CN218876067U

CN218876067U - LED paster support packaging mechanism that moulds plastics

Info

Publication number: CN218876067U
Application number: CN202222672964.3U
Authority: CN
Inventors: 黄平; 廖达新; 饶家平
Original assignee: Shenzhen Wanxingrui Technology Co ltd
Current assignee: Shenzhen Wanxingrui Technology Co ltd
Priority date: 2022-10-11
Filing date: 2022-10-11
Publication date: 2023-04-18
Anticipated expiration: 2032-10-11

Abstract

The utility model relates to a LED processing equipment technical field discloses a LED paster support packaging mechanism that moulds plastics, include: the upper die in the packaging die is arranged at the bottom of the lifting plate through the connecting assembly, the lifting plate is positioned above the inner part of the rack, and the lower die in the packaging die is connected below the inner part of the rack through the moving assembly; the moving assembly comprises a mold moving groove and a positioning assembly connected in the mold moving groove and used for locking the lower mold, two ends of the mold moving groove extend to the outside of the rack, and the lower mold is movably connected in the mold moving groove. The utility model discloses a set up the mould shifting chute and be used for limiting shift position to the bed die, make things convenient for the bed die to shift out simultaneously to set up locating component in the shifting chute, be used for fixing a position the bed die, do benefit to the butt joint of upper and lower mould, avoid misplacing between the upper and lower mould, can effectual improvement encapsulation quality.

Description

LED paster support packaging mechanism that moulds plastics

Technical Field

The utility model relates to a LED processing equipment technical field specifically is a LED paster support packaging mechanism that moulds plastics.

Background

The LED chip mounting structure comprises an LED support and a base seat of an LED lamp bead before packaging, wherein a chip is fixed on the base seat of the LED lamp bead on the basis of the LED support, positive and negative electrodes are welded, packaging glue is used for packaging and forming once, and an injection molding packaging machine is required to be used for processing when the LED chip mounting support is packaged. Among the prior art, when encapsulating LED paster support, often adopt the packaging machine to fill gluey encapsulation, but among the encapsulation process, need place in proper order and take out, not only can let the staff easily appear tiredly, still can reduce encapsulation efficiency.

Aiming at the technical problems, for example, the patent number 202111016923.2 provides a comprehensive packaging mechanism of an LED patch bracket and a packaging method thereof, wherein a group of placing blocks are arranged on a conveyor belt, the LED patch bracket to be packaged is placed in a first groove and then is conveyed by the conveyor belt, the LED patch bracket to be packaged is moved to the position under a glue sprayer, then is subjected to glue discharging packaging by a glue discharging component of a packaging box, and then is moved by the conveyor belt to be directly moved to the next processing position,

in the above patent, the work intensity of the worker can be reduced, and the packaging efficiency can be improved. It does not facilitate positioning of the encapsulation mould, so that the encapsulation quality is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED paster support packaging mechanism that moulds plastics, through setting up the removal subassembly, be convenient for to the removal and the location of mould to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED paster support packaging mechanism that moulds plastics, includes: the frame is used for supporting the glue injection mechanism and the packaging mold, an upper mold in the packaging mold is installed at the bottom of the lifting plate through the connecting assembly, the lifting plate is located above the inner portion of the frame, and a lower mold in the packaging mold is connected below the inner portion of the frame through the moving assembly;

the moving assembly comprises a mold moving groove and a positioning assembly connected in the mold moving groove and used for locking the lower mold, two ends of the mold moving groove extend to the outside of the rack, and the lower mold is movably connected in the mold moving groove.

Preferably, the positioning assembly comprises:

the locating plate and connect at the inboard electric putter of frame through the butt joint subassembly, the equal fixedly connected with location tooth in a side portion both ends of locating plate, the limit portion of mould shifting chute seted up with locating plate assorted bar groove, locating plate swing joint is in the bar groove.

Preferably, the docking assembly comprises:

the screw rod and the internal thread sleeve are connected to the outer part of the screw rod; one end of the screw rod is fixed on the other side edge of the positioning plate, and one end of the internal thread sleeve is rotatably installed at the output end of the electric push rod.

Preferably, the lifting plate is provided with a guide rod through a linear bearing, the upper end of the guide rod is fixed at the top of the inner side of the rack, the top of the inner side of the rack is provided with a stroke cylinder, and the end part of the output end of the stroke cylinder is arranged at the top of the lifting plate.

Preferably, the mounting groove has been seted up at the top of lifter plate, it fixes to go up the mould through coupling assembling the inside of mounting groove, just injecting glue head among the injecting glue mechanism is connected on last mould.

Preferably, the connection assembly includes:

the connecting groove and be located the bolt in the connecting groove, the tip of bolt rotates the installation connecting plate, connecting plate swing joint is in the inside of connecting groove, the tip of connecting groove seted up with bolt assorted screw.

Preferably, the glue injection mechanism further comprises:

the glue storage barrel and the glue conveying pipe are communicated in the glue storage barrel, and a glue conveying pump is arranged between the glue conveying pipe and the glue injection head; wherein, the glue storage barrel is arranged at the top of the frame.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the mould shifting chute and be used for limiting shift position to the bed die, make things convenient for the bed die to shift out simultaneously to set up locating component in the shifting chute, be used for fixing a position the bed die, do benefit to the butt joint of upper and lower mould, avoid misplacing between the upper and lower mould, can effectual improvement encapsulation quality.

2. The utility model provides a mould moving groove both ends extend to the outside of frame, can hold two sets of or multiunit mould simultaneously, are convenient for shift out the frame with the mould, conveniently take out the LED paster support after the encapsulation, still conveniently put into simultaneously and treat encapsulation LED paster support, do benefit to the efficiency that improves the encapsulation.

Drawings

Fig. 1 is a schematic perspective view of an injection molding and packaging mechanism of an LED chip mounting bracket according to an embodiment of the present invention;

fig. 2 is a schematic view of a front view structure of an injection molding and packaging mechanism of an LED chip mounting bracket according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a lifting plate according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a connection assembly according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a moving assembly according to an embodiment of the present invention;

fig. 6 is a schematic sectional view of a mold moving groove according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a docking assembly according to an embodiment of the present invention.

In the figure:

1. a frame;

2. an upper die;

3. a connection assembly; 301. connecting grooves; 302. a bolt; 303. a connecting plate; 304. a screw hole;

4. a lifting plate; 401. a guide bar; 402. a stroke cylinder; 403. mounting grooves;

5. a lower die;

6. a moving assembly; 601. a mold moving groove; 602. a positioning assembly; 603. positioning a plate; 604. a docking assembly; 605. an electric push rod; 606. positioning teeth; 607. a strip-shaped groove; 608. a screw; 609. an internally threaded sleeve;

701. a glue injection head; 702. a glue storage barrel; 703. a rubber delivery pipe; 704. a glue conveying pump.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

The embodiment of the utility model provides an in provide a LED paster support packaging mechanism that moulds plastics, it is exemplary, as shown in figure 1 and figure 2, it includes: frame 1, packaging mold, injecting glue mechanism etc.. Wherein, frame 1 is used for supporting injecting glue mechanism and packaging mold. The packaging mold comprises an upper mold 2 and a lower mold 5, the LED patch support to be packaged is placed in the lower mold 5, and after the upper mold 2 and the lower mold 5 are closed, the glue injection mechanism injects glue into the packaging mold to package the LED patch support. The glue injection process and the glue injection amount can be controlled by a computer program to perform automatic glue conveying and packaging, and the specific working principle is not the main content in the embodiment, and is not described herein again, which can refer to the prior art.

Briefly, the glue injection mechanism in this embodiment includes: the glue injection head 701, the glue storage barrel 702, the glue delivery pipe 703 and the glue delivery pump 704. Wherein, store up gluey bucket 702 and install at the top of frame 1 for the glue of storage encapsulation usefulness, in addition, still can set up the heat retainer in storing up gluey bucket 702 for keep the glue temperature, avoid it to solidify. Specifically, the glue delivery pipe 703 is connected to the bottom of the glue storage barrel 702 and connected to the glue delivery pump 704, and is used for drawing out the glue in the glue storage barrel 702 and injecting the glue into the upper mold 2 through the glue injection head 701.

As shown in fig. 2 and 3, the upper mold 2 is mounted at the bottom of the lifting plate 4 through the connecting assembly 3, and the packaging molds of different models can be replaced according to the models of the LED chip supports through the connecting assembly 3. The lifting plate can move up and down in the frame 1 under the driving of the lifting plate 4, and is beneficial to the die closing and die splitting of the upper die 2 and the lower die 5.

Specifically, the lifting plate 4 is provided with a guide rod 401 through a linear bearing, and the upper end of the guide rod 401 is fixed at the top of the inner side of the frame 1. And the guide arm 401 is provided with two sets at least, can restrict the angle of lifter plate 4, and linear bearing does benefit to and reduces the frictional force between guide arm 401 and lifter plate 4, does benefit to it and reciprocates. In this embodiment, the stroke cylinder 402 is installed at the top of the inner side of the frame 1 and used as a power source for moving the lifting plate 4 up and down, but of course, other power components such as a hydraulic cylinder may be used instead, and not illustrated here, and the output end of the stroke cylinder 402 is installed at the top of the lifting plate 4. The lifting plate 4 can be driven to move by the extension of the stroke cylinder 402, and then the die closing and die separation of the upper die 2 and the lower die 5 are realized.

In order to facilitate the installation of the upper mold 2 and the connecting assembly 3, the top of the lifting plate 4 is provided with an installation groove 403 for placing the upper mold 2, and the upper mold 2 is fixed inside the installation groove 403 through the connecting assembly 3. As shown in fig. 4, the connecting member 3 includes a connecting groove 301, a bolt 302, and a connecting plate 303. Wherein, spread groove 301 sets up in the top both sides of lifter plate 4, and is located the edge of mounting groove 403, and spread groove 301's tip is seted up and is put up with bolt 302 assorted screw 304 for connecting bolt 302, with the tip rotation of bolt 302 install the limit portion at connecting plate 303. The bolts 302 are rotated to drive the connecting plates 303 to move, and the connecting plates are clamped at the edge of the upper mold 2, that is, the upper mold 2 is fixed by clamping the two groups of connecting plates 303. In order to improve the holding stability, a groove matching with the connecting plate 303 may be formed at the edge of the upper mold 2.

As shown in fig. 5 to 7, the lower mold 5 is connected to the lower portion of the inside of the frame 1 by a moving assembly 6, and the lower mold 5 corresponds to the upper mold 2.

Specifically, the movable assembly 6 comprises a mold moving groove 601 and a positioning assembly 602 connected to the mold moving groove 601 and used for locking the lower mold 5, two ends of the mold moving groove 601 extend to the outside of the frame 1, the mold moving groove 601 is used for limiting the moving position of the lower mold 5, the lower mold 5 can be moved out conveniently, two or more groups of molds can be accommodated simultaneously, the molds can be moved out of the frame conveniently, the packaged LED patch support can be taken out conveniently, the packaged LED patch support can be put in conveniently, and the packaging efficiency can be improved. The positioning assembly 602 is used for positioning the lower die, is beneficial to butt joint of the upper die and the lower die, avoids dislocation between the upper die and the lower die, and can effectively improve the packaging quality.

The positioning assembly 602 is composed of a positioning plate 603, a docking assembly 604, and an electric push rod 605. The electric push rod 605 is connected with the positioning plate 603 through the docking assembly 604, so that the positioning plate 603 can be conveniently replaced according to the model of the mold. And the equal fixedly connected with location tooth 606 in one side limit portion both ends of locating plate 603 sets up location tooth 606 to the triangle-shaped structure, and the hypotenuse of location tooth 606 contacts with bed die 5, does benefit to and presss from both sides tight bed die 5. In order to facilitate the positioning and moving of the positioning plate 603, a strip-shaped groove 607 matched with the positioning plate 603 is formed in the edge of the mold moving groove 601, and the positioning plate 603 is movably connected in the strip-shaped groove 607.

The docking assembly 604 includes: a threaded shank 608 and an internally threaded sleeve 609 attached to the exterior of the threaded shank 608. One end of the screw 608 is fixed to the other side of the positioning plate 603, and one end of the internally threaded sleeve 609 is rotatably mounted at the output end of the electric push rod 605. When the positioning plate 603 is installed, the positioning plate 603 is placed in the strip-shaped groove 607, the internal thread sleeve 609 is rotated to connect the screw 608 to the internal thread sleeve 609, so that the positioning plate 603 and the electric push rod 605 are fixed together, the electric push rod 605 is convenient to drive the positioning plate 603 to clamp the lower die 5, the lower die 5 is positioned, the die assembly of the upper die 2 and the lower die 5 is facilitated, and the packaging quality is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An injection molding and packaging mechanism of an LED patch bracket is characterized by comprising a moving assembly (6);

the moving assembly (6) comprises a mold moving groove (601) and a positioning assembly (602) connected in the mold moving groove (601) and used for locking the lower mold (5), two ends of the mold moving groove (601) extend to the outside of the machine frame (1), and the lower mold (5) is movably connected in the mold moving groove (601).

2. The LED patch bracket injection molding and packaging mechanism according to claim 1, characterized in that: still including frame (1) that is used for supporting injecting glue mechanism and packaging mold, last mould (2) among the packaging mold installs in the bottom of lifter plate (4) through coupling assembling (3), and lifter plate (4) are located frame (1) inside top, bed die (5) among the packaging mold are connected through removing subassembly (6) frame (1) inside below.

3. The LED patch support injection molding and packaging mechanism according to claim 2, wherein the LED patch support injection molding and packaging mechanism comprises: the positioning assembly (602) comprises:

the die comprises a positioning plate (603) and an electric push rod (605) connected to the inner side of a frame (1) through a butt joint assembly (604), wherein positioning teeth (606) are fixedly connected to two ends of one side edge of the positioning plate (603), a strip-shaped groove (607) matched with the positioning plate (603) is formed in the edge of a die moving groove (601), and the positioning plate (603) is movably connected to the strip-shaped groove (607).

4. The LED patch bracket injection molding and packaging mechanism according to claim 3, wherein: the docking assembly (604) comprises:

a threaded rod (608) and an internally threaded sleeve (609) connected to the exterior of the threaded rod (608); one end of the screw rod (608) is fixed on the other side of the positioning plate (603), and one end of the internal thread sleeve (609) is rotatably arranged at the output end of the electric push rod (605).

5. The LED patch support injection molding and packaging mechanism according to claim 2, wherein the LED patch support injection molding and packaging mechanism comprises: the lifting plate (4) is provided with a guide rod (401) through a linear bearing, the upper end of the guide rod (401) is fixed at the top of the inner side of the rack (1), the top of the inner side of the rack (1) is provided with a stroke cylinder (402), and the end part of the output end of the stroke cylinder (402) is arranged at the top of the lifting plate (4).

6. The LED patch bracket injection molding and packaging mechanism according to claim 5, wherein: mounting groove (403) have been seted up at the top of lifter plate (4), it fixes to go up mould (2) through coupling assembling (3) the inside of mounting groove (403), just injecting glue head (701) among the injecting glue mechanism are connected on last mould (2).

7. The LED patch bracket injection molding and packaging mechanism according to claim 6, wherein: the connection assembly (3) comprises:

connecting groove (301) and be located bolt (302) in connecting groove (301), the tip of bolt (302) rotates installation connecting plate (303), connecting plate (303) swing joint is in the inside of connecting groove (301), the tip of connecting groove (301 seted up with bolt (302) assorted screw (304).

8. The LED patch support injection molding and packaging mechanism according to claim 7, wherein: the injecting glue mechanism still includes:

the glue storage barrel (702) and a glue conveying pipe (703) communicated in the glue storage barrel (702), wherein a glue conveying pump (704) is arranged between the glue conveying pipe (703) and the glue injection head (701); wherein, the glue storage barrel (702) is arranged at the top of the frame (1).