CN218910503U - Heterojunction battery production system and carrier - Google Patents

Abstract

The utility model relates to a heterojunction battery production system and a carrier, wherein the carrier comprises a base and at least two supporting members. Wherein, be equipped with two at least first connecting portions on the base, every bearing spare all is equipped with one and can dismantle the second connecting portion of being connected with a first connecting portion, and two at least bearing spare and two at least first connecting portion one-to-one set up, make all bearing spare cooperation form the supporting plane who is used for supporting the silicon chip, and a second connecting portion is connected with a first connecting portion in order to form in supporting plane's top and be used for with a silicon chip location complex location structure. When the carrier and the silicon wafer finish amorphous silicon deposition of the silicon wafer in the cavity, after the carrier and the silicon wafer deposited with amorphous silicon are moved out of the cavity, the carrier and the silicon wafer are only required to be taken down from the base for cleaning, and the standby bearing is installed on the base again to bear the silicon wafer again for amorphous silicon deposition of the silicon wafer, so that the utilization rate of CVD equipment is not affected, the productivity is improved, and the production efficiency is ensured.

Description

Heterojunction battery production system and carrier

Technical Field

The utility model relates to the technical field of batteries, in particular to a heterojunction battery production system and a carrier.

Background

In the production process of the heterojunction battery, a CVD (Chemical Vapor Deposition ) process is required to deposit an amorphous silicon layer on the cleaned and textured silicon wafer to form a PN junction. Specifically, the carrier is used for bearing the silicon wafer into the chamber to finish the deposition of the amorphous silicon layer. Because the carrier and the cavity can deposit the film in the use process, when the film reaches a certain thickness, silicon powder can fall off, thereby influencing the efficiency and the yield of the battery, and the carrier and the cavity need to be cleaned regularly in order not to influence the normal operation of the CVD process. When the existing carrier is cleaned, the equipment is longer in machine halt waiting time, and the utilization rate of the equipment is affected.

Disclosure of Invention

Based on this, it is necessary to provide a heterojunction battery production system and a carrier aiming at the problem of influencing the utilization rate of equipment.

The technical scheme is as follows:

in one aspect, a carrier is provided, comprising:

the base is provided with at least two first connecting parts; a kind of electronic device with high-pressure air-conditioning system

The support device comprises at least two support pieces, wherein each support piece is provided with a second connecting part detachably connected with one first connecting part, the at least two support pieces are arranged in one-to-one correspondence with the at least two first connecting parts, all support pieces are matched to form a supporting plane for supporting a silicon wafer, and one second connecting part is connected with one first connecting part to form a positioning structure for positioning and matching with one silicon wafer above the supporting plane.

The technical scheme is further described as follows:

in one embodiment, each first connecting portion includes at least two positioning pins disposed at intervals, each second connecting portion includes at least two positioning through holes disposed at intervals, at least two positioning pins are disposed in one-to-one correspondence with at least two positioning through holes, and each positioning pin can pass through the corresponding positioning through hole to form the positioning structure.

In one embodiment, the spacing between the locating pin and the side wall of the silicon wafer is L, and L is less than or equal to 1.5mm.

In one embodiment, the inner diameter of the positioning through hole decreases in a direction away from the base along the axial direction of the positioning through hole.

In one embodiment, a guiding inclined plane or a guiding cambered surface is arranged at one end of the positioning pin, which is far away from the base.

In one embodiment, the positioning pin is rotatably connected with the base, so that the positioning pin can rotate around the central axis of the positioning pin relative to the base.

In one embodiment, each first connection portion includes eight positioning pins, the eight positioning pins are arranged around the circumference of the silicon wafer, each second connection portion includes eight positioning through holes, the eight positioning pins are arranged in one-to-one correspondence with the eight positioning through holes, and the eight positioning pins can pass through the corresponding positioning through holes to form the positioning structure for positioning the circumference of the silicon wafer.

In one embodiment, the sidewalls of two adjacent supporting members are attached to each other, and each supporting member is correspondingly provided with one silicon wafer.

In another aspect, a heterojunction battery production system is provided, comprising the carrier.

In one embodiment, the heterojunction cell production system further comprises a wet cleaning device for cleaning the support.

According to the heterojunction battery production system and the carrier, when the carrier and the silicon wafer finish amorphous silicon deposition of the silicon wafer in the cavity, and the carrier and the silicon wafer deposited with amorphous silicon are moved out of the cavity, and when the carrier is required to be cleaned, all the supporting pieces are taken down from the base to be cleaned, and the spare supporting pieces are mounted on the base again to support the silicon wafer again for amorphous silicon deposition of the silicon wafer, so that the utilization rate of CVD equipment is not affected, the productivity is improved, and the production efficiency is ensured. Meanwhile, after the second connecting part is connected with the first connecting part, a positioning structure can be formed above the supporting plane, and the positioning structure can be matched with a silicon wafer in a positioning manner, so that the silicon wafer can be placed on the supporting plane for positioning, and the silicon wafer can be accurately placed on the supporting plane. And moreover, the positioning structure can also limit and restrict the placement of the silicon wafer on the supporting plane, so that the silicon wafer is prevented from being displaced or offset relative to the supporting plane after being placed on the supporting plane, the quality of the film coating is prevented from being influenced by movement when the amorphous silicon layer is deposited in the cavity, and the yield is ensured. In addition, when the carrier and the silicon wafer finish amorphous silicon deposition of the silicon wafer in the cavity, and the carrier and the silicon wafer after the amorphous silicon deposition are moved out of the cavity, and the carrier is required to be cleaned, the carrier is only required to be cleaned by taking down each bearing piece from the base, and the spare bearing pieces are installed on the base again, so that the silicon wafer can be supported again for amorphous silicon deposition of the silicon wafer, the utilization rate of the CVD equipment is not influenced, the productivity is improved, and the production efficiency is ensured.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model.

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a carrier according to an embodiment;

FIG. 2 isbase:Sub>A cross-sectional view of the carrier A-A of FIG. 1;

FIG. 3 is a top view of a base of the carrier of FIG. 1;

FIG. 4 is a side view of a base of the carrier of FIG. 1;

FIG. 5 is a top view of a support of the carrier of FIG. 1;

FIG. 6 is a schematic view of a structure of a silicon wafer placed on the support of FIG. 5;

FIG. 7 is a cross-sectional view of a silicon wafer B-B placed on the support of FIG. 6;

fig. 8 is a schematic diagram illustrating the cooperation between the positioning pins of the base and the positioning holes of the support in the carrier of fig. 1.

Reference numerals illustrate:

100. a base; 110. a first connection portion; 111. a positioning pin; 200. a support; 210. a second connecting portion; 211. positioning the through hole; 300. and (3) a silicon wafer.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In one embodiment, a heterojunction cell production system is provided that includes a CVD apparatus and a carrier by which a silicon wafer 300 is supported for deposition of an amorphous silicon layer into a chamber of the CVD apparatus. Moreover, the utilization of the carrier does not influence the utilization rate of the CVD equipment, improves the productivity and ensures the production efficiency.

The CVD apparatus may be any apparatus capable of performing a chemical vapor deposition process on the silicon wafer 300.

As shown in fig. 1 and 2, in particular, the carrier includes a base 100 and at least two supports 200.

The base 100 may be plate-shaped or disk-shaped, and may be made of aluminum, ceramic, carbon, glass, or the like. As shown in fig. 3 and 4, at least two first connection portions 110 are provided on the base 100.

The support 200 may be in the form of a support plate or a support sheet, and may be made of aluminum, glass, teflon, or the like. As shown in fig. 5 to 7, each of the holders 200 is provided with a second connection portion 210 detachably connected to one of the first connection portions 110, that is, each of the holders 200 is detachably connected to the base 100; moreover, at least two of the holders 200 are disposed in one-to-one correspondence with at least two of the first connection portions 110, so that a supporting plane for supporting the silicon wafer 300 can be formed after all of the holders 200 are connected with the base 100. In this way, the second connection portion 210 on each supporting member 200 is connected with the corresponding first connection portion 110, so that each supporting member 200 is mounted on the base 100, and the top surfaces of each supporting member 200 are on the same plane to form a supporting plane in a matching manner, so that the silicon wafer 300 can be placed on the supporting plane.

As shown in fig. 1 and 2, preferably, when at least two of the holders 200 are mounted on the base 100, sidewalls between two adjacent holders 200 are attached to each other, so that gaps between the holders 200 are eliminated or reduced, and thus as many holders 200 as possible can be disposed on the base 100, and the space utilization is high. And, a silicon wafer 300 is correspondingly placed on a supporting member 200, so that the silicon wafers 300 are arranged at intervals, mutual interference can not exist when an amorphous silicon layer is deposited, and the coating quality is ensured.

Of course, in other embodiments, two adjacent holders 200 may be disposed at predetermined gap intervals.

Meanwhile, after one second connection part 210 is connected with one first connection part 110, a positioning structure can be formed above the supporting plane, and the silicon wafer 300 can be positioned on the supporting plane by using the positioning structure to be matched with one silicon wafer 300 in a positioning manner, so that the silicon wafer 300 is accurately placed on the supporting plane. And, utilize location structure can also carry out spacing and restraint to the placing of silicon chip 300 on the supporting plane, avoid the silicon chip 300 to place behind the supporting plane and take place displacement or skew relative to the supporting plane, avoid influencing the coating film quality because of removing when carrying out the deposition of amorphous silicon layer in the cavity, guarantee the yield.

In addition, when the carrier and the silicon wafer 300 finish amorphous silicon deposition of the silicon wafer 300 in the chamber, and after the carrier and the silicon wafer 300 finish amorphous silicon deposition, the carrier is removed from the chamber, and when the carrier is required to be cleaned, the support pieces 200 are only required to be removed from the base 100 for cleaning, and the standby support pieces 200 are installed on the base 100 again to support the silicon wafer 300 again for amorphous silicon deposition of the silicon wafer 300, so that the utilization rate of CVD equipment is not affected, the productivity is improved, and the production efficiency is ensured.

Optionally, the heterojunction battery production system further comprises a wet cleaning device, so that the support 200 is cleaned by the wet cleaning device, and further, the adsorption of F atoms in the traditional plasma cleaning process can be avoided, and the corrosion of the plasma to the support 200 can also be avoided.

The wet cleaning device may be any existing device capable of performing wet cleaning on the support 200.

In addition, each bearing piece 200 is utilized to bear the silicon wafer 300, so that the silicon wafer 300 is attached to the supporting plane, the bearing requirement of the large-size silicon wafer 300 can be met, the large-size silicon wafer 300 cannot deform, and the problems of plating around, flow around and the like are avoided. Moreover, the roughness of the top surface of each supporting member 200 can be processed to be within 0.06um, the flatness of the top surface of each supporting member 200 can be processed to be within 0.3mm, so that abrasion to the silicon wafer 300 when the silicon wafer 300 is contacted with a supporting plane can be avoided, marks can be avoided when PL (photo luminescence) and EL (electroluminescence) are generated, and the battery efficiency and the product yield are ensured. Moreover, since each of the supporting members 200 may be modularized, deformation of the supporting member 200 during the transportation process can be prevented, and the service life can be prolonged.

The detachable connection between the first connection portion 110 and the second connection portion 210 may be implemented by a plug-in fit manner or a snap-in fit manner.

In particular, in the embodiment of the present application, as shown in fig. 2 to 4, each first connection portion 110 includes at least two positioning pins 111 disposed at intervals. As shown in fig. 5, each of the second connection parts 210 includes at least two positioning through holes 211 disposed at intervals. And, at least two locating pins 111 and at least two locating through holes 211 one-to-one set up, so, place bearing piece 200 from last decurrent on base 100 for in each locating through hole 211 of each locating pin 111 one-to-one's insertion, can realize the assembly connection of bearing piece 200 and base 100, when needs change the washing to bearing piece 200, only need simple from lifting up bearing piece 200 down, make each locating pin 111 pull out from each locating through hole 211 can, simply, conveniently. Moreover, each positioning pin 111 can pass through the corresponding positioning through hole 211, that is, the top end of each positioning pin 111 can extend out of the positioning through hole 211 and be located above the supporting plane, so that a positioning structure can be formed above the supporting plane, that is, the part of each positioning pin 111 extending out of the positioning through hole 211 forms a positioning structure, when the silicon wafer 300 is placed in the area surrounded by each positioning pin 111 of the first connecting portion 110, the side wall of the silicon wafer 300 can be positioned and guided by using each positioning pin 111, so that the silicon wafer 300 can be accurately placed on the supporting plane of the area defined by each positioning pin 111 of the first connecting portion 110; meanwhile, the parts of the positioning pins 111 extending out of the mounting through holes can limit and restrict the side wall of the silicon wafer 300, so that the silicon wafer 300 is prevented from being displaced or offset relative to the supporting plane after being placed on the supporting plane, the quality of the coating film is prevented from being influenced by movement when the amorphous silicon layer is deposited in the chamber, and the yield is ensured

In addition, as shown in fig. 2, the distance between the positioning pin 111 and the side wall of the silicon wafer 300 is L, and L is less than or equal to 1.5mm, so that interference caused by the positioning pin 111 on the silicon wafer 300 placed on the supporting plane can be avoided, and meanwhile, the positioning pin 111 can limit and restrict the side wall of the silicon wafer 300 after the silicon wafer 300 is placed on the supporting plane so as to prevent the silicon wafer 300 from displacing or shifting relative to the supporting plane.

Specifically, L may be 0.3mm, 0.6mm, 0.9mm, 1.2mm or 1.5mm, which can be flexibly designed or adjusted according to actual use conditions.

As shown in fig. 8, in addition, along the axial direction of the positioning through hole 211, the inner diameter of the positioning through hole 211 decreases along the direction away from the base 100, that is, the inner diameter of the side of the positioning through hole 211 close to the base 100 is larger and the inner diameter of the side away from the base 100 is smaller, so that the positioning pin 111 is conveniently inserted into the positioning through hole 211 from below, and when the positioning pin 111 passes out of the positioning through hole 211 from the side of the positioning through hole 211 away from the base 100, the positioning pin 111 can be limited by the inner side wall of the positioning through hole 211, so that the support piece 200 is prevented from moving or shaking relative to the base 100.

As shown in fig. 8, preferably, the inner diameter of the side of the positioning through hole 211 away from the base 100 is matched with the outer diameter of the positioning pin 111, so that the central axis of the positioning through hole 211 coincides with the central axis of the positioning pin 111, and the inner side wall of the positioning through hole 211 can limit the positioning pin 111, so as to avoid the movement or shaking of the support member 200 relative to the base 100.

Meanwhile, in order to accurately place the silicon wafer 300 on the supporting plane, a guide slope or a guide arc surface may be further provided at an end of the positioning pin 111 remote from the base 100, so that when the silicon wafer 300 is placed on the supporting plane, the side edge of the silicon wafer 300 is guided by the guide slope or the guide arc surface, thereby accurately placing the silicon wafer 300 on the supporting plane of the area defined by each positioning pin 111 of the first connection part 110.

Further, the positioning pin 111 is rotatably connected with the base 100 by adopting a bearing connection mode and the like, so that the positioning pin 111 can rotate around the central axis of the positioning pin 111 relative to the base 100, and further when the silicon wafer 300 collides with the positioning pin 111, the collision force can be buffered and absorbed by utilizing the rotation of the positioning pin 111, and the damage to the silicon wafer 300 is avoided.

The number of the positioning pins 111 in each first connecting portion 110 may be flexibly designed or adjusted according to actual use requirements.

As shown in fig. 3, in one embodiment, each first connection 110 includes eight locating pins 111, the eight locating pins 111 being arranged circumferentially around the silicon wafer 300. As shown in fig. 1, each of the second connection portions 210 includes eight positioning through holes 211, respectively. The eight positioning pins 111 are arranged in one-to-one correspondence with the eight positioning through holes 211. So, place bearing 200 from top to bottom on base 100 for eight locating pins 111 one-to-one inserts in eight locating through holes 211, can realize the assembly connection of bearing 200 and base 100, when needs change the washing to bearing 200, only need simple from the bottom up lift up bearing 200, make eight locating pins 111 pull out from eight locating through holes 211 can, simple, convenient. And, eight locating pins 111 can all pass through corresponding locating through holes 211 to form the location structure that is used for carrying out the circumference to silicon chip 300, namely when the top of eight constant head tanks passes corresponding locating through holes 211 and stretches out to the outside of locating through holes 211 and lie in the top of supporting plane, the part that eight locating pins 111 stretches out of locating through holes 211 forms the location structure, and the region that supplies silicon chip 300 to place is delimited on the supporting plane to the part that eight locating pins 111 stretch out of locating through holes 211, guarantees the accurate placement of silicon chip 300.

Of course, in other embodiments, the first connecting portion 110 may also include twelve positioning pins 111, and correspondingly, each second connecting portion 210 may also include twelve positioning through holes 211, and the assembly principle and positioning principle thereof are similar to those of the eight positioning pins 111 and the eight positioning through holes 211, which are not described herein.

The "body" and "certain portion" may be a part of the corresponding "member", that is, the "body" and "certain portion" are integrally formed with the other portion of the "member"; or a separate component which is separable from the other part of the component, namely, a certain body and a certain part can be independently manufactured and then combined with the other part of the component into a whole. The expressions of "a body" and "a portion" are merely examples, which are intended to facilitate reading, but not to limit the scope of protection of the present application, so long as the features described above are included and the actions are the same, it should be understood that the utility model is equivalent to the technical solutions described herein.

It should be noted that the components included in the "units", "assemblies", "mechanisms" and "devices" of the present application may be flexibly combined, i.e. may be produced in a modularized manner according to actual needs, so as to facilitate modularized assembly. The above-mentioned components are only one embodiment, and for convenience of reading, not limitation of the scope of protection of the present application, so long as the above components are included and the same function should be understood as the equivalent technical solutions of the present application.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. The term "and/or" as used in this utility model includes any and all combinations of one or more of the associated listed items.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "mounted," "positioned," "secured" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, when one element is considered as "fixed transmission connection" and the other element, the two elements may be fixed in a detachable connection manner, or may be fixed in a non-detachable connection manner, so that power transmission can be achieved, for example, sleeving, clamping, integrally forming and fixing, welding, etc., which may be achieved in the prior art, and no more details are needed. When an element is perpendicular or nearly perpendicular to another element, it is meant that the ideal conditions for both are perpendicular, but certain vertical errors may exist due to manufacturing and assembly effects. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

It will be further understood that when interpreting the connection or positional relationship of elements, although not explicitly described, the connection and positional relationship are to be interpreted as including the range of errors that should be within an acceptable range of deviations from the particular values as determined by those skilled in the art. For example, "about," "approximately," or "substantially" may mean within one or more standard deviations, and is not limited herein.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A carrier, comprising:

the base is provided with at least two first connecting parts; a kind of electronic device with high-pressure air-conditioning system

The support device comprises at least two support pieces, wherein each support piece is provided with a second connecting part detachably connected with one first connecting part, the at least two support pieces are arranged in one-to-one correspondence with the at least two first connecting parts, all support pieces are matched to form a supporting plane for supporting a silicon wafer, and one second connecting part is connected with one first connecting part to form a positioning structure for positioning and matching with one silicon wafer above the supporting plane.

2. The carrier of claim 1, wherein each first connecting portion includes at least two positioning pins disposed at intervals, each second connecting portion includes at least two positioning through holes disposed at intervals, at least two positioning pins are disposed in one-to-one correspondence with at least two positioning through holes, and each positioning pin can pass through the corresponding positioning through hole to form the positioning structure.

3. The carrier of claim 2, wherein the spacing between the locating pin and the sidewall of the silicon wafer is L, and L is less than or equal to 1.5mm.

4. The carrier of claim 2, wherein an inner diameter of the positioning through hole decreases in a direction away from the base along an axial direction of the positioning through hole.

5. The carrier of claim 2, wherein an end of the locating pin remote from the base is provided with a guiding ramp or a guiding cambered surface.

6. The carrier of claim 5, wherein the dowel is rotatably coupled to the base such that the dowel is rotatable relative to the base about a central axis of the dowel.

7. The carrier according to claim 2, wherein each of the first connection portions includes eight positioning pins, the eight positioning pins are arranged around a circumference of the silicon wafer, each of the second connection portions includes eight positioning through holes, the eight positioning pins are arranged in one-to-one correspondence with the eight positioning through holes, and the eight positioning pins can pass through the corresponding positioning through holes to form the positioning structure for positioning the circumference of the silicon wafer.

8. The carrier of any one of claims 1 to 7, wherein sidewalls of two adjacent supports are attached to each other, and each support is configured to hold a corresponding one of the silicon wafers.

9. A heterojunction cell production system comprising the carrier of any one of claims 1 to 8.

10. The heterojunction cell production system of claim 9, further comprising a wet cleaning device for cleaning the support.

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