CN218840935U

CN218840935U - Silicon wafer taking-out mechanism

Info

Publication number: CN218840935U
Application number: CN202223117998.2U
Authority: CN
Inventors: 张贝贝
Original assignee: Longwei Microelectronics Equipment Longquan Co ltd
Current assignee: Longwei Microelectronics Equipment Longquan Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-04-11
Anticipated expiration: 2032-11-23

Abstract

The utility model provides a silicon wafer taking-out mechanism, which comprises a horizontal translation mechanism arranged along the taking-out direction of a silicon wafer, wherein a shifting piece used for hooking and taking the silicon wafer is arranged on the horizontal translation mechanism, and the horizontal translation mechanism is also arranged on a longitudinal translation mechanism; the horizontal translation mechanism and the longitudinal translation mechanism are respectively connected to a group of driving mechanisms, each driving mechanism comprises an eccentric shaft and a cam device, the eccentric shafts are matched with a swing arm, a sliding groove is formed in each swing arm, the eccentric shafts move along the sliding grooves, and the horizontal translation mechanisms are connected to the swing arms; the longitudinal translation mechanism is provided with a rolling wheel which is matched with the cam device to drive the longitudinal translation mechanism to move. The shifting piece is only contacted with the back side surface of the silicon wafer and can not be contacted with the surface of the silicon wafer, so that the silicon wafer is prevented from being polluted or damaged in the taking-out process, and the whole taking-out mechanism is simple in design and easy to realize.

Description

Silicon wafer taking-out mechanism

Technical Field

The utility model relates to an electronic component production facility, especially a be arranged in silicon chip production process to be used for the mechanism that takes out the silicon chip from the basket of flowers.

Background

The silicon wafers used for producing the electronic element are divided by the slicing mechanism and then need to be stored and transferred to a production line. The divided silicon wafers need to be kept separate and placed in a basket for transportation. When the silicon wafer enters an automatic production line, the silicon wafer needs to be taken out of a flower basket, and the silicon wafer is taken out by a sucker through a mechanical arm. For example, in the silicon wafer feeding/discharging transmission system with the publication number of CN108305846B and the working method thereof, the suction cup is controlled to suck or place the silicon wafer through the suction cup on the feeding mechanical arm, and for the silicon wafers with different heights, the corresponding silicon wafers are taken out through the movement of the feeding mechanical arm by the control system, so that the requirement on the operation precision of the control system is high, once the mechanical arm deviates from the position of the silicon wafer to be taken out, the silicon wafer may be scratched, and the whole taking-out efficiency is also low. In addition, when the wafer is taken out, the sucker can contact the surface of the silicon wafer, so that the silicon wafer can be damaged or polluted, and the overall performance of the silicon wafer is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip taking out mechanism changes the mode that current adoption sucking disc took out, releases the silicon chip from the basket of flowers and send to put on arranging transmission device through taking out mechanism piece by piece.

The utility model discloses a realize through following technical scheme:

the silicon wafer taking-out mechanism comprises a horizontal translation mechanism arranged along the taking-out direction of the silicon wafer, a shifting piece used for hooking and taking out the silicon wafer is arranged on the horizontal translation mechanism, and the horizontal translation mechanism is also arranged on the longitudinal translation mechanism; the horizontal translation mechanism and the longitudinal translation mechanism are respectively connected to a group of driving mechanisms, each driving mechanism comprises an eccentric shaft and a cam device, the eccentric shafts are matched with a swing arm, a sliding groove is formed in each swing arm, the eccentric shafts move along the sliding grooves, and the horizontal translation mechanisms are connected to the swing arms; the longitudinal translation mechanism is provided with a rolling wheel which is matched with the cam device to drive the longitudinal translation mechanism to move.

Further, the cam device is a cam groove arranged on the wheel disc, the eccentric shaft and the wheel disc are installed on a driving shaft, and the driving shaft is connected with the motor.

Further, the horizontal translation mechanism comprises a slide rail and a slide block, and the shifting piece is arranged on the slide block; the slider is connected to the free end of the swing arm through a connecting rod.

Furthermore, the longitudinal translation mechanism comprises a sliding rail and a sliding block, the sliding block is matched with the cam groove through a lever, one end of the lever is connected with the sliding block, the other end of the lever is provided with a rolling wheel, and the rolling wheel rolls in the cam groove along the groove rail.

Further, the groove rail in the cam groove is equipped with major diameter section and path section, through pitch arc transitional coupling between major diameter section and the path section.

Compared with the prior art, the beneficial effects of the utility model are that: when the silicon wafer is taken out from the flower basket, the horizontal translation mechanism and the shifting piece are driven by the longitudinal translation mechanism to move downwards, so that the top of the shifting piece is lower than the silicon wafer, then the shifting piece is driven by the translation mechanism to move to the rear of the silicon wafer, then the longitudinal translation mechanism rises, and then the shifting piece is driven by the translation mechanism to push the silicon wafer out of the flower basket from the rear of the silicon wafer. When the silicon wafer is taken out, the poking piece is only contacted with the back side surface of the silicon wafer and can not be contacted with the surface of the silicon wafer, so that the silicon wafer is prevented from being polluted or damaged in the taking-out process, and the whole taking-out mechanism is simple in design and easy to realize.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the following description is further made with reference to the accompanying drawings.

Fig. 1 is a perspective view of the present invention.

Detailed Description

In order to make the technical problem, technical scheme and the beneficial effect that the utility model discloses solve clearer, it is right to combine figure and embodiment below to go on further the detailed description of the utility model. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1, the silicon wafer taking-out mechanism comprises a horizontal translation mechanism 1 arranged along the taking-out direction of the silicon wafer, and a shifting piece 2 used for hooking and taking the silicon wafer is arranged on the horizontal translation mechanism 1. The horizontal translation mechanism 1 is also mounted on the longitudinal translation mechanism 3. When the silicon wafer is taken out from the flower basket, the horizontal translation mechanism 1 and the shifting piece 2 are driven by the longitudinal translation mechanism 3 to move downwards, so that the top of the shifting piece 2 is lower than the silicon wafer, then the shifting piece 2 is driven by the translation mechanism to move to the rear of the silicon wafer, then the longitudinal translation mechanism 3 rises, and then the translation mechanism drives the shifting piece 2 to push the silicon wafer out of the flower basket from the rear of the silicon wafer. In order to simplify the design of the driving mechanism, i.e. a set of motors for providing power is required to drive all the mechanisms, the horizontal translation mechanism 1 and the longitudinal translation mechanism 3 are respectively connected to a set of driving mechanisms, and the driving mechanisms comprise eccentric shafts 4 and cam devices 5. The eccentric shaft 4 is matched with a swing arm 6, a roller is usually sleeved on the eccentric shaft 4 through a bearing, then the roller is arranged in a sliding groove 13 in the swing arm 6, one end of the swing arm 6 is fixed on a rotating shaft, and the other end of the swing arm is connected with the horizontal translation mechanism 1 through a connecting device. The cam device 5 drives the longitudinal translation device to complete the up-and-down movement through the diameter change of different positions of the cam. More specifically, the cam means 5 is a cam groove 9 provided on the wheel 8, and the eccentric shaft 4 and the wheel 8 are mounted to a drive shaft 10, the drive shaft 10 being connected to a motor. When the silicon wafer is taken out from the flower basket, the horizontal translation mechanism 1 and the shifting piece 2 are driven by the longitudinal translation mechanism 3 to move downwards, so that the top of the shifting piece 2 is lower than the silicon wafer, then the shifting piece 2 is driven by the translation mechanism to move to the rear of the silicon wafer, then the longitudinal translation mechanism 3 rises, and then the translation mechanism drives the shifting piece 2 to push the silicon wafer out of the flower basket from the rear of the silicon wafer. When the silicon wafer is taken out, the poking piece 2 is only contacted with the back side surface of the silicon wafer and can not be contacted with the surface of the silicon wafer, so that the silicon wafer is prevented from being polluted or damaged in the taking-out process, and the whole taking-out mechanism is simple in design and easy to realize.

The horizontal translation mechanism 1 is composed of a slide rail and a slide block, and the plectrum 2 is arranged on the slide block; the slider is connected to the free end of the swing arm 6 by a link 11. When the rotating shaft drives the eccentric shaft 4 to rotate, the corresponding swing arm 6 can swing back and forth, and the connecting rod 11 drives the sliding block to slide along the sliding rail, so that the plectrum 2 pushes the bone pieces out of the flower basket.

Likewise, the longitudinal translation mechanism 3 comprises a sliding rail and a sliding block, wherein the sliding rail is longitudinally arranged, the sliding block is matched with the cam groove 9 through a lever 12, one end of the lever 12 is connected with the sliding block, the other end of the lever 12 is provided with a rolling wheel 7, and the rolling wheel 7 rolls along the groove rail in the cam groove 9. In order to match the whole action process of taking out the silicon wafer from the flower basket by the plectrum 2, the groove track needs to be correspondingly designed, namely the groove track is provided with a large-diameter section and a small-diameter section. Wherein, the large-diameter section can jack up one end of the lever 12, so that the other end of the lever 12 descends, i.e. the slide block of the longitudinal translation mechanism 3 is pushed downwards to drive the horizontal translation mechanism 1 and the shifting piece 2 to move downwards; on the contrary, the small diameter section lowers the modified end of the lever 12, thereby driving the horizontal mechanism and the shifting piece 2 to move upwards. In order to ensure that the whole mechanism is smoother in the movement process, the large-diameter section and the small-diameter section are in transition connection through arcs.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and all modifications, equivalents, improvements and the like that are made within the principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The silicon chip taking-out mechanism is characterized in that: the silicon wafer taking device comprises a horizontal translation mechanism (1) arranged along the taking-out direction of a silicon wafer, wherein a shifting piece (2) used for hooking and taking the silicon wafer is arranged on the horizontal translation mechanism (1), and the horizontal translation mechanism (1) is also arranged on a longitudinal translation mechanism (3); the horizontal translation mechanism (1) and the longitudinal translation mechanism (3) are respectively connected to a group of driving mechanisms, each driving mechanism comprises an eccentric shaft (4) and a cam device (5), the eccentric shaft (4) is matched with a swing arm (6), a sliding groove (13) is formed in each swing arm, the eccentric shaft moves along the sliding groove (13), and the horizontal translation mechanism (1) is connected to the swing arm (6); the longitudinal translation mechanism (3) is provided with a rolling wheel (7) which is matched with the cam device (5) to drive the longitudinal translation mechanism (3) to move.

2. The silicon wafer take-out mechanism according to claim 1, characterized in that: the cam device (5) is a cam groove (9) arranged on the wheel disc (8), the eccentric shaft (4) and the wheel disc (8) are installed on a driving shaft (10), and the driving shaft (10) is connected with the motor.

3. The silicon wafer take-out mechanism according to claim 1, characterized in that: the horizontal translation mechanism (1) comprises a sliding rail and a sliding block, and the shifting piece (2) is arranged on the sliding block; the slide block is connected to the free end of the swing arm (6) through a connecting rod (11).

4. The silicon wafer take-out mechanism according to claim 2, characterized in that: vertical translation mechanism (3) include slide rail and slider, the slider passes through lever (12) and cooperates with cam groove (9), and the slider is connected to the one end of lever (12), and the other end of lever (12) sets up rolling wheel (7), and rolling wheel (7) roll along the grooved rail in cam groove (9).

5. The silicon wafer extracting mechanism according to claim 2 or 4, characterized in that: the groove rail in the cam groove (9) is provided with a large-diameter section and a small-diameter section, and the large-diameter section and the small-diameter section are in transition connection through an arc line.