CN218849522U

CN218849522U - Support for increasing area of solid crystal region

Info

Publication number: CN218849522U
Application number: CN202223242695.3U
Authority: CN
Inventors: 陆鹏军; 张路华; 高宇辰; 王天
Original assignee: Shenzhen Smart Semiconductor Ltd
Current assignee: Shenzhen Smart Semiconductor Ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-04-11
Anticipated expiration: 2032-12-05

Abstract

The utility model relates to an increase support of solid crystalline region area, including plastic support and lead wire pad, the plastic support with the lead wire pad sets up to the integrated into one piece structure, plastic support upper end middle part undercut forms bowl cup chamber, just the lead wire pad is located the bottom in bowl cup chamber, bowl cup chamber bottom is provided with first interval and glues, just first interval is glued will weld line district and solid crystalline region are divided into to the upper end of lead wire pad, just the weld line district set up in a corner department in bowl cup chamber, plastic support bottom is provided with the second interval and glues, just the upper end that the second interval was glued is connected with the lower extreme that first interval was glued. The utility model discloses an increase support of solid brilliant district area has increased solid brilliant area when keeping bottom pad edge safe interval between pin, has improved the power and the luminous power of LED lamp pearl, has effectively promoted the reliability of LED lamp pearl.

Description

Support for increasing area of solid crystal region

Technical Field

The utility model relates to a LED encapsulates technical field, concretely relates to increase support of solid brilliant district area.

Background

The development prospect of the LED is very wide, and the LED is developing towards the directions of high brightness, high weather resistance, higher luminous density, higher luminous uniformity and lower cost. Along with the continuous maturity in market to LED lamps and lanterns colour, luminous efficacy, the degree that integrates, more and more requirements have also been proposed to the reliability, how on with the size, or on the LED lamp pearl of smaller size, further promote luminance, the light efficiency, the reliance is the development direction of LED encapsulation industry. The area of the functional area in the lamp bead in the prior art is limited, and more large-size chips need to be placed by adjusting the area proportion of the functional area on the upper surface of the lead frame in the industry, so that the reliability of the LED lamp is improved.

Referring to fig. 1a-1c, taking an example of LED beads of two 2835 lead frames, area ratios of a functional region on an upper surface of a first lead frame to a functional region on an upper surface of a second lead frame are respectively 2, 3, 7, and 5, and 22 × 35mil chips are respectively placed in 2/8, 3/7, and 5/5 branch frame functional regions, and then wire bonding is performed in a serial connection manner; as can be seen, the three supports can just place two 22-35mil chips, but not three 22-35mil chips. The width of a gap of the bracket is 0.23mm, the area of the gap accounts for 12% of the area of the bowl cup, the solid welding area is greatly reduced, the quantity of the LED chips is limited, and the power and the luminous power of the LED lamp bead are influenced; in addition, the lead frame is connected together by partial plastic, and the white road between the plastic and the lead frame is of a horizontal linear structure, so that when the lead frame is in a bending state, the lamp beads are easily broken along a straight line from the white road, and the reliability of the LED lamp beads is low.

Therefore, it is desirable to provide a support with an increased die bonding area to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming prior art's is not enough and defect, provides a support that increases solid brilliant district area, has increased solid brilliant area when keeping bottom pad edge safe interval between the pin, has improved the power and the luminous power of LED lamp pearl, has effectively promoted the reliability of LED lamp pearl.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides an increase support of solid brilliant district area, includes plastic support and lead wire pad, the plastic support with the lead wire pad sets up to the integrated into one piece structure, plastic support upper end middle part undercut forms bowl cup chamber, just the lead wire pad is located the bottom in bowl cup chamber, bowl cup chamber bottom is provided with first interval and glues, just first interval is glued will weld line district and solid brilliant district are divided into to the upper end of lead wire pad, just the weld line district set up in a corner department in bowl cup chamber, plastic support bottom is provided with the second interval and glues, just the upper end that the second interval was glued is connected with the lower extreme that first interval was glued.

As an optimized technical scheme of the utility model, the both ends that first interval was glued to the outside extension in bowl cup chamber and with the both ends of plastic support are connected.

As an optimized technical scheme of the utility model, the width scope of first interval glue sets up to 0.1mm ~ 0.35mm.

As a preferred technical scheme of the utility model, the second space is glued with first space is glued the structure unanimously, just the width that the second space was glued is greater than the width that first space was glued.

As a preferred technical scheme of the utility model, the lead wire pad is provided with first lead wire pad and second lead wire pad, first lead wire pad set up in the bonding wire district, the second lead wire pad set up in gu the crystalline region.

As an optimal technical scheme of the utility model, gu brilliant district is provided with the LED chip, gu brilliant glue and lead wire, just the LED chip is fixed through solid brilliant glue installation on the second lead wire pad, just the pin connection is passed through to the one end of LED chip first lead wire pad, the other end of LED chip passes through the pin connection the second lead wire pad.

As a preferred technical scheme of the utility model, bowl cup chamber upper end opening size is greater than the lower extreme size in bowl cup chamber, just the domatic setting of lateral wall in bowl cup chamber is the reflection of light face.

As an optimized technical scheme, the plastic support upper end is provided with the sign angle that is used for distinguishing positive negative pole.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses a keep original bottom lead wire pad edge safe interval unchangeable, glue first interval and design into the form of buckling to suitably reduce the width that first interval was glued, thereby increase the solid area of welding of solid crystalline region.

2. The utility model can place more large-size and high-power chips by increasing the area of the solid crystal area, thereby improving the power and the luminous power of the lamp bead; meanwhile, the welding wire area is arranged at a corner of the bowl cup cavity, the area of the welding wire area is reduced to increase the area of the solid crystal area, the heat dissipation performance of the lamp bead can be improved, and the junction temperature of the LED chip is reduced.

3. The utility model reduces the width of the first spacing adhesive, reduces the gap width of the interface between the plastic and the metal after high temperature expansion and cold contraction to a certain extent, and reduces the risk that elements such as water vapor, sulfur, halogen and the like infect the inner part of the lamp bead along the gap flow channel; in addition, first interval is glued and is the shape of bending with second interval for mutual gomphosis between the lead wire pad can effectively avoid LED lamp pearl atress along the centralized fracture of straight line, has promoted LED lamp pearl's reliability.

Drawings

Fig. 1a-1c are attached drawings of the background art of the present invention.

Fig. 2 is a schematic view of the three-dimensional structure of the bracket of the present invention.

FIG. 3 is the schematic view of the split structure of the bracket of the present invention

Fig. 4 is a schematic structural view of the plastic bracket of the present invention.

Fig. 5a-5c are various examples of the bracket applied to the LED chip package according to the embodiment of the present invention.

Fig. 6 is a schematic plan view of a bracket according to another embodiment of the present invention.

Wherein the figures include the following reference numerals:

1. plastic support, 2, lead wire pad, 21, first lead wire pad, 22, second lead wire pad, 3, bowl cup chamber, 4, first interval glue, 5, second interval glue, 6, bonding wire district, 7, solid crystal district, 8, LED chip, 9, solid crystal glue, 10, lead wire, 11, reflection of light face, 12, sign angle.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 2-4, the specific implementation process of the present invention is as follows: a support for increasing the area of a die bonding area comprises a plastic support 1 and a lead bonding pad 2, wherein the plastic support 1 and the lead bonding pad 2 are of an integral injection molding structure, so that the lead bonding pad 2 and the plastic support 1 are fixed more firmly, a bowl cup cavity 3 is formed in the middle of the upper end of the plastic support 1 in a downward concave mode, the lead bonding pad 2 is arranged at the bottom end of the bowl cup cavity 3, a first spacing adhesive 4 is further arranged at the bottom of the bowl cup cavity 3, the upper end face of the lead bonding pad 2 is divided into a wire bonding area 6 and a die bonding area 7 by the first spacing adhesive 4, the wire bonding area 6 is arranged at one corner of the bowl cup cavity 3 for mounting more LED chips, the LED chips do not need to be mounted, the rest part of the bottom of the bowl cup cavity is the die bonding area 7, and more LED chips can be mounted; meanwhile, the second interval glue 5 is arranged at the bottom end of the plastic support 1, the upper end of the second interval glue 5 is connected with the lower end of the first interval glue 4, and therefore the lead bonding pad 2 is completely divided into two parts, one part is used as an anode lead bonding pad of the LED, the other part is used as a cathode lead bonding pad of the LED, and the connection standard of electrical components is met.

The utility model discloses an in the embodiment, because lead wire pad 2 has positive negative polarity, need separate two lead wire pads completely, just extend to the both ends of plastic support 1 with the both ends that first interval was glued 4 to bowl cup chamber 3's outside, and the structure that 5 was glued to second interval is unanimous with the structure that first interval was glued 4, also is connected with the both ends of plastic support 1 for the lower extreme of plastic support 1 forms two draw-in grooves, with two perfect embeddings of lead wire pad in the draw-in groove, and do not influence polarity relation of connection.

The utility model discloses an in the embodiment, the interval width in solid crystal district surpasses 0.2mm among the prior art, and common interval width has 0.23mm, 0.25mm, 0.3mm etc. consequently glues the width scope of 4 with first interval and sets up to 0.1mm ~ 0.35mm, can select suitable interval width according to the size of a dimension of solid crystal support design. In this embodiment, taking the LED lamp beads of 2835 two lead frames as an example, in order to increase the area of the die attach area, the width of the first spacer 4 is reduced from the commonly selected width of 0.23mm to the preferred width of 0.1mm, and then the area of the bonding wire area 6 is further reduced, so as to effectively increase the area of the die attach area 7, thereby facilitating the design of a large-size and high-power die attach wire; and the width that the second interval was glued 5 then sets up to two 2 bottom pad edge safe spacing of lead wire pad, is greater than the width that first interval was glued 4, guarantees welding safety, improves the reliability of lamp pearl.

The utility model discloses an in the embodiment, lead wire pad 2 is provided with first lead wire pad 21 and second lead wire pad 22, and set up first lead wire pad 21 in bonding wire district 6, second lead wire pad 22 sets up in solid brilliant district 7, wherein, because the width that second interval glued 5 is greater than the width that first interval glued 4, form the ladder position, consequently, first lead wire pad 21 and second lead wire pad 22 also design for the echelonment with the gluey junction in interval, so can prolong the route of moisture infiltration, reduce the moisture and infect the inside risk of lamp pearl.

The utility model discloses an in the embodiment, be provided with LED chip 8, solid crystal glue 9 and lead wire 10 in solid crystal district 7, fix LED chip 8 on the second lead wire pad 22 of solid crystal district 7 through solid crystal glue 9 installation to pass through lead wire 10 with the positive negative pole of LED chip 8 and be connected with lead wire pad 2, its positive pole is connected with first lead wire pad 21, and the negative pole is connected with second lead wire pad 22, alright realization LED chip 8 normally switches on.

As shown in fig. 5a to 5c, the support provided for the embodiment of the present invention is applied to various examples of LED chip packaging, specifically: the upper end face of the lead bonding pad 2 is divided into a bonding wire area 6 and a die bonding area 7 by the bent first spacing adhesive 4, different numbers of LED chips are placed in the die bonding area 7 according to use requirements, and in fig. 5a, one 22 × 35mil chip is placed in the die bonding area 7; in fig. 5b, two 22 × 35mil chips are placed in the die attach region 7; in fig. 5c, three 22 x 35mil chips are placed in the die bonding region 7, and compared with a die bonding bracket which can only mount two 22 x 35mil chips in the prior art, the bracket of the embodiment effectively enlarges the area of the die bonding region by changing the shape and the position of the spacing adhesive, thereby being capable of easily mounting the lower three 22 x 35mil chips, effectively improving the power and the luminous power of the LED lamp bead, and simultaneously improving the reliability of the LED.

Furthermore, the utility model discloses a solid brilliant support can design into not isostructure and different shape functional areas according to the usage of difference to satisfy corresponding solid welding and arrange. As shown in fig. 6, for the utility model discloses another embodiment adopts four pin supports of two cups, be provided with two bowl cup chambeies 3 in the top of plastic support 1, every bowl cup intracavity is glued 4 with leading wire pad 2 up end by the first interval of bending form and is divided into bonding wire district 6 and solid crystal district 7, and glue 9 installation LED chip 8 with solid crystal in every solid crystal district 7, use lead wire 10 and first lead wire pad 21 and second lead wire pad 22 to be connected with LED chip 8's both ends again, thereby form four pin supports of two cups, can realize the adjustment of two and above colour temperature sections through two independent cavities, satisfy the different times, different environment, automatic switch-over colour temperature is carried out in different occasions.

The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides an increase support of solid crystalline region area, includes plastic support and lead wire pad, its characterized in that, the plastic support with the lead wire pad sets up to the integrated into one piece structure of moulding plastics, plastic support upper end middle part undercut forms bowl cup chamber, just the lead wire pad is located the bottom in bowl cup chamber, bowl cup chamber bottom is provided with first interval and glues, just first interval is glued will weld line district and solid crystalline region are divided into to the upper end of lead wire pad, just the weld line district set up in a corner department in bowl cup chamber, plastic support bottom is provided with the second interval and glues, just the lower extreme that the upper end that the second interval was glued links together with first interval is glued.

2. The support for increasing the area of a die bonding area according to claim 1, wherein two ends of the first spacer extend to the outside of the bowl cavity and are connected to two ends of the plastic support.

3. The support of claim 1, wherein the width of the first spacer is set to be 0.1mm to 0.35mm.

4. The support of claim 1, wherein the second spacer paste is structurally identical to the first spacer paste, and a width of the second spacer paste is greater than a width of the first spacer paste.

5. The support for increasing the area of the die attach area according to claim 1, wherein the wire bonding pad is provided with a first wire bonding pad and a second wire bonding pad, the first wire bonding pad is disposed in the bonding wire area, and the second wire bonding pad is disposed in the die attach area.

6. The support for increasing the area of the die attach area according to claim 5, wherein the die attach area is provided with an LED chip, die attach adhesive and a lead, the LED chip is fixedly mounted on the second lead pad through the die attach adhesive, one end of the LED chip is connected to the first lead pad through the lead, and the other end of the LED chip is connected to the second lead pad through the lead.

7. The support for increasing the area of the die bonding area according to claim 1, wherein the size of the opening at the upper end of the bowl cavity is larger than the size of the lower end of the bowl cavity, and the slope surface of the sidewall of the bowl cavity is a light reflecting surface.

8. The support for increasing the area of a die bonding area according to claim 1, wherein an identification angle for distinguishing a positive electrode and a negative electrode is arranged at the upper end of the plastic support.