CN218321639U - Coating film carrier plate and coating film equipment - Google Patents

Abstract

The utility model belongs to the technical field of vacuum coating, a coating film support plate and coating equipment is disclosed. The utility model discloses a film coating carrier plate, which comprises a carrier plate body with a first carrying surface and a second carrying surface which are oppositely arranged, wherein the first carrying surface is provided with a plurality of groups of first carrying parts, the second carrying surface is provided with a plurality of groups of second carrying parts, and the plurality of groups of first carrying parts and the plurality of groups of second carrying parts are arranged in a staggered way along a first direction; any group of first bearing parts comprise a plurality of first bearing parts which are arranged at intervals along the second direction, the first bearing parts are used for fixing the silicon wafers, the first bearing parts are provided with first reserved edges, and the first reserved edges are used for placing the silicon wafers into the first bearing parts or taking the silicon wafers out of the first bearing parts. The coating carrier plate can directly insert the silicon wafer into the first bearing part, so that the low working efficiency caused by the disassembly of the fixing part is avoided, the problem that the silicon wafer cannot be put into or taken out of the adjacent first bearing parts is solved by the first bearing parts and the second bearing parts which are arranged in a staggered mode, and the coating efficiency is improved.

Description

Coating film carrier plate and coating film equipment

Technical Field

The utility model relates to a vacuum coating technical field especially relates to coating film support plate and filming equipment.

Background

A thin film/crystalline silicon heterojunction solar cell (hereinafter referred to as heterojunction solar cell, HIT or HJT or SHJ solar cell) belongs to the third-generation high-efficiency solar cell technology, has the characteristics of high conversion efficiency, low temperature coefficient and the like, and needs to use a Chemical Vapor Deposition (CVD) process to deposit a thin film on N-type crystalline silicon with a textured surface.

The film coating carrier plate is a loading tool in a film coating process and is used for bearing a substrate to be coated, a plurality of bearing areas for bearing silicon wafers are usually arranged on the carrier plate in the film coating carrier plate in the prior art, two layers of grooves are formed in the bearing areas, the grooves are processed into steps, detachable fixing parts are arranged at the steps, the limitation of the silicon wafers is realized through the steps and the fixing parts, the carrier plate can allow more silicon wafers to be coated at the same time, the substrates can be loaded or unloaded only by disassembling and assembling the detachable fixing parts, the production efficiency is low, another film coating carrier plate in the prior art is provided with clamping points at the bearing part of the carrier plate, the clamping points can tightly attach the silicon wafers to the film coating carrier plate, the silicon wafers are inserted into the bearing part from the openings of the clamping points, the frequent disassembling of the clamping points is avoided, but the film coating carrier plate allows a small number of silicon wafers to be placed at a time, and the production efficiency is also reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a coating film support plate and filming equipment, this coating film support plate not only can be convenient for put into or take out the silicon chip, can carry out the coating film to multirow silicon chip simultaneously moreover, can promote the coating film efficiency of silicon chip.

To achieve the purpose, the utility model adopts the following technical proposal:

a coating carrier plate, the coating carrier plate comprising:

the carrier plate body is provided with a first bearing surface and a second bearing surface which are arranged oppositely, the first bearing surface is provided with a plurality of groups of first bearing parts, the second bearing surface is provided with a plurality of groups of second bearing parts, and the plurality of groups of first bearing parts and the plurality of groups of second bearing parts are arranged in a staggered manner along a first direction;

any group of first bearing parts comprise a plurality of first bearing parts which are arranged at intervals along the second direction, the first bearing parts are used for fixing the silicon wafers, the first bearing parts are provided with first reserved edges, and the first reserved edges are used for placing the silicon wafers into the first bearing parts or taking the silicon wafers out of the first bearing parts.

Preferably, the first bearing part comprises a first mounting part and a plurality of first clamping points, the plurality of first clamping points are arranged around the first mounting part, and the first clamping points are convexly arranged on the first bearing surface.

Preferably, the first clamping point comprises a first connecting portion, a first bearing portion and a first clamping portion, the first connecting portion, the first bearing portion and the first clamping portion are sequentially connected, the first connecting portion is used for connecting the carrier plate body, and the first bearing portion and the first clamping portion are used for fixing the silicon wafer.

Preferably, the first clamping portion has a first guide surface, the first bearing portion has a first bearing surface, the first guide surface, the first bearing surface and the first bearing surface form a first fixing groove, the first fixing groove is used for accommodating a silicon wafer, and the axial width of the first bearing surface is the same as the thickness of the silicon wafer.

Preferably, the first clamping portion further has a first abutting surface, the first abutting surface is located between the first guide surface and the first bearing surface, and the first abutting surface is perpendicular to the first bearing surface.

Preferably, the first installation part is a polygon, at least two first clamping points are arranged, and at least one first clamping point is arranged on each side except the first reserved side.

Preferably, at least three first clamping points are arranged, and the surface surrounded by the three first clamping points can cover at least one half of the area of the silicon chip.

Preferably, the first mounting part is arranged obliquely relative to the second direction, the inclination angle is 3-10 degrees, and the inclination direction is the same as the movement trend direction of the silicon wafer.

Preferably, the coating carrier further comprises at least two carrier hooks, the at least two carrier hooks are arranged on the carrier body, and the at least two carrier hooks are used for hanging the carrier body to the external support member.

The utility model discloses still adopt following technical scheme:

the coating equipment comprises any one of the coating carrier plates.

The utility model has the advantages that:

the utility model discloses a film coating carrier plate, which comprises a carrier plate body, wherein the carrier plate body is provided with a first bearing surface and a second bearing surface which are arranged oppositely, the first bearing surface is provided with a plurality of groups of first bearing parts, the second bearing surface is provided with a plurality of groups of second bearing parts, and the plurality of groups of first bearing parts and the plurality of groups of second bearing parts are arranged along a first direction in a staggered way; any group of first bearing parts comprises a plurality of first bearing parts which are arranged at intervals along a first direction, the first bearing parts are used for fixing the silicon wafer, the first bearing parts are provided with first reserved edges, and the first reserved edges are used for placing the silicon wafer into the first bearing parts or taking the silicon wafer out of the first bearing parts. The film coating carrier plate can improve the efficiency of putting silicon wafers into the film coating carrier plate or taking the silicon wafers out of the film coating carrier plate, can also mount a large number of silicon wafers on the carrier plate and carry out film coating at the same time, and can obviously improve the film coating efficiency.

The utility model also discloses a coating equipment, this coating equipment includes foretell coating film support plate for coating film efficiency has had great promotion.

Drawings

Fig. 1 is a schematic structural diagram of a coated carrier plate according to an embodiment of the present invention;

FIG. 2 is a front view of a carrier plate for coating according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of the embodiment of the present invention shown in fig. 2;

fig. 4 is a partial enlarged view of B of fig. 3 according to the present invention;

fig. 5 is a partially enlarged view of C of fig. 3 according to the present invention.

In the figure:

1. a silicon wafer; 10. a carrier plate body; 11. a first bearing surface; 111. a first stuck point; 1111. a first connection portion; 1112. a first bearing part; 1113. a first clamping part; 11131. a first guide surface; 1114. a first fixing groove; 112. a first hollow-out section; 113. a first reserved edge; 12. a second bearing surface; 121. a second stuck point;

20. and (6) hanging a carrier plate.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The film coating carrier plate is a loading tool in the film coating process and is used for bearing a substrate to be coated. However, the coating carrier plate in the prior art has the problem that the mounting and dismounting of the carrier plate fixing part are frequent, which results in lower production efficiency. The other type of coated carrier plate adopts an insertion type manner to fix the substrates, but the coated carrier plate can only be placed in a single row, and the number of the substrates coated at the same time is small, which also results in low production efficiency.

Accordingly, the present embodiment provides a carrier plate for film coating.

As shown in fig. 1 to fig. 5, the carrier plate for film coating provided in this embodiment includes a carrier plate body 10, the carrier plate body 10 has a first carrying surface 11 and a second carrying surface 12 disposed oppositely, the first carrying surface 11 has a plurality of sets of first carrying portions, the second carrying surface 12 has a plurality of sets of second carrying portions, and the plurality of sets of first carrying portions and the plurality of sets of second carrying portions are disposed in a staggered manner along a first direction; any group of first bearing parts comprises a plurality of first bearing parts which are arranged at intervals along the second direction, the first bearing parts are used for fixing the silicon wafer 1, the first bearing parts are provided with first reserved edges 113, and the first reserved edges 113 are used for placing the silicon wafer 1 into the first bearing parts or taking the silicon wafer 1 out of the first bearing parts. Specifically, in the embodiment, the first bearing surface 11 and the second bearing surface 12 are the front surface and the back surface of the carrier body 10, the first bearing surface 11 and the second bearing surface 12 are respectively provided with three groups of first bearing parts and two groups of second bearing parts, and the three groups of first bearing parts and the two groups of second bearing parts are arranged in a staggered manner, so that the number of the silicon wafers 1 which are simultaneously coated can be obviously increased, and the coating efficiency is improved. One group of the first bearing parts comprises six first bearing parts which are arranged at intervals along a first direction, the six first bearing parts are arranged at intervals, the first bearing parts are provided with first reserved edges 113, the first reserved edges 113 are used for taking out or putting in the silicon wafer 1, the fixing piece can be prevented from being disassembled and assembled, the time for putting in and taking out the silicon wafer 1 is saved, and the film coating efficiency of the silicon wafer 1 can be further improved. The specific arrangement of the second bearing portion on the second bearing surface 12 is the same as the arrangement of the first bearing portion on the first bearing surface 11, which is not described herein again. The silicon wafer 1 is inserted into or taken out from the first reserved edge 113 of the first bearing part, and the first bearing part and the second bearing part are arranged in a staggered mode, so that the adjacent first bearing part and the second bearing part cannot interfere with each other when the silicon wafer 1 is inserted into or taken out, and the silicon wafer 1 cannot be damaged when the silicon wafer 1 is inserted into or taken out.

Optionally, the first mounting portion has a first hollow-out portion 112, and the first hollow-out portion 112 is disposed in an inclined manner. Specifically, in this embodiment, on the one hand, the first hollow-out portion 112 is obliquely disposed, and the first clamping point 111 is disposed around the first hollow-out portion 112, so that the silicon wafer 1 is also in an oblique state after being mounted to the first mounting portion, thereby avoiding the silicon wafer 1 from shaking, and ensuring the stability of the silicon wafer 1, and on the other hand, the first hollow-out portion 112 is disposed to reduce the overall weight of the film-coating carrier plate, and can perform double-sided film coating on the silicon wafer 1. Correspondingly, the second installation part is provided with a second hollow part, the second hollow part is also obliquely arranged, and the inclination angle of the second hollow part is the same as that of the first hollow part 112, so that the structure of the film-coating carrier plate is compact, and the utilization rate of the film-coating carrier plate is improved. Optionally, the first mounting portion is virtually present for convenience of describing the position relationship, and in other embodiments, the first mounting portion may be a projection plane or a blank plane formed by covering the bearing surface with a silicon wafer, a groove forming a step with the bearing surface, and the like.

Further, the first bearing portion includes a first mounting portion and a plurality of first clamping points 111, the plurality of first clamping points 111 are disposed around the first mounting portion, and the first clamping points 111 are convexly disposed on the first bearing surface 11. Specifically, in this embodiment, the first bearing portion includes a first mounting portion and three first clamping points 111, the first mounting portion is attached to the back of the silicon wafer 1, the first bearing portion is rectangular, the three first clamping points 111 are respectively disposed on three sides of the rectangle, the remaining one without the first clamping point 111 is the first reserved side 113, which is used for inserting or taking out the silicon wafer 1, and the three first clamping points 111 can form a relatively stable support for the silicon wafer 1, so as to ensure the stability of the silicon wafer 1. In other embodiments, the shape of the first mounting portion and the number of the first clamping points 111 may be specifically set according to the shape of the silicon wafer 1 to be coated. The second carrying part correspondingly includes a second mounting part and a plurality of second clamping points 121, the plurality of second clamping points 121 are disposed around the second mounting part, and the second clamping points 121 are convexly disposed on the second carrying surface 12, which is not described herein.

Further, the first fastening point 111 includes a first connection portion 1111, a first bearing portion 1112 and a first fastening portion 1113, the first connection portion 1111, the first bearing portion 1112 and the first fastening portion 1113 are sequentially connected, the first connection portion 1111 is used for connecting the carrier body 10, and the first bearing portion 1112 and the first fastening portion 1113 are used for fixing the silicon chip 1. Specifically, in this embodiment, the connection manner of the first connection portion 1111 and the carrier body 10 may be a threaded connection manner, so that the first bearing portion 1112 and the first clamping portion 1113 of the first clamping point 111 are convexly disposed on the first bearing surface 11, when the silicon wafer 1 is mounted on the first bearing portion, the side edge of the silicon wafer 1 contacts with the first bearing portion 1112 to ensure the stability of the silicon wafer 1, and the first clamping portion 1113 makes the silicon wafer 1 tightly contact with the first bearing surface 11, so as to avoid the poor film plating quality of the silicon wafer 1. Accordingly, the specific structure of the second clamping point 121 is the same as that of the first clamping point 111, and is not described herein again. Preferably, in this embodiment, the first connection portion 1111, the first bearing portion 1112 and the first clamping portion 1113 are coaxially connected, so that the mounting position of the silicon wafer 1 can be controlled more accurately in practical use, and the stability of the silicon wafer 1 is ensured; and the first connection portion 1111 and the first bearing portion 1112 are both configured to be cylindrical, which not only facilitates processing, but also facilitates fixing and mounting to the carrier body 10. In other embodiments, the first bearing portion 1112 of the first fastening point 111 may also be configured to be circular, elliptical, rectangular, triangular, etc. according to actual needs, which is not described herein.

Optionally, the first connection portion 1111, the first bearing portion 1112 and the first fastening portion 1113 of the first fastening point 111 are integrally formed, and other connection manners, such as screwing, fastening, etc., may also be used for connection.

Further, the first clamping portion 1113 has a first guiding surface 11131, the first supporting portion 1112 has a first supporting surface, the first guiding surface 11131, the first supporting surface and the first supporting surface 11 form a first fixing groove 1114, the first fixing groove 1114 is used for accommodating the silicon wafer 1, and the width of the first supporting surface along the axial direction is the same as the thickness of the silicon wafer. Specifically, in this embodiment, a surface of the first clamping portion 1113 connected to the first bearing portion 1112 is a guiding surface 11131, a surface of the first bearing portion 1112 contacting the silicon wafer 1 is a first bearing surface, the first guiding surface 11131, the first bearing surface and the first bearing surface 11 form a first fixing groove 1114, and when the silicon wafer 1 is mounted on the first bearing portion, the silicon wafer 1 is located in the first fixing groove 1114. First spigot surface 11131 can make and have the guide effect to silicon chip 1 when inserting silicon chip 1, can avoid silicon chip 1 and first joint portion 1113 to take place to collide with the silicon chip 1 that leads to impaired, this kind of setting can make silicon chip 1 get into this first fixed slot 1114 comparatively conveniently, and first bearing surface can make silicon chip 1 and first spigot surface 11131's bottom paste tightly along the same of thickness of axial width and silicon chip, both ensure that silicon chip 1 has higher stability, avoid silicon chip 1 shakiness to lead to appearing unnecessary impaired, further guarantee silicon chip 1's coating film effect, can make silicon chip 1 and first bearing surface paste tightly again, avoid taking place around plating. The width and the like of the first bearing surface may be specifically set according to actual requirements, and are not limited specifically herein. Accordingly, the second engaging portion has the same specific structure as the first engaging portion 1113, and is not described herein again.

Further, the first connecting portion 1113 further has a first abutting surface, the first abutting surface is located between the first guiding surface 11131 and the first bearing surface, and the first abutting surface is perpendicular to the first bearing surface. Specifically, the first abutting surface can enable the silicon wafer 1 to have a further limiting effect when the silicon wafer 1 is inserted into the first fixing groove 1114, the silicon wafer 1 can be ensured to abut against the first bearing surface 11, the silicon wafer 1 is ensured not to be wound and plated, the first abutting surface and the first bearing surface are perpendicularly arranged, the contact area between the first abutting surface and the silicon wafer 1 can be increased, and the silicon wafer 1 is prevented from being scratched by a sharp edge. Alternatively, in order to prevent the first guide surface 11131 from damaging the surface of the silicon wafer 1, the first guide surface 11131 and the first contact surface smoothly transition, and the first guide surface 11131 and the outer side surface of the first clamping portion 1113 also transition in an arc. Correspondingly, the second clamping part also has a second abutting surface, and the specific function is the same as that of the first guide surface 11131.

Further, the first installation part is polygonal, at least two first clamping points 111 are arranged, and at least one first clamping point 111 is arranged on each side except the first reserved side 113. Specifically, the arrangement enables the silicon wafer 1 to conveniently enter the first installation part through the first reserved edge 113, and each edge except the first reserved edge 113 is provided with at least one first clamping point 111, so that sufficient support can be provided for the silicon wafer 1 placed inside the first installation part, and the silicon wafer 1 is stably installed.

Further, at least three first clamping points 111 are arranged, and the surface surrounded by the three first clamping points 111 can cover at least one half of the area of the silicon wafer 1. Specifically, in this embodiment, the first installation portion is rectangular, one of the sides of the rectangle is a first reserved side 113, the remaining three sides are provided with a first clamping point 111, and the surface formed by the three first clamping points 111 can cover at least one half of the area of the silicon wafer 1, so that the silicon wafer 1 can be prevented from falling off from the first installation portion due to shaking, the silicon wafer 1 can be prevented from being damaged or broken due to large shaking amplitude, and the normal operation of silicon wafer coating is ensured.

Further, the first mounting part is arranged obliquely relative to the second direction, the inclination angle is 3-10 degrees, and the inclination direction is the same as the movement trend direction of the silicon wafer 1. Specifically, in this embodiment, in order to ensure that the silicon wafer does not slide along the second direction and collide with the silicon wafer, the first installation part is inclined, the three first clamping points 111 are correspondingly inclined, the center of gravity of the silicon wafer 1 can be shifted by the arrangement, so that the height difference is generated at the left end and the right end of the silicon wafer 1, when the film-coating carrier plate moves, the silicon wafer 1 cannot shake greatly, the stability of the silicon wafer 1 in the film-coating process is ensured, and the silicon wafer is prevented from shaking or shifting.

Further, the film-coating carrier further comprises at least two carrier hooks 20, the at least two carrier hooks 20 are disposed on the carrier body 10, and the at least two carrier hooks 20 are used for suspending the carrier body 10 to an external support. Specifically, in this embodiment, the coating carrier includes two carrier hooks 20, and the distance between two carrier hooks 20 is greater than the distance between carrier hook 20 and the edge of carrier body 10, so as to ensure that carrier body 10 has better stability when hanging, and two carrier hooks 20 are all disposed at the position close to the station without the bearing part, in this embodiment, the second bearing surface 12, and this arrangement can avoid collision with carrier hooks 20 when silicon wafer 1 is inserted or taken out. In other embodiments, the number and the position of the carrier plate hooks 20 can be specifically set according to actual use requirements, which is not described herein again.

The embodiment also provides a coating device, which comprises any one of the coating carrier plates, the coating device has high coating efficiency, the replacement of the silicon wafer 1 is also convenient and efficient, and the coating quality of the silicon wafer 1 can be ensured.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A coated carrier plate, wherein the coated carrier plate comprises:

the carrier plate comprises a carrier plate body (10), wherein the carrier plate body (10) is provided with a first bearing surface (11) and a second bearing surface (12) which are oppositely arranged, the first bearing surface (11) is provided with a plurality of groups of first bearing parts, the second bearing surface (12) is provided with a plurality of groups of second bearing parts, and the plurality of groups of first bearing parts and the plurality of groups of second bearing parts are arranged in a staggered manner along a first direction;

any group of the first bearing parts comprise a plurality of first bearing parts which are arranged at intervals along a second direction, the first bearing parts are used for fixing the silicon wafer (1), the first bearing parts are provided with first reserved edges (113), and the first reserved edges (113) are used for placing the silicon wafer (1) into the first bearing parts or taking the silicon wafer (1) out of the first bearing parts.

2. The plating carrier plate according to claim 1, wherein the first carrier part comprises a first mounting portion and a plurality of first fastening points (111), the plurality of first fastening points (111) are disposed around the first mounting portion, and the first fastening points (111) are protruded on the first carrier surface (11).

3. The plating carrier plate according to claim 2, wherein the first locking point (111) comprises a first connecting portion (1111), a first bearing portion (1112) and a first locking portion (1113), the first connecting portion (1111), the first bearing portion (1112) and the first locking portion (1113) are sequentially connected, the first connecting portion (1111) is used for connecting the carrier plate body (10), and the first bearing portion (1112) and the first locking portion (1113) are used for fixing the silicon wafer (1).

4. The coated carrier plate according to claim 3, wherein the first latching portion (1113) has a first guiding surface (11131), the first bearing portion (1112) has a first bearing surface, the first guiding surface (11131), the first bearing surface and the first bearing surface (11) form a first fixing groove (1114), the first fixing groove (1114) is used for accommodating the silicon wafer (1), and the width of the first bearing surface along the axial direction is the same as the thickness of the silicon wafer (1).

5. A plating carrier plate according to claim 4, wherein the first latching portion (1113) further comprises a first abutting surface, the first abutting surface is located between the first guiding surface (11131) and the first bearing surface, and the first abutting surface is perpendicular to the first bearing surface.

6. The plating carrier plate according to claim 2, wherein the first mounting portion is polygonal, at least two first clamping points (111) are provided, and at least one first clamping point (111) is provided on each side outside the first reserved side (113).

7. The coating carrier plate according to claim 6, wherein the first clamping points (111) are at least three, and the surface surrounded by the three first clamping points (111) can cover at least one half of the area of the silicon wafer.

8. The coating carrier plate according to claim 6, wherein the first mounting portion is inclined with respect to the second direction by an angle of 3 ° -10 °, and the inclination direction is the same as the movement trend direction of the silicon wafer (1).

9. A coated carrier plate according to any one of claims 1 to 8 further comprising at least two carrier plate hooks (20), wherein at least two carrier plate hooks (20) are provided on the carrier plate body (10), and at least two carrier plate hooks (20) are used for suspending the carrier plate body (10) to an external support.

10. A coating device, characterized in that the coating device comprises the coating carrier plate according to any one of claims 1 to 9.

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