CN218887129U

CN218887129U - Wafer placement anomaly detection device

Info

Publication number: CN218887129U
Application number: CN202222973724.7U
Authority: CN
Inventors: 王磊
Original assignee: Hangzhou Fuxin Semiconductor Co Ltd
Current assignee: Hangzhou Fuxin Semiconductor Co Ltd
Priority date: 2022-11-07
Filing date: 2022-11-07
Publication date: 2023-04-18
Anticipated expiration: 2032-11-07

Abstract

The application discloses unusual detection device is placed to wafer, including the controller, detect the sensor and be used for the location and place the positioning mechanism of wafer box, controller and detection sensor communication connection, it sets up in positioning mechanism to detect the sensor, the detection response route of detecting the sensor crosses the target area, when the target area is that wafer box is correctly placed in positioning mechanism, all correctly place the wafer in the wafer box and lack the region that forms, the wafer circle lacks the part that corresponds the lack for wafer location limit. This application sets up all wafer circles in crossing the wafer box through the detection response route with detecting sensor, exists in the wafer box that the wafer is placed incorrectly and can shelter from the detection response route promptly, and then realizes judging whether have the wafer because of placing incorrect right purpose in the wafer box through detecting sensor's detected signal.

Description

Wafer placement anomaly detection device

Technical Field

The application relates to and wafer detection technology field especially relates to an unusual detection device is placed to wafer.

Background

Wafers, which are the core material of microelectronic integrated circuits, are obtained through very complicated front-end processes, and therefore the production cost of the wafers is relatively high. The problems of damage, scratch, corner defect and the like easily occur in the process of turnover, so that the protection of the wafer cannot be ignored by each semiconductor enterprise.

At present, the wafer of the novel substrate such as silicon carbide is usually in an incomplete circle shape, and a positioning edge is usually arranged. The wafer opening of the novel silicon carbide substrate has high requirements on process conditions, so that vertical furnace tube equipment needs to be used, but the orientation of all positioning edges in the wafer box on the vertical furnace tube needs to be correct, namely, the wafer needs to be placed on the wafer box correctly (namely, positively), and otherwise, the wafer opening has a falling risk, so that the subsequent process design is influenced.

Under normal conditions, the furnace tube equipment is inconvenient to detect the device, so that in order to be suitable for the transmission characteristics of the furnace tube and avoid wafer falling, all wafer positioning edges in the wafer box need to be ensured to face correctly when the wafer box is installed, the condition of reverse or deflection cannot exist, but no corresponding detection equipment exists at present.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the application is that a device for detecting whether the wafer positioning edges in the wafer box face towards the right direction does not exist at present.

In order to solve the technical problem, the application provides a wafer is placed unusual detection device, including controller, detection sensor and be used for the location and place the positioning mechanism of wafer box, the controller with detection sensor communication connection, detection sensor sets up in positioning mechanism, detection sensor's detection response route crosses the target area, the target area does wafer box correctly place in when positioning mechanism is interior, all wafer circles that correctly place the wafer in the wafer box lack the region that forms, the wafer circle lack do the part that wafer location limit correspondence lacks.

Preferably, the positioning mechanism is arranged on the wafer loader.

Preferably, the controller is a central processing unit of the wafer loader, the detection sensor is connected to a 26 th slot scanning signal interface of the wafer cassette, and the slot signal interface of the wafer cassette is connected to the central processing unit.

Preferably, the detection sensor comprises an infrared emission sensor and an infrared receiving sensor, and the infrared emission sensor and the infrared receiving sensor are oppositely arranged in the positioning mechanism.

Preferably, the positioning mechanism includes a movable plate for placing the inlet and the outlet as the wafer cassette, and the emission sensor or the infrared receiving sensor is disposed on the movable plate of the positioning mechanism.

Preferably, the detection sensor comprises a ranging sensor.

Preferably, the detection sensor is one or more.

Preferably, the wafer placement anomaly detection device further comprises an alarm, and the alarm is connected with the controller.

Preferably, the alarm is a buzzer or a flashing light.

Preferably, the controller is in communication connection with the detection sensor through a wireless communication module.

Compared with the prior art, one or more embodiments in the above scheme can have the following advantages or beneficial effects:

by applying the wafer placement abnormity detection device provided by the embodiment of the application, the detection sensor is used for detecting the wafers placed in the wafer box in the positioning mechanism so as to judge whether the wafers in the wafer box are all placed correctly. Further, the detection sensing path of the detection sensor is arranged on all wafer segments penetrating through the wafer box, when the wafer is incorrectly placed in the wafer box, the detection sensing path can be shielded, and the purpose that whether the wafer is incorrectly placed in the wafer box or not is judged through the detection signal of the detection sensor is achieved.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic structural diagram illustrating a wafer placement anomaly detection apparatus according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a first embodiment of the present application when the detecting sensors are infrared emission sensors and infrared receiving sensors;

FIG. 3 is a schematic structural diagram illustrating a first embodiment of the present disclosure when the detecting sensor is a distance measuring sensor;

fig. 4 is a schematic structural diagram of a wafer cassette according to an embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a wafer being placed in a wafer cassette according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram illustrating a wafer placed in a wafer cassette in a reversed orientation according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram illustrating a method for detecting a wafer misplacement in a wafer cassette according to an embodiment of the present disclosure.

The reference numbers in the figures illustrate: the device comprises a wafer box 1, a controller 2, a positioning mechanism 3, a target area 4, a wafer segment 5, an infrared emission sensor 6, an infrared receiving sensor 7, a movable plate 8, a distance measurement sensor 9, a wafer 10, a positioning piece 11, a hinge 12, an alarm 13 and a detection sensing path 14.

Detailed Description

The following detailed description will be provided with reference to the drawings and examples to explain how to apply the technical means to solve the technical problems and to achieve the technical effects. It should be noted that, as long as there is no conflict, the embodiments and the features in the embodiments in the present application may be combined with each other, and the formed technical solutions are all within the protection scope of the present application.

At present, the wafer of the novel substrate such as silicon carbide is usually in an incomplete round shape, namely, the wafer is provided with a positioning edge. The wafer opening of the novel silicon carbide substrate has high requirements on process conditions, so that vertical furnace tube equipment needs to be used, but the wafer box on the vertical furnace tube needs to meet the condition that all positioning edges in the wafer box face rightly, namely, the wafer needs to be correctly lapped on the wafer box, otherwise, the wafer opening has a falling risk, and further the subsequent process design is influenced. At present, there is no device for detecting whether the wafer positioning edges in the wafer box are all oriented correctly.

Example one

In order to solve the technical problem existing in the prior art, the embodiment of the application provides a wafer placement anomaly detection device.

Fig. 1 is a schematic structural diagram illustrating a wafer placement abnormality detection apparatus according to an embodiment of the present disclosure, and referring to fig. 1, the wafer placement abnormality detection apparatus according to the embodiment of the present disclosure includes a controller 2, a detection sensor, and a positioning mechanism 3. Wherein the controller 2 is in communication connection with the detection sensor, and the detection sensor is arranged in the positioning mechanism 3. The positioning mechanism 3 is mainly used for positioning and placing the wafer cassette 1. Referring to fig. 4, the structure of the wafer cassette 1 is shown, the positioning mechanism 3 is a closed box-shaped structure, a positioning member 11 is disposed in the positioning mechanism for positioning the wafer cassette 1, the positioning mechanism 3 is further provided with a movable plate 8 for placing an inlet and an outlet of the wafer cassette 1, and the movable plate 8 is connected with the inlet and the outlet of the positioning mechanism through a hinge 12. The positioning mechanism 3 can be integrated separately and is dedicated for the wafer placement abnormality detection device of the embodiment to position and place the wafer cassette 1; meanwhile, the wafer box 1 on the wafer loader can be directly positioned and placed as the positioning mechanism 3, so that the wafer loader can detect the placement condition of the wafer 10 in the wafer box 1.

FIG. 5 is a schematic diagram illustrating a wafer being placed in a wafer cassette according to an embodiment of the present disclosure; FIG. 6 is a schematic diagram illustrating a wafer placed in a wafer cassette in a reversed orientation according to an embodiment of the present disclosure; referring to fig. 5 and 6, the present application is directed to a wafer 10 that is not a complete circle, and there is a missing portion relative to the complete circle, which is the wafer segment 5. When the wafer 10 is placed correctly (i.e. in the forward direction) in the cassette 1, the corresponding wafer segment 5 is left free, and when the wafer 10 is placed in the cassette 1 in the reverse or inclined direction, the corresponding wafer segment 5 is filled.

Based on the above principle, the present embodiment arranges the detection sensor inside the positioning mechanism 3, and the detection sensing path 14, which needs to be arranged with the detection sensor, crosses the target area 4, so as to detect the wafer 10 in the wafer cassette 1 placed in the positioning mechanism 3. Wherein the target area 4 is an area formed by all wafer segments 5 for correctly placing the wafers 10 in the wafer cassette 1 when the wafer cassette 1 is correctly placed in the positioning mechanism 3. The detection sensing path 14 of the detection sensor is arranged to cross the target area 4, so that the detection of the detection sensor on whether all wafers 10 in the wafer box 1 are correctly placed is realized, if the wafers 10 are reversely or obliquely placed in the wafer box 1, the wafers 10 are partially protruded to block the detection sensing path 14 of the detection sensor, and further corresponding signal feedback is obtained; if the wafer 10 is not placed in the wafer cassette 1 in the reverse direction or in the inclined direction, the sensing path 14 of the sensor is not blocked and thus does not receive the corresponding signal feedback. In order to improve the detection accuracy, a plurality of detection sensors may be provided inside the positioning mechanism 3. And the controller 2 and the detection sensor can also be in communication connection through a wireless communication module.

Preferably, fig. 2 shows a schematic structural diagram when the detection sensors are an infrared emission sensor and an infrared reception sensor in the first embodiment of the present application; referring to fig. 2, the infrared emission sensor 6 and the infrared receiving sensor 7 can be selected as detecting sensors, that is, the infrared emission sensor 6 and the infrared receiving sensor 7 are oppositely arranged in the positioning mechanism 3. FIG. 7 is a schematic diagram illustrating an embodiment of the present invention for detecting an abnormal placement of a wafer in a wafer cassette; referring to fig. 2 and 7, in the normal detection process, the infrared transmitting sensor 6 sends infrared light to the infrared receiving sensor 7, and if the infrared receiving sensor 7 does not receive the infrared light, it indicates that the infrared light is blocked by the wafer 10 placed in the wafer cassette 1 in the reverse direction or in a biased manner, and at this time, the infrared receiving sensor 7 outputs an abnormal signal; if the infrared receiving sensor 7 receives the infrared light, it indicates that the infrared light is not blocked by the wafer 10 placed in the wafer box 1 in the reverse direction or in a deflected manner, and at this time, the infrared receiving sensor 7 outputs a normal signal.

It is further preferred that the detection sensor path 14 is disposed on the movable plate 8 of the positioning mechanism 3 and crosses the target area 4. At this time, before the wafer 10 placement condition is detected, the infrared emission sensor 6 and the infrared receiving sensor 7 can also be used to detect whether the movable plate 8 of the positioning mechanism 3 is normally closed.

Preferably, fig. 3 shows a schematic structural diagram of the first embodiment of the present application when the detection sensor is a distance measurement sensor; referring to fig. 3, the distance measuring sensor 9 may be selected as a detection sensor, that is, a fixed distance (i.e., including a distance crossing the target area 4) is detected by the distance measuring sensor 9, and the detected result is transmitted to the controller 2. After receiving the distance result measured by the distance measuring sensor 9, the controller 2 compares the distance result with the set distance, if the measured distance is smaller than the set distance, it indicates that the distance measuring sensor 9 is blocked by the wafer 10 placed in the wafer box 1 in the reverse direction or in the biased direction, otherwise, it indicates that all the wafers 10 in the wafer box 1 are placed in the forward direction.

The controller 2 is configured to receive and process a signal detected and sensed by the detection sensor, that is, receive a signal fed back by the infrared receiving sensor 7 or receive a distance signal fed back by the distance measuring sensor 9, so as to determine whether the wafer 10 is placed abnormally in the wafer box 1 at present. In order to further reduce the cost, a central processing unit on the wafer loader can be used as the controller 2, the detection sensor can be connected with the 26 th slot position scanning signal interface of the wafer box 1, and the slot position signal interface of the wafer box 1 is connected with the central processing unit, so that the signal can be directly reported on a machine table of the wafer loader without software change.

The wafer placement abnormity detection device further comprises an alarm 13, wherein the alarm 13 is connected with the controller 2 so as to give an alarm when the controller 2 judges that the wafer 10 which is abnormally placed exists in the wafer box 1. Preferably, the alarm 13 is a buzzer or a flashing light.

The wafer placement anomaly detection device provided by the embodiment of the application detects the wafers 10 placed in the wafer box 1 in the positioning mechanism 3 through the detection sensor so as to judge whether the wafers 10 in the wafer box 1 are all placed correctly. Further, the detection sensing path 14 of the detection sensor is arranged on all wafer segments 5 which transversely penetrate through the wafer box 1, when the wafer 10 is incorrectly placed in the wafer box 1, the detection sensing path 14 is shielded, and the purpose that whether the wafer 10 is incorrectly placed in the wafer box 1 is judged through the detection signal of the detection sensor is achieved.

Although the embodiments disclosed in the present application are described above, the descriptions are only for the convenience of understanding the present application, and are not intended to limit the present application. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.

Claims

1. The utility model provides an unusual detection device is placed to wafer, characterized in that, includes controller (2), detection sensor and is used for fixing a position and places positioning mechanism (3) of wafer box (1), controller (2) with detection sensor communication connection, detection sensor sets up in positioning mechanism (3), detection response route (14) of detection sensor crosses target area (4), target area (4) do wafer box (1) place correctly in when positioning mechanism (3), all wafer circle-offs (5) that place wafer (10) correctly in wafer box (1) formed the region, wafer circle-offs (5) do wafer (10) location limit corresponds the part that lacks.

2. The wafer placement anomaly detection device according to claim 1, characterized in that said positioning mechanism (3) is disposed on a wafer loader.

3. The apparatus of claim 2, wherein the controller (2) is a central processing unit of the wafer loader, the detection sensor is connected to a 26 th slot signal interface of the pod (1), and the slot signal interface of the pod (1) is connected to the central processing unit.

4. The wafer placement anomaly detection device according to claim 1, characterized in that said detection sensor comprises an infrared emission sensor (6) and an infrared reception sensor (7), said infrared emission sensor (6) and said infrared reception sensor (7) being disposed opposite each other within said positioning mechanism (3).

5. The wafer placement anomaly detection device according to claim 4, wherein the positioning mechanism (3) comprises a movable plate (8) as a wafer cassette (1) placement inlet/outlet, and the emission sensor or the infrared reception sensor is disposed on the movable plate (8) of the positioning mechanism (3).

6. The wafer placement abnormality detection apparatus according to claim 1, characterized in that the detection sensor includes a distance measurement sensor (9).

7. The wafer placement abnormality detection apparatus according to claim 1, wherein said detection sensor is one or more.

8. The wafer placement anomaly detection device according to claim 1, further comprising an alarm (13), wherein the alarm (13) is connected to the controller (2).

9. The wafer placement anomaly detection device according to claim 8, wherein said alarm (13) is a buzzer or a flash lamp.

10. The wafer placement anomaly detection device according to claim 1, wherein said controller (2) is in communication connection with said detection sensor through a wireless communication module.