducting rail provided in the present application;

FIG. 13 is a schematic view of an embodiment of a channel B provided in the present application;

FIG. 14 is a schematic view of another embodiment of a channel B provided herein;

fig. 15 is a schematic view of a disassembled structure of a heat dissipating member and a heat conducting rail provided in the present application;

FIG. 16 is a schematic view of the heat sink of FIG. 15 mated with a thermally conductive rail;

FIG. 17 is a schematic view of another disassembled structure of the heat dissipating member and the heat conducting rail provided in the present application;

fig. 18 is a schematic structural view of the heat dissipating member of fig. 17 after being mated with the heat conducting rail.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a refrigeration apparatus provided in the present application. The refrigeration apparatus 100 includes: a first refrigeration unit 10 and a second refrigeration unit 20.

The first refrigerating device 10 comprises an evaporator line 11 and a first receiving chamber 12, wherein the evaporator line 11 is used for refrigerating the first receiving chamber 12.

In other embodiments, the first refrigeration unit 10 further includes a compressor (not shown) and a condenser (not shown). The compressor, condenser and evaporator piping 11 constitute a refrigeration system, and the first accommodation chamber 12 is refrigerated by the evaporator piping 11.

The heat dissipation element 21 of the second refrigeration device 20 is fixedly arranged on the side wall 121 of the first accommodating cavity 12 and is attached to part of the evaporator pipeline 11, and heat generated by the second refrigeration device 20 is transferred by the evaporator pipeline 11; the second refrigerating device 20 is a semiconductor refrigerating device. I.e. the transfer of heat generated by the second cooling device 20 is accelerated by means of the evaporator circuit 11 to bring the second receiving chamber 22 of the second cooling device 20 to a lower temperature.

The semiconductor refrigerating device is a refrigerating device which utilizes a semiconductor refrigerating sheet to realize refrigeration through a heat pipe radiating and conducting technology and an automatic variable-voltage variable-current control technology, and does not need refrigerating working medium and mechanical moving parts.

In this embodiment, the refrigeration apparatus 100 attaches the heat dissipating member of the second refrigeration device 20 to the portion of the evaporator pipeline 11 of the first refrigeration device 10, and uses the evaporator pipeline 11 to transfer the heat generated by the second refrigeration device 20, so as to accelerate the heat transfer of the second refrigeration device 20, so that the accommodating cavity in the second refrigeration device 20 reaches a lower temperature.

Referring to fig. 2, the second refrigerating apparatus 20 includes: the cooling member 21, the second accommodating chamber 22, the cooling chip 23, and the cooling member 24.

The cooling piece 24 is attached to the first end face of the refrigeration chip 23 and is used for absorbing heat of the second accommodating cavity 22; the heat dissipation element 21 is attached to the second end surface of the refrigeration chip 23, and is used for dissipating heat absorbed from the second accommodating cavity 22. In some embodiments, a spoiler may be disposed at an end surface of the cooling member 24 away from the cooling chip 23, and the spoiler is utilized to spoiler the second accommodating cavity 22, so as to improve the uniformity of the temperature in the second accommodating cavity 22 and improve the cooling speed. The spoiler may be an electronic fan.

The first end surface of the refrigeration chip 23 is a cold end surface, and the second end surface of the refrigeration chip 23 is a hot end surface. Therefore, the first end surface of the refrigeration chip 23 exchanges cold energy through the cold dissipation member 24, that is, the cold energy is dissipated to the second accommodating cavity 22 through the cold dissipation member, and heat of the second accommodating cavity 22 is conducted out through the second end surface of the refrigeration chip 23. In some embodiments, the cooling member 24 and the cooling member 21 may be formed of a material that facilitates heat conduction, such as metal. Such as copper, iron or aluminum alloys.

Further, the second refrigerating apparatus 20 includes: and a heat insulating layer 25.

The heat preservation 25 is arranged around the second accommodating cavity 22, and the refrigeration chip 23 is arranged on the heat preservation 25. The heat insulating layer 25 may be made of a heat insulating material. The thermal insulation material can be an inorganic material or an organic material. The heat insulating layer can also be made of a mixture of organic materials and inorganic materials.

The organic material may be polyurethane foam, polystyrene board, EPS (Expanded Polystyrene, polystyrene foam), XPS (extruded polystyrene, extruded polystyrene foam) or phenolic foam, among others.

The inorganic material can be ceramic fiber blanket, aluminum silicate felt, aluminum oxide, silicon carbide fiber, aerogel felt, glass wool, rock wool, expanded perlite, micro-nano heat insulation or foaming cement.

Further, the second refrigerating apparatus 20 includes: a housing 26. The heat preservation 25, the refrigeration chip 23, the second accommodating cavity 22, the cooling member 24, and the cooling member 21 are disposed on the housing 26. The housing 26 is provided with an opening, and a portion of the heat dissipation element 21 is exposed through the opening and fixedly disposed on a side wall of the first accommodating cavity 12.

In some embodiments, to ensure a heat transfer effect, a thermally conductive material is coated between the cold sink 24 and the first end surface of the refrigeration chip 23.

In some embodiments, a thermally conductive material is coated between the heat sink 21 and the second end face of the refrigeration chip 23.

In other embodiments, a thermally conductive material is coated between the heat sink 24 and the first end face of the refrigeration chip 23 and a thermally conductive material is coated between the heat sink 21 and the second end face of the refrigeration chip 23.

The heat conducting material can be heat conducting silicone grease or heat conducting oil.

By coating the heat-conducting silicone grease on the contact surface of the heat dissipation element 21 and the refrigeration chip 23, the heat-conducting property is increased.

Referring to fig. 3, the second refrigerating apparatus 20 includes: the heat dissipation part 21, the second accommodating cavity 22, the refrigeration chip 23, the heat dissipation part 24, the heat preservation layer 25 and the shell 26. Wherein the heat sink 21 includes: a first heat sink 211 and a second heat sink 212.

Wherein, the first end surface of the first heat dissipation element 211 is attached to the second end surface of the refrigeration chip 23; the first end surface of the second heat dissipation element 212 is attached to the second end surface of the first heat dissipation element 211, which is far away from the refrigeration chip 23, and the second heat dissipation element 212 is fixedly arranged on the side wall of the first accommodating cavity 12.

The second heat dissipation element 212 is fixedly disposed on a side wall of the first accommodating cavity 12 through a fastener. The fastener may be a bolt, a screw, or a combination of a bolt and a nut. In some embodiments, a hole with internal threads may be provided on the second heat dissipating member 212, and the external threads of the bolt are matched with the internal threads, so that the second heat dissipating member 212 is fixedly disposed on the side wall of the first accommodating cavity 12, and the whole second cooling device is fixedly disposed on the side wall of the first accommodating cavity 12.

Referring to fig. 4, a first groove 21a is disposed on a first end surface of the second heat dissipation element 212, a first protrusion 21b is disposed on a second end surface of the first heat dissipation element 211, and the first end surface of the second heat dissipation element 212 is engaged with the first protrusion 21b of the second end surface of the first heat dissipation element 211 through the first groove 21a, so that the first end surface of the second heat dissipation element 212 is attached to the second end surface of the first heat dissipation element 211, thereby forming the heat dissipation element 21 as shown in fig. 5. In other embodiments, after the first end surface of the second heat dissipation element 212 is engaged with the first protrusion 21b of the second end surface of the first heat dissipation element 211 through the first groove 21a, the rest of the first end surface of the second heat dissipation element 212 is attached to the rest of the second end surface of the first heat dissipation element 211.

In other embodiments, the first heat sink 211 and the second heat sink 212 may be attached by other forms. Such as M/W complementary or concave/convex, etc.

In some embodiments, the power end face of the second refrigeration device 20 is coupled to a power module internal to the first refrigeration device 10. That is, by adding a socket to the inside of the first refrigerating apparatus 10, the second refrigerating apparatus 20 is supplied with power by connecting the power end surface of the second refrigerating apparatus 20 to the socket in the inside of the first refrigerating apparatus 10.

In other embodiments, the refrigeration information of the second refrigeration device 20 may be displayed by the display centralized control module of the first refrigeration device 10, and the user may control the temperature of the second refrigeration device 20.

In the above embodiment, the first refrigeration device 10 and the second refrigeration device 20 form an cascade refrigeration system, the refrigerant passing through the evaporator pipeline 11 of the first refrigeration device 10 transfers the cold energy to the heat dissipation member 21, and performs heat conversion with the heat dissipation member 21 to take away the heat of the heat dissipation member 21, thereby cooling the second accommodating cavity of the second refrigeration device 20.

The heat sink 21 may be fixed to the case of the first refrigeration apparatus 10 by bolts and attached to the evaporator tube 11 of the first refrigeration apparatus 10.

Referring to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of a refrigeration apparatus provided in the present application. The refrigeration apparatus 100 includes: a first refrigeration unit 10 and a second refrigeration unit 20.

The first refrigerating device 10 comprises an evaporator line (not shown) and a first receiving chamber 12, the evaporator line 11 being used for refrigerating the first receiving chamber 12.

The second refrigerating device 20 is arranged in the first accommodating cavity 12, a channel A is arranged in the radiating piece 21 of the second refrigerating device 20, and two ends of the channel A are respectively connected with the evaporator pipeline through flexible pipes 27; the flexible tube 27 is configured to deform under an external force to move the second cooling device 20 within the first housing cavity. I.e. the two ends of the channel a are connected to the evaporator tube 11 by flexible tubes 27, respectively, so that the channel a becomes part of the evaporator tube. Further, the heat absorption function of the evaporator can be also generated in the passage a, and the heat conduction to the heat sink 21 is accelerated.

The second refrigerating device 20 is a semiconductor refrigerating device.

In some embodiments, the flexible tube 27 may be a nylon hose.

In some embodiments, the flexible tube 27 may be a stainless steel corrugated hose.

In some embodiments, the flexible tube 27 may be a rubber hose with embedded steel wires.

It will be appreciated that the flexible tube 27 has the same or similar properties as the evaporator tube 11, except that it is configured to deform easily under external forces.

In this embodiment, the refrigerating apparatus 100 is provided with a channel a in the heat dissipation member 21 of the second refrigerating device 20, two ends of the channel a are respectively connected with the evaporator pipeline through the flexible tube 27, and the evaporator pipeline is utilized to transfer the heat generated by the second refrigerating device 20, so as to accelerate the heat transfer of the second refrigerating device 20, and make the accommodating cavity in the second refrigerating device 20 reach a lower temperature. And the flexible tube 27 deforms under the action of external force, so that the second refrigerating device 20 can move in the first accommodating cavity 12, and the movement flexibility of the second refrigerating device 20 is improved.

Referring to fig. 7, the second refrigerating apparatus 20 includes: the cooling member 21, the second accommodating chamber 22, the cooling chip 23, and the cooling member 24.

The first end surface of the refrigeration chip 23 is a cold end surface, and the second end surface of the refrigeration chip 23 is a hot end surface. Therefore, the first end surface of the refrigeration chip 23 exchanges cold energy through the cold dissipation member 24, that is, the cold energy is dissipated to the second accommodating cavity 22 through the cold dissipation member, and heat of the second accommodating cavity 22 is conducted out through the second end surface of the refrigeration chip 23.

Referring to fig. 8, the second refrigerating apparatus 20 includes: the heat dissipation part 21, the second accommodating cavity 22, the refrigeration chip 23, the heat dissipation part 24, the heat preservation layer 25 and the shell 26. The heat dissipation element 21 includes a first heat dissipation element 211 and a second heat dissipation element 212, the first heat dissipation element 211 is disposed on the heat insulation layer 25, the second heat dissipation element 212 is attached to the first heat dissipation element 211, and the second heat dissipation element 212 is provided with a channel a. The two ends of the channel A are respectively connected with an evaporator pipeline through flexible pipes 27; the flexible tube 27 is configured to deform under an external force to move the second cooling device 20 within the first housing cavity.

In some embodiments, referring to fig. 9, channel a in heat sink 21 is formed of a plurality of parallel sub-channels a. As shown in fig. 9, the refrigerant in the evaporator tube flows in from the inlet of the passage a, disperses according to the sub-passage a, and flows out from the outlet of the passage a, thereby circulating and absorbing the heat of the radiator 21. The contact area between the refrigerant and the heat radiating member 21 is increased by the plurality of sub-channels a connected in parallel to accelerate the efficiency of absorbing heat.

In some embodiments, referring to fig. 10, the channel a in the heat sink 21 is a circuitous channel. By setting the channel a as a detour channel, the circulation time of the refrigerant in the heat sink 21 is increased, and the contact area between the refrigerant and the heat sink 21 is increased, so as to increase the heat absorption efficiency.

In the above embodiment, the cascade refrigeration system is constituted by the first refrigeration apparatus 10 and the second refrigeration apparatus 20, the heat radiation member 21 of the second refrigeration apparatus 20 radiates heat through the evaporator pipe 11 of the first refrigeration apparatus 10, the evaporator pipe is embedded in the heat radiation member 21, the evaporator pipe 11 and the passage in the heat radiation member 21 are connected by the flexible pipe 27, the flexible pipe 27 can be moved/bent within a certain range, and thus the second refrigeration apparatus 20 can be made movable.

Wherein the second cooling device 20 can be placed in the first receiving chamber 12 of the first cooling device 10 and moved within the range allowed by the flexible tube 27.

Referring to fig. 11, fig. 11 is a schematic structural diagram of another embodiment of a refrigeration apparatus provided in the present application. The refrigeration apparatus 100 includes: a first cooling device 10, a second cooling device 20 and a heat conducting rail 30.

The heat conduction guide rail 30 is attached to the inner wall of the first accommodating cavity 12, a channel B is arranged in the heat conduction guide rail 30, and two ends of the channel B are respectively connected with the evaporator pipeline 11. I.e. the two ends of the channel B are connected to the evaporator tube 11, respectively, so that the channel B becomes part of the evaporator tube 11. And further the function of absorbing heat of the evaporator can be generated at the channel B.

The heat dissipation element 21 of the second refrigeration device 20 is disposed on the heat conduction guide rail 30, and the second refrigeration device 20 is configured to move along the heat conduction guide rail 30 in the first accommodating cavity 12 under the action of external force; the heat conductive rail 30 serves to conduct heat on the heat sink 21.

The second refrigerating device 20 is a semiconductor refrigerating device.

In the present embodiment, the refrigeration apparatus 100 is provided with the channel B in the heat-conducting rail 30, both ends of the channel B are respectively connected with the evaporator pipeline 11, and the heat dissipation member 21 is disposed on the heat-conducting rail 30, and the evaporator pipeline 11 is utilized to transfer the heat generated by the second refrigeration device 20, so as to accelerate the heat transfer of the second refrigeration device 20, so that the accommodating cavity in the second refrigeration device 20 reaches a lower temperature. And the second cooling device 20 is configured to move along the heat conductive rail 30 within the first accommodating chamber 12 under the action of an external force, improving the movement flexibility of the second cooling device 20.

Referring to fig. 12, the second refrigerating apparatus 20 includes: the cooling device comprises a heat dissipation piece 21, a second accommodating cavity 22, a refrigeration chip 23 and a cooling piece 24.

In some embodiments, referring to fig. 13, channel B within thermally conductive track 30 is comprised of a plurality of parallel sub-channels B. As shown in fig. 13, the refrigerant in the evaporator tube 11 flows in from the inlet of the passage B, disperses in accordance with the sub-passage B, and flows out from the outlet of the passage B, thereby circulating and absorbing the heat of the radiator 21. The contact area between the refrigerant and the heat conducting guide rail 30 is increased by the plurality of parallel sub-channels b, and the heat dissipation member 21 is arranged on the heat conducting guide rail 30, which is equivalent to indirectly increasing the contact area between the refrigerant and the heat dissipation member 21, so as to increase the heat absorption efficiency.

In some embodiments, referring to fig. 14, the channels within the thermally conductive rail 30 are circuitous channels. By setting the channel B as a detour channel, the circulation time of the refrigerant in the heat conducting guide rail 30 is increased, and the contact area between the refrigerant and the heat conducting guide rail 30 is increased, so that the heat dissipation element 21 is disposed on the heat conducting guide rail 30, which is equivalent to indirectly increasing the contact area between the refrigerant and the heat dissipation element 21, so as to increase the heat absorption efficiency.

Referring to fig. 15, the heat conducting rail 30 is provided with a second protruding portion 31a, the heat dissipating member 21 is provided with a second groove 22a, and the heat dissipating member 21 is matched with the second protruding portion 31a of the heat conducting rail 30 through the second groove 22a to form a fitting shape as shown in fig. 16, so that the second refrigerating device 20 moves along the heat conducting rail 30 in the first accommodating cavity 12 under the action of external force.

Referring to fig. 17, the heat conducting rail 30 is provided with a third groove 32a, the heat dissipating member 21 is provided with a third protrusion 23a, and the heat dissipating member 21 is matched with the third groove 32a of the heat conducting rail 30 through the third protrusion 23a to form a fitting shape as shown in fig. 18, so that the second refrigerating device 20 moves along the heat conducting rail 30 in the first accommodating cavity 12 under the action of external force.

In the above embodiment, the cascade refrigeration system is constituted by the first refrigeration apparatus 10 and the second refrigeration apparatus 20, the heat sink 21 of the second refrigeration apparatus 20 exchanges heat with the evaporator tube 11 of the first refrigeration apparatus 10 through the heat conduction rail 30 to dissipate heat, the evaporator tube 11 is embedded in the heat conduction rail 30, and the heat sink 21 is caught on the heat conduction rail 30, so that the second refrigeration apparatus 20 can be moved along the heat conduction rail 30.

Wherein the second cooling device 20 can be placed in the first receiving chamber 12 of the first cooling device 10 to move within the range allowed by the heat conducting rail 30.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structural changes made according to the present application specification and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the patent protection of the present application.

Claims

1. A refrigeration appliance, the refrigeration appliance comprising:

the first refrigerating device comprises an evaporator pipeline and a first accommodating cavity, and the evaporator pipeline is used for refrigerating the first accommodating cavity;

the heat conducting guide rail is attached to the inner wall of the first accommodating cavity, a channel is arranged in the heat conducting guide rail, and two ends of the channel are respectively connected with the evaporator pipeline;

the heat dissipation part of the second refrigeration device is arranged on the heat conduction guide rail, and the second refrigeration device is configured to move in the first accommodating cavity along the heat conduction guide rail under the action of external force; the heat conducting guide rail is used for conducting heat on the heat radiating piece;

wherein the second refrigerating device is a semiconductor refrigerating device.

2. The refrigeration appliance of claim 1 wherein the second refrigeration device includes:

a second accommodation chamber;

a refrigeration chip;

the cooling piece is attached to the first end face of the refrigeration chip and used for absorbing heat of the second accommodating cavity;

the heat dissipation piece is attached to the second end face of the refrigeration chip and used for dissipating heat absorbed from the second accommodating cavity.

3. The refrigeration appliance of claim 2 wherein the second refrigeration device includes:

the heat preservation layer surrounds the second accommodating cavity, and the refrigeration chip is arranged on the heat preservation layer.

4. A refrigeration unit as recited in claim 3 wherein said second refrigeration means comprises:

the heat preservation layer, the refrigeration chip, the second accommodating cavity, the cooling piece and the heat dissipation piece are arranged in the shell.

5. A refrigeration device according to claim 2, wherein,

and a heat conducting material is coated between the heat dissipation part and the first end surface of the refrigeration chip, and/or a heat conducting material is coated between the heat dissipation part and the second end surface of the refrigeration chip.

6. The refrigeration appliance of claim 5 wherein the thermally conductive material is a thermally conductive silicone grease or a thermally conductive oil.

7. The refrigeration appliance of claim 1 wherein the channel in the thermally conductive track is comprised of a plurality of sub-channels connected in parallel.

8. The refrigeration appliance of claim 1 wherein the channel in the thermally conductive track is a circuitous channel.

9. The refrigeration device according to claim 1, wherein a protruding portion is provided on the heat conducting guide rail, a groove is provided on the heat dissipating member, and the heat dissipating member is matched with the protruding portion of the heat conducting guide rail through the groove, so that the second refrigeration device moves along the heat conducting guide rail in the first accommodating cavity under the action of external force.

10. The refrigeration device according to claim 1, wherein a groove is formed in the heat conducting guide rail, a protruding portion is formed in the heat dissipating member, and the heat dissipating member is matched with the groove of the heat conducting guide rail through the protruding portion, so that the second refrigeration device moves in the first accommodating cavity along the heat conducting guide rail under the action of external force.