CN218840996U

CN218840996U - Electronic component moves and carries mechanism and electronic component test sorter

Info

Publication number: CN218840996U
Application number: CN202221125158.8U
Authority: CN
Inventors: 王建玮; 程海宾
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2022-05-10
Filing date: 2022-05-10
Publication date: 2023-04-11
Anticipated expiration: 2032-05-10

Abstract

The application discloses electronic component moves and carries mechanism and electronic component test sorter belongs to electronic component test technical field, and electronic component moves and carries mechanism, includes: the taking and placing assembly is used for taking and placing the electronic element, and two sides of the taking and placing assembly are provided with taking and placing stations; the conveying units are used for conveying the electronic elements and comprise at least two conveying units, the at least two conveying units are distributed on two sides of the picking and placing assembly and can reciprocate, and the movement tracks of the conveying units pass through the corresponding picking and placing stations so that the picking and placing assembly can pick and place the electronic elements at the picking and placing stations. The two conveying units for conveying the electronic components are always positioned on two sides of the pick-and-place assembly and respectively reciprocate, so that the risk of collision is avoided. Meanwhile, the two sides of the taking and placing assembly are respectively provided with a taking and placing station, the two conveying units respectively move to the respective side taking and placing stations and take and place the electronic element, waiting for the taking and placing stations is not needed, the exchange waiting time is saved, and the material conveying efficiency is improved.

Description

Electronic component moves and carries mechanism and electronic component test sorter

Technical Field

The utility model relates to an electronic component tests technical field, concretely relates to electronic component moves and carries mechanism and electronic component test sorter.

Background

The existing feeding mechanism of the electronic component testing and sorting machine comprises an automatic feeding mechanism, a first transfer trolley and a second transfer trolley, wherein when the automatic feeding mechanism feeds materials into the first transfer trolley, the first transfer trolley is positioned at a Y-direction low-position working position, the second transfer trolley is positioned in a Y-direction high-position waiting area, and in the feeding process of the first transfer trolley, the second transfer trolley moves from the Y-direction high-position waiting area to the Y-direction low-position specific waiting area. After the first transfer trolley is full and moves to the Y-direction high position to be picked up, the second transfer trolley moves to the working position quickly to complete the alternate work between the feeding transfer trolleys, and the automatic feeding mechanism feeds the second transfer trolley. Through the alternate work among the feeding trolleys, the rapid feeding of the electronic component testing and sorting machine is realized.

However, the first transfer trolley and the second transfer trolley in the feeding mechanism of the existing electronic component testing sorting machine need to take materials at the same position, and when positions are exchanged, in order to ensure safety, one transfer trolley needs to leave the working position, and the other transfer trolley can move to the working position, so that the exchange waiting time exists, the feeding efficiency is reduced, and meanwhile, the collision risk also exists between the two transfer trolleys.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for an electronic component transfer mechanism and an electronic component testing and sorting machine that can reduce the risk of collision and improve the material transportation efficiency.

An electronic component transfer mechanism includes:

the taking and placing assembly is used for taking and placing the electronic element, and taking and placing stations are arranged on two sides of the taking and placing assembly;

the conveying units are used for conveying the electronic elements and comprise at least two conveying units, the at least two conveying units are distributed on two sides of the picking and placing assembly and can reciprocate, and the movement track of the conveying units passes through the corresponding picking and placing stations, so that the picking and placing assembly picks and places the electronic elements at the picking and placing stations.

Compared with the prior art, two conveying units for conveying the electronic elements are always located on two sides of the pick-and-place assembly and do not move in a reciprocating mode, and the risk of collision does not exist. Meanwhile, the two sides of the taking and placing assembly are respectively provided with a taking and placing station, the two conveying units respectively move to the respective side taking and placing stations and take and place the electronic element, waiting for the taking and placing stations is not needed, the exchange waiting time is saved, and the material conveying efficiency is improved.

In one embodiment, the conveying units on both sides move alternately or synchronously.

In one embodiment, the reciprocating motion of the conveying unit includes an X-axis motion and a Y-axis motion, the transfer mechanism further includes an X-axis power unit and a Y-axis power unit, the X-axis power unit drives the conveying unit to perform the X-axis motion, and the Y-axis power unit drives the conveying unit to perform the Y-axis motion. When the picking and placing station and the position to be picked are not in the same axial direction, the X-axis power unit and the Y-axis power unit drive the conveying unit to do X-axis motion and Y-axis motion, so that the electronic element reciprocates between the picking and placing station and the position to be picked, and the material conveying of the electronic element is realized.

In one embodiment, the Y-axis power unit includes a first driving member and a first moving platform, the X-axis power unit is disposed on the first moving platform, and the first driving member drives the X-axis power unit and the first moving platform to perform Y-axis motion. The first moving platform moves under the driving of the Y-axis power unit to drive the X-axis power unit and the conveying unit to move in the Y-axis direction.

In one embodiment, the device further comprises a track, wherein the first moving platform moves on the track, and the track is used for limiting and guiding the movement of the first moving platform.

In one embodiment, the X-axis power unit includes a second driving element and a second moving platform, the conveying unit is disposed on the second moving platform, and the second driving element drives the second moving platform and the conveying unit to perform X-axis movement. When the X-axis power unit and the conveying unit reach the Y-axis set position, the second moving platform moves under the driving of the X-axis power unit to drive the conveying unit to move in the X-axis direction.

In one embodiment, the pick-and-place assembly includes at least two PNP nozzle modules, and the at least two PNP nozzle modules are respectively matched with the conveying units on two sides to pick electronic components from the conveying units. Every side conveying unit sets up corresponding PNP suction nozzle module respectively, and every side PNP suction nozzle module's motion is fixed, single, has promoted and has got and put efficiency, simultaneously, has further reduced the interference between the conveying unit of both sides.

In one embodiment, at least two of the PNP nozzle modules work alternately, and by the alternate work, the two PNP nozzle modules are prevented from interfering when taking and placing electronic components.

In one embodiment, the conveying unit is provided with a plurality of holes capable of placing the electronic elements, so that the conveying unit can convey more electronic elements at one time, the movement times of the conveying unit are reduced, and the material conveying efficiency is improved.

The utility model discloses another technical scheme as follows:

an electronic component testing and sorting machine comprises the electronic component transferring mechanism in any technical scheme.

These features and advantages of the present invention will be disclosed in more detail in the following detailed description and the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of an electronic component testing and sorting machine provided by the present application.

Fig. 2 is a schematic partial perspective view of an electronic component loading and transferring mechanism provided in the present application.

Fig. 3 is a partial top view of an electronic component loading and transferring mechanism provided in the present application.

Reference numerals:

100. an automatic feeding assembly; 110. a feeding direct vibration track; 210. feeding the PNP suction nozzle module; 211. a left feeding PNP suction nozzle module; 212. a PNP suction nozzle module is loaded on the right side; 220. a feeding shuttle; 221. a left loading shuttle; 222. a right feeding shuttle; 230. a first mobile platform; 240. a first track; 250. a second mobile platform; 260. a second track; 270a, a left picking and placing station; 270b, a right picking and placing station; 280a, a left bit to be picked; 280b, a right bit to be picked; 300. an automatic material receiving assembly; 310. a material receiving direct vibration rail; 410. A material receiving PNP suction nozzle module; 420. a material receiving shuttle.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "secured to" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used in the description of the present application are for illustrative purposes only and do not represent the only embodiments.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact via an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of this application, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The electronic component transferring mechanism and the electronic component testing and sorting machine according to the present invention will be described in further detail with reference to the accompanying drawings and embodiments:

the electronic component testing and sorting machine is used for detecting the electrical property of an electronic component to ensure the product quality of the electronic component, and comprises an automatic feeding assembly 100, an electronic component transferring mechanism, a testing unit and an automatic receiving assembly 300. The electronic component transferring mechanism further comprises an electronic component loading and transferring mechanism and an electronic component receiving and transferring mechanism. The main function of the automatic feeding assembly 100 is to take out the electronic components in the feeding tube and move the electronic components to a first specific area to wait for the electronic components to be picked up by the electronic component feeding and transferring mechanism. The main function of the automatic material collecting assembly 300 is to collect the electronic components placed in the second specific area into the material discharging pipe. The automatic feeding assembly 100 and the automatic receiving assembly 300 are well-known in the market, and therefore are not described in detail.

The automatic feeding assembly 100, the electronic component feeding and transferring mechanism and the test unit form a feeding side, and the electronic component feeding and transferring mechanism conveys the electronic components on the automatic feeding assembly 100 to the test unit for testing on the feeding side; the test unit, the electronic component receiving and transferring mechanism and the automatic receiving assembly 300 form a receiving side, and on the receiving side, the electronic component receiving and transferring mechanism transfers the tested electronic components in the test unit to the automatic receiving assembly 300, and so on.

Referring to fig. 1, the electronic component receiving and transferring mechanism and the electronic component loading and transferring mechanism are substantially symmetrical, and are symmetrically installed on the electronic component testing and sorting machine. Moreover, the working steps of the electronic component receiving and transferring mechanism are just opposite to the working steps of the electronic component loading and transferring mechanism, so for convenience of description and understanding, the electronic component loading and transferring mechanism is taken as an example in the embodiment for specific description.

Referring to fig. 2 and 3, the electronic component loading and transferring mechanism includes a pick-and-place component and a conveying unit, the pick-and-place component is used for picking and placing the electronic component, and pick-and-place stations are arranged on both sides of the pick-and-place component; the conveying unit is used for conveying electronic components, preferably selects material shuttles, namely the material loading shuttles 220, and comprises at least two material loading shuttles, the at least two material loading shuttles 220 are distributed on two sides of the pick-and-place assembly and can reciprocate, and the movement track of the conveying unit passes through the corresponding pick-and-place stations, so that the pick-and-place assembly picks and places the electronic components at the pick-and-place stations.

The two feeding shuttles 220 for conveying electronic components in this embodiment are always located at two sides of the pick-and-place assembly and respectively reciprocate, so that there is no risk of collision. Meanwhile, the two sides of the taking and placing assembly are respectively provided with a taking and placing station, the two feeding shuttles 220 respectively move to the respective side taking and placing stations and take and place the electronic elements, waiting for the taking and placing stations is not needed, the exchange waiting time is saved, and the feeding efficiency is improved.

Of course, in other embodiments, the conveying unit is not limited to the material loading shuttle 220, and may be a transfer cart or the like as long as the conveying of the electronic component can be realized by the reciprocating motion.

In order to enable the feeding shuttle 220 to transport more electronic components at a time, a plurality of cavities capable of placing the electronic components are arranged on the feeding shuttle 220, so that the number of movement times of the feeding shuttle 220 is reduced, and the feeding efficiency is improved.

It should be noted that the two-side loading shuttle 220 moves alternately, and of course, in other embodiments, in order to further save the waiting time and improve the loading efficiency of the loading shuttle 220, the two-side loading shuttle 220 may also move synchronously.

The movement mode and the operation principle of the two-side feeding shuttle 220 are the same, and the movement of the one-side feeding shuttle 220 will be described.

In the electronic component testing and sorting machine, the pick-and-place station for picking the electronic component from the automatic feeding assembly 100 and the to-be-picked position for feeding the electronic component to the testing unit are generally not in the same axial direction, so that the feeding shuttle 220 needs to perform the X axial movement and the Y axial movement for adjustment when reciprocating between the pick-and-place station and the to-be-picked position. In this embodiment, the X-axis movement and the Y-axis movement of the feeding shuttle 220 are respectively realized by an X-axis power unit and a Y-axis power unit.

When the feeding shuttle 220 needs to do Y axial motion, the first driving part drives the first moving platform 230 to do Y axial motion along the first rail 240 and drives the X-axis power unit and the feeding shuttle 220 to do Y axial motion together. The motion of the first moving platform 230 is limited and guided by the first track 240.

In this embodiment, the X-axis power unit includes a second driving element, a second moving platform 250 and a second track 260, the feeding shuttle 220 is disposed on the second moving platform 250, the second moving platform 250 is disposed on the second track 260, when the feeding shuttle 220 needs to do X-axis motion, the second driving element drives the second moving platform 250 to do X-axis motion along the second track 260, and the second moving platform 250 drives the feeding shuttle 220 to do X-axis motion.

The electronic components are loaded by the above-mentioned X-axis movement and Y-axis movement of the loading shuttle 220.

Of course, if the pick-and-place station for picking the electronic component from the automatic feeding assembly 100 and the to-be-picked station for feeding the electronic component to the testing unit are located on the same axial direction, the feeding shuttle 220 only needs to perform the X axial movement or the Y axial movement for adjustment when reciprocating between the pick-and-place station and the to-be-picked station.

The pick-and-place assembly in this embodiment includes at least two feeding PNP nozzle modules 210, in order to reduce interference generated when the feeding shuttles 220 on both sides pick and place the electrons, the at least two feeding PNP nozzle modules 210 are respectively matched with the feeding shuttles 220 on both sides to place the electronic components into the feeding shuttles 220. The material loading shuttles 220 on each side are respectively provided with the corresponding material loading PNP suction nozzle modules 210, the material loading PNP suction nozzle modules 210 on each side are fixed and single in movement, and the picking and placing efficiency is improved. Meanwhile, for example, to avoid interference when at least two feeding PNP nozzle modules 210 take electronic components from the automatic feeding assembly 100, the at least two feeding PNP nozzle modules 210 work alternately.

For convenience of describing the working process of the electronic component loading and transferring mechanism, the loading shuttles 220 are respectively arranged at the left side and the right side of the taking and placing component, namely a left loading shuttle 221 and a right loading shuttle 222; the feeding PNP nozzle module 210 corresponding to the left feeding shuttle 221 is the left feeding PNP nozzle module 211, and the feeding PNP nozzle module 210 corresponding to the right feeding shuttle 222 is the right feeding PNP nozzle module 212; the stations at the two sides of the taking and placing component are a left taking and placing station 270a and a right taking and placing station 270b respectively, and the positions to be picked at the two sides are a left position 280a to be picked and a right position 280b to be picked respectively; the automatic feeding assembly 100 includes a feeding straight vibration rail 110, and the left feeding PNP nozzle module 211 and the right feeding PNP nozzle module 212 are respectively located on two sides of the feeding straight vibration rail 110, and are arranged in a mirror image manner, and both of them can be placed on the corresponding feeding shuttle 220 after being taken by the feeding straight vibration rail 110.

The loading process of the electronic component loading and transferring mechanism in this embodiment is as follows:

the left feeding shuttle 221 and the right feeding shuttle 222 wait at the left taking and placing station 270a and the right taking and placing station 270b respectively, and the left feeding PNP nozzle module 211 takes the material at the feeding straight vibration rail 110 and fills the left feeding shuttle 221;

after the left feeding shuttle 221 is full, the left feeding shuttle 221 moves to the left to-be-picked position 280a, and takes the materials to the testing unit by other mechanisms, and then returns to the left taking and placing position 270a to wait, and meanwhile, the right feeding PNP nozzle module 212 fills the right feeding shuttle 222;

after the right loading shuttle 222 is full, it moves to the right pick-up waiting position 280b to pick up the material to the testing unit by other mechanisms, and then returns to the right pick-and-place station 270b to wait. Meanwhile, the left feeding PNP nozzle module 211 fills the left feeding shuttle 221, and so on.

The electronic component receiving and transferring mechanism and the electronic component loading and transferring mechanism have the same structure, referring to fig. 1, the conveying unit is a blanking shuttle, the picking and placing assembly includes a receiving PNP nozzle module 410, and the automatic receiving assembly 300 includes a receiving straight vibration rail 310. The material receiving flow of the electronic component receiving and transferring mechanism is opposite to the material feeding flow, that is, the tested electronic component is picked up by the receiving PNP nozzle module 410 and placed in the receiving shuttle 420, the electronic component in the test unit is carried to the receiving straight vibration rail 310 by the receiving shuttle 420, and then the electronic component is received into the receiving tube by other mechanisms.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. An electronic component transfer mechanism, comprising:

the taking and placing assembly is used for taking and placing the electronic element, and two sides of the taking and placing assembly are provided with taking and placing stations;

2. The electronic component transfer mechanism according to claim 1, wherein the transport units on both sides are alternately moved or synchronously moved.

3. The electronic component transfer mechanism according to claim 1, wherein the reciprocating motion of the transport unit includes an X-axis motion and a Y-axis motion, and the transfer mechanism further includes an X-axis power unit and a Y-axis power unit, the X-axis power unit drives the transport unit to move in the X-axis direction, and the Y-axis power unit drives the transport unit to move in the Y-axis direction.

4. The electronic component transfer mechanism as claimed in claim 3, wherein the Y-axis power unit includes a first driving member and a first moving platform, the X-axis power unit is disposed on the first moving platform, and the first driving member drives the X-axis power unit and the first moving platform to move in the Y-axis direction.

5. The electronic component transfer mechanism according to claim 4, further comprising a rail on which the first moving platform moves.

6. The electronic component transfer mechanism according to claim 3, wherein the X-axis power unit includes a second driving member and a second moving platform, the transporting unit is disposed on the second moving platform, and the second driving member drives the second moving platform and the transporting unit to move in the X-axis direction.

7. The electronic component transferring mechanism of claim 1, wherein the pick-and-place assembly comprises at least two PNP nozzle modules, and the at least two PNP nozzle modules are respectively engaged with the two side conveying units to pick and place electronic components into the conveying units.

8. The electronic component transfer mechanism of claim 7, wherein at least two of the PNP nozzle modules operate alternately.

9. The electronic component transfer mechanism according to claim 1, wherein the transport unit is provided with a plurality of cavities in which the electronic components can be placed.

10. An electronic component testing and sorting machine comprising the electronic component transfer mechanism according to any one of claims 1 to 9.