CN218830389U

CN218830389U - PCB heat dissipation mechanism

Info

Publication number: CN218830389U
Application number: CN202222680532.7U
Authority: CN
Inventors: 汪秀文; 黄秀群
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-04-07
Anticipated expiration: 2032-10-12

Abstract

The utility model discloses a PCB board heat dissipation mechanism belongs to camera technical field, including camera, top cap, PCB board, the PCB board is installed to camera top one side screw thread, and the camera top is close to PCB board top position screw thread and installs the top cap, and the camera top is provided with the normal atmospheric temperature heat dissipation mechanism that carries out air cycle heat dissipation and rain-proof flowing backward to the circuit board when normal atmospheric temperature weather. The utility model discloses in, when normal atmospheric temperature weather, through two louvres that prevent the rainwater and two inside fan A that admit air of louvre that flow backward, exhaust fan A circulates the inside air of camera, and then reduce the temperature of PCB board, the use of electric energy is comparatively saved to this kind of cooling mode, when hot weather, through the rare heat-conducting plate of graphite, the semiconductor refrigeration piece, the cooling is carried out to the PCB board to heat dissipation chamber isotructure, and then guarantee the cooling effect of the inside PCB board of camera when high temperature weather, the life of camera has been prolonged.

Description

PCB heat dissipation mechanism

Technical Field

The utility model belongs to the technical field of the camera, specifically be a PCB board heat dissipation mechanism.

Background

The camera on the highway can monitor and shoot overspeed violation vehicles for traffic policemen, after the camera collects images by means of the lens, the images are processed and converted into digital signals which can be identified by a computer by the photosensitive assembly circuit and the control assembly of the PCB in the camera, then the images are input into the computer by means of parallel ports or USB connection and then are restored by software, and the photosensitive assembly circuit and the control assembly of the PCB inside the camera process the images and convert the images into the digital signals which can be identified by the computer, so that heat can be dissipated, and the PCB needs to be cooled.

Wherein, found through the retrieval, there is a patent number CN201922390912.5 a monitoring camera that radiating effect is good, this kind of monitoring camera that radiating effect is good, it constructs through the heat dissipation, reach the radiating effect to the circuit board body, through first connecting pipe and first fan, reach the radiating effect to radiating mechanism, also reach the radiating effect to the organism, through second connecting pipe and second fan, reach the radiating effect to the circuit board body, this monitoring camera radiating effect is good, the difficult situation that the damage appears of inner element, make things convenient for people to carry out the advantage of using.

This kind of monitoring camera that radiating effect is good is more fit for using in comparatively normal atmospheric temperature's environment, but when this kind of monitoring camera that radiating effect is good was used in high temperature environment, only simply passes through air cycle through the fan, hardly realizes abundant inside PCB board to the camera and dispels the heat because outside air temperature is also comparatively high temperature, can not reduce self temperature after getting into the camera inside.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the above problems, a PCB heat dissipation mechanism is provided.

The utility model adopts the technical scheme as follows: the utility model provides a PCB board heat dissipation mechanism, includes camera, top cap, PCB board, the PCB board is installed to camera top one side screw thread, the camera top is close to PCB board top position screw thread and installs the top cap, the camera top is provided with carries out the normal atmospheric temperature heat dissipation mechanism that air cycle dispels the heat and rain-proof flows backward to the circuit board when normal atmospheric temperature weather, carries out the high temperature heat dissipation mechanism of refrigeration cooling bottom the circuit board when high temperature weather.

Wherein, normal atmospheric temperature heat dissipation mechanism includes: louvre, air inlet fan A, air discharge fan A, filter screen frame, slot, sealing strip, the equal opening in top cap top both sides is provided with the louvre, louvre opening part bottom is provided with the slope of thirty degrees upwards, and the left side the inside fixed mounting of louvre has air inlet fan A, the right side the inside fixed mounting of louvre has air discharge fan A, two the louvre is close to air inlet fan A and the equal opening in air discharge fan A one side and is provided with the slot, the filter screen frame is installed to the inside joint of slot, the sealing strip is installed in the equal laminating of filter screen frame both sides, the sealing strip closely laminates the setting with the slot.

Wherein, high temperature heat dissipation mechanism includes: rare heat-conducting plate of graphite, semiconductor refrigeration piece, heat dissipation chamber, air inlet fan B, air outlet fan B, draw-in groove, dustproof filter screen, joint strip, the camera inner chamber is close to the thin heat-conducting plate of PCB board below position fixed mounting graphite, the thin heat-conducting plate top of graphite sets up with the laminating of PCB board bottom, the camera inner chamber is close to the thin heat-conducting plate below position fixed mounting of graphite and has the semiconductor refrigeration piece, semiconductor refrigeration piece system cold end and the thin heat-conducting plate bottom laminating of graphite set up, semiconductor refrigeration piece radiating end extends to the heat dissipation intracavity portion, camera one side is close to the thin position opening of semiconductor refrigeration piece below and is provided with the heat dissipation chamber, heat dissipation chamber one side fixed mounting has air inlet fan B, heat dissipation chamber opposite side fixed mounting has air outlet fan B, the equal opening in heat dissipation chamber both sides is provided with the draw-in groove, dustproof filter screen is installed to the inside joint of draw-in groove, the outside one side fixed mounting of dustproof filter screen has joint strip.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

1. the utility model discloses in, when normal atmospheric temperature weather, through two louvres that prevent the rainwater and two louvres inside fan A, the air discharge fan A that admits air that the louvre flows backward circulate camera inside air, and then reduce the temperature of PCB board, the comparatively use of saving the electric energy of this kind of cooling mode.

2. The utility model discloses in, when inflammation hot weather, refrigerate the cooling to the PCB board through the rare heat-conducting plate of graphite, semiconductor refrigeration piece, heat dissipation chamber isotructure, and then guarantee the cooling effect of the inside PCB board of camera when high temperature weather, prolonged the life of camera.

3. The utility model discloses in, the labour that has reduced the staff through convenient filter screen frame and the dustproof filter screen of dismantling makes the clean convenient and fast more of filter screen of staff, has increased the practicality and the popularity of this kind of device.

Drawings

FIG. 1 is a schematic diagram of the overall three-dimensional structure of the present invention;

FIG. 2 is a schematic diagram of the front structure of the present invention;

fig. 3 is a schematic diagram of an enlarged structure at a in fig. 2;

fig. 4 is a schematic diagram of an enlarged structure at B of fig. 3 in the present invention;

fig. 5 is an enlarged schematic diagram of the structure at C of fig. 3 according to the present invention.

The labels in the figure are: 1. a camera; 101. a top cover; 102. a PCB board; 2. heat dissipation holes; 201. an air inlet fan A; 202. an exhaust fan A; 3. a screen frame; 301. inserting slots; 302. a seal strip; 4. a graphite heat-conducting plate; 401. a semiconductor refrigeration sheet; 5. a heat dissipation cavity; 501. an air inlet fan B; 502. an exhaust fan B; 6. a card slot; 601. a dustproof filter screen; 602. and sealing rubber strips.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model discloses in:

referring to fig. 1-5, a PCB heat dissipation mechanism for a high-speed camera comprises a camera 1, a top cover 101 and a PCB 102, wherein the PCB 102 is installed on one side of the top of the camera 1 through threads, the top cover 101 is installed on the top of the camera 1 close to the position above the PCB 102 through threads, a normal-temperature heat dissipation mechanism which conducts air circulation heat dissipation and rain-proof backflow on the circuit board in normal-temperature weather is arranged on the top of the camera 1, and a high-temperature heat dissipation mechanism which conducts refrigeration and cooling on the bottom of the circuit board in high-temperature weather is arranged on the bottom of the circuit board.

Referring to fig. 1, 2, 3, and 4, in this embodiment, the normal temperature heat dissipation mechanism includes: the air purifier comprises heat dissipation holes 2, an air inlet fan A201, an air exhaust fan A202, a filter screen frame 3, slots 301 and sealing strips 302;

top cap 101 top both sides all opening be provided with louvre 2, the inside fixed mounting of 2 left side louvres has air inlet fan A201, the inside fixed mounting of 2 right side louvres has air outlet fan A202, two louvres 2 are close to air inlet fan A201 and the equal opening of air outlet fan A202 one side and are provided with slot 301, the inside joint of slot 301 installs screen frame 3, screen frame 3 both sides all laminate and install

sealing strip

302, 2 opening part bottoms of louvre are provided with thirty slopes upwards, sealing strip 302 and slot 301 closely laminate the setting, when using camera 1 in normal atmospheric temperature weather, the staff starts two inside air outlet fan A202 of louvre 2 and air inlet fan A201, and then circulate the air to PCB board 102 installation inner chamber, the heat that the air was given off PCB board 102 in the in-process of circulation takes the louvre that PCB board 102 distributes to camera 1 outside, inhale camera 1 inside with outside normal atmospheric temperature air, and then the field refrigeration heat dissipation has been accomplished, the slope of 2 opening part can avoid the rainwater to enter camera 1 inside when rainy day to get into camera, avoid PCB board 102 inside the screen frame 3 to carry out the filter plug 3, then the filter screen frame 3 can carry out the inside clean filter screen plug of the filter screen frame 3 when the rainy day, the dust is taken out, this moment, the inside filter screen frame 3, the filter screen frame 3 clean filter screen plug that the filter screen frame can carry out the filter screen plug that the dust has the filter screen frame 3 self when the filter screen frame 3 is carried out.

Referring to fig. 1, 2, 3, and 5, in this embodiment, the high-temperature heat dissipation mechanism includes: the device comprises a graphite heat conduction plate 4, a semiconductor refrigerating sheet 401, a heat dissipation cavity 5, an air inlet fan B501, an air exhaust fan B502, a clamping groove 6, a dustproof filter screen 601 and a sealing rubber strip 602;

a graphite heat conducting plate 4 is fixedly arranged in a position, close to the lower part of the PCB 102, of an inner cavity of the camera 1, a semiconductor refrigerating sheet 401 is fixedly arranged in a position, close to the lower part of the graphite heat conducting plate 4, of the inner cavity of the camera 1, a heat dissipation cavity 5 is arranged in a position, close to the lower part of the semiconductor refrigerating sheet 401, of the inner cavity of the camera 1, an air inlet fan B501 is fixedly arranged in one side of the heat dissipation cavity 5, an air outlet fan B502 is fixedly arranged in the other side of the heat dissipation cavity 5, clamping grooves 6 are formed in two sides of the heat dissipation cavity 5, a dustproof filter screen 601 is clamped and installed in the clamping groove 6, a sealing rubber strip 602 is fixedly installed on one side of the outer part of the dustproof filter screen 601, the top of the graphite heat conducting plate 4 is attached to the bottom of the graphite heat conducting plate 4, the heat dissipation end of the semiconductor refrigerating sheet 401 extends into the heat dissipation cavity 5, in hot weather, the air is high in temperature, the heat dissipation hole, the heat dissipation efficiency of the air inlet fan A201 and the air outlet fan A202 in the PCB 2 is not high, when the work of the work cooling fan, the work of the work cooling fan is finished, the cooling filter screen is used, the cooling filter screen, the cooling fan 5, the cooling filter screen is cleaned, the cooling filter screen 5, the cooling fan 5, the cooling filter screen is taken out, the cooling filter screen 601, the cooling fan, the cooling screen 401, the cooling fan 5, the cooling screen is cleaned, the cooling screen 601, the dustproof filter screen 601 can be blocked in the clamping groove 6 for fixing.

In this embodiment, the camera 1, the air supply fan a 201, the exhaust fan a 202, the semiconductor chilling plate 401, the air supply fan B501, and the exhaust fan B502 are all electrically connected to the external power source through the switch.

The working principle is as follows: firstly, when the camera 1 is used in normal temperature, a worker starts an exhaust fan A202 and an air inlet fan A201 in two heat dissipation holes 2, and further circulates air in an installation cavity of the PCB 102, the air brings heat dissipated by the PCB 102 to the outside of the camera 1 in the circulation process, the outside normal temperature air is sucked into the camera 1, and further field refrigeration and heat dissipation are completed, thirty-degree slopes at the bottom of openings of the heat dissipation holes 2 can prevent rainwater from flowing backwards into the camera 1 in rainy days, and the PCB 102 is prevented from being damaged, a filter screen frame 3 in the heat dissipation holes 2 can prevent dust from entering the camera 1, and prevent the PCB 102 from accumulating dust to influence the self heat dissipation effect of the PCB 102, after the PCB is used for a certain time, dust can accumulate at one side of a filter screen of the heat dissipation holes 3, the worker can extract the filter screen frame 3 from the inside a slot 301 at the moment, then clean the filter screen frame 3 in the refrigeration and cool the refrigeration screen frame 3, the worker reinserts the filter screen frame 3 into the interior of the slot 301 after the cleaning is finished, the worker reinserts the heat dissipation holes 3, the heat dissipation fan A and the heat dissipation fan A are started up, the heat dissipation fan A401, the heat dissipation fan A and the heat dissipation fan B are started up, the heat dissipation fan 401, the heat dissipation of the semiconductor working at a time, the heat dissipation holes 401, the PCB 102, the semiconductor working at the heat dissipation holes 401 is completed, the heat dissipation holes 401, the dustproof filter screens 601 on two sides of the heat dissipation cavity 5 need to be cleaned, a worker takes out the dustproof filter screens 601 for cleaning, then the sealing rubber strips 602 on one sides of the dustproof filter screens 601 after cleaning are plugged into the clamping grooves 6, and the sealing rubber strips 602 on one sides of the dustproof filter screens 601 can block the dustproof filter screens 601 in the clamping grooves 6 for fixing while sealing the heat dissipation cavity 5.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.

Claims

1. The utility model provides a PCB board heat dissipation mechanism, includes camera (1), top cap (101), PCB board (102) are installed to camera (1) top one side screw thread, top cap (101), its characterized in that are installed to camera (1) top near PCB board (102) top position screw thread: the top of the camera (1) is provided with a normal-temperature heat dissipation mechanism which performs air circulation heat dissipation and rainproof backflow on the circuit board in normal-temperature weather, and a high-temperature heat dissipation mechanism which performs refrigeration and cooling on the bottom of the circuit board in high-temperature weather.

2. The PCB board heat dissipation mechanism of claim 1, wherein: the normal atmospheric temperature heat dissipation mechanism includes: the air conditioner comprises heat dissipation holes (2), an air inlet fan A (201), an exhaust fan A (202), a filter screen frame (3), slots (301) and sealing strips (302);

the utility model discloses a filter screen, including top cap (101), top cap (101) top all opening be provided with louvre (2), left side the inside fixed mounting of louvre (2) has air admission fan A (201), right side the inside fixed mounting of louvre (2) has air discharge fan A (202), two louvre (2) are close to air admission fan A (201) and air discharge fan A (202) one side all opening be provided with slot (301), filter screen frame (3) are installed to slot (301) inside joint, sealing strip (302) are all installed in all laminating of filter screen frame (3) both sides.

3. The PCB board heat dissipation mechanism of claim 1, wherein: the high temperature heat dissipation mechanism includes: the device comprises a graphite heat conducting plate (4), a semiconductor refrigerating sheet (401), a heat dissipation cavity (5), an air inlet fan B (501), an air exhaust fan B (502), a clamping groove (6), a dustproof filter screen (601) and a sealing rubber strip (602);

camera (1) inner chamber is close to the rare heat-conducting plate of graphite (4) of PCB board (102) below position fixed mounting, camera (1) inner chamber is close to the rare heat-conducting plate of graphite (4) below position fixed mounting and has semiconductor refrigeration piece (401), camera (1) one side is close to semiconductor refrigeration piece (401) below position opening and is provided with heat dissipation chamber (5), heat dissipation chamber (5) one side fixed mounting has air inlet fan B (501), heat dissipation chamber (5) opposite side fixed mounting has air discharge fan B (502), the equal opening in heat dissipation chamber (5) both sides is provided with draw-in groove (6), dustproof filter screen (601) are installed to draw-in groove (6) inside joint, dustproof filter screen (601) outside one side fixed mounting has joint strip (602).

4. The PCB board heat dissipation mechanism of claim 2, wherein: the bottom of the opening of the heat dissipation hole (2) is provided with a slope which extends upwards for thirty degrees.

5. The PCB board heat dissipation mechanism of claim 2, wherein: the sealing strip (302) is tightly attached to the slot (301).

6. A PCB heat dissipating mechanism as recited in claim 3, wherein: the top of the graphite heat-conducting plate (4) is attached to the bottom of the PCB (102).

7. A PCB heat dissipating mechanism as recited in claim 3, wherein: semiconductor refrigeration piece (401) refrigeration end and the laminating setting in the rare heat-conducting plate of graphite (4) bottom, semiconductor refrigeration piece (401) heat dissipation end extends to inside heat dissipation chamber (5).