CN218890872U - Wafer carrier cleaning device - Google Patents

Abstract

The utility model discloses a wafer carrier cleaning device, which comprises a cleaning seat, wherein a wiping piece is arranged on a first side of the cleaning seat, and at least one part of the wiping piece is exposed out of the surface of the first side of the cleaning seat; the second side of clean seat is provided with the gripping member, and the gripping member is connected with clean seat fixed connection, and the second side and the first side of clean seat are relative to be arranged. The utility model can conveniently and manually clean the wafer carrier and clean the wafer carrier in a narrow space environment.

Description

Wafer carrier cleaning device

Technical Field

The utility model relates to the technical field of semiconductor device manufacturing, in particular to a cleaning device for cleaning a wafer carrier.

Background

With the development of electronic technology, semiconductor devices are increasingly used. Semiconductor devices typically require the use of a lithographic apparatus, which is typically provided with a wafer stage, on which dust tends to appear after the lithographic apparatus has been used for a period of time, and therefore cleaning of the wafer stage is typically required.

Some existing lithography machines are provided with devices for cleaning the wafer carrier, and the cleaning devices are driven by a control mechanism of the lithography machine to complete the cleaning operation of the wafer carrier. However, these cleaning devices are often complex in structure and require driving by the lithographic apparatus itself, and do not allow for manual and flexible cleaning operations.

In order to clean the wafer carrier, the existing processing mode is to directly clean the wafer carrier by an operator holding dust-free cloth, but because precise devices such as lenses are arranged above the wafer carrier, the space above the wafer carrier is very narrow and is not beneficial to manual cleaning.

Disclosure of Invention

The utility model aims to provide a wafer carrier cleaning device which has a simple structure and can manually perform cleaning operation.

In order to achieve the above-mentioned object, the wafer carrier cleaning device provided by the present utility model includes a cleaning seat, a wiper is disposed on a first side of the cleaning seat, and at least a portion of the wiper is exposed on a surface of the first side of the cleaning seat; the second side of clean seat is provided with the gripping member, and the gripping member is connected with clean seat fixed connection, and the second side and the first side of clean seat are relative to be arranged.

According to the technical scheme, the wiping piece is arranged on one side of the cleaning seat, the holding piece is arranged on the other side of the cleaning seat, a user can hold the holding piece and drive the cleaning seat to move, so that the wafer carrier can be reciprocated on the wafer carrier and cleaned, and the wafer carrier can be cleaned in a narrow space.

In one preferred embodiment, the cleaning base includes a cleaning jig and a base disposed on a first side of the cleaning jig, the base being detachably and fixedly connected to the cleaning jig, and the wiper being clamped between the cleaning jig and the base.

Therefore, the cleaning clamp and the base are used for clamping the wiping piece, a part of the wiping piece is exposed on the surface of the base, and a user can move the wafer carrier cleaning device through the holding piece, so that the wafer carrier can be cleaned in a narrow space.

In one preferred scheme, the first side of the cleaning clamp is provided with a protruding portion, the base is provided with a hollowed-out portion, the hollowed-out portion and the protruding portion are arranged oppositely, and the exposed portion of the wiping piece is located in the hollowed-out portion.

Therefore, the wiping piece can be exposed out of the hollowed-out part, and the surface of the wiping piece can be exposed out of the base under the action of the protruding part, so that the wiping piece can be contacted with the surface of the wafer carrier, and the wafer carrier is cleaned.

The outer surface of the protruding part protrudes outwards from the outer surface of the base along the normal direction of the lower surface of the cleaning clamp. Preferably, the protruding portion is located entirely within the hollowed-out portion.

It can be seen that, because the outer surface of the boss protrudes from the base, the wiper can be lifted by the boss and brought into contact with the wafer carrier, so that the wafer carrier can be cleaned better by the wiper.

The cleaning clamp is characterized in that a connecting piece is arranged between the cleaning clamp and the base, and the cleaning clamp is connected with the base through the connecting piece.

Therefore, the cleaning clamp is connected with the base through the connecting piece, and when the wiping piece needs to be replaced, the base can be conveniently taken down from the cleaning clamp, so that the wiping piece is convenient to replace.

In a further scheme, the connecting piece is a magnet, and the cleaning clamp and the base are made of magnetic adsorption materials; alternatively, the connecting piece is a double-sided suction cup.

Therefore, the connecting piece is not exposed out of the outer surface of the base no matter the magnet or the double-sided sucker, so that the connecting piece is prevented from being contacted with the wafer carrier, and the connecting piece is prevented from being exposed out of the cleaning clamp, and damage to devices above the wafer carrier caused by the connecting piece is avoided.

Still further, the fretwork portion is circular, and the quantity of connecting piece is more than two, and a plurality of connecting pieces are arranged along fretwork portion circumference.

Therefore, the plurality of connecting pieces can better connect the cleaning clamp with the base, and the cleaning clamp is prevented from falling off outside the wiping piece.

Still further, the base is square, and a plurality of connecting pieces set up respectively in a plurality of apex angles departments of base.

Therefore, the connecting pieces are arranged at the positions of the plurality of top corners of the base, so that the connection between the cleaning clamp and the base is more reliable.

Still further, the holding member includes a fixing base disposed on the second side of the cleaning fixture, and the fixing end of the holding rod is connected to the fixing base.

Therefore, the user can conveniently drive the cleaning clamp to move through the holding piece, and the holding piece is fixedly connected with the cleaning clamp, so that the condition that the cleaning clamp is accidentally separated from the holding piece can be avoided.

In a further scheme, the fixed end of the holding rod is hinged with the fixed seat, and preferably, the holding rod is a telescopic tube.

Therefore, a user can extend or shorten the telescopic tube according to actual production needs, and the holding rod can rotate with the cleaning clamp, so that the wafer carrier cleaning device is suitable for different spaces.

Alternatively, the gripping member includes a grip portion having two finger grip locations. Therefore, in the scene of larger space, the user can directly hold the holding piece and conveniently clean the wafer carrier.

Still further, the wiper is a dust-free cloth. On the one hand, the dust-free cloth is used as a common wiper, so that the wafer carrier can be cleaned effectively, and on the other hand, the manufacturing cost of the dust-free cloth is lower, so that the production cost of the wafer carrier cleaning device can be reduced.

Alternatively, the wiper is an oilstone, which is glued to the first side of the cleaning seat. Because the oilstone has higher hardness, the oilstone does not need to be replaced frequently, and the use is more convenient. In addition, after the oilstone is cleaned, pollutants such as silk threads and the like cannot be remained, so that the cleaning effect is better.

Drawings

Fig. 1 is a block diagram of a first view of a first embodiment of the present utility model.

Fig. 2 is a block diagram of a second view of the first embodiment of the present utility model.

Fig. 3 is an exploded view of a first embodiment of the present utility model from a first perspective.

Fig. 4 is an exploded view of the structure from a second perspective of the first embodiment of the present utility model.

Fig. 5 is a partial cross-sectional view of a cleaning clamp, base and wiper of a first embodiment of the present utility model.

Fig. 6 is an exploded view of the cleaning clip, base, attachment and wiper of the first embodiment of the present utility model.

Fig. 7 is a structural view of a second embodiment of the present utility model.

The utility model is further described below with reference to the drawings and examples.

Detailed Description

The wafer carrier cleaning device is used for cleaning the wafer carrier, and particularly aims at a scene that the wafer carrier needs to be cleaned manually for a photoetching machine without the cleaning device. Because the precise instrument is arranged above the wafer carrier of the photoetching machine, and the space above the wafer carrier is very narrow, the hand is difficult to extend into a deeper place to clean, and therefore, the wafer carrier cleaning device provided by the utility model can clean the wafer carrier in a scene with narrow space.

First embodiment:

referring to fig. 1 and 2, the present embodiment has a cleaning base, which includes a cleaning jig 10, the cleaning jig 10 is substantially square, and the second side of the cleaning jig 10 is the upper side of the cleaning jig from the perspective of fig. 1. A holding member is provided on the second side of the cleaning fixture 10, where the holding member of the present embodiment includes a holding rod assembly and a clamping portion 40, the holding rod assembly includes a holding rod 36 and a fixing base 30, the holding rod 36 is hinged to the fixing base 30, and preferably, in order to save space, the wafer carrier cleaning device is miniaturized, and the clamping portion 40 is disposed adjacent to the fixing base 30.

The cleaning seat further comprises a base 20, the base 20 being arranged on a first side of the cleaning clamp 10, i.e. on the underside of the cleaning clamp 10 in the view of fig. 1. The present embodiment further includes a wiper 18, referring to fig. 3 and 4, the base 20 is substantially square, a circular hollow portion 21 is formed in the middle, the wiper 18 is a dust-free cloth, and is substantially square, and the wiper 18 is soft and flexible to deform. The wiper 18 is clamped between the cleaning clamp 10 and the base 20.

The cleaning jig 10 is formed on a first side thereof with a circular protrusion 11, and as seen in fig. 5, the protrusion 11 protrudes downward, i.e., in a direction perpendicular to the main surface of the cleaning jig 10, in a direction of the first side, as seen from a normal direction of the cleaning jig 10, i.e., perpendicular to the main surface. The purpose of the boss 11 is to project the wiper 18 from the outer surface of the base 20 so that the wiper 18 can be in direct contact with the wafer carrier to clean the wafer carrier.

For this reason, the boss 11 needs to be located in the hollowed-out portion 21 of the base 20, and preferably, the diameter of the boss 11 may be equal to or smaller than the diameter of the hollowed-out portion 21, so that the boss 11 is located entirely in the hollowed-out portion 21. Further, in the normal direction of the cleaning jig 10, the lower surface of the boss 11 protrudes from the lower surface of the base 20, i.e., the lowest position of the boss 11 is lower than the lowest position of the base 20. Thus, when the wiper 18 is clamped between the cleaning jig 10 and the base 20, the exposed portion of the wiper 18 is located within the hollowed-out portion 21. The wiper 18 will follow the shape of the boss 11, i.e. the wiper 18 will also form a circular boss, so that a portion of the wiper 18 is exposed to the lower surface of the base 20, facilitating direct contact of the wiper 18 with the wafer carrier. In addition, the lower surface of the base 20 is the lowest part of the high-pressure wiper 18, so that the base 20 does not contact the wafer carrier during the process of cleaning the wafer carrier, and the base 20 is prevented from scraping the wafer carrier.

To secure the base 20 to the first side of the cleaning clamp 10, this embodiment is provided with a connector. Considering that the wiper 18 needs to be replaced frequently, the base 20 and the cleaning clamp 10 are detachably fixed, that is, when the wafer stage cleaning device is used, the base 20 is fixed on the first side of the cleaning clamp 10 and is not easy to fall from the cleaning clamp 10; when the wiper 18 needs to be replaced, the base 20 needs to be easily removed from the cleaning jig 10. In this embodiment, the connector employs four magnets 14, for example, each magnet 14 is a strong magnet. Meanwhile, the cleaning jig 10 and the base 20 are both made of magnetic adsorption materials, such as steel, iron, and the like.

Since the cleaning base 10 and the base 20 are both square, and the protruding portion 11 and the hollowed portion 21 are both circular, the four magnets 14 are arranged along the circumferential direction of the protruding portion 11, for example, at four corners of the cleaning base 10, that is, at four corners of the base 20. Preferably, a magnet mounting position 13 is respectively arranged at four vertex angles of the cleaning base 10, the magnet mounting position 13 is a concave blind hole, and each magnet 14 can be mounted in one magnet mounting position 13, so that the four magnets 14 can be positioned conveniently.

Since the magnet 14 as a connecting member does not protrude beyond the cleaning jig 10 or the base 20, it does not cause scratches on the wafer stage, nor on devices above the cleaning stage, which is advantageous for protecting the photolithography machine.

Of course, in practical application, other devices may be used instead of the magnet 14 as a connecting piece, for example, a double-sided suction cup may be used instead of the magnet, one surface of the double-sided suction cup is adsorbed on the lower surface of the cleaning fixture 10, and the other surface of the double-sided suction cup is adsorbed on the upper surface of the base 20, so that the fixing between the cleaning fixture 10 and the base 20 can be also realized. In addition, the double-sided suction cup does not extend out of the cleaning clamp 10 or the base 20, and damage to the photoetching machine is avoided.

A fixing base 30 is provided at a second side of the cleaning jig 10, and as shown in fig. 1, the fixing base 30 is fixed to an upper surface of the cleaning jig 10. The cleaning jig 10 may be stamped from metal so that a first side of the cleaning jig 10 will define a circular recess 12 and the anchor block 30 is secured within the recess 12.

Referring to fig. 6, the grip lever 36 may be inserted into and fixed to one end of the holder 30, for example, by interference fit between the grip lever 36 and the holder 30. In addition, the fixing base 30 includes two fixing blocks 31, the two fixing blocks 31 are disposed opposite to each other, and a through hole is formed in each fixing block 31. A rotating member 32 is disposed between the two fixed blocks 31, rotating shafts 35 are respectively disposed at both sides of the rotating member 32, and the rotating shafts 35 are inserted into the through holes so that the rotating member 32 can rotate relative to the fixed blocks 31. And, one end of the rotating member 32 is provided with a mounting hole 33, and one end of the grip lever 36 can be inserted into the mounting hole 33 so that the grip lever 36 can be rotated with respect to the fixing base 30. And, one end of the grip lever 36 is fixed with the mounting hole 33 in an interference fit manner.

In addition, a clamping portion 40 is disposed on the second side of the cleaning clamp 10, and the clamping portion 40 has two finger clamping positions 41, as can be seen in fig. 6, each finger clamping position 41 is open on the outer side, and each finger clamping position 41 is penetrated in the front-back direction along the length direction of the holding rod 36, so that the finger of the user can extend into the finger clamping position 41 to drive the cleaning clamp 10 to move. It can be seen that the user can drive the cleaning jig to move through the holding rod 36 or through the clamping portion 40, and under the condition of narrow space, the holding rod 36 is used to drive the wafer carrier cleaning device to move above the wafer carrier, so as to clean the wafer carrier. Because the gripping bar 36 is retractable, the user can flexibly adjust the length of the gripping bar 36 according to the depth of the wafer carrier. In addition, the holding rod 36 can also rotate relative to the cleaning clamp 10, so that the wafer carrier can be cleaned more flexibly and conveniently.

In the case of a large space above the wafer stage, the user may directly drive the clamping part 40 to move with a finger without using the holding rod 36, so that the wafer stage can be cleaned more flexibly and conveniently. Therefore, the wafer carrier cleaning device provided by the embodiment can be used in various modes, and meets the requirements of different use scenes.

Second embodiment:

referring to fig. 7, the present embodiment has a cleaning seat 50, the cleaning seat 50 is substantially square, and from the perspective of fig. 7, a first side of the cleaning seat 50 is a lower side of the cleaning seat 50, and a second side is an upper side of the cleaning seat 50. The second side of the cleaning seat 50 is provided with a holding member, which, like the first embodiment, includes a holding rod assembly and a clamping portion 60, the holding rod assembly includes a holding rod 70 and a fixing seat 65, the holding rod 70 is hinged to the fixing seat 65, and the holding rod 70 is a telescopic sleeve rod. The clamping portion 60 has two finger clamping positions, each of which is open at the outside, and each of which is penetrated in the longitudinal direction of the grip lever 70, so that a user's finger can extend into the finger clamping position and thereby drive the cleaning seat 50 to move.

Unlike the first embodiment, the wiper of the present embodiment is not a dust-free cloth, but is an oilstone 51, and as can be seen from fig. 7, the oilstone 51 is fixed under the cleaning seat 50, for example, adhered to the first side of the cleaning seat 51 by an adhesive. Since the oilstone 51 has a high hardness, it is possible to directly adhere the flat oilstone 51 to the lower side of the cleaning seat 51, and the cleaning seat 50 is not required to be provided with a convex portion protruding toward the first side, and the cleaning seat 50 is provided as a flat plate body. Preferably, the size of the oilstone 51 is the same as that of the cleaning seat 50, and the thickness thereof can be adjusted according to actual use requirements.

Since the oilstone 51 has high hardness and is not easily worn, it is not required to be replaced, and thus the oilstone 51 may be directly adhered to the first side of the cleaning seat 50 by an adhesive, instead of being detachably fixed. Because the clean cloth cleans the wafer carrier, there may be additional contaminants such as residual wires left on the wafer carrier, and the use of the oilstone 51 does not generate additional contaminants after cleaning, and in addition, for some stubborn contaminants, the use of the oilstone 51 is easier to clean than the clean cloth.

Of course, the above-mentioned solution is only a preferred embodiment of the present utility model, and many variations are possible in practical application, for example, the holding rod is a rod with a fixed length, i.e. a telescopic tube is not used, or the first side of the cleaning clamp is only provided with the fixing seat and the holding rod, and no holding part is provided, which do not affect the implementation of the present utility model, and should be included in the protection scope of the present utility model.

Claims (16)

1. Wafer carrier cleaning device, characterized in that includes:

a cleaning seat, wherein a first side of the cleaning seat is provided with a wiper, and at least a part of the wiper is exposed out of the surface of the first side of the cleaning seat;

the second side of clean seat is provided with the gripping member, the gripping member with clean seat fixed connection, clean seat's second side with first side is relative to be arranged.

2. The wafer carrier cleaning apparatus of claim 1, wherein:

the cleaning seat comprises a cleaning clamp and a base, wherein the base is arranged on the first side of the cleaning clamp, the base is fixedly connected with the cleaning clamp in a detachable mode, and the wiping piece is clamped between the cleaning clamp and the base.

3. The wafer carrier cleaning apparatus of claim 2, wherein:

the cleaning clamp comprises a cleaning clamp body and is characterized in that a protruding portion is arranged on the first side of the cleaning clamp body, a hollowed-out portion is arranged on the base, the hollowed-out portion is opposite to the protruding portion, and an exposed portion of the wiping piece is located in the hollowed-out portion.

4. The wafer carrier cleaning apparatus of claim 3, wherein:

and along the normal direction of the lower surface of the cleaning clamp, the outer surface of the protruding part protrudes outwards from the outer surface of the base.

5. The wafer carrier cleaning apparatus of claim 3, wherein:

the protruding portion is located in the hollow portion completely.

6. The wafer carrier cleaning apparatus of any one of claims 3 to 5, wherein:

and a connecting piece is arranged between the cleaning clamp and the base, and the cleaning clamp is connected with the base through the connecting piece.

7. The wafer carrier cleaning apparatus of claim 6, wherein:

the connecting piece is a magnet, and the cleaning clamp and the base are both made of magnetic adsorption materials.

8. The wafer carrier cleaning apparatus of claim 6, wherein:

the connecting piece is a double-sided sucker.

9. The wafer carrier cleaning apparatus of claim 6, wherein:

the fretwork portion is circular, the quantity of connecting piece is more than two, and a plurality of the connecting piece is followed fretwork portion circumference is arranged.

10. The wafer carrier cleaning apparatus of claim 9, wherein:

the base is square, and a plurality of connecting pieces are respectively arranged at a plurality of vertex angles of the base.

11. The wafer carrier cleaning apparatus of any one of claims 1 to 5, wherein:

the holding piece comprises a fixing seat arranged on the second side of the cleaning clamp, and the fixed end of the holding rod is connected to the fixing seat.

12. The wafer carrier cleaning apparatus of claim 11, wherein:

the fixed end of the holding rod is hinged with the fixed seat.

13. The wafer carrier cleaning apparatus of claim 11, wherein:

the holding rod is a telescopic sleeve.

14. The wafer carrier cleaning apparatus of any one of claims 1 to 5, wherein:

the grip includes a grip portion having two finger grip locations.

15. The wafer carrier cleaning apparatus of any one of claims 2 to 5, wherein:

the wiping piece is dust-free cloth.

16. The wafer carrier cleaning apparatus of claim 1, wherein:

the wiper is an oilstone bonded to the first side of the cleaning seat.

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