CN218867059U

CN218867059U - Wafer jig

Info

Publication number: CN218867059U
Application number: CN202223226428.7U
Authority: CN
Inventors: 曾祥金; 梁毅; 林冠宏; 崔思远; 文国昇; 金从龙
Original assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Current assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Priority date: 2022-11-28
Filing date: 2022-11-28
Publication date: 2023-04-14
Anticipated expiration: 2032-11-28

Abstract

The utility model provides a wafer jig, which belongs to the technical field of semiconductors and is used for producing wafers, and the jig comprises a first tray body, a second tray body covered and connected on the first tray body, and a placing groove group arranged on the first tray body; the surface of the first tray body and the surface of the second tray body are coated with insulating layers, and when the second tray body is covered and connected on the first tray body, the insulating layers are used for enabling the first tray body and the second tray body to be insulated and not conducted. Through the arrangement, the surface charges of the second tray body are not accumulated, and the ion offset caused by the accumulation of the charges of the upper cover can be avoided, so that the utilization rate and the performance of the edge of the wafer are improved.

Description

Wafer jig

Technical Field

The utility model belongs to the technical field of the semiconductor, concretely relates to wafer tool.

Background

During the processing of the wafer, a tool is used to support the wafer, and the tool is mainly used as a tool to assist in controlling the position or the motion (or both).

The existing jig comprises an upper cover and a lower disc corresponding to the upper cover, wherein a plurality of placing grooves are formed in the lower disc, and are used for supporting a wafer, so that the wafer is processed subsequently, in the process of etching an aluminum disc by using a PSS (patterned sapphire substrate), the upper cover is easy to accumulate charges, the PSS is a sapphire graphical process, and the sapphire is of a hexagonal structure.

In the prior art, due to the fact that charges are accumulated on the upper cover, the wafer graph close to the upper cover is easy to be abnormal when ion bombardment is carried out, the wafer graph is abnormal, due to the fact that the charges are accumulated on the upper cover, the edge of the wafer is affected by the accumulated charges to deflect, the bombarded graph is irregular in deformation, the C surface at the bottom is not flat in bombardment, and the defects of atomization, dislocation and the like occur when crystal is epitaxially grown.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a wafer tool to because the upper cover accumulated charge leads to being close to near the wafer figure of upper cover when carrying out the ion bombardment and takes place unusual technical problem easily among the solution above-mentioned background art.

The utility model provides a wafer jig, the jig is used for producing the wafer, the jig includes first disk body, covers to close the second disk body that connects on the first disk body, and locates the placing groove crowd on the first disk body;

the placing groove group comprises a plurality of first placing grooves which are circumferentially arranged at intervals by taking the first tray body as a center, the plurality of first placing grooves are positioned on the first surface of the first tray body, and two adjacent first placing grooves are arranged in an abutting mode;

the surface of the first tray body and the surface of the second tray body are coated with insulating layers, and when the second tray body is connected to the first tray body in a covering mode, the first tray body and the second tray body are insulated and not conducted through the insulating layers.

Further, a part of the edge of each of the first placement grooves abuts against the edge of the first tray body.

Further, the placing groove group further comprises at least one second placing groove, and the second placing groove is located in the center of the first surface.

Furthermore, a plurality of through holes corresponding to the first placing grooves and the second placing grooves are formed in the second tray body.

Furthermore, a limiting structure is arranged in the through hole, and when the wafer is located on the first placing groove and/or the second placing groove, the limiting structure limits the wafer to move relative to the first tray body.

Furthermore, limit structure includes a plurality of protruding pieces that the interval set up, states protruding piece and locates the inner hole wall of through-hole.

Furthermore, the jig further comprises a limiting rod, one of the first tray body and the second tray body is provided with the limiting rod, the other one of the first tray body and the second tray body is provided with a limiting groove opposite to the limiting rod, the limiting rod extends into the limiting groove and at least partially limits the limiting groove so as to limit the movement of the second tray body relative to the first tray body.

Furthermore, the limiting rod is arranged on the first tray body, and the limiting groove is arranged on the second tray body.

Furthermore, a plurality of limiting rods are arranged, the limiting rods are arranged on the first surface of the first tray body and extend towards the second tray body, and at least two limiting rods are symmetrically arranged with the central line of the first tray body;

the limiting groove is formed in the second surface of the second disc body, and the first surface and the second surface are arranged oppositely.

Further, when the second tray body is covered and connected on the first tray body, the edge of the first tray body is overlapped with the edge of the second tray body.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model provides an among the wafer tool, through cladding insulating layer on first disk body and second disk body, in order to close when connecting on first disk body when second disk body lid, produce insulating nonconducting between first disk body and the second disk body, near the upper cover because of the wafer figure is unusual, lead to C face roughness poor, the easy atomizing technical problem of epitaxial growth crystal, specifically, the tool includes first disk body, the lid closes the second disk body of connecting on first disk body, and locate the placing groove crowd on the first disk body, the placing groove crowd includes a plurality of first standing grooves that use first disk body as central circumference interval arrangement, a plurality of first standing grooves are located the first surface of first disk body, and two adjacent first standing grooves are near the setting, wherein, the surface cladding of first disk body and second disk body has the insulating layer, when second disk body lid closes and connects on first disk body, through the insulating layer, so that first disk body with produce insulating nonconducting between the second disk body, when the concrete implementation, the insulating layer can be for the all-round hard oxide film of second disk body on first disk body and second disk body. Therefore, in the process of processing the wafer, the surface charge of the second disc body is not accumulated, so that the ion offset caused by the accumulation of the charge of the upper cover can be avoided, and the utilization rate and the performance of the edge of the wafer are improved.

Drawings

Fig. 1 is a schematic view of an overall structure of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the first tray according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a second tray according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an insulating layer according to an embodiment of the present invention;

fig. 5 is a comparison diagram of the use status of the existing jig and the wafer jig provided by the present invention.

Description of the drawings: 100. a first tray body; 110. a first surface; 200. a second tray body; 210. a through hole; 220. a second surface; 230. a protrusion member; 300. placing a groove group; 310. a first placing groove; 320. a second placing groove; 400. an insulating layer; 500. a limiting rod; 510. a limiting groove.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for purposes of illustration only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, a wafer jig according to an embodiment of the present invention is shown, the wafer jig is used for producing wafers, and the wafer jig includes a first tray 100, a second tray 200 covering and connected to the first tray 100, and a placing groove group 300 disposed on the first tray 100;

the placing groove group 300 includes a plurality of first placing grooves 310 circumferentially spaced with the first tray body 100 as a center, the plurality of first placing grooves 310 are located on the first surface 110 of the first tray body 100, and two adjacent first placing grooves 310 are closely arranged, wherein the surface of the first tray body 100 and the surface of the second tray body 200 are coated with an insulating layer 400, and when the second tray body 200 is covered and connected to the first tray body 100, the insulating layer 400 is used for generating insulation and non-conduction between the first tray body 100 and the second tray body 200.

The insulating layer 400 may be a hard anodic oxide film that is omnidirectionally plated on the first tray 100 and the second tray 200, and in the process of processing the wafer, the surface charges of the second tray 200 are not accumulated, so that ion offset caused by the accumulation of the charges of the upper lid, abnormal pattern at the edge of the wafer, and atomization of the crystal is prevented from being extended, thereby improving the utilization rate and performance of the edge of the wafer.

The placing groove group 300 includes a plurality of first placing grooves 310 and at least one second placing groove 320, and two adjacent first placing grooves 310 are disposed closely and the second placing groove 320 is located at the center of the first surface 110, which is not limited by example, in this embodiment, the number of the first placing grooves 310 may be eight, the number of the second placing grooves 320 may be one, and a part of the edge of each first placing groove 310 in the first placing grooves 310 is closely adjacent to the edge of the first disk 100, so as to implement reasonable utilization of the first surface 110 of the first disk 100 and avoid wasting the surface area of the first disk 100 by utilizing the position distribution of the first placing grooves 310.

In addition, a plurality of through holes 210 corresponding to the first and second placing

grooves

310 and 320 are formed in the second tray body 200, and a limiting structure is formed in the through holes 210, and when the wafer is positioned on the first and/or second placing

grooves

310 and 320, the movement of the wafer relative to the first tray body 100 is limited by the limiting structure, specifically, the limiting structure includes a plurality of protruding members 230 arranged at intervals, and the protruding members 230 are positioned in the through holes 210.

In an implementation, when the second tray 200 is covered and connected to the first tray 100, the lower surfaces of the protrusions 230 abut against the upper surfaces of the wafers to prevent the wafers from being separated from the first placing groove 310 or the second placing groove 320.

Further, the jig further includes a plurality of limiting rods 500, one of the first tray body 100 and the second tray body 200 is provided with the limiting rod 500, and the other one is provided with a plurality of limiting grooves 510 opposite to the limiting rod 500, the limiting rods 500 extend into the limiting grooves 510 and are at least partially limited in the limiting grooves 510 to limit the movement of the second tray body 200 relative to the first tray body 100, specifically, the plurality of limiting rods 500 are provided and are disposed on the first surface 110 of the first tray body 100, and at least two limiting rods 500 are symmetrically disposed with respect to the center line of the first tray body 100, wherein the limiting grooves 510 are disposed on the second surface 220 of the second tray body 200, and the first surface 110 is disposed opposite to the second surface 220.

When the second tray body 200 is coupled to the first tray body 100 in a covering manner, the limiting rod 500 on the first tray body 100 extends into the limiting groove 510 to prevent the second tray body 200 from moving relative to the first tray body 100, in this embodiment, the cross sections of the limiting rod 500 and the limiting groove 510 may be circular, rectangular, polygonal, or other shapes, which are not particularly limited herein, and when the second tray body 200 is coupled to the first tray body 100 in a covering manner, the edge of the first tray body 100 overlaps the edge of the second tray body 200.

To sum up, the utility model discloses a wafer tool that the first embodiment provided compares with the tool among the prior art, has following beneficial effect at least:

the utility model provides an among the wafer tool, through cladding insulating layer 400 on first disk 100 and second disk 200, when second disk 200 lid is connected on first disk 100, produce insulating nonconducting between first disk 100 and the second disk 200, it is unusual to have solved near upper cover wafer figure, C face roughness is poor, epitaxial crystal is easy to atomize, wafer edge rate of utilization and the problem of performance are low, specifically speaking, the tool includes first disk 100, lid connects the second disk 200 on first disk 100, and locate placing groove crowd 300 on first disk 100, placing groove crowd 300 includes a plurality of first standing grooves 310 with first disk 100 as central circumference interval arrangement, a plurality of first standing grooves 310 are located the first surface 110 of first disk 100, and two adjacent first standing grooves 310 are close to setting up, wherein, the surface of first disk 100 and the surface of second disk 200 are wrapped with insulating layer 400, when second disk 200 lid is connected on first disk 100, through insulating layer 400, so that the first disk 100 and second disk 200 produce nonconducting.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A wafer jig is used for producing wafers and comprises a first tray body, a second tray body and a placing groove group, wherein the second tray body is connected to the first tray body in a covering mode, the placing groove group is arranged on the first tray body, and the wafer jig is characterized in that the placing groove group is arranged on the first tray body;

2. The wafer jig of claim 1, wherein a portion of an edge of each of the first placement grooves abuts against an edge of the first tray.

3. The wafer tool of claim 1, wherein the placement groove group further comprises at least one second placement groove, and the second placement groove is located in the center of the first surface.

4. The wafer jig according to claim 3, wherein a plurality of through holes corresponding to the first and second placing grooves are formed in the second tray body.

5. The wafer jig according to claim 4, wherein a limiting structure is disposed in the through hole, so as to limit the movement of the wafer relative to the first tray body by the limiting structure when the wafer is located on the first placing groove and/or the second placing groove.

6. The wafer fixture of claim 5, wherein the limiting structure comprises a plurality of protruding members arranged at intervals, and the protruding members are arranged on the inner hole wall of the through hole.

7. The wafer jig of claim 1, further comprising a limiting rod, wherein one of the first tray and the second tray is provided with the limiting rod, and the other one of the first tray and the second tray is provided with a limiting groove opposite to the limiting rod, and the limiting rod extends into the limiting groove and is at least partially limited in the limiting groove so as to limit the movement of the second tray relative to the first tray.

8. The wafer jig of claim 7, wherein the limiting rod is arranged on the first tray body, and the limiting groove is arranged on the second tray body.

9. The wafer jig of claim 7, wherein a plurality of limiting rods are provided, the plurality of limiting rods are provided on the first surface of the first tray body and extend towards the second tray body, and at least two limiting rods are symmetrically arranged with respect to a center line of the first tray body;

10. The wafer tool of claim 1, wherein when the second tray is coupled to the first tray, the edge of the first tray overlaps the edge of the second tray.